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USD396846S - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD396846S
USD396846S US29/069,444 US6944497F USD396846S US D396846 S USD396846 S US D396846S US 6944497 F US6944497 F US 6944497F US D396846 S USD396846 S US D396846S
Authority
US
United States
Prior art keywords
semiconductor device
view
elevational view
ornamental design
perspective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/069,444
Inventor
Masao Nakayama
Yukio Nakamura
Isamu Yuasa
Noboru Yoshida
Katsuji Tara
Toshio Fujiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to US29/069,444 priority Critical patent/USD396846S/en
Assigned to MATSUSHITA ELECTRONICS CORPORATION reassignment MATSUSHITA ELECTRONICS CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FUJIWARA, TOSHIO, NAKAMURA, YUKIO, NAKAYAMA, MASAO, TARA, KATSUJI, YOSHIDA, NOBORU, YUASA, ISAMU
Application granted granted Critical
Publication of USD396846S publication Critical patent/USD396846S/en
Assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. reassignment MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. MERGER (SEE DOCUMENT FOR DETAILS). Assignors: MATSUSHITA ELECTRONICS CORPORATION
Assigned to PANASONIC CORPORATION reassignment PANASONIC CORPORATION CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of the top, front and left side of a semiconductor device showing our new design;
FIG. 2 is a perspective view of the bottom, rear and right side thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is a rear elevational view thereof; and,
FIG. 8 is a bottom plan view thereof.

Claims (1)

  1. The ornamental design for a semiconductor device, as shown.
US29/069,444 1997-04-16 1997-04-16 Semiconductor device Expired - Lifetime USD396846S (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/069,444 USD396846S (en) 1997-04-16 1997-04-16 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/069,444 USD396846S (en) 1997-04-16 1997-04-16 Semiconductor device

Publications (1)

Publication Number Publication Date
USD396846S true USD396846S (en) 1998-08-11

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Family Applications (1)

Application Number Title Priority Date Filing Date
US29/069,444 Expired - Lifetime USD396846S (en) 1997-04-16 1997-04-16 Semiconductor device

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US (1) USD396846S (en)

Cited By (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD475028S1 (en) 2002-03-11 2003-05-27 Kabushiki Kaisha Toshiba Semiconductor device
USD475355S1 (en) 2002-03-11 2003-06-03 Kabushiki Kaisha Toshiba Semiconductor device
USD475982S1 (en) 2002-03-11 2003-06-17 Kabushiki Kaisha Toshiba Semiconductor device
USD476962S1 (en) 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device
USD522978S1 (en) 2004-06-25 2006-06-13 Matsushita Electric Industrial Co., Ltd. Information storage semiconductor element
USD525214S1 (en) 2004-06-25 2006-07-18 Matsushita Electrical Industrial Co., Ltd. Information storage semiconductor element
USD714745S1 (en) * 2012-02-14 2014-10-07 Panasonic Corporation Semiconductor
USD717254S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717256S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717253S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717255S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719113S1 (en) * 2012-09-20 2014-12-09 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719926S1 (en) * 2012-09-20 2014-12-23 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD721047S1 (en) * 2013-03-07 2015-01-13 Vlt, Inc. Semiconductor device
USD722298S1 (en) * 2013-07-17 2015-02-10 Nuflare Technology, Inc. Chamber of charged particle beam drawing apparatus
US8975694B1 (en) 2013-03-07 2015-03-10 Vlt, Inc. Low resistance power switching device
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD732488S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD732487S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD738834S1 (en) * 2014-07-29 2015-09-15 Jianhui Xie Driver circuit integrated LED module
USD758329S1 (en) * 2013-08-06 2016-06-07 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD759603S1 (en) 2013-07-17 2016-06-21 Nuflare Technology, Inc. Chamber of charged particle beam drawing apparatus
USD769834S1 (en) * 2013-05-08 2016-10-25 Mitsubishi Electric Corporation Semiconductor device
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD902877S1 (en) * 2018-06-12 2020-11-24 Rohm Co., Ltd. Packaged semiconductor module
USD914621S1 (en) * 2019-05-14 2021-03-30 Rohm Co., Ltd. Packaged semiconductor module
USD920264S1 (en) * 2019-11-27 2021-05-25 The Noco Company Semiconductor device
USD922970S1 (en) * 2019-10-28 2021-06-22 Rohm Co., Ltd. Semiconductor device
USD928105S1 (en) * 2019-10-28 2021-08-17 Rohm Co., Ltd. Semiconductor device
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
USD945384S1 (en) * 2019-09-26 2022-03-08 Lapis Semiconductor Co., Ltd. Semiconductor module

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD260091S (en) 1978-08-25 1981-08-04 Hitachi, Ltd. Semiconductor
USD288557S (en) 1984-09-10 1987-03-03 Motorola, Inc. Semiconductor housing
USD345731S (en) 1992-12-03 1994-04-05 Motorola, Inc. Semiconductor package
US5347160A (en) 1992-09-28 1994-09-13 Sundstrand Corporation Power semiconductor integrated circuit package
USD358805S (en) 1993-09-24 1995-05-30 Sgs-Thomson Microelectronics, Inc. Detachable integrated circuit module

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD260091S (en) 1978-08-25 1981-08-04 Hitachi, Ltd. Semiconductor
USD288557S (en) 1984-09-10 1987-03-03 Motorola, Inc. Semiconductor housing
US5347160A (en) 1992-09-28 1994-09-13 Sundstrand Corporation Power semiconductor integrated circuit package
USD345731S (en) 1992-12-03 1994-04-05 Motorola, Inc. Semiconductor package
USD358805S (en) 1993-09-24 1995-05-30 Sgs-Thomson Microelectronics, Inc. Detachable integrated circuit module

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Catalogue-Oki GaAs Device issued prior to Oct. 17, 1996, 3 pages.

Cited By (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD475028S1 (en) 2002-03-11 2003-05-27 Kabushiki Kaisha Toshiba Semiconductor device
USD475355S1 (en) 2002-03-11 2003-06-03 Kabushiki Kaisha Toshiba Semiconductor device
USD475982S1 (en) 2002-03-11 2003-06-17 Kabushiki Kaisha Toshiba Semiconductor device
USD476962S1 (en) 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device
USD522978S1 (en) 2004-06-25 2006-06-13 Matsushita Electric Industrial Co., Ltd. Information storage semiconductor element
USD525214S1 (en) 2004-06-25 2006-07-18 Matsushita Electrical Industrial Co., Ltd. Information storage semiconductor element
USD714745S1 (en) * 2012-02-14 2014-10-07 Panasonic Corporation Semiconductor
USD717256S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717255S1 (en) * 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719113S1 (en) * 2012-09-20 2014-12-09 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719926S1 (en) * 2012-09-20 2014-12-23 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717254S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717253S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
US9269661B1 (en) 2013-03-07 2016-02-23 Vlt, Inc. Low resistance power switching device
US8975694B1 (en) 2013-03-07 2015-03-10 Vlt, Inc. Low resistance power switching device
USD721047S1 (en) * 2013-03-07 2015-01-13 Vlt, Inc. Semiconductor device
USD752000S1 (en) 2013-03-07 2016-03-22 Vlt, Inc. Semiconductor device
USD769834S1 (en) * 2013-05-08 2016-10-25 Mitsubishi Electric Corporation Semiconductor device
USD722298S1 (en) * 2013-07-17 2015-02-10 Nuflare Technology, Inc. Chamber of charged particle beam drawing apparatus
USD759603S1 (en) 2013-07-17 2016-06-21 Nuflare Technology, Inc. Chamber of charged particle beam drawing apparatus
USD732488S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD732487S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD758329S1 (en) * 2013-08-06 2016-06-07 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD738834S1 (en) * 2014-07-29 2015-09-15 Jianhui Xie Driver circuit integrated LED module
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD902877S1 (en) * 2018-06-12 2020-11-24 Rohm Co., Ltd. Packaged semiconductor module
USD914621S1 (en) * 2019-05-14 2021-03-30 Rohm Co., Ltd. Packaged semiconductor module
USD945384S1 (en) * 2019-09-26 2022-03-08 Lapis Semiconductor Co., Ltd. Semiconductor module
USD922970S1 (en) * 2019-10-28 2021-06-22 Rohm Co., Ltd. Semiconductor device
USD928105S1 (en) * 2019-10-28 2021-08-17 Rohm Co., Ltd. Semiconductor device
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
USD920264S1 (en) * 2019-11-27 2021-05-25 The Noco Company Semiconductor device
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
USD969762S1 (en) 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package

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