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USD260091S - Semiconductor - Google Patents

Semiconductor Download PDF

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Publication number
USD260091S
USD260091S US06/015,216 US1521679F USD260091S US D260091 S USD260091 S US D260091S US 1521679 F US1521679 F US 1521679F US D260091 S USD260091 S US D260091S
Authority
US
United States
Prior art keywords
semiconductor
view
front perspective
new design
another embodiment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US06/015,216
Inventor
Hidetoshi Mochizuki
Keizo Otsuki
Hideki Kosaka
Gen Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Assigned to HITACHI, LTD reassignment HITACHI, LTD ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: MOCHIZUKI HIDETOSHI
Application granted granted Critical
Publication of USD260091S publication Critical patent/USD260091S/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a right side, top and front perspective view of a semiconductor showing our new design;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a left side view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a right side, top and front perspective view of a semiconductor showing another embodiment of our new design;
FIG. 6 is a bottom view thereof;
FIG. 7 is a right side, top and front perspective view of a semiconductor showing another embodiment of our new design;
FIG. 8 is a bottom view thereof;
FIG. 9 is a right side, top and front perspective view of a semiconductor showing another embodiment of our new design;
FIG. 10 is a bottom view thereof.

Claims (1)

  1. The ornamental design for a semiconductor, as shown and described.
US06/015,216 1978-08-25 1979-02-26 Semiconductor Expired - Lifetime USD260091S (en)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP53-35723 1978-08-25
JP53-35734 1978-08-25
JP53-35738 1978-08-25
JP3573478 1978-08-25
JP3573878 1978-08-25
JP3573078 1978-08-25
JP53-35730 1978-08-25
JP3572378 1978-08-25

Publications (1)

Publication Number Publication Date
USD260091S true USD260091S (en) 1981-08-04

Family

ID=69802856

Family Applications (1)

Application Number Title Priority Date Filing Date
US06/015,216 Expired - Lifetime USD260091S (en) 1978-08-25 1979-02-26 Semiconductor

Country Status (1)

Country Link
US (1) USD260091S (en)

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD396847S (en) 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD396846S (en) 1997-04-16 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD397092S (en) 1997-01-03 1998-08-18 Fujitsu Limited Integrated circuit package
USD416872S (en) * 1997-11-06 1999-11-23 Zf Microsystems, Inc. Single component computer
USD487430S1 (en) 2002-07-10 2004-03-09 Matsushita Electric Industrial Co., Ltd. Semiconductor memory element
USD522978S1 (en) 2004-06-25 2006-06-13 Matsushita Electric Industrial Co., Ltd. Information storage semiconductor element
USD525214S1 (en) 2004-06-25 2006-07-18 Matsushita Electrical Industrial Co., Ltd. Information storage semiconductor element
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD904325S1 (en) * 2019-03-20 2020-12-08 Sansha Electric Manufacturing Company, Limited Semiconductor module
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
USD945384S1 (en) * 2019-09-26 2022-03-08 Lapis Semiconductor Co., Ltd. Semiconductor module
USD1042376S1 (en) * 2022-02-25 2024-09-17 Rohm Co., Ltd. Semiconductor module

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3208892A (en) 1960-09-15 1965-09-28 Westinghouse Electric Corp Sealed articles and methods of forming the same
US3436451A (en) 1966-06-29 1969-04-01 Servonic Instr Inc Method of making molded ceramic articles
US4012766A (en) 1973-08-28 1977-03-15 Western Digital Corporation Semiconductor package and method of manufacture thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3208892A (en) 1960-09-15 1965-09-28 Westinghouse Electric Corp Sealed articles and methods of forming the same
US3436451A (en) 1966-06-29 1969-04-01 Servonic Instr Inc Method of making molded ceramic articles
US4012766A (en) 1973-08-28 1977-03-15 Western Digital Corporation Semiconductor package and method of manufacture thereof

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
Electronics, 10-13-1977, p. 9, Semiconductor.
Electronics, 10-27-1977, p. 9, Integrated Circuit Package (square).
Electronics, 11-24-1977, p. 145, Integrated Circuit Package (bottom right).
Electronics, 3-17-1977, Front Cover, LSI Package (top right).

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD396847S (en) 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD397092S (en) 1997-01-03 1998-08-18 Fujitsu Limited Integrated circuit package
USD396846S (en) 1997-04-16 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD416872S (en) * 1997-11-06 1999-11-23 Zf Microsystems, Inc. Single component computer
USD487430S1 (en) 2002-07-10 2004-03-09 Matsushita Electric Industrial Co., Ltd. Semiconductor memory element
USD522978S1 (en) 2004-06-25 2006-06-13 Matsushita Electric Industrial Co., Ltd. Information storage semiconductor element
USD525214S1 (en) 2004-06-25 2006-07-18 Matsushita Electrical Industrial Co., Ltd. Information storage semiconductor element
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD864135S1 (en) 2017-10-26 2019-10-22 Mitsubishi Electric Corporation Semiconductor device
USD904325S1 (en) * 2019-03-20 2020-12-08 Sansha Electric Manufacturing Company, Limited Semiconductor module
USD945384S1 (en) * 2019-09-26 2022-03-08 Lapis Semiconductor Co., Ltd. Semiconductor module
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
USD969762S1 (en) 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package
USD1042376S1 (en) * 2022-02-25 2024-09-17 Rohm Co., Ltd. Semiconductor module

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