USD397092S - Integrated circuit package - Google Patents
Integrated circuit package Download PDFInfo
- Publication number
- USD397092S USD397092S US29/064,520 US6452097F USD397092S US D397092 S USD397092 S US D397092S US 6452097 F US6452097 F US 6452097F US D397092 S USD397092 S US D397092S
- Authority
- US
- United States
- Prior art keywords
- integrated circuit
- circuit package
- package
- view
- ornamental design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 is a front elevational view of our new integrated circuit package;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a right side elevational view thereof; and,
FIG. 7 is a perspective view thereof.
Claims (1)
- The ornamental design for an integrated circuit package, as shown.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/064,520 USD397092S (en) | 1997-01-03 | 1997-01-03 | Integrated circuit package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/064,520 USD397092S (en) | 1997-01-03 | 1997-01-03 | Integrated circuit package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD397092S true USD397092S (en) | 1998-08-18 |
Family
ID=71577897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/064,520 Expired - Lifetime USD397092S (en) | 1997-01-03 | 1997-01-03 | Integrated circuit package |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD397092S (en) |
Cited By (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD412888S (en) | 1997-03-27 | 1999-08-17 | Omega Digital Data Inc. | Integrated circuit holder |
| USD418485S (en) * | 1998-09-29 | 2000-01-04 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD421969S (en) * | 1998-09-29 | 2000-03-28 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD432097S (en) * | 1999-11-20 | 2000-10-17 | Samsung Electronics Co., Ltd. | Semiconductor package |
| USD539761S1 (en) * | 2006-08-22 | 2007-04-03 | Kabushiki Kaisha Toshiba | Semiconductor |
| USD548203S1 (en) * | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
| USD548202S1 (en) * | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
| USD594827S1 (en) * | 2006-12-07 | 2009-06-23 | Cree, Inc. | Lamp package |
| USD691101S1 (en) * | 2011-11-08 | 2013-10-08 | Seiko Epson Corporation | Circuit board for an ink cartridge |
| USD731990S1 (en) * | 2012-04-18 | 2015-06-16 | Nok Corporation | Integrated circuit tag |
| USD738834S1 (en) * | 2014-07-29 | 2015-09-15 | Jianhui Xie | Driver circuit integrated LED module |
| USD769834S1 (en) * | 2013-05-08 | 2016-10-25 | Mitsubishi Electric Corporation | Semiconductor device |
| USD794034S1 (en) * | 2009-01-07 | 2017-08-08 | Samsung Electronics Co., Ltd. | Memory device |
| USD794641S1 (en) * | 2009-01-07 | 2017-08-15 | Samsung Electronics Co., Ltd. | Memory device |
| USD794642S1 (en) * | 2009-01-07 | 2017-08-15 | Samsung Electronics Co., Ltd. | Memory device |
| USD794644S1 (en) * | 2009-01-07 | 2017-08-15 | Samsung Electronics Co., Ltd. | Memory device |
| USD794643S1 (en) * | 2009-01-07 | 2017-08-15 | Samsung Electronics Co., Ltd. | Memory device |
| USD795262S1 (en) * | 2009-01-07 | 2017-08-22 | Samsung Electronics Co., Ltd. | Memory device |
| USD795261S1 (en) * | 2009-01-07 | 2017-08-22 | Samsung Electronics Co., Ltd. | Memory device |
| USD796459S1 (en) * | 2016-04-11 | 2017-09-05 | Rohm Co., Ltd. | Packaged semiconductor circuit module |
| USD832227S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
| USD832228S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
| US10256385B2 (en) | 2007-10-31 | 2019-04-09 | Cree, Inc. | Light emitting die (LED) packages and related methods |
| USD855577S1 (en) * | 2018-04-12 | 2019-08-06 | Telebox Industries Corp. | Circuit board for electrical connector |
| USD915310S1 (en) * | 2019-02-12 | 2021-04-06 | Analog Devices, Inc. | Circuit board |
| USD920265S1 (en) * | 2019-09-29 | 2021-05-25 | China Chippacking Technology Co., Ltd. | Integrated circuit package |
| USD920266S1 (en) * | 2019-09-29 | 2021-05-25 | China Chippacking Technology Co., Ltd. | Integrated circuit package |
| USD934187S1 (en) * | 2020-01-21 | 2021-10-26 | Lang Cheng | Integrated circuit package |
| USD937231S1 (en) * | 2020-04-06 | 2021-11-30 | Wolfspeed, Inc. | Power semiconductor package |
| USD1042376S1 (en) * | 2022-02-25 | 2024-09-17 | Rohm Co., Ltd. | Semiconductor module |
| USD1050059S1 (en) * | 2022-06-17 | 2024-11-05 | Seiko Epson Corporation | Circuit board for computer printers |
| USD1095474S1 (en) * | 2022-12-02 | 2025-09-30 | Semiconductor Components Industries, Llc | Power module package |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD260091S (en) | 1978-08-25 | 1981-08-04 | Hitachi, Ltd. | Semiconductor |
| USD345731S (en) | 1992-12-03 | 1994-04-05 | Motorola, Inc. | Semiconductor package |
| USD358806S (en) | 1993-09-24 | 1995-05-30 | Sgs-Thomson Microelectronics, Inc. | Socketed integrated circuit package |
| USD363056S (en) | 1994-12-20 | 1995-10-10 | Vlt Corporation | Package for DC-DC power converter or related circuitry |
| US5570273A (en) | 1993-08-31 | 1996-10-29 | Sgs-Thomson Microelectronics, Inc. | Surface mountable integrated circuit package with low-profile detachable module |
-
1997
- 1997-01-03 US US29/064,520 patent/USD397092S/en not_active Expired - Lifetime
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD260091S (en) | 1978-08-25 | 1981-08-04 | Hitachi, Ltd. | Semiconductor |
| USD345731S (en) | 1992-12-03 | 1994-04-05 | Motorola, Inc. | Semiconductor package |
| US5570273A (en) | 1993-08-31 | 1996-10-29 | Sgs-Thomson Microelectronics, Inc. | Surface mountable integrated circuit package with low-profile detachable module |
| USD358806S (en) | 1993-09-24 | 1995-05-30 | Sgs-Thomson Microelectronics, Inc. | Socketed integrated circuit package |
| USD363056S (en) | 1994-12-20 | 1995-10-10 | Vlt Corporation | Package for DC-DC power converter or related circuitry |
Cited By (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD412888S (en) | 1997-03-27 | 1999-08-17 | Omega Digital Data Inc. | Integrated circuit holder |
| USD418485S (en) * | 1998-09-29 | 2000-01-04 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD421969S (en) * | 1998-09-29 | 2000-03-28 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD432097S (en) * | 1999-11-20 | 2000-10-17 | Samsung Electronics Co., Ltd. | Semiconductor package |
| USD548202S1 (en) * | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
| USD548203S1 (en) * | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
| USD539761S1 (en) * | 2006-08-22 | 2007-04-03 | Kabushiki Kaisha Toshiba | Semiconductor |
| USD594827S1 (en) * | 2006-12-07 | 2009-06-23 | Cree, Inc. | Lamp package |
| US10256385B2 (en) | 2007-10-31 | 2019-04-09 | Cree, Inc. | Light emitting die (LED) packages and related methods |
| USD794643S1 (en) * | 2009-01-07 | 2017-08-15 | Samsung Electronics Co., Ltd. | Memory device |
| USD795261S1 (en) * | 2009-01-07 | 2017-08-22 | Samsung Electronics Co., Ltd. | Memory device |
| USD795262S1 (en) * | 2009-01-07 | 2017-08-22 | Samsung Electronics Co., Ltd. | Memory device |
| USD794034S1 (en) * | 2009-01-07 | 2017-08-08 | Samsung Electronics Co., Ltd. | Memory device |
| USD794641S1 (en) * | 2009-01-07 | 2017-08-15 | Samsung Electronics Co., Ltd. | Memory device |
| USD794642S1 (en) * | 2009-01-07 | 2017-08-15 | Samsung Electronics Co., Ltd. | Memory device |
| USD794644S1 (en) * | 2009-01-07 | 2017-08-15 | Samsung Electronics Co., Ltd. | Memory device |
| USD691101S1 (en) * | 2011-11-08 | 2013-10-08 | Seiko Epson Corporation | Circuit board for an ink cartridge |
| USD731990S1 (en) * | 2012-04-18 | 2015-06-16 | Nok Corporation | Integrated circuit tag |
| USD769834S1 (en) * | 2013-05-08 | 2016-10-25 | Mitsubishi Electric Corporation | Semiconductor device |
| USD738834S1 (en) * | 2014-07-29 | 2015-09-15 | Jianhui Xie | Driver circuit integrated LED module |
| USD796459S1 (en) * | 2016-04-11 | 2017-09-05 | Rohm Co., Ltd. | Packaged semiconductor circuit module |
| USD832227S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
| USD832228S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
| USD855577S1 (en) * | 2018-04-12 | 2019-08-06 | Telebox Industries Corp. | Circuit board for electrical connector |
| USD915310S1 (en) * | 2019-02-12 | 2021-04-06 | Analog Devices, Inc. | Circuit board |
| USD920265S1 (en) * | 2019-09-29 | 2021-05-25 | China Chippacking Technology Co., Ltd. | Integrated circuit package |
| USD920266S1 (en) * | 2019-09-29 | 2021-05-25 | China Chippacking Technology Co., Ltd. | Integrated circuit package |
| USD934187S1 (en) * | 2020-01-21 | 2021-10-26 | Lang Cheng | Integrated circuit package |
| USD937231S1 (en) * | 2020-04-06 | 2021-11-30 | Wolfspeed, Inc. | Power semiconductor package |
| USD969762S1 (en) | 2020-04-06 | 2022-11-15 | Wolfspeed, Inc. | Power semiconductor package |
| USD1042376S1 (en) * | 2022-02-25 | 2024-09-17 | Rohm Co., Ltd. | Semiconductor module |
| USD1050059S1 (en) * | 2022-06-17 | 2024-11-05 | Seiko Epson Corporation | Circuit board for computer printers |
| USD1095474S1 (en) * | 2022-12-02 | 2025-09-30 | Semiconductor Components Industries, Llc | Power module package |
| USD1098055S1 (en) * | 2022-12-02 | 2025-10-14 | Semiconductor Components Industries, Llc | Power module package |
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