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USD396213S - Integrated circuit device - Google Patents

Integrated circuit device Download PDF

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Publication number
USD396213S
USD396213S US29/068,465 US6846597F USD396213S US D396213 S USD396213 S US D396213S US 6846597 F US6846597 F US 6846597F US D396213 S USD396213 S US D396213S
Authority
US
United States
Prior art keywords
integrated circuit
circuit device
view
ornamental design
elevational view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/068,465
Inventor
Yoshinari Enomoto
Satomi Kajiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Assigned to FUJI ELECTRIC CO., LTD. reassignment FUJI ELECTRIC CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ENOMOTO, YOSHINARI, KAJIWARA, SATOMI
Assigned to FUJI ELECTRIC CO., LTD. reassignment FUJI ELECTRIC CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ENOMOTO, YOSHINARI, KAJIWARA, SATOMI
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Application granted granted Critical
Publication of USD396213S publication Critical patent/USD396213S/en
Assigned to FUJI ELECTRIC CO., LTD. reassignment FUJI ELECTRIC CO., LTD. MERGER AND CHANGE OF NAME Assignors: FUJI ELECTRIC SYSTEMS CO., LTD. (FES), FUJI TECHNOSURVEY CO., LTD. (MERGER BY ABSORPTION)
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view of the top, front and left side of an integrated circuit device showing our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a front elevational view thereof; and,
FIG. 7 is a rear elevational view thereof.

Claims (1)

  1. The ornamental design for an integrated circuit device, as shown.
US29/068,465 1996-09-09 1997-03-03 Integrated circuit device Expired - Lifetime USD396213S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2683596 1996-09-09
JP8-26835 1996-09-09

Publications (1)

Publication Number Publication Date
USD396213S true USD396213S (en) 1998-07-21

Family

ID=71597861

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/068,465 Expired - Lifetime USD396213S (en) 1996-09-09 1997-03-03 Integrated circuit device

Country Status (1)

Country Link
US (1) USD396213S (en)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD416872S (en) * 1997-11-06 1999-11-23 Zf Microsystems, Inc. Single component computer
USD418485S (en) * 1998-09-29 2000-01-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD421969S (en) * 1998-09-29 2000-03-28 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD448740S1 (en) 2000-11-30 2001-10-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD920266S1 (en) * 2019-09-29 2021-05-25 China Chippacking Technology Co., Ltd. Integrated circuit package
USD920265S1 (en) * 2019-09-29 2021-05-25 China Chippacking Technology Co., Ltd. Integrated circuit package
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD969762S1 (en) * 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package
USD978809S1 (en) * 2018-04-13 2023-02-21 Rohm Co., Ltd. Semiconductor module
USD1009819S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1009818S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1037187S1 (en) * 2022-05-12 2024-07-30 Alpha And Omega Semiconductor International Lp Power semiconductor module
USD1042375S1 (en) * 2022-05-12 2024-09-17 Alpha And Omega Semiconductor International Lp Power semiconductor module

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4868349A (en) 1988-05-09 1989-09-19 National Semiconductor Corporation Plastic molded pin-grid-array power package
USD317592S (en) 1987-01-19 1991-06-18 Canon Kabushiki Kaisha Semiconductor element
US5220298A (en) 1990-07-24 1993-06-15 Kabushiki Kaisha Toshiba Integrated circuit having a built-in noise filter
US5221859A (en) 1990-02-26 1993-06-22 Hitachi, Ltd. Lead frame for semiconductor device
USD345731S (en) 1992-12-03 1994-04-05 Motorola, Inc. Semiconductor package
USD358806S (en) 1993-09-24 1995-05-30 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
USD359028S (en) 1993-09-02 1995-06-06 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
USD362259S (en) 1993-07-23 1995-09-12 Fuji Electric Co., Ltd. Distance measuring unit for an automatic focusing camera
USD362258S (en) 1993-07-23 1995-09-12 Fuji Electric Co., Ltd. Distance measuring unit for an automatic focusing camera
US5585670A (en) 1995-09-05 1996-12-17 Mitsubishi Electric Semiconductor Software Co. Semiconductor device package

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD317592S (en) 1987-01-19 1991-06-18 Canon Kabushiki Kaisha Semiconductor element
US4868349A (en) 1988-05-09 1989-09-19 National Semiconductor Corporation Plastic molded pin-grid-array power package
US5221859A (en) 1990-02-26 1993-06-22 Hitachi, Ltd. Lead frame for semiconductor device
US5220298A (en) 1990-07-24 1993-06-15 Kabushiki Kaisha Toshiba Integrated circuit having a built-in noise filter
USD345731S (en) 1992-12-03 1994-04-05 Motorola, Inc. Semiconductor package
USD362259S (en) 1993-07-23 1995-09-12 Fuji Electric Co., Ltd. Distance measuring unit for an automatic focusing camera
USD362258S (en) 1993-07-23 1995-09-12 Fuji Electric Co., Ltd. Distance measuring unit for an automatic focusing camera
USD359028S (en) 1993-09-02 1995-06-06 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
USD358806S (en) 1993-09-24 1995-05-30 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
US5585670A (en) 1995-09-05 1996-12-17 Mitsubishi Electric Semiconductor Software Co. Semiconductor device package

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD416872S (en) * 1997-11-06 1999-11-23 Zf Microsystems, Inc. Single component computer
USD418485S (en) * 1998-09-29 2000-01-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD421969S (en) * 1998-09-29 2000-03-28 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD448740S1 (en) 2000-11-30 2001-10-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD864135S1 (en) 2017-10-26 2019-10-22 Mitsubishi Electric Corporation Semiconductor device
USD978809S1 (en) * 2018-04-13 2023-02-21 Rohm Co., Ltd. Semiconductor module
USD920265S1 (en) * 2019-09-29 2021-05-25 China Chippacking Technology Co., Ltd. Integrated circuit package
USD920266S1 (en) * 2019-09-29 2021-05-25 China Chippacking Technology Co., Ltd. Integrated circuit package
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD969762S1 (en) * 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package
USD1009819S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1009818S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1037187S1 (en) * 2022-05-12 2024-07-30 Alpha And Omega Semiconductor International Lp Power semiconductor module
USD1042375S1 (en) * 2022-05-12 2024-09-17 Alpha And Omega Semiconductor International Lp Power semiconductor module

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