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USD978809S1 - Semiconductor module - Google Patents

Semiconductor module Download PDF

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Publication number
USD978809S1
USD978809S1 US29/757,007 US202029757007F USD978809S US D978809 S1 USD978809 S1 US D978809S1 US 202029757007 F US202029757007 F US 202029757007F US D978809 S USD978809 S US D978809S
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US
United States
Prior art keywords
semiconductor module
view
design
taken along
along line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/757,007
Inventor
Takumi Kanda
Masashi Hayashiguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JPD2018-8229F external-priority patent/JP1615979S/ja
Priority claimed from JPD2018-8227F external-priority patent/JP1615884S/ja
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to US29/757,007 priority Critical patent/USD978809S1/en
Application granted granted Critical
Publication of USD978809S1 publication Critical patent/USD978809S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a front, top and right side perspective view of a semiconductor module, showing our new design;
FIG. 2 is a rear, bottom, and left side perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a right side view thereof, the left side view being identical to FIG. 7 ;
FIG. 8 is a cross-sectional view taken along line 8-8 in FIG. 5 ; and,
FIG. 9 is a cross-sectional view taken along line 9-9 in FIG. 5 .
The even broken lines illustrate portions of the semiconductor module and form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design. The member illustrated with fine, diagonal, parallel lines in FIG. 2 and FIG. 6 is transparent.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor module, as shown and described.
US29/757,007 2018-04-13 2020-11-02 Semiconductor module Active USD978809S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/757,007 USD978809S1 (en) 2018-04-13 2020-11-02 Semiconductor module

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JPD2018-8229F JP1615979S (en) 2018-04-13 2018-04-13
JPD2018-8227F JP1615884S (en) 2018-04-13 2018-04-13
JP2018-008229 2018-04-13
JP2018-008227 2018-04-13
US29/666,024 USD906271S1 (en) 2018-04-13 2018-10-09 Semiconductor module
US29/757,007 USD978809S1 (en) 2018-04-13 2020-11-02 Semiconductor module

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/666,024 Division USD906271S1 (en) 2018-04-13 2018-10-09 Semiconductor module

Publications (1)

Publication Number Publication Date
USD978809S1 true USD978809S1 (en) 2023-02-21

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US29/666,024 Active USD906271S1 (en) 2018-04-13 2018-10-09 Semiconductor module
US29/757,007 Active USD978809S1 (en) 2018-04-13 2020-11-02 Semiconductor module

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US29/666,024 Active USD906271S1 (en) 2018-04-13 2018-10-09 Semiconductor module

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US (2) USD906271S1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1009819S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1009818S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1011300S1 (en) * 2021-09-01 2024-01-16 Dexerials Corporation Fuse
USD1037187S1 (en) * 2022-05-12 2024-07-30 Alpha And Omega Semiconductor International Lp Power semiconductor module
USD1042375S1 (en) * 2022-05-12 2024-09-17 Alpha And Omega Semiconductor International Lp Power semiconductor module
USD1049065S1 (en) * 2021-07-12 2024-10-29 Jmj Korea Co., Ltd. Semiconductor package

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD981356S1 (en) * 2020-01-28 2023-03-21 Rohm Co., Ltd. Semiconductor module
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
JP1692095S (en) * 2020-07-31 2021-08-10
USD1034494S1 (en) * 2020-07-31 2024-07-09 Rohm Co., Ltd. Semiconductor device
JP1699856S (en) * 2020-12-15 2021-11-15 semiconductor element
USD1021829S1 (en) * 2021-03-16 2024-04-09 Rohm Co., Ltd. Semiconductor module
USD1022932S1 (en) * 2021-03-16 2024-04-16 Rohm Co., Ltd. Semiconductor module
USD1021830S1 (en) * 2021-03-16 2024-04-09 Rohm Co., Ltd. Semiconductor module
JP1727400S (en) * 2022-01-28 2022-10-14 semiconductor device
JP1727398S (en) * 2022-01-28 2022-10-14 semiconductor element

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USD766851S1 (en) 2015-02-04 2016-09-20 Mitsubishi Electric Corporation Semiconductor device
USD767516S1 (en) 2015-02-04 2016-09-27 Mitsubishi Electric Corporation Semiconductor device
USD770994S1 (en) 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
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USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD856947S1 (en) * 2017-10-19 2019-08-20 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package

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US3846734A (en) * 1973-02-06 1974-11-05 Amp Inc Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates
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USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1049065S1 (en) * 2021-07-12 2024-10-29 Jmj Korea Co., Ltd. Semiconductor package
USD1011300S1 (en) * 2021-09-01 2024-01-16 Dexerials Corporation Fuse
USD1009819S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1009818S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1037187S1 (en) * 2022-05-12 2024-07-30 Alpha And Omega Semiconductor International Lp Power semiconductor module
USD1042375S1 (en) * 2022-05-12 2024-09-17 Alpha And Omega Semiconductor International Lp Power semiconductor module

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