USD978809S1 - Semiconductor module - Google Patents
Semiconductor module Download PDFInfo
- Publication number
- USD978809S1 USD978809S1 US29/757,007 US202029757007F USD978809S US D978809 S1 USD978809 S1 US D978809S1 US 202029757007 F US202029757007 F US 202029757007F US D978809 S USD978809 S US D978809S
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- US
- United States
- Prior art keywords
- semiconductor module
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- design
- taken along
- along line
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Description
The even broken lines illustrate portions of the semiconductor module and form no part of the claimed design. The dash-dotted lines denote the boundary of the claim and form no part of the claimed design. The member illustrated with fine, diagonal, parallel lines in FIG. 2 and FIG. 6 is transparent.
Claims (1)
- The ornamental design for a semiconductor module, as shown and described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29/757,007 USD978809S1 (en) | 2018-04-13 | 2020-11-02 | Semiconductor module |
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2018-8229F JP1615979S (en) | 2018-04-13 | 2018-04-13 | |
| JPD2018-8227F JP1615884S (en) | 2018-04-13 | 2018-04-13 | |
| JP2018-008229 | 2018-04-13 | ||
| JP2018-008227 | 2018-04-13 | ||
| US29/666,024 USD906271S1 (en) | 2018-04-13 | 2018-10-09 | Semiconductor module |
| US29/757,007 USD978809S1 (en) | 2018-04-13 | 2020-11-02 | Semiconductor module |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/666,024 Division USD906271S1 (en) | 2018-04-13 | 2018-10-09 | Semiconductor module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD978809S1 true USD978809S1 (en) | 2023-02-21 |
Family
ID=74041451
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/666,024 Active USD906271S1 (en) | 2018-04-13 | 2018-10-09 | Semiconductor module |
| US29/757,007 Active USD978809S1 (en) | 2018-04-13 | 2020-11-02 | Semiconductor module |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/666,024 Active USD906271S1 (en) | 2018-04-13 | 2018-10-09 | Semiconductor module |
Country Status (1)
| Country | Link |
|---|---|
| US (2) | USD906271S1 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1009819S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
| USD1009818S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
| USD1011300S1 (en) * | 2021-09-01 | 2024-01-16 | Dexerials Corporation | Fuse |
| USD1037187S1 (en) * | 2022-05-12 | 2024-07-30 | Alpha And Omega Semiconductor International Lp | Power semiconductor module |
| USD1042375S1 (en) * | 2022-05-12 | 2024-09-17 | Alpha And Omega Semiconductor International Lp | Power semiconductor module |
| USD1049065S1 (en) * | 2021-07-12 | 2024-10-29 | Jmj Korea Co., Ltd. | Semiconductor package |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD981356S1 (en) * | 2020-01-28 | 2023-03-21 | Rohm Co., Ltd. | Semiconductor module |
| USD972516S1 (en) * | 2020-01-28 | 2022-12-13 | Rohm Co., Ltd. | Semiconductor module |
| USD971863S1 (en) * | 2020-01-28 | 2022-12-06 | Rohm Co., Ltd. | Semiconductor module |
| JP1692095S (en) * | 2020-07-31 | 2021-08-10 | ||
| USD1034494S1 (en) * | 2020-07-31 | 2024-07-09 | Rohm Co., Ltd. | Semiconductor device |
| JP1699856S (en) * | 2020-12-15 | 2021-11-15 | semiconductor element | |
| USD1021829S1 (en) * | 2021-03-16 | 2024-04-09 | Rohm Co., Ltd. | Semiconductor module |
| USD1022932S1 (en) * | 2021-03-16 | 2024-04-16 | Rohm Co., Ltd. | Semiconductor module |
| USD1021830S1 (en) * | 2021-03-16 | 2024-04-09 | Rohm Co., Ltd. | Semiconductor module |
| JP1727400S (en) * | 2022-01-28 | 2022-10-14 | semiconductor device | |
| JP1727398S (en) * | 2022-01-28 | 2022-10-14 | semiconductor element |
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| US8107255B2 (en) | 2007-09-27 | 2012-01-31 | Sanyo Semiconductor Co., Ltd. | Circuit device and method of manufacturing the same |
| USD653634S1 (en) | 2010-10-28 | 2012-02-07 | Fuji Electric Co., Ltd. | Semiconductor |
| USD653633S1 (en) | 2010-12-14 | 2012-02-07 | Fuji Electric Co., Ltd. | Semiconductor |
| USD705184S1 (en) | 2013-07-11 | 2014-05-20 | Fuji Electric Co., Ltd. | Semiconductor module |
| USD712853S1 (en) | 2012-12-21 | 2014-09-09 | Fuji Electric Co., Ltd. | Semiconductor module |
| USD717253S1 (en) | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD717256S1 (en) | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD717255S1 (en) | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD717254S1 (en) | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
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| USD721340S1 (en) | 2012-12-21 | 2015-01-20 | Fuji Electric Co., Ltd. | Semiconductor module |
| JP1551590S (en) | 2015-11-30 | 2016-06-13 | ||
| USD766851S1 (en) | 2015-02-04 | 2016-09-20 | Mitsubishi Electric Corporation | Semiconductor device |
| USD767516S1 (en) | 2015-02-04 | 2016-09-27 | Mitsubishi Electric Corporation | Semiconductor device |
| USD770994S1 (en) | 2014-04-02 | 2016-11-08 | Mitsubishi Electric Corporation | Power semiconductor device |
| JP1565636S (en) | 2016-03-11 | 2016-12-19 | ||
| JP1578687S (en) | 2016-11-08 | 2017-06-12 | ||
| USD852765S1 (en) * | 2017-10-19 | 2019-07-02 | Rohm Co., Ltd. | Semiconductor device |
| USD856947S1 (en) * | 2017-10-19 | 2019-08-20 | Rohm Co., Ltd. | Semiconductor device |
| USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
| USD932452S1 (en) * | 2019-11-27 | 2021-10-05 | The Noco Company | Semiconductor device |
| USD934187S1 (en) * | 2020-01-21 | 2021-10-26 | Lang Cheng | Integrated circuit package |
| USD937231S1 (en) * | 2020-04-06 | 2021-11-30 | Wolfspeed, Inc. | Power semiconductor package |
-
2018
- 2018-10-09 US US29/666,024 patent/USD906271S1/en active Active
-
2020
- 2020-11-02 US US29/757,007 patent/USD978809S1/en active Active
Patent Citations (83)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3602846A (en) | 1969-07-14 | 1971-08-31 | Pulse Eng Inc | Delay line |
| US3825876A (en) | 1971-08-12 | 1974-07-23 | Augat Inc | Electrical component mounting |
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| USD357462S (en) | 1993-09-16 | 1995-04-18 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
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| USD505400S1 (en) | 2004-03-26 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD548202S1 (en) | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
| USD548203S1 (en) | 2006-04-17 | 2007-08-07 | Kabushiki Kaisha Toshiba | Semiconductor |
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| USD810036S1 (en) | 2016-11-08 | 2018-02-13 | Fuji Electric Co., Ltd. | Semiconductor module |
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| USD852765S1 (en) * | 2017-10-19 | 2019-07-02 | Rohm Co., Ltd. | Semiconductor device |
| USD856947S1 (en) * | 2017-10-19 | 2019-08-20 | Rohm Co., Ltd. | Semiconductor device |
| USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
| USD864135S1 (en) * | 2017-10-26 | 2019-10-22 | Mitsubishi Electric Corporation | Semiconductor device |
| USD932452S1 (en) * | 2019-11-27 | 2021-10-05 | The Noco Company | Semiconductor device |
| USD934187S1 (en) * | 2020-01-21 | 2021-10-26 | Lang Cheng | Integrated circuit package |
| USD937231S1 (en) * | 2020-04-06 | 2021-11-30 | Wolfspeed, Inc. | Power semiconductor package |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD1049065S1 (en) * | 2021-07-12 | 2024-10-29 | Jmj Korea Co., Ltd. | Semiconductor package |
| USD1011300S1 (en) * | 2021-09-01 | 2024-01-16 | Dexerials Corporation | Fuse |
| USD1009819S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
| USD1009818S1 (en) * | 2021-10-13 | 2024-01-02 | Rohm Co., Ltd. | Semiconductor device |
| USD1037187S1 (en) * | 2022-05-12 | 2024-07-30 | Alpha And Omega Semiconductor International Lp | Power semiconductor module |
| USD1042375S1 (en) * | 2022-05-12 | 2024-09-17 | Alpha And Omega Semiconductor International Lp | Power semiconductor module |
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