USD470825S1 - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
- Publication number
- USD470825S1 USD470825S1 US29/159,531 US15953102F USD470825S US D470825 S1 USD470825 S1 US D470825S1 US 15953102 F US15953102 F US 15953102F US D470825 S USD470825 S US D470825S
- Authority
- US
- United States
- Prior art keywords
- semiconductor device
- view
- elevational view
- sectional
- taken along
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Description
FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;
FIG. 2 is a front, bottom and right side perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a right side elevational view thereof;
FIG. 8 is a left side elevational view thereof;
FIG. 9 is a cross-sectional view thereof, taken along line 9—9 of FIG. 5, with the internal system omitted;
FIG. 10 is a cross-sectional view thereof, taken along line 10—10 of FIG. 5, with the internal system omitted;
FIG. 11 is a front, top and right side perspective view of a second embodiment of the semiconductor device, showing our new design;
FIG. 12 is a front, bottom and right side perspective view thereof;
FIG. 13 is a front elevational view thereof;
FIG. 14 is a rear elevational view thereof;
FIG. 15 is a top plan view thereof;
FIG. 16 is a bottom plan view thereof;
FIG. 17 is a right side elevational view thereof;
FIG. 18 is a left side elevational view thereof;
FIG. 19 is a cross-sectional view thereof, taken along line 19—19 of FIG. 15, with the internal system omitted; and,
FIG. 20 is a cross-sectional view thereof, taken along line 20—20 of FIG. 15, with the internal system omitted.
Claims (1)
- The ornamental design for a semiconductor device, as shown and described.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001038795 | 2001-12-28 | ||
| JP2001-038795 | 2001-12-28 | ||
| JP2001038794 | 2001-12-28 | ||
| JP2001-038794 | 2001-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD470825S1 true USD470825S1 (en) | 2003-02-25 |
Family
ID=26609470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/159,531 Expired - Lifetime USD470825S1 (en) | 2001-12-28 | 2002-04-24 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD470825S1 (en) |
Cited By (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD505399S1 (en) * | 2003-03-14 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD694724S1 (en) * | 2012-10-03 | 2013-12-03 | Honda Motor Co., Ltd. | Semiconductor device |
| USD699693S1 (en) * | 2012-10-03 | 2014-02-18 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD704671S1 (en) * | 2013-01-24 | 2014-05-13 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD704670S1 (en) * | 2013-01-24 | 2014-05-13 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD710317S1 (en) * | 2013-01-24 | 2014-08-05 | Fuji Electric Co., Inc. | Semiconductor device |
| USD710319S1 (en) * | 2013-01-24 | 2014-08-05 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD710318S1 (en) * | 2013-01-24 | 2014-08-05 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD717255S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD717254S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD717253S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD717256S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD719113S1 (en) * | 2012-09-20 | 2014-12-09 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD719537S1 (en) * | 2013-05-08 | 2014-12-16 | Mitsubishi Electric Corporation | Semiconductor device |
| USD719926S1 (en) * | 2012-09-20 | 2014-12-23 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD731491S1 (en) * | 2014-02-07 | 2015-06-09 | NimbeLink L.L.C. | Embedded cellular modem |
| USD770994S1 (en) * | 2014-04-02 | 2016-11-08 | Mitsubishi Electric Corporation | Power semiconductor device |
| US9497570B2 (en) | 2014-02-06 | 2016-11-15 | Nimbelink Corp. | Embedded wireless modem |
| USD839220S1 (en) * | 2013-02-19 | 2019-01-29 | Sony Corporation | Semiconductor device |
| USD877102S1 (en) * | 2017-12-28 | 2020-03-03 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor module |
| USD903613S1 (en) | 2018-06-26 | 2020-12-01 | Rohm Co., Ltd. | Semiconductor module |
| USD906271S1 (en) * | 2018-04-13 | 2020-12-29 | Rohm Co., Ltd. | Semiconductor module |
| USD913978S1 (en) * | 2018-06-26 | 2021-03-23 | Rohm Co., Ltd. | Semiconductor module |
| USD971863S1 (en) * | 2020-01-28 | 2022-12-06 | Rohm Co., Ltd. | Semiconductor module |
| USD972516S1 (en) * | 2020-01-28 | 2022-12-13 | Rohm Co., Ltd. | Semiconductor module |
| USD981356S1 (en) * | 2020-01-28 | 2023-03-21 | Rohm Co., Ltd. | Semiconductor module |
| USD1017533S1 (en) * | 2022-01-28 | 2024-03-12 | Mitsubishi Electric Corporation | Semiconductor device |
| USD1046801S1 (en) * | 2022-01-28 | 2024-10-15 | Mitsubishi Electric Corporation | Semiconductor device |
| USD1046800S1 (en) * | 2022-01-28 | 2024-10-15 | Mitsubishi Electric Corporation | Semiconductor device |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5221859A (en) | 1990-02-26 | 1993-06-22 | Hitachi, Ltd. | Lead frame for semiconductor device |
| USD357462S (en) | 1993-09-16 | 1995-04-18 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
| USD357671S (en) | 1993-09-16 | 1995-04-25 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
| USD360619S (en) | 1993-09-16 | 1995-07-25 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
| USD394244S (en) | 1995-11-27 | 1998-05-12 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| US5757070A (en) | 1995-10-24 | 1998-05-26 | Altera Corporation | Integrated circuit package |
| USD401912S (en) | 1995-11-27 | 1998-12-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| US5877548A (en) | 1996-06-24 | 1999-03-02 | Mitsubishi Denki Kabushiki Kaisha | Terminal configuration in semiconductor IC device |
| USD421969S (en) | 1998-09-29 | 2000-03-28 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD448739S1 (en) | 2000-09-12 | 2001-10-02 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD459705S1 (en) | 2001-03-06 | 2002-07-02 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor package |
-
2002
- 2002-04-24 US US29/159,531 patent/USD470825S1/en not_active Expired - Lifetime
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5221859A (en) | 1990-02-26 | 1993-06-22 | Hitachi, Ltd. | Lead frame for semiconductor device |
| USD357462S (en) | 1993-09-16 | 1995-04-18 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
| USD357671S (en) | 1993-09-16 | 1995-04-25 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
| USD360619S (en) | 1993-09-16 | 1995-07-25 | Fuji Electric Co., Ltd. | Hybrid integrated circuit for electric power control |
| US5757070A (en) | 1995-10-24 | 1998-05-26 | Altera Corporation | Integrated circuit package |
| USD394244S (en) | 1995-11-27 | 1998-05-12 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD401912S (en) | 1995-11-27 | 1998-12-01 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| US5877548A (en) | 1996-06-24 | 1999-03-02 | Mitsubishi Denki Kabushiki Kaisha | Terminal configuration in semiconductor IC device |
| USD421969S (en) | 1998-09-29 | 2000-03-28 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD448739S1 (en) | 2000-09-12 | 2001-10-02 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD459705S1 (en) | 2001-03-06 | 2002-07-02 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor package |
Cited By (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD505399S1 (en) * | 2003-03-14 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| USD719926S1 (en) * | 2012-09-20 | 2014-12-23 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD719113S1 (en) * | 2012-09-20 | 2014-12-09 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD717256S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD717255S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD694724S1 (en) * | 2012-10-03 | 2013-12-03 | Honda Motor Co., Ltd. | Semiconductor device |
| USD699693S1 (en) * | 2012-10-03 | 2014-02-18 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD717254S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD717253S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD704671S1 (en) * | 2013-01-24 | 2014-05-13 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD710318S1 (en) * | 2013-01-24 | 2014-08-05 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD710319S1 (en) * | 2013-01-24 | 2014-08-05 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD710317S1 (en) * | 2013-01-24 | 2014-08-05 | Fuji Electric Co., Inc. | Semiconductor device |
| USD704670S1 (en) * | 2013-01-24 | 2014-05-13 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD839220S1 (en) * | 2013-02-19 | 2019-01-29 | Sony Corporation | Semiconductor device |
| USD769834S1 (en) | 2013-05-08 | 2016-10-25 | Mitsubishi Electric Corporation | Semiconductor device |
| USD719537S1 (en) * | 2013-05-08 | 2014-12-16 | Mitsubishi Electric Corporation | Semiconductor device |
| US9497570B2 (en) | 2014-02-06 | 2016-11-15 | Nimbelink Corp. | Embedded wireless modem |
| USD731491S1 (en) * | 2014-02-07 | 2015-06-09 | NimbeLink L.L.C. | Embedded cellular modem |
| USD770994S1 (en) * | 2014-04-02 | 2016-11-08 | Mitsubishi Electric Corporation | Power semiconductor device |
| USD772182S1 (en) * | 2014-04-02 | 2016-11-22 | Mitsubishi Electric Corporation | Power semiconductor device |
| USD777124S1 (en) * | 2014-04-02 | 2017-01-24 | Mitsubishi Electric Corporation | Power semiconductor device |
| USD783550S1 (en) * | 2014-04-02 | 2017-04-11 | Mitsubishi Electric Corporation | Power semiconductor device |
| USD877102S1 (en) * | 2017-12-28 | 2020-03-03 | Shindengen Electric Manufacturing Co., Ltd. | Semiconductor module |
| USD978809S1 (en) | 2018-04-13 | 2023-02-21 | Rohm Co., Ltd. | Semiconductor module |
| USD906271S1 (en) * | 2018-04-13 | 2020-12-29 | Rohm Co., Ltd. | Semiconductor module |
| USD903613S1 (en) | 2018-06-26 | 2020-12-01 | Rohm Co., Ltd. | Semiconductor module |
| USD913978S1 (en) * | 2018-06-26 | 2021-03-23 | Rohm Co., Ltd. | Semiconductor module |
| USD971863S1 (en) * | 2020-01-28 | 2022-12-06 | Rohm Co., Ltd. | Semiconductor module |
| USD972516S1 (en) * | 2020-01-28 | 2022-12-13 | Rohm Co., Ltd. | Semiconductor module |
| USD981356S1 (en) * | 2020-01-28 | 2023-03-21 | Rohm Co., Ltd. | Semiconductor module |
| USD1017533S1 (en) * | 2022-01-28 | 2024-03-12 | Mitsubishi Electric Corporation | Semiconductor device |
| USD1046801S1 (en) * | 2022-01-28 | 2024-10-15 | Mitsubishi Electric Corporation | Semiconductor device |
| USD1046800S1 (en) * | 2022-01-28 | 2024-10-15 | Mitsubishi Electric Corporation | Semiconductor device |
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