USD472530S1 - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
- Publication number
- USD472530S1 USD472530S1 US29/156,527 US15652702F USD472530S US D472530 S1 USD472530 S1 US D472530S1 US 15652702 F US15652702 F US 15652702F US D472530 S USD472530 S US D472530S
- Authority
- US
- United States
- Prior art keywords
- semiconductor device
- view
- elevational view
- ornamental design
- side perspective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
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Description
FIG. 1 is a front, top and right side perspective view of a semiconductor device, showing our new design;
FIG. 2 is a rear, bottom and left side perspective view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a left side elevational view thereof;
FIG. 8 is a right side elevational view thereof; and,
FIG. 9 is a cross-sectional view thereof, taken along line 9—9 of FIG. 3, with the internal system omitted.
Claims (1)
- The ornamental design for a semiconductor device, as shown and described.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001035252 | 2001-11-30 | ||
| JP2001-035252 | 2001-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD472530S1 true USD472530S1 (en) | 2003-04-01 |
Family
ID=18898726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/156,527 Expired - Lifetime USD472530S1 (en) | 2001-11-30 | 2002-03-04 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD472530S1 (en) |
Cited By (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD505400S1 (en) * | 2004-03-26 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| US20090233466A1 (en) * | 2008-03-11 | 2009-09-17 | Delta Electronics, Inc. | Surface-mounted circuit board module and process for fabricating the same |
| USD694724S1 (en) * | 2012-10-03 | 2013-12-03 | Honda Motor Co., Ltd. | Semiconductor device |
| USD699693S1 (en) * | 2012-10-03 | 2014-02-18 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD717255S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD717253S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD717256S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD717254S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD719113S1 (en) * | 2012-09-20 | 2014-12-09 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD719926S1 (en) * | 2012-09-20 | 2014-12-23 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD770994S1 (en) * | 2014-04-02 | 2016-11-08 | Mitsubishi Electric Corporation | Power semiconductor device |
| USD839220S1 (en) * | 2013-02-19 | 2019-01-29 | Sony Corporation | Semiconductor device |
| USD914621S1 (en) * | 2019-05-14 | 2021-03-30 | Rohm Co., Ltd. | Packaged semiconductor module |
| USD920264S1 (en) * | 2019-11-27 | 2021-05-25 | The Noco Company | Semiconductor device |
| USD932452S1 (en) * | 2019-11-27 | 2021-10-05 | The Noco Company | Semiconductor device |
| USD1012049S1 (en) * | 2021-03-19 | 2024-01-23 | Rohm Co., Ltd. | Semiconductor module |
| USD1012048S1 (en) * | 2021-03-19 | 2024-01-23 | Rohm Co., Ltd. | Semiconductor module |
| USD1013648S1 (en) * | 2021-03-19 | 2024-02-06 | Rohm Co., Ltd. | Semiconductor module |
| USD1013647S1 (en) * | 2021-03-19 | 2024-02-06 | Rohm Co., Ltd. | Semiconductor module |
| USD1015283S1 (en) * | 2021-03-19 | 2024-02-20 | Rohm Co., Ltd. | Semiconductor module |
| USD1015284S1 (en) * | 2021-03-19 | 2024-02-20 | Rohm Co., Ltd. | Semiconductor module |
| USD1021831S1 (en) * | 2021-03-23 | 2024-04-09 | Rohm Co., Ltd. | Power semiconductor module |
| USD1030686S1 (en) * | 2021-03-23 | 2024-06-11 | Rohm Co., Ltd. | Power semiconductor module |
| USD1046800S1 (en) * | 2022-01-28 | 2024-10-15 | Mitsubishi Electric Corporation | Semiconductor device |
| USD1046801S1 (en) * | 2022-01-28 | 2024-10-15 | Mitsubishi Electric Corporation | Semiconductor device |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4951124A (en) | 1986-10-24 | 1990-08-21 | Kabushiki Kaisha Toshiba | Semiconductor device |
| US4985747A (en) | 1988-06-09 | 1991-01-15 | Oki Electric Industry Co., Ltd. | Terminal structure and process of fabricating the same |
| USD358806S (en) | 1993-09-24 | 1995-05-30 | Sgs-Thomson Microelectronics, Inc. | Socketed integrated circuit package |
| US5889658A (en) | 1997-11-25 | 1999-03-30 | Motorola, Inc. | Package assembly for an electronic component |
| USD421969S (en) | 1998-09-29 | 2000-03-28 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| US6100580A (en) | 1988-09-20 | 2000-08-08 | Hitachi, Ltd. | Semiconductor device having all outer leads extending from one side of a resin member |
| US6114759A (en) | 1998-04-23 | 2000-09-05 | Nec Corporation | Semiconductor package |
| USD448740S1 (en) | 2000-11-30 | 2001-10-02 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| US6444905B1 (en) | 1998-12-24 | 2002-09-03 | Hitachi, Ltd. | Semiconductor device |
-
2002
- 2002-03-04 US US29/156,527 patent/USD472530S1/en not_active Expired - Lifetime
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4951124A (en) | 1986-10-24 | 1990-08-21 | Kabushiki Kaisha Toshiba | Semiconductor device |
| US4985747A (en) | 1988-06-09 | 1991-01-15 | Oki Electric Industry Co., Ltd. | Terminal structure and process of fabricating the same |
| US6100580A (en) | 1988-09-20 | 2000-08-08 | Hitachi, Ltd. | Semiconductor device having all outer leads extending from one side of a resin member |
| USD358806S (en) | 1993-09-24 | 1995-05-30 | Sgs-Thomson Microelectronics, Inc. | Socketed integrated circuit package |
| US5889658A (en) | 1997-11-25 | 1999-03-30 | Motorola, Inc. | Package assembly for an electronic component |
| US6114759A (en) | 1998-04-23 | 2000-09-05 | Nec Corporation | Semiconductor package |
| USD421969S (en) | 1998-09-29 | 2000-03-28 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| US6444905B1 (en) | 1998-12-24 | 2002-09-03 | Hitachi, Ltd. | Semiconductor device |
| USD448740S1 (en) | 2000-11-30 | 2001-10-02 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
Cited By (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD505400S1 (en) * | 2004-03-26 | 2005-05-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| US20090233466A1 (en) * | 2008-03-11 | 2009-09-17 | Delta Electronics, Inc. | Surface-mounted circuit board module and process for fabricating the same |
| USD717255S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD717256S1 (en) * | 2012-09-20 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD719113S1 (en) * | 2012-09-20 | 2014-12-09 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD719926S1 (en) * | 2012-09-20 | 2014-12-23 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD694724S1 (en) * | 2012-10-03 | 2013-12-03 | Honda Motor Co., Ltd. | Semiconductor device |
| USD699693S1 (en) * | 2012-10-03 | 2014-02-18 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD717253S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD717254S1 (en) * | 2012-10-11 | 2014-11-11 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor device |
| USD839220S1 (en) * | 2013-02-19 | 2019-01-29 | Sony Corporation | Semiconductor device |
| USD772182S1 (en) * | 2014-04-02 | 2016-11-22 | Mitsubishi Electric Corporation | Power semiconductor device |
| USD777124S1 (en) * | 2014-04-02 | 2017-01-24 | Mitsubishi Electric Corporation | Power semiconductor device |
| USD783550S1 (en) * | 2014-04-02 | 2017-04-11 | Mitsubishi Electric Corporation | Power semiconductor device |
| USD770994S1 (en) * | 2014-04-02 | 2016-11-08 | Mitsubishi Electric Corporation | Power semiconductor device |
| USD914621S1 (en) * | 2019-05-14 | 2021-03-30 | Rohm Co., Ltd. | Packaged semiconductor module |
| USD920264S1 (en) * | 2019-11-27 | 2021-05-25 | The Noco Company | Semiconductor device |
| USD932452S1 (en) * | 2019-11-27 | 2021-10-05 | The Noco Company | Semiconductor device |
| USD1012048S1 (en) * | 2021-03-19 | 2024-01-23 | Rohm Co., Ltd. | Semiconductor module |
| USD1012049S1 (en) * | 2021-03-19 | 2024-01-23 | Rohm Co., Ltd. | Semiconductor module |
| USD1013648S1 (en) * | 2021-03-19 | 2024-02-06 | Rohm Co., Ltd. | Semiconductor module |
| USD1013647S1 (en) * | 2021-03-19 | 2024-02-06 | Rohm Co., Ltd. | Semiconductor module |
| USD1015283S1 (en) * | 2021-03-19 | 2024-02-20 | Rohm Co., Ltd. | Semiconductor module |
| USD1015284S1 (en) * | 2021-03-19 | 2024-02-20 | Rohm Co., Ltd. | Semiconductor module |
| USD1021831S1 (en) * | 2021-03-23 | 2024-04-09 | Rohm Co., Ltd. | Power semiconductor module |
| USD1030686S1 (en) * | 2021-03-23 | 2024-06-11 | Rohm Co., Ltd. | Power semiconductor module |
| USD1046800S1 (en) * | 2022-01-28 | 2024-10-15 | Mitsubishi Electric Corporation | Semiconductor device |
| USD1046801S1 (en) * | 2022-01-28 | 2024-10-15 | Mitsubishi Electric Corporation | Semiconductor device |
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