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USD345731S - Semiconductor package - Google Patents

Semiconductor package Download PDF

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Publication number
USD345731S
USD345731S US29/002,224 US222492F USD345731S US D345731 S USD345731 S US D345731S US 222492 F US222492 F US 222492F US D345731 S USD345731 S US D345731S
Authority
US
United States
Prior art keywords
semiconductor package
ornamental design
view
package
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/002,224
Inventor
Norman L. Owens
Timothy L. Olson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP USA Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Priority to US29/002,224 priority Critical patent/USD345731S/en
Assigned to MOTOROLA, INC. reassignment MOTOROLA, INC. ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: OLSON, TIMOTHY L., OWENS, NORMAN L.
Application granted granted Critical
Publication of USD345731S publication Critical patent/USD345731S/en
Assigned to FREESCALE SEMICONDUCTOR, INC. reassignment FREESCALE SEMICONDUCTOR, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MOTOROLA, INC.
Assigned to CITIBANK, N.A. AS COLLATERAL AGENT reassignment CITIBANK, N.A. AS COLLATERAL AGENT SECURITY AGREEMENT Assignors: FREESCALE ACQUISITION CORPORATION, FREESCALE ACQUISITION HOLDINGS CORP., FREESCALE HOLDINGS (BERMUDA) III, LTD., FREESCALE SEMICONDUCTOR, INC.
Anticipated expiration legal-status Critical
Assigned to FREESCALE SEMICONDUCTOR, INC. reassignment FREESCALE SEMICONDUCTOR, INC. PATENT RELEASE Assignors: CITIBANK, N.A., AS COLLATERAL AGENT
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front and upper right perspective view of a semiconductor package showing our new design;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a side elevational view thereof; and,
FIG. 4 is a bottom plan view thereof.

Claims (1)

  1. The ornamental design for a semiconductor package, as shown and described.
US29/002,224 1992-12-03 1992-12-03 Semiconductor package Expired - Lifetime USD345731S (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/002,224 USD345731S (en) 1992-12-03 1992-12-03 Semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/002,224 USD345731S (en) 1992-12-03 1992-12-03 Semiconductor package

Publications (1)

Publication Number Publication Date
USD345731S true USD345731S (en) 1994-04-05

Family

ID=71016187

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/002,224 Expired - Lifetime USD345731S (en) 1992-12-03 1992-12-03 Semiconductor package

Country Status (1)

Country Link
US (1) USD345731S (en)

Cited By (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD396213S (en) 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD396211S (en) 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD396212S (en) 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD396450S (en) 1996-12-24 1998-07-28 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD396846S (en) 1997-04-16 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD396847S (en) 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD397092S (en) 1997-01-03 1998-08-18 Fujitsu Limited Integrated circuit package
USD416236S (en) 1998-09-02 1999-11-09 Citizen Electronics Co., Ltd. Integrated circuit package
USD427977S (en) * 1999-06-18 2000-07-11 Fujikura Ltd. Piezoelectric conversion type semiconductor device
USD444132S1 (en) 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
USD458234S1 (en) 2001-02-15 2002-06-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD459316S1 (en) 2001-02-15 2002-06-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD459317S1 (en) 2001-02-15 2002-06-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD460744S1 (en) 2001-02-15 2002-07-23 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD460951S1 (en) 2001-02-15 2002-07-30 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD461171S1 (en) 2001-02-15 2002-08-06 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD465773S1 (en) 2001-08-31 2002-11-19 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD466873S1 (en) 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
USD472528S1 (en) 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
USD522978S1 (en) 2004-06-25 2006-06-13 Matsushita Electric Industrial Co., Ltd. Information storage semiconductor element
USD525214S1 (en) 2004-06-25 2006-07-18 Matsushita Electrical Industrial Co., Ltd. Information storage semiconductor element
USD594827S1 (en) * 2006-12-07 2009-06-23 Cree, Inc. Lamp package
USD719537S1 (en) * 2013-05-08 2014-12-16 Mitsubishi Electric Corporation Semiconductor device
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD732488S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD732487S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD738834S1 (en) * 2014-07-29 2015-09-15 Jianhui Xie Driver circuit integrated LED module
USD758329S1 (en) * 2013-08-06 2016-06-07 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD901405S1 (en) * 2017-03-28 2020-11-10 Rohm Co., Ltd. Semiconductor device
USD902877S1 (en) * 2018-06-12 2020-11-24 Rohm Co., Ltd. Packaged semiconductor module
USD914621S1 (en) * 2019-05-14 2021-03-30 Rohm Co., Ltd. Packaged semiconductor module
USD920264S1 (en) * 2019-11-27 2021-05-25 The Noco Company Semiconductor device
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
USD945384S1 (en) * 2019-09-26 2022-03-08 Lapis Semiconductor Co., Ltd. Semiconductor module
USD1042376S1 (en) * 2022-02-25 2024-09-17 Rohm Co., Ltd. Semiconductor module
USD1095474S1 (en) * 2022-12-02 2025-09-30 Semiconductor Components Industries, Llc Power module package

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD259560S (en) 1978-07-28 1981-06-16 Hitachi, Ltd. Semiconductor
USD260986S (en) 1978-08-25 1981-09-29 Hitachi, Ltd. Semiconductor
USD288922S (en) 1984-04-19 1987-03-24 Thomson Components-Mostek Corporation Zero power random access memory package
USD318271S (en) 1987-07-04 1991-07-16 Terutomi Hasegawa Substrate for mounting semiconductors
US5109269A (en) 1991-07-08 1992-04-28 Ofer Holzman Method and means for positioning surface mounted electronic components on a printed wiring board

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD259560S (en) 1978-07-28 1981-06-16 Hitachi, Ltd. Semiconductor
USD260986S (en) 1978-08-25 1981-09-29 Hitachi, Ltd. Semiconductor
USD288922S (en) 1984-04-19 1987-03-24 Thomson Components-Mostek Corporation Zero power random access memory package
USD318271S (en) 1987-07-04 1991-07-16 Terutomi Hasegawa Substrate for mounting semiconductors
US5109269A (en) 1991-07-08 1992-04-28 Ofer Holzman Method and means for positioning surface mounted electronic components on a printed wiring board

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Mini-Circuits' YSW-2-50DR semiconductor package on p. 5 of EDN Jan. 1991.

Cited By (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD396213S (en) 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD396211S (en) 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD396212S (en) 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD396847S (en) 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD396450S (en) 1996-12-24 1998-07-28 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD397092S (en) 1997-01-03 1998-08-18 Fujitsu Limited Integrated circuit package
USD396846S (en) 1997-04-16 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD416236S (en) 1998-09-02 1999-11-09 Citizen Electronics Co., Ltd. Integrated circuit package
USD427977S (en) * 1999-06-18 2000-07-11 Fujikura Ltd. Piezoelectric conversion type semiconductor device
USD444132S1 (en) 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
USD458234S1 (en) 2001-02-15 2002-06-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD459316S1 (en) 2001-02-15 2002-06-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD459317S1 (en) 2001-02-15 2002-06-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD460744S1 (en) 2001-02-15 2002-07-23 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD460951S1 (en) 2001-02-15 2002-07-30 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD461171S1 (en) 2001-02-15 2002-08-06 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD465773S1 (en) 2001-08-31 2002-11-19 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD466873S1 (en) 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
USD472528S1 (en) 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
USD522978S1 (en) 2004-06-25 2006-06-13 Matsushita Electric Industrial Co., Ltd. Information storage semiconductor element
USD525214S1 (en) 2004-06-25 2006-07-18 Matsushita Electrical Industrial Co., Ltd. Information storage semiconductor element
USD594827S1 (en) * 2006-12-07 2009-06-23 Cree, Inc. Lamp package
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
USD719537S1 (en) * 2013-05-08 2014-12-16 Mitsubishi Electric Corporation Semiconductor device
USD769834S1 (en) 2013-05-08 2016-10-25 Mitsubishi Electric Corporation Semiconductor device
USD732488S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD732487S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD758329S1 (en) * 2013-08-06 2016-06-07 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD738834S1 (en) * 2014-07-29 2015-09-15 Jianhui Xie Driver circuit integrated LED module
USD901405S1 (en) * 2017-03-28 2020-11-10 Rohm Co., Ltd. Semiconductor device
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD864135S1 (en) 2017-10-26 2019-10-22 Mitsubishi Electric Corporation Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD902877S1 (en) * 2018-06-12 2020-11-24 Rohm Co., Ltd. Packaged semiconductor module
USD914621S1 (en) * 2019-05-14 2021-03-30 Rohm Co., Ltd. Packaged semiconductor module
USD945384S1 (en) * 2019-09-26 2022-03-08 Lapis Semiconductor Co., Ltd. Semiconductor module
USD920264S1 (en) * 2019-11-27 2021-05-25 The Noco Company Semiconductor device
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
USD969762S1 (en) 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package
USD1042376S1 (en) * 2022-02-25 2024-09-17 Rohm Co., Ltd. Semiconductor module
USD1095474S1 (en) * 2022-12-02 2025-09-30 Semiconductor Components Industries, Llc Power module package
USD1098055S1 (en) * 2022-12-02 2025-10-14 Semiconductor Components Industries, Llc Power module package

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