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USD732487S1 - Partial semiconductor light emitting component - Google Patents

Partial semiconductor light emitting component Download PDF

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Publication number
USD732487S1
USD732487S1 US29/479,810 US201429479810F USD732487S US D732487 S1 USD732487 S1 US D732487S1 US 201429479810 F US201429479810 F US 201429479810F US D732487 S USD732487 S US D732487S
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US
United States
Prior art keywords
light emitting
semiconductor light
emitting component
partial semiconductor
partial
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/479,810
Inventor
Lung-Kuan Lai
Jen-Chih Li
Wei-Kang Cheng
Shyi-Ming Pan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Epistar Corp
Original Assignee
Formosa Epitaxy Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Formosa Epitaxy Inc filed Critical Formosa Epitaxy Inc
Assigned to FORMOSA EPITAXY INCORPORATION reassignment FORMOSA EPITAXY INCORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHENG, WEI-KANG, LAI, LUNG-KUAN, LI, JEN-CHIH, PAN, SHYI-MING
Application granted granted Critical
Publication of USD732487S1 publication Critical patent/USD732487S1/en
Assigned to EPISTAR CORPORATION reassignment EPISTAR CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FORMOSA EPITAXY INCORPORATION
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a perspective view of a partial semiconductor light emitting component showing our new design; and,
FIG. 2 is a top plan view thereof.
A bottom plan view, a front elevation view, a rear elevation view, a right side view, and a left side view of a partial semiconductor light emitting component form no part of the claimed design.
The broken lines shown in the drawings represent unclaimed portions of the partial semiconductor light emitting component and form no part of the claimed design.
The dash-dot-dash lines represent a boundary between the clamed design subject matter and the unclaimed design subject matter.

Claims (1)

    CLAIM
  1. The ornamental design for a partial semiconductor light emitting component, as shown and described.
US29/479,810 2013-08-06 2014-01-21 Partial semiconductor light emitting component Active USD732487S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW102305358 2013-08-06
TW102305358F TWD161478S (en) 2013-08-06 2013-08-06 Semiconductor light emitting device parts

Publications (1)

Publication Number Publication Date
USD732487S1 true USD732487S1 (en) 2015-06-23

Family

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US29/479,810 Active USD732487S1 (en) 2013-08-06 2014-01-21 Partial semiconductor light emitting component

Country Status (2)

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US (1) USD732487S1 (en)
TW (1) TWD161478S (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD752000S1 (en) * 2013-03-07 2016-03-22 Vlt, Inc. Semiconductor device
US9786825B2 (en) 2012-02-07 2017-10-10 Cree, Inc. Ceramic-based light emitting diode (LED) devices, components, and methods
US9806246B2 (en) 2012-02-07 2017-10-31 Cree, Inc. Ceramic-based light emitting diode (LED) devices, components, and methods
US9826581B2 (en) 2014-12-05 2017-11-21 Cree, Inc. Voltage configurable solid state lighting apparatuses, systems, and related methods
USD820817S1 (en) * 2017-03-06 2018-06-19 Fitivision Technology Inc. Antenna used in wireless communication
USD831009S1 (en) * 2015-12-11 2018-10-16 Gemalto M2M Gmbh Radio module
US10267506B2 (en) 2010-11-22 2019-04-23 Cree, Inc. Solid state lighting apparatuses with non-uniformly spaced emitters for improved heat distribution, system having the same, and methods having the same
USD905647S1 (en) * 2018-07-20 2020-12-22 Heatscape.Com, Inc. Combination heat pipe and heat sink
USD935424S1 (en) * 2019-05-06 2021-11-09 Lam Research Corporation Semiconductor wafer processing tool
USD967818S1 (en) * 2019-09-17 2022-10-25 Samsung Display Co., Ltd. Display panel
USD1044788S1 (en) 2019-04-24 2024-10-01 Samsung Display Co., Ltd. Cover window for a display panel

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD186014S (en) 2016-09-29 2017-10-11 新世紀光電股份有限公司 Portion of light emitting diode module

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USD345731S (en) * 1992-12-03 1994-04-05 Motorola, Inc. Semiconductor package
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USD396846S (en) * 1997-04-16 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD444132S1 (en) * 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
US20010019245A1 (en) * 2000-02-22 2001-09-06 Isamu Ohshita Organic electroluminescent display panel and method of manufacturing the same
USD466873S1 (en) * 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
USD472528S1 (en) * 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
USD473199S1 (en) * 2001-11-30 2003-04-15 Kabushiki Kaisha Toshiba Portion of semiconductor device
USD476962S1 (en) * 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device
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USD499384S1 (en) * 2001-12-28 2004-12-07 Nichia Corporation Light emitting diode
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USD508682S1 (en) * 2004-02-23 2005-08-23 Kabushiki Kaisha Toshiba Semiconductor device
USD510728S1 (en) * 2004-08-11 2005-10-18 Semiconductor Components Industries Llc Semiconductor device package
US20080303408A1 (en) * 2001-06-20 2008-12-11 Semiconductor Energy Laboratory Co., Ltd. Light emitting device and method of manufacturing the same
US20090267526A1 (en) * 2008-04-28 2009-10-29 Samsung Electronics Co., Ltd. Organic light-emitting diode display device
US20110095701A1 (en) * 2009-10-27 2011-04-28 Panasonic Electric Works Co., Ltd. Light emitting module
USD638810S1 (en) * 2010-05-14 2011-05-31 Panasonic Corporation Substrate for light source of light emitting diode
USD642996S1 (en) * 2010-04-09 2011-08-09 Panasonic Electric Works Co., Ltd. Electroluminescence apparatus
USD664508S1 (en) * 2011-02-04 2012-07-31 Panasonic Corporation Electroluminescence module
USD664506S1 (en) * 2011-02-04 2012-07-31 Panasonic Corporation Electroluminescence module
USD684125S1 (en) * 2011-08-30 2013-06-11 Panasonic Corporation Electroluminescence module
USD684124S1 (en) * 2011-09-07 2013-06-11 Panasonic Corporation Electroluminescence module
USD684126S1 (en) * 2011-08-30 2013-06-11 Panasonic Corporation Electroluminescence module assembly
USD687394S1 (en) * 2011-02-04 2013-08-06 Panasonic Corporation Electroluminescence module
USD690277S1 (en) * 2011-09-07 2013-09-24 Panasonic Corporation Electroluminescence module
USD701843S1 (en) * 2010-12-28 2014-04-01 Sumitomo Electric Industries, Ltd. Semiconductor device

Patent Citations (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4127792A (en) * 1976-06-01 1978-11-28 Mitsubishi Denki Kabushiki Kaisha Luminescent semiconductor display device including gate control electrodes
USD345731S (en) * 1992-12-03 1994-04-05 Motorola, Inc. Semiconductor package
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD396846S (en) * 1997-04-16 1998-08-11 Matsushita Electronics Corporation Semiconductor device
US20010019245A1 (en) * 2000-02-22 2001-09-06 Isamu Ohshita Organic electroluminescent display panel and method of manufacturing the same
USD444132S1 (en) * 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
US20080303408A1 (en) * 2001-06-20 2008-12-11 Semiconductor Energy Laboratory Co., Ltd. Light emitting device and method of manufacturing the same
USD466873S1 (en) * 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
USD472528S1 (en) * 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
USD473199S1 (en) * 2001-11-30 2003-04-15 Kabushiki Kaisha Toshiba Portion of semiconductor device
USD480371S1 (en) * 2001-11-30 2003-10-07 Kabushiki Kaisha Toshiba Semiconductor device
USD499384S1 (en) * 2001-12-28 2004-12-07 Nichia Corporation Light emitting diode
USD476962S1 (en) * 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device
USD476959S1 (en) * 2002-07-31 2003-07-08 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD489338S1 (en) * 2003-07-28 2004-05-04 Semiconductor Components Industries, L.L.C. Packaged semiconductor device
US20050168143A1 (en) * 2004-02-04 2005-08-04 Lg Electronics Inc. Electro-luminescence display device
USD508682S1 (en) * 2004-02-23 2005-08-23 Kabushiki Kaisha Toshiba Semiconductor device
USD504874S1 (en) * 2004-08-11 2005-05-10 Semiconductor Components Industries, Llc Semiconductor device package
USD510728S1 (en) * 2004-08-11 2005-10-18 Semiconductor Components Industries Llc Semiconductor device package
US20090267526A1 (en) * 2008-04-28 2009-10-29 Samsung Electronics Co., Ltd. Organic light-emitting diode display device
US20110095701A1 (en) * 2009-10-27 2011-04-28 Panasonic Electric Works Co., Ltd. Light emitting module
USD642996S1 (en) * 2010-04-09 2011-08-09 Panasonic Electric Works Co., Ltd. Electroluminescence apparatus
USD638810S1 (en) * 2010-05-14 2011-05-31 Panasonic Corporation Substrate for light source of light emitting diode
USD701843S1 (en) * 2010-12-28 2014-04-01 Sumitomo Electric Industries, Ltd. Semiconductor device
USD664506S1 (en) * 2011-02-04 2012-07-31 Panasonic Corporation Electroluminescence module
USD687394S1 (en) * 2011-02-04 2013-08-06 Panasonic Corporation Electroluminescence module
USD664508S1 (en) * 2011-02-04 2012-07-31 Panasonic Corporation Electroluminescence module
USD684125S1 (en) * 2011-08-30 2013-06-11 Panasonic Corporation Electroluminescence module
USD684126S1 (en) * 2011-08-30 2013-06-11 Panasonic Corporation Electroluminescence module assembly
USD684124S1 (en) * 2011-09-07 2013-06-11 Panasonic Corporation Electroluminescence module
USD690277S1 (en) * 2011-09-07 2013-09-24 Panasonic Corporation Electroluminescence module

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10267506B2 (en) 2010-11-22 2019-04-23 Cree, Inc. Solid state lighting apparatuses with non-uniformly spaced emitters for improved heat distribution, system having the same, and methods having the same
US9786825B2 (en) 2012-02-07 2017-10-10 Cree, Inc. Ceramic-based light emitting diode (LED) devices, components, and methods
US9806246B2 (en) 2012-02-07 2017-10-31 Cree, Inc. Ceramic-based light emitting diode (LED) devices, components, and methods
USD752000S1 (en) * 2013-03-07 2016-03-22 Vlt, Inc. Semiconductor device
US9826581B2 (en) 2014-12-05 2017-11-21 Cree, Inc. Voltage configurable solid state lighting apparatuses, systems, and related methods
USD831009S1 (en) * 2015-12-11 2018-10-16 Gemalto M2M Gmbh Radio module
USD904355S1 (en) 2015-12-11 2020-12-08 Gemalto M2M Gmbh Radio module
USD820817S1 (en) * 2017-03-06 2018-06-19 Fitivision Technology Inc. Antenna used in wireless communication
USD905647S1 (en) * 2018-07-20 2020-12-22 Heatscape.Com, Inc. Combination heat pipe and heat sink
USD1044788S1 (en) 2019-04-24 2024-10-01 Samsung Display Co., Ltd. Cover window for a display panel
USD935424S1 (en) * 2019-05-06 2021-11-09 Lam Research Corporation Semiconductor wafer processing tool
USD967818S1 (en) * 2019-09-17 2022-10-25 Samsung Display Co., Ltd. Display panel

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