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USD476962S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD476962S1
USD476962S1 US29/168,143 US16814302F USD476962S US D476962 S1 USD476962 S1 US D476962S1 US 16814302 F US16814302 F US 16814302F US D476962 S USD476962 S US D476962S
Authority
US
United States
Prior art keywords
semiconductor device
view
elevational view
mirror image
side elevational
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/168,143
Inventor
Takayuki Yoshihira
Gentaro Ookura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Assigned to KABUSHIKI KAISHA TOSHIBA reassignment KABUSHIKI KAISHA TOSHIBA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OOKURA, GENTARO, YOSHIHIRA, TAKAYUKI
Application granted granted Critical
Publication of USD476962S1 publication Critical patent/USD476962S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front perspective view of a semiconductor device, showing our new design;
FIG. 2 is a rear perspective view thereof;
FIG. 3 is a top plan view thereof; a bottom plan view being a mirror image thereof;
FIG. 4 is a right side elevational view thereof; a left side elevational view being a mirror image thereof;
FIG. 5 is a front elevational view thereof;
FIG. 6 is a rear elevational view thereof;
FIG. 7 is a front perspective view of a second embodiment of a semiconductor device, showing our new design;
FIG. 8 is a rear perspective view thereof;
FIG. 9 is a top plan view thereof; a bottom plan view being a mirror image thereof;
FIG. 10 is a right side elevational view thereof; a left side elevational view being a mirror image thereof;
FIG. 11 is a front elevational view thereof; and,
FIG. 12 is a rear elevational view thereof.

Claims (1)

  1. The ornamental design for a semiconductor device, as shown and described.
US29/168,143 2002-03-29 2002-09-27 Semiconductor device Expired - Lifetime USD476962S1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2002-008488 2002-03-29
JP2002008488 2002-03-29
JP2002008487 2002-03-29
JP2002-008487 2002-03-29

Publications (1)

Publication Number Publication Date
USD476962S1 true USD476962S1 (en) 2003-07-08

Family

ID=26625553

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/168,143 Expired - Lifetime USD476962S1 (en) 2002-03-29 2002-09-27 Semiconductor device

Country Status (1)

Country Link
US (1) USD476962S1 (en)

Cited By (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD489338S1 (en) 2003-07-28 2004-05-04 Semiconductor Components Industries, L.L.C. Packaged semiconductor device
USD504874S1 (en) * 2004-08-11 2005-05-10 Semiconductor Components Industries, Llc Semiconductor device package
USD508682S1 (en) 2004-02-23 2005-08-23 Kabushiki Kaisha Toshiba Semiconductor device
USD510728S1 (en) * 2004-08-11 2005-10-18 Semiconductor Components Industries Llc Semiconductor device package
USD514074S1 (en) 2003-08-27 2006-01-31 Kabushiki Kaisha Toshiba Semiconductor device
USD521952S1 (en) 2004-02-23 2006-05-30 Kabushiki Kaisha Toshiba Semiconductor device
USD550868S1 (en) * 2005-02-28 2007-09-11 Toshiba Lighting & Technology Corporation Light emitting diode lamp
USD594827S1 (en) * 2006-12-07 2009-06-23 Cree, Inc. Lamp package
USD648290S1 (en) * 2010-06-08 2011-11-08 Miyoshi Electronics Corporation Semiconductor device
USD668659S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
USD668658S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
USD680119S1 (en) * 2011-11-15 2013-04-16 Connectblue Ab Module
USD680545S1 (en) * 2011-11-15 2013-04-23 Connectblue Ab Module
USD689053S1 (en) * 2011-11-15 2013-09-03 Connectblue Ab Module
USD692377S1 (en) * 2012-12-04 2013-10-29 Remy Technologies, Llc Mosfet rectifier bridge power pack
USD692896S1 (en) * 2011-11-15 2013-11-05 Connectblue Ab Module
USD694724S1 (en) * 2012-10-03 2013-12-03 Honda Motor Co., Ltd. Semiconductor device
USD699693S1 (en) * 2012-10-03 2014-02-18 Fuji Electric Co., Ltd. Semiconductor device
USD705184S1 (en) * 2013-07-11 2014-05-20 Fuji Electric Co., Ltd. Semiconductor module
USD714745S1 (en) * 2012-02-14 2014-10-07 Panasonic Corporation Semiconductor
USD721047S1 (en) * 2013-03-07 2015-01-13 Vlt, Inc. Semiconductor device
US8975694B1 (en) 2013-03-07 2015-03-10 Vlt, Inc. Low resistance power switching device
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD732487S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD732488S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD758329S1 (en) * 2013-08-06 2016-06-07 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
USD845921S1 (en) * 2017-05-02 2019-04-16 Rohm Co., Ltd. Semiconductor device
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD904325S1 (en) * 2019-03-20 2020-12-08 Sansha Electric Manufacturing Company, Limited Semiconductor module
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
USD945384S1 (en) * 2019-09-26 2022-03-08 Lapis Semiconductor Co., Ltd. Semiconductor module
USD1042376S1 (en) * 2022-02-25 2024-09-17 Rohm Co., Ltd. Semiconductor module
USD1095474S1 (en) * 2022-12-02 2025-09-30 Semiconductor Components Industries, Llc Power module package

Citations (9)

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Publication number Priority date Publication date Assignee Title
US5401910A (en) 1992-12-03 1995-03-28 Murata Manufacturing Co. Ltd. Electronic component
US5450286A (en) 1992-12-04 1995-09-12 Parlex Corporation Printed circuit having a dielectric covercoat
US5459641A (en) 1994-02-18 1995-10-17 Rohm Co. Ltd. Polar electronic component and mounting structure therefor
US5726859A (en) 1995-07-26 1998-03-10 Dell Usa, L.P. Circuit board component retainer and extractor
USD396846S (en) 1997-04-16 1998-08-11 Matsushita Electronics Corporation Semiconductor device
US6232655B1 (en) 1997-01-10 2001-05-15 Kabushiki Kaisha Toshiba Semiconductor element having external connection terminals, method of manufacturing the semiconductor element, and semiconductor device equipped with the semiconductor element
USD444132S1 (en) 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
US6330165B1 (en) 1998-07-06 2001-12-11 Hitachi, Ltd. Semiconductor device
US6459048B1 (en) 1999-06-25 2002-10-01 Murata Manufacturing Co., Ltd. Surface-mount electronic component

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5401910A (en) 1992-12-03 1995-03-28 Murata Manufacturing Co. Ltd. Electronic component
US5450286A (en) 1992-12-04 1995-09-12 Parlex Corporation Printed circuit having a dielectric covercoat
US5459641A (en) 1994-02-18 1995-10-17 Rohm Co. Ltd. Polar electronic component and mounting structure therefor
US5726859A (en) 1995-07-26 1998-03-10 Dell Usa, L.P. Circuit board component retainer and extractor
US6232655B1 (en) 1997-01-10 2001-05-15 Kabushiki Kaisha Toshiba Semiconductor element having external connection terminals, method of manufacturing the semiconductor element, and semiconductor device equipped with the semiconductor element
USD396846S (en) 1997-04-16 1998-08-11 Matsushita Electronics Corporation Semiconductor device
US6330165B1 (en) 1998-07-06 2001-12-11 Hitachi, Ltd. Semiconductor device
US6459048B1 (en) 1999-06-25 2002-10-01 Murata Manufacturing Co., Ltd. Surface-mount electronic component
USD444132S1 (en) 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Catalog showing a Power MOSFET (PowerFLAT).
Website showing a Power MOSFET (P series).

Cited By (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD489338S1 (en) 2003-07-28 2004-05-04 Semiconductor Components Industries, L.L.C. Packaged semiconductor device
USD514074S1 (en) 2003-08-27 2006-01-31 Kabushiki Kaisha Toshiba Semiconductor device
USD508682S1 (en) 2004-02-23 2005-08-23 Kabushiki Kaisha Toshiba Semiconductor device
USD521952S1 (en) 2004-02-23 2006-05-30 Kabushiki Kaisha Toshiba Semiconductor device
USD504874S1 (en) * 2004-08-11 2005-05-10 Semiconductor Components Industries, Llc Semiconductor device package
USD510728S1 (en) * 2004-08-11 2005-10-18 Semiconductor Components Industries Llc Semiconductor device package
USD550868S1 (en) * 2005-02-28 2007-09-11 Toshiba Lighting & Technology Corporation Light emitting diode lamp
USD594827S1 (en) * 2006-12-07 2009-06-23 Cree, Inc. Lamp package
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
USD648290S1 (en) * 2010-06-08 2011-11-08 Miyoshi Electronics Corporation Semiconductor device
USD680119S1 (en) * 2011-11-15 2013-04-16 Connectblue Ab Module
USD668659S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
USD680545S1 (en) * 2011-11-15 2013-04-23 Connectblue Ab Module
USD689053S1 (en) * 2011-11-15 2013-09-03 Connectblue Ab Module
USD668658S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
USD692896S1 (en) * 2011-11-15 2013-11-05 Connectblue Ab Module
USD714745S1 (en) * 2012-02-14 2014-10-07 Panasonic Corporation Semiconductor
USD699693S1 (en) * 2012-10-03 2014-02-18 Fuji Electric Co., Ltd. Semiconductor device
USD694724S1 (en) * 2012-10-03 2013-12-03 Honda Motor Co., Ltd. Semiconductor device
USD692377S1 (en) * 2012-12-04 2013-10-29 Remy Technologies, Llc Mosfet rectifier bridge power pack
USD752000S1 (en) 2013-03-07 2016-03-22 Vlt, Inc. Semiconductor device
US8975694B1 (en) 2013-03-07 2015-03-10 Vlt, Inc. Low resistance power switching device
US9269661B1 (en) 2013-03-07 2016-02-23 Vlt, Inc. Low resistance power switching device
USD721047S1 (en) * 2013-03-07 2015-01-13 Vlt, Inc. Semiconductor device
USD705184S1 (en) * 2013-07-11 2014-05-20 Fuji Electric Co., Ltd. Semiconductor module
USD732487S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD732488S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD758329S1 (en) * 2013-08-06 2016-06-07 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD845921S1 (en) * 2017-05-02 2019-04-16 Rohm Co., Ltd. Semiconductor device
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD864135S1 (en) 2017-10-26 2019-10-22 Mitsubishi Electric Corporation Semiconductor device
USD904325S1 (en) * 2019-03-20 2020-12-08 Sansha Electric Manufacturing Company, Limited Semiconductor module
USD945384S1 (en) * 2019-09-26 2022-03-08 Lapis Semiconductor Co., Ltd. Semiconductor module
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
USD969762S1 (en) 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package
USD1042376S1 (en) * 2022-02-25 2024-09-17 Rohm Co., Ltd. Semiconductor module
USD1095474S1 (en) * 2022-12-02 2025-09-30 Semiconductor Components Industries, Llc Power module package
USD1098055S1 (en) * 2022-12-02 2025-10-14 Semiconductor Components Industries, Llc Power module package

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