USD476962S1 - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
- Publication number
- USD476962S1 USD476962S1 US29/168,143 US16814302F USD476962S US D476962 S1 USD476962 S1 US D476962S1 US 16814302 F US16814302 F US 16814302F US D476962 S USD476962 S US D476962S
- Authority
- US
- United States
- Prior art keywords
- semiconductor device
- view
- elevational view
- mirror image
- side elevational
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 is a front perspective view of a semiconductor device, showing our new design;
FIG. 2 is a rear perspective view thereof;
FIG. 3 is a top plan view thereof; a bottom plan view being a mirror image thereof;
FIG. 4 is a right side elevational view thereof; a left side elevational view being a mirror image thereof;
FIG. 5 is a front elevational view thereof;
FIG. 6 is a rear elevational view thereof;
FIG. 7 is a front perspective view of a second embodiment of a semiconductor device, showing our new design;
FIG. 8 is a rear perspective view thereof;
FIG. 9 is a top plan view thereof; a bottom plan view being a mirror image thereof;
FIG. 10 is a right side elevational view thereof; a left side elevational view being a mirror image thereof;
FIG. 11 is a front elevational view thereof; and,
FIG. 12 is a rear elevational view thereof.
Claims (1)
- The ornamental design for a semiconductor device, as shown and described.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002-008488 | 2002-03-29 | ||
| JP2002008488 | 2002-03-29 | ||
| JP2002008487 | 2002-03-29 | ||
| JP2002-008487 | 2002-03-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD476962S1 true USD476962S1 (en) | 2003-07-08 |
Family
ID=26625553
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/168,143 Expired - Lifetime USD476962S1 (en) | 2002-03-29 | 2002-09-27 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD476962S1 (en) |
Cited By (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD489338S1 (en) | 2003-07-28 | 2004-05-04 | Semiconductor Components Industries, L.L.C. | Packaged semiconductor device |
| USD504874S1 (en) * | 2004-08-11 | 2005-05-10 | Semiconductor Components Industries, Llc | Semiconductor device package |
| USD508682S1 (en) | 2004-02-23 | 2005-08-23 | Kabushiki Kaisha Toshiba | Semiconductor device |
| USD510728S1 (en) * | 2004-08-11 | 2005-10-18 | Semiconductor Components Industries Llc | Semiconductor device package |
| USD514074S1 (en) | 2003-08-27 | 2006-01-31 | Kabushiki Kaisha Toshiba | Semiconductor device |
| USD521952S1 (en) | 2004-02-23 | 2006-05-30 | Kabushiki Kaisha Toshiba | Semiconductor device |
| USD550868S1 (en) * | 2005-02-28 | 2007-09-11 | Toshiba Lighting & Technology Corporation | Light emitting diode lamp |
| USD594827S1 (en) * | 2006-12-07 | 2009-06-23 | Cree, Inc. | Lamp package |
| USD648290S1 (en) * | 2010-06-08 | 2011-11-08 | Miyoshi Electronics Corporation | Semiconductor device |
| USD668659S1 (en) * | 2011-11-15 | 2012-10-09 | Connectblue Ab | Module |
| USD668658S1 (en) * | 2011-11-15 | 2012-10-09 | Connectblue Ab | Module |
| USD680119S1 (en) * | 2011-11-15 | 2013-04-16 | Connectblue Ab | Module |
| USD680545S1 (en) * | 2011-11-15 | 2013-04-23 | Connectblue Ab | Module |
| USD689053S1 (en) * | 2011-11-15 | 2013-09-03 | Connectblue Ab | Module |
| USD692377S1 (en) * | 2012-12-04 | 2013-10-29 | Remy Technologies, Llc | Mosfet rectifier bridge power pack |
| USD692896S1 (en) * | 2011-11-15 | 2013-11-05 | Connectblue Ab | Module |
| USD694724S1 (en) * | 2012-10-03 | 2013-12-03 | Honda Motor Co., Ltd. | Semiconductor device |
| USD699693S1 (en) * | 2012-10-03 | 2014-02-18 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD705184S1 (en) * | 2013-07-11 | 2014-05-20 | Fuji Electric Co., Ltd. | Semiconductor module |
| USD714745S1 (en) * | 2012-02-14 | 2014-10-07 | Panasonic Corporation | Semiconductor |
| USD721047S1 (en) * | 2013-03-07 | 2015-01-13 | Vlt, Inc. | Semiconductor device |
| US8975694B1 (en) | 2013-03-07 | 2015-03-10 | Vlt, Inc. | Low resistance power switching device |
| USD731491S1 (en) * | 2014-02-07 | 2015-06-09 | NimbeLink L.L.C. | Embedded cellular modem |
| USD732487S1 (en) * | 2013-08-06 | 2015-06-23 | Formosa Epitaxy Incorporation | Partial semiconductor light emitting component |
| USD732488S1 (en) * | 2013-08-06 | 2015-06-23 | Formosa Epitaxy Incorporation | Partial semiconductor light emitting component |
| USD758329S1 (en) * | 2013-08-06 | 2016-06-07 | Formosa Epitaxy Incorporation | Partial semiconductor light emitting component |
| US9497570B2 (en) | 2014-02-06 | 2016-11-15 | Nimbelink Corp. | Embedded wireless modem |
| USD796459S1 (en) * | 2016-04-11 | 2017-09-05 | Rohm Co., Ltd. | Packaged semiconductor circuit module |
| USD822629S1 (en) * | 2017-01-26 | 2018-07-10 | Kyocera Corporation | Semiconductor package |
| USD832228S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
| USD832227S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
| US10256385B2 (en) | 2007-10-31 | 2019-04-09 | Cree, Inc. | Light emitting die (LED) packages and related methods |
| USD845921S1 (en) * | 2017-05-02 | 2019-04-16 | Rohm Co., Ltd. | Semiconductor device |
| USD852765S1 (en) * | 2017-10-19 | 2019-07-02 | Rohm Co., Ltd. | Semiconductor device |
| USD853343S1 (en) * | 2017-10-19 | 2019-07-09 | Rohm Co., Ltd. | Semiconductor device |
| USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
| USD904325S1 (en) * | 2019-03-20 | 2020-12-08 | Sansha Electric Manufacturing Company, Limited | Semiconductor module |
| USD934187S1 (en) * | 2020-01-21 | 2021-10-26 | Lang Cheng | Integrated circuit package |
| USD937231S1 (en) * | 2020-04-06 | 2021-11-30 | Wolfspeed, Inc. | Power semiconductor package |
| USD945384S1 (en) * | 2019-09-26 | 2022-03-08 | Lapis Semiconductor Co., Ltd. | Semiconductor module |
| USD1042376S1 (en) * | 2022-02-25 | 2024-09-17 | Rohm Co., Ltd. | Semiconductor module |
| USD1095474S1 (en) * | 2022-12-02 | 2025-09-30 | Semiconductor Components Industries, Llc | Power module package |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5401910A (en) | 1992-12-03 | 1995-03-28 | Murata Manufacturing Co. Ltd. | Electronic component |
| US5450286A (en) | 1992-12-04 | 1995-09-12 | Parlex Corporation | Printed circuit having a dielectric covercoat |
| US5459641A (en) | 1994-02-18 | 1995-10-17 | Rohm Co. Ltd. | Polar electronic component and mounting structure therefor |
| US5726859A (en) | 1995-07-26 | 1998-03-10 | Dell Usa, L.P. | Circuit board component retainer and extractor |
| USD396846S (en) | 1997-04-16 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
| US6232655B1 (en) | 1997-01-10 | 2001-05-15 | Kabushiki Kaisha Toshiba | Semiconductor element having external connection terminals, method of manufacturing the semiconductor element, and semiconductor device equipped with the semiconductor element |
| USD444132S1 (en) | 2000-08-23 | 2001-06-26 | Kabushiki Kaisha Toshiba | Semiconductor element |
| US6330165B1 (en) | 1998-07-06 | 2001-12-11 | Hitachi, Ltd. | Semiconductor device |
| US6459048B1 (en) | 1999-06-25 | 2002-10-01 | Murata Manufacturing Co., Ltd. | Surface-mount electronic component |
-
2002
- 2002-09-27 US US29/168,143 patent/USD476962S1/en not_active Expired - Lifetime
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5401910A (en) | 1992-12-03 | 1995-03-28 | Murata Manufacturing Co. Ltd. | Electronic component |
| US5450286A (en) | 1992-12-04 | 1995-09-12 | Parlex Corporation | Printed circuit having a dielectric covercoat |
| US5459641A (en) | 1994-02-18 | 1995-10-17 | Rohm Co. Ltd. | Polar electronic component and mounting structure therefor |
| US5726859A (en) | 1995-07-26 | 1998-03-10 | Dell Usa, L.P. | Circuit board component retainer and extractor |
| US6232655B1 (en) | 1997-01-10 | 2001-05-15 | Kabushiki Kaisha Toshiba | Semiconductor element having external connection terminals, method of manufacturing the semiconductor element, and semiconductor device equipped with the semiconductor element |
| USD396846S (en) | 1997-04-16 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
| US6330165B1 (en) | 1998-07-06 | 2001-12-11 | Hitachi, Ltd. | Semiconductor device |
| US6459048B1 (en) | 1999-06-25 | 2002-10-01 | Murata Manufacturing Co., Ltd. | Surface-mount electronic component |
| USD444132S1 (en) | 2000-08-23 | 2001-06-26 | Kabushiki Kaisha Toshiba | Semiconductor element |
Non-Patent Citations (2)
| Title |
|---|
| Catalog showing a Power MOSFET (PowerFLAT). |
| Website showing a Power MOSFET (P series). |
Cited By (47)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD489338S1 (en) | 2003-07-28 | 2004-05-04 | Semiconductor Components Industries, L.L.C. | Packaged semiconductor device |
| USD514074S1 (en) | 2003-08-27 | 2006-01-31 | Kabushiki Kaisha Toshiba | Semiconductor device |
| USD508682S1 (en) | 2004-02-23 | 2005-08-23 | Kabushiki Kaisha Toshiba | Semiconductor device |
| USD521952S1 (en) | 2004-02-23 | 2006-05-30 | Kabushiki Kaisha Toshiba | Semiconductor device |
| USD504874S1 (en) * | 2004-08-11 | 2005-05-10 | Semiconductor Components Industries, Llc | Semiconductor device package |
| USD510728S1 (en) * | 2004-08-11 | 2005-10-18 | Semiconductor Components Industries Llc | Semiconductor device package |
| USD550868S1 (en) * | 2005-02-28 | 2007-09-11 | Toshiba Lighting & Technology Corporation | Light emitting diode lamp |
| USD594827S1 (en) * | 2006-12-07 | 2009-06-23 | Cree, Inc. | Lamp package |
| US10256385B2 (en) | 2007-10-31 | 2019-04-09 | Cree, Inc. | Light emitting die (LED) packages and related methods |
| USD648290S1 (en) * | 2010-06-08 | 2011-11-08 | Miyoshi Electronics Corporation | Semiconductor device |
| USD680119S1 (en) * | 2011-11-15 | 2013-04-16 | Connectblue Ab | Module |
| USD668659S1 (en) * | 2011-11-15 | 2012-10-09 | Connectblue Ab | Module |
| USD680545S1 (en) * | 2011-11-15 | 2013-04-23 | Connectblue Ab | Module |
| USD689053S1 (en) * | 2011-11-15 | 2013-09-03 | Connectblue Ab | Module |
| USD668658S1 (en) * | 2011-11-15 | 2012-10-09 | Connectblue Ab | Module |
| USD692896S1 (en) * | 2011-11-15 | 2013-11-05 | Connectblue Ab | Module |
| USD714745S1 (en) * | 2012-02-14 | 2014-10-07 | Panasonic Corporation | Semiconductor |
| USD699693S1 (en) * | 2012-10-03 | 2014-02-18 | Fuji Electric Co., Ltd. | Semiconductor device |
| USD694724S1 (en) * | 2012-10-03 | 2013-12-03 | Honda Motor Co., Ltd. | Semiconductor device |
| USD692377S1 (en) * | 2012-12-04 | 2013-10-29 | Remy Technologies, Llc | Mosfet rectifier bridge power pack |
| USD752000S1 (en) | 2013-03-07 | 2016-03-22 | Vlt, Inc. | Semiconductor device |
| US8975694B1 (en) | 2013-03-07 | 2015-03-10 | Vlt, Inc. | Low resistance power switching device |
| US9269661B1 (en) | 2013-03-07 | 2016-02-23 | Vlt, Inc. | Low resistance power switching device |
| USD721047S1 (en) * | 2013-03-07 | 2015-01-13 | Vlt, Inc. | Semiconductor device |
| USD705184S1 (en) * | 2013-07-11 | 2014-05-20 | Fuji Electric Co., Ltd. | Semiconductor module |
| USD732487S1 (en) * | 2013-08-06 | 2015-06-23 | Formosa Epitaxy Incorporation | Partial semiconductor light emitting component |
| USD732488S1 (en) * | 2013-08-06 | 2015-06-23 | Formosa Epitaxy Incorporation | Partial semiconductor light emitting component |
| USD758329S1 (en) * | 2013-08-06 | 2016-06-07 | Formosa Epitaxy Incorporation | Partial semiconductor light emitting component |
| US9497570B2 (en) | 2014-02-06 | 2016-11-15 | Nimbelink Corp. | Embedded wireless modem |
| USD731491S1 (en) * | 2014-02-07 | 2015-06-09 | NimbeLink L.L.C. | Embedded cellular modem |
| USD796459S1 (en) * | 2016-04-11 | 2017-09-05 | Rohm Co., Ltd. | Packaged semiconductor circuit module |
| USD832228S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
| USD832227S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
| USD822629S1 (en) * | 2017-01-26 | 2018-07-10 | Kyocera Corporation | Semiconductor package |
| USD845921S1 (en) * | 2017-05-02 | 2019-04-16 | Rohm Co., Ltd. | Semiconductor device |
| USD852765S1 (en) * | 2017-10-19 | 2019-07-02 | Rohm Co., Ltd. | Semiconductor device |
| USD853343S1 (en) * | 2017-10-19 | 2019-07-09 | Rohm Co., Ltd. | Semiconductor device |
| USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
| USD864135S1 (en) | 2017-10-26 | 2019-10-22 | Mitsubishi Electric Corporation | Semiconductor device |
| USD904325S1 (en) * | 2019-03-20 | 2020-12-08 | Sansha Electric Manufacturing Company, Limited | Semiconductor module |
| USD945384S1 (en) * | 2019-09-26 | 2022-03-08 | Lapis Semiconductor Co., Ltd. | Semiconductor module |
| USD934187S1 (en) * | 2020-01-21 | 2021-10-26 | Lang Cheng | Integrated circuit package |
| USD937231S1 (en) * | 2020-04-06 | 2021-11-30 | Wolfspeed, Inc. | Power semiconductor package |
| USD969762S1 (en) | 2020-04-06 | 2022-11-15 | Wolfspeed, Inc. | Power semiconductor package |
| USD1042376S1 (en) * | 2022-02-25 | 2024-09-17 | Rohm Co., Ltd. | Semiconductor module |
| USD1095474S1 (en) * | 2022-12-02 | 2025-09-30 | Semiconductor Components Industries, Llc | Power module package |
| USD1098055S1 (en) * | 2022-12-02 | 2025-10-14 | Semiconductor Components Industries, Llc | Power module package |
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