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USD489338S1 - Packaged semiconductor device - Google Patents

Packaged semiconductor device Download PDF

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Publication number
USD489338S1
USD489338S1 US29/187,122 US18712203F USD489338S US D489338 S1 USD489338 S1 US D489338S1 US 18712203 F US18712203 F US 18712203F US D489338 S USD489338 S US D489338S
Authority
US
United States
Prior art keywords
semiconductor device
packaged semiconductor
packaged
view
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/187,122
Inventor
Michael Seddon
Francis Carney
Kent L. Kime
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Components Industries LLC
Original Assignee
Semiconductor Components Industries LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES reassignment SEMICONDUCTOR COMPONENTS INDUSTRIES ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CARNEY, FRANCIS, KIME, KENT L., SEDDON, MICHAEL
Priority to US29/187,122 priority Critical patent/USD489338S1/en
Application filed by Semiconductor Components Industries LLC filed Critical Semiconductor Components Industries LLC
Assigned to JPMORGAN CHASE BANK, AS COLLATERAL AGENT reassignment JPMORGAN CHASE BANK, AS COLLATERAL AGENT SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Publication of USD489338S1 publication Critical patent/USD489338S1/en
Application granted granted Critical
Assigned to JPMORGAN CHASE BANK, N.A. reassignment JPMORGAN CHASE BANK, N.A. SECURITY AGREEMENT Assignors: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC reassignment SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC RELEASE OF SECURITY INTEREST Assignors: JPMORGAN CHASE BANK, N.A.
Assigned to DEUTSCHE BANK AG NEW YORK BRANCH reassignment DEUTSCHE BANK AG NEW YORK BRANCH SECURITY INTEREST Assignors: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Assigned to DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT reassignment DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 5859768 AND TO RECITE COLLATERAL AGENT ROLE OF RECEIVING PARTY IN THE SECURITY INTEREST PREVIOUSLY RECORDED ON REEL 038620 FRAME 0087. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Assignors: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Anticipated expiration legal-status Critical
Assigned to FAIRCHILD SEMICONDUCTOR CORPORATION, SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC reassignment FAIRCHILD SEMICONDUCTOR CORPORATION RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 0087 Assignors: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a perspective view from the back right side and above the packaged semiconductor device;
FIG. 2 is a perspective view from the front left side and above the packaged semiconductor device;
FIG. 3 is a perspective view from the front left side and below the packaged semiconductor device;
FIG. 4 is a top view of the packaged semiconductor device;
FIG. 5 is a bottom view of the packaged semiconductor device;
FIG. 6 is an elevational view from the left side of the packaged semiconductor device;
FIG. 7 is an elevational view from the right side of the packaged semiconductor device;
FIG. 8 is an elevational view from the back side of the packaged semiconductor device; and,
FIG. 9 is an elevational view from the front side of the packaged semiconductor device.

Claims (1)

  1. We claim the ornamental design for a packaged semiconductor device, as shown and described.
US29/187,122 2003-07-28 2003-07-28 Packaged semiconductor device Expired - Lifetime USD489338S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/187,122 USD489338S1 (en) 2003-07-28 2003-07-28 Packaged semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/187,122 USD489338S1 (en) 2003-07-28 2003-07-28 Packaged semiconductor device

Publications (1)

Publication Number Publication Date
USD489338S1 true USD489338S1 (en) 2004-05-04

Family

ID=32174399

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/187,122 Expired - Lifetime USD489338S1 (en) 2003-07-28 2003-07-28 Packaged semiconductor device

Country Status (1)

Country Link
US (1) USD489338S1 (en)

Cited By (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD504874S1 (en) * 2004-08-11 2005-05-10 Semiconductor Components Industries, Llc Semiconductor device package
USD510728S1 (en) * 2004-08-11 2005-10-18 Semiconductor Components Industries Llc Semiconductor device package
USD675582S1 (en) * 2011-06-27 2013-02-05 Uninet Imaging, Inc. Chip assembly
USD714745S1 (en) * 2012-02-14 2014-10-07 Panasonic Corporation Semiconductor
USD719509S1 (en) * 2011-12-28 2014-12-16 Toko, Inc. Inductor
USD721047S1 (en) * 2013-03-07 2015-01-13 Vlt, Inc. Semiconductor device
US8975694B1 (en) 2013-03-07 2015-03-10 Vlt, Inc. Low resistance power switching device
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD732487S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD732488S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD758329S1 (en) * 2013-08-06 2016-06-07 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD760230S1 (en) * 2014-09-16 2016-06-28 Daishinku Corporation Piezoelectric vibration device
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD839244S1 (en) * 2016-04-29 2019-01-29 Laird Technologies, Inc. Antenna housing
USD845921S1 (en) * 2017-05-02 2019-04-16 Rohm Co., Ltd. Semiconductor device
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD856947S1 (en) * 2017-10-19 2019-08-20 Rohm Co., Ltd. Semiconductor device
USD914621S1 (en) * 2019-05-14 2021-03-30 Rohm Co., Ltd. Packaged semiconductor module
USD920264S1 (en) * 2019-11-27 2021-05-25 The Noco Company Semiconductor device
USD920266S1 (en) * 2019-09-29 2021-05-25 China Chippacking Technology Co., Ltd. Integrated circuit package
USD920265S1 (en) * 2019-09-29 2021-05-25 China Chippacking Technology Co., Ltd. Integrated circuit package
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
USD1009814S1 (en) * 2020-04-01 2024-01-02 Xiamen San'an Optoelectronics Technology Co., Ltd. LED chip
USD1022930S1 (en) * 2020-03-30 2024-04-16 Quanzhou San'an Semiconductor Technology Co., Ltd. LED chip
USD1042376S1 (en) * 2022-02-25 2024-09-17 Rohm Co., Ltd. Semiconductor module
USD1043594S1 (en) * 2022-11-01 2024-09-24 Rohm Co., Ltd. Semiconductor device
USD1043595S1 (en) * 2022-11-01 2024-09-24 Rohm Co., Ltd. Semiconductor device
USD1052545S1 (en) * 2022-11-01 2024-11-26 Rohm Co., Ltd. Semiconductor device
USD1059315S1 (en) * 2022-11-02 2025-01-28 Ganrich Semiconductor Corporation Package structure for a semiconductor element

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5434357A (en) 1991-12-23 1995-07-18 Belcher; Donald K. Reduced semiconductor size package
US5844307A (en) 1995-07-31 1998-12-01 Nec Corporation Plastic molded IC package with leads having small flatness fluctuation
US5866942A (en) 1995-04-28 1999-02-02 Nec Corporation Metal base package for a semiconductor device
USD416236S (en) 1998-09-02 1999-11-09 Citizen Electronics Co., Ltd. Integrated circuit package
US6238953B1 (en) 1999-01-12 2001-05-29 Sony Corporation Lead frame, resin-encapsulated semiconductor device and fabrication process for the device
USD466873S1 (en) 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
USD472528S1 (en) 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
US6555899B1 (en) 1999-10-15 2003-04-29 Amkor Technology, Inc. Semiconductor package leadframe assembly and method of manufacture
USD476962S1 (en) 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5434357A (en) 1991-12-23 1995-07-18 Belcher; Donald K. Reduced semiconductor size package
US5866942A (en) 1995-04-28 1999-02-02 Nec Corporation Metal base package for a semiconductor device
US5844307A (en) 1995-07-31 1998-12-01 Nec Corporation Plastic molded IC package with leads having small flatness fluctuation
USD416236S (en) 1998-09-02 1999-11-09 Citizen Electronics Co., Ltd. Integrated circuit package
US6238953B1 (en) 1999-01-12 2001-05-29 Sony Corporation Lead frame, resin-encapsulated semiconductor device and fabrication process for the device
US6555899B1 (en) 1999-10-15 2003-04-29 Amkor Technology, Inc. Semiconductor package leadframe assembly and method of manufacture
USD466873S1 (en) 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
USD472528S1 (en) 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
USD476962S1 (en) 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device

Cited By (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD510728S1 (en) * 2004-08-11 2005-10-18 Semiconductor Components Industries Llc Semiconductor device package
USD504874S1 (en) * 2004-08-11 2005-05-10 Semiconductor Components Industries, Llc Semiconductor device package
USD675582S1 (en) * 2011-06-27 2013-02-05 Uninet Imaging, Inc. Chip assembly
USD741261S1 (en) 2011-12-28 2015-10-20 Toko, Inc. Inductor
USD719509S1 (en) * 2011-12-28 2014-12-16 Toko, Inc. Inductor
USD714745S1 (en) * 2012-02-14 2014-10-07 Panasonic Corporation Semiconductor
USD752000S1 (en) 2013-03-07 2016-03-22 Vlt, Inc. Semiconductor device
US8975694B1 (en) 2013-03-07 2015-03-10 Vlt, Inc. Low resistance power switching device
US9269661B1 (en) 2013-03-07 2016-02-23 Vlt, Inc. Low resistance power switching device
USD721047S1 (en) * 2013-03-07 2015-01-13 Vlt, Inc. Semiconductor device
USD732487S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD732488S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD758329S1 (en) * 2013-08-06 2016-06-07 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD760230S1 (en) * 2014-09-16 2016-06-28 Daishinku Corporation Piezoelectric vibration device
USD767571S1 (en) 2014-09-16 2016-09-27 Daishinku Corporation Piezoelectric vibration device
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD839244S1 (en) * 2016-04-29 2019-01-29 Laird Technologies, Inc. Antenna housing
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD845921S1 (en) * 2017-05-02 2019-04-16 Rohm Co., Ltd. Semiconductor device
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD856947S1 (en) * 2017-10-19 2019-08-20 Rohm Co., Ltd. Semiconductor device
USD914621S1 (en) * 2019-05-14 2021-03-30 Rohm Co., Ltd. Packaged semiconductor module
USD920265S1 (en) * 2019-09-29 2021-05-25 China Chippacking Technology Co., Ltd. Integrated circuit package
USD920266S1 (en) * 2019-09-29 2021-05-25 China Chippacking Technology Co., Ltd. Integrated circuit package
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
USD920264S1 (en) * 2019-11-27 2021-05-25 The Noco Company Semiconductor device
USD1022930S1 (en) * 2020-03-30 2024-04-16 Quanzhou San'an Semiconductor Technology Co., Ltd. LED chip
USD1009814S1 (en) * 2020-04-01 2024-01-02 Xiamen San'an Optoelectronics Technology Co., Ltd. LED chip
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
USD969762S1 (en) 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package
USD1042376S1 (en) * 2022-02-25 2024-09-17 Rohm Co., Ltd. Semiconductor module
USD1043594S1 (en) * 2022-11-01 2024-09-24 Rohm Co., Ltd. Semiconductor device
USD1043595S1 (en) * 2022-11-01 2024-09-24 Rohm Co., Ltd. Semiconductor device
USD1052545S1 (en) * 2022-11-01 2024-11-26 Rohm Co., Ltd. Semiconductor device
USD1059315S1 (en) * 2022-11-02 2025-01-28 Ganrich Semiconductor Corporation Package structure for a semiconductor element

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