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USD416236S - Integrated circuit package - Google Patents

Integrated circuit package Download PDF

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Publication number
USD416236S
USD416236S US29/093,046 US9304698F USD416236S US D416236 S USD416236 S US D416236S US 9304698 F US9304698 F US 9304698F US D416236 S USD416236 S US D416236S
Authority
US
United States
Prior art keywords
integrated circuit
circuit package
view
package
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/093,046
Inventor
Kazuhiro Kobayashi
Masayoshi Shiraishi
Osamu Tanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Electronics Co Ltd
SII Crystal Technology Inc
Original Assignee
Seiko Instruments Inc
Citizen Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc, Citizen Electronics Co Ltd filed Critical Seiko Instruments Inc
Priority to US29/093,046 priority Critical patent/USD416236S/en
Assigned to CITIZEN ELECTRONICS CO. LTD., SEIKO INSTRUMENTS INC. reassignment CITIZEN ELECTRONICS CO. LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KOBAYASHI, KAZUHIRO, SHIRAISHI, MASAYOSHI, TANABE, OSAMU
Application granted granted Critical
Publication of USD416236S publication Critical patent/USD416236S/en
Anticipated expiration legal-status Critical
Assigned to SII CRYSTAL TECHNOLOGY INC. reassignment SII CRYSTAL TECHNOLOGY INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SEIKO INSTRUMENTS INC.
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front elevational view of an integrated circuit package showing our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a right elevational view thereof, the left side being the same in appearance as the right side;
FIG. 5 is a top, front, right perspective view thereof; and,
FIG. 6 is a bottom, rear, right perspective view thereof.

Claims (1)

  1. The ornamental design for an integrated circuit package, as shown and described.
US29/093,046 1998-09-02 1998-09-02 Integrated circuit package Expired - Lifetime USD416236S (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/093,046 USD416236S (en) 1998-09-02 1998-09-02 Integrated circuit package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/093,046 USD416236S (en) 1998-09-02 1998-09-02 Integrated circuit package

Publications (1)

Publication Number Publication Date
USD416236S true USD416236S (en) 1999-11-09

Family

ID=71618678

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/093,046 Expired - Lifetime USD416236S (en) 1998-09-02 1998-09-02 Integrated circuit package

Country Status (1)

Country Link
US (1) USD416236S (en)

Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD489338S1 (en) 2003-07-28 2004-05-04 Semiconductor Components Industries, L.L.C. Packaged semiconductor device
USD503930S1 (en) * 2003-09-15 2005-04-12 Nichia Corporation Light emitting diode
USD504874S1 (en) * 2004-08-11 2005-05-10 Semiconductor Components Industries, Llc Semiconductor device package
USD505397S1 (en) * 2003-09-15 2005-05-24 Nichia Corporation Light emitting diode
USD506732S1 (en) * 2004-06-23 2005-06-28 Harvatek Corporation Light-emitting diode
USD508682S1 (en) * 2004-02-23 2005-08-23 Kabushiki Kaisha Toshiba Semiconductor device
USD510728S1 (en) * 2004-08-11 2005-10-18 Semiconductor Components Industries Llc Semiconductor device package
USD510912S1 (en) * 2003-09-15 2005-10-25 Nichia Corporation Light emitting diode
USD511328S1 (en) * 2004-06-23 2005-11-08 Harvatek Corporation Light-emitting diode
USD521952S1 (en) * 2004-02-23 2006-05-30 Kabushiki Kaisha Toshiba Semiconductor device
USD668658S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
USD668659S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
USD680119S1 (en) * 2011-11-15 2013-04-16 Connectblue Ab Module
USD680545S1 (en) * 2011-11-15 2013-04-23 Connectblue Ab Module
USD689053S1 (en) * 2011-11-15 2013-09-03 Connectblue Ab Module
USD692896S1 (en) * 2011-11-15 2013-11-05 Connectblue Ab Module
USD715234S1 (en) * 2013-04-18 2014-10-14 SemiLEDs Optoelectronics Co., Ltd. Flip chip
USD731990S1 (en) * 2012-04-18 2015-06-16 Nok Corporation Integrated circuit tag
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD845921S1 (en) * 2017-05-02 2019-04-16 Rohm Co., Ltd. Semiconductor device
USD920265S1 (en) * 2019-09-29 2021-05-25 China Chippacking Technology Co., Ltd. Integrated circuit package
USD920266S1 (en) * 2019-09-29 2021-05-25 China Chippacking Technology Co., Ltd. Integrated circuit package
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD976215S1 (en) * 2021-01-18 2023-01-24 Dexerials Corporation Fuse
USD976216S1 (en) * 2021-01-18 2023-01-24 Dexerials Corporation Fuse
USD981966S1 (en) * 2021-01-18 2023-03-28 Dexerials Corporation Fuse

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD311520S (en) 1988-10-11 1990-10-23 Serco Mold Inc. Electronic equipment housing
US5295297A (en) 1986-11-25 1994-03-22 Hitachi, Ltd. Method of producing semiconductor memory
USD345731S (en) 1992-12-03 1994-04-05 Motorola, Inc. Semiconductor package
US5841189A (en) 1995-05-31 1998-11-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and manufacturing method thereof
US5884772A (en) 1997-09-04 1999-03-23 Motorola, Inc. Electronic device having multiple user interface configurations

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5295297A (en) 1986-11-25 1994-03-22 Hitachi, Ltd. Method of producing semiconductor memory
US5295297B1 (en) 1986-11-25 1996-11-26 Hitachi Ltd Method of producing semiconductor memory
USD311520S (en) 1988-10-11 1990-10-23 Serco Mold Inc. Electronic equipment housing
USD345731S (en) 1992-12-03 1994-04-05 Motorola, Inc. Semiconductor package
US5841189A (en) 1995-05-31 1998-11-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and manufacturing method thereof
US5884772A (en) 1997-09-04 1999-03-23 Motorola, Inc. Electronic device having multiple user interface configurations

Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD489338S1 (en) 2003-07-28 2004-05-04 Semiconductor Components Industries, L.L.C. Packaged semiconductor device
USD503930S1 (en) * 2003-09-15 2005-04-12 Nichia Corporation Light emitting diode
USD505397S1 (en) * 2003-09-15 2005-05-24 Nichia Corporation Light emitting diode
USD510912S1 (en) * 2003-09-15 2005-10-25 Nichia Corporation Light emitting diode
USD508682S1 (en) * 2004-02-23 2005-08-23 Kabushiki Kaisha Toshiba Semiconductor device
USD521952S1 (en) * 2004-02-23 2006-05-30 Kabushiki Kaisha Toshiba Semiconductor device
USD506732S1 (en) * 2004-06-23 2005-06-28 Harvatek Corporation Light-emitting diode
USD511328S1 (en) * 2004-06-23 2005-11-08 Harvatek Corporation Light-emitting diode
USD504874S1 (en) * 2004-08-11 2005-05-10 Semiconductor Components Industries, Llc Semiconductor device package
USD510728S1 (en) * 2004-08-11 2005-10-18 Semiconductor Components Industries Llc Semiconductor device package
USD689053S1 (en) * 2011-11-15 2013-09-03 Connectblue Ab Module
USD680119S1 (en) * 2011-11-15 2013-04-16 Connectblue Ab Module
USD680545S1 (en) * 2011-11-15 2013-04-23 Connectblue Ab Module
USD668658S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
USD692896S1 (en) * 2011-11-15 2013-11-05 Connectblue Ab Module
USD668659S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
USD731990S1 (en) * 2012-04-18 2015-06-16 Nok Corporation Integrated circuit tag
USD715234S1 (en) * 2013-04-18 2014-10-14 SemiLEDs Optoelectronics Co., Ltd. Flip chip
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD845921S1 (en) * 2017-05-02 2019-04-16 Rohm Co., Ltd. Semiconductor device
USD920265S1 (en) * 2019-09-29 2021-05-25 China Chippacking Technology Co., Ltd. Integrated circuit package
USD920266S1 (en) * 2019-09-29 2021-05-25 China Chippacking Technology Co., Ltd. Integrated circuit package
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD976215S1 (en) * 2021-01-18 2023-01-24 Dexerials Corporation Fuse
USD976216S1 (en) * 2021-01-18 2023-01-24 Dexerials Corporation Fuse
USD981966S1 (en) * 2021-01-18 2023-03-28 Dexerials Corporation Fuse

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