USD475028S1 - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
- Publication number
- USD475028S1 USD475028S1 US29/167,132 US16713202F USD475028S US D475028 S1 USD475028 S1 US D475028S1 US 16713202 F US16713202 F US 16713202F US D475028 S USD475028 S US D475028S
- Authority
- US
- United States
- Prior art keywords
- semiconductor device
- view
- elevational view
- ornamental design
- mirror image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 is a front perspective view of a semiconductor device, showing our new design;
FIG. 2 is a rear perspective view thereof;
FIG. 3 is a top plan view thereof; a bottom plan view being a mirror image thereof;
FIG. 4 is a right side elevational view thereof; a left side elevational view being a mirror image thereof;
FIG. 5 is a front elevational view thereof; and,
FIG. 6 is a rear elevational view thereof.
Claims (1)
- The ornamental design for a semiconductor device, as shown and described.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002-006214 | 2002-03-11 | ||
| JP2002006214 | 2002-03-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD475028S1 true USD475028S1 (en) | 2003-05-27 |
Family
ID=19191198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/167,132 Expired - Lifetime USD475028S1 (en) | 2002-03-11 | 2002-09-10 | Semiconductor device |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD475028S1 (en) |
| TW (1) | TWD101174S1 (en) |
Cited By (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD578084S1 (en) * | 2007-03-30 | 2008-10-07 | Rohm Co., Ltd. | Light emitting diode module |
| USD578969S1 (en) * | 2007-03-30 | 2008-10-21 | Rohm Co., Ltd. | Light emitting diode module |
| USD627310S1 (en) * | 2009-11-27 | 2010-11-16 | Lite-On Technology Corp. | Package of a light emitting diode |
| USD640994S1 (en) * | 2010-09-27 | 2011-07-05 | Lite-On Technology Corporation | Packing structure of light-emitting diode |
| USD640996S1 (en) * | 2010-09-27 | 2011-07-05 | Lite-On Technology Corporation | Packing structure of light-emitting diode |
| USD640995S1 (en) * | 2010-09-27 | 2011-07-05 | Lite-On Technology Corporation | Packing structure of light-emitting diode |
| USD675582S1 (en) * | 2011-06-27 | 2013-02-05 | Uninet Imaging, Inc. | Chip assembly |
| USD706733S1 (en) * | 2013-09-16 | 2014-06-10 | Photonics Electronics Technology Research Association (PETRA) | Signal conversion device |
| USD707193S1 (en) * | 2013-09-16 | 2014-06-17 | Photonics Electronics Technology Research Association (PETRA) | Signal conversion device |
| USD714745S1 (en) * | 2012-02-14 | 2014-10-07 | Panasonic Corporation | Semiconductor |
| USRE45712E1 (en) * | 2013-03-18 | 2015-10-06 | Photonics Electronics Technology Research Association (PETRA) | Signal conversion device |
| USRE45741E1 (en) * | 2013-03-18 | 2015-10-13 | Photonics Electronics Technology Research Association (PETRA) | Signal conversion device |
| USD769832S1 (en) * | 2013-02-19 | 2016-10-25 | Sony Corporation | Semiconductor device |
| USD796459S1 (en) * | 2016-04-11 | 2017-09-05 | Rohm Co., Ltd. | Packaged semiconductor circuit module |
| USD822629S1 (en) * | 2017-01-26 | 2018-07-10 | Kyocera Corporation | Semiconductor package |
| USD832228S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
| USD832227S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
| USD904325S1 (en) * | 2019-03-20 | 2020-12-08 | Sansha Electric Manufacturing Company, Limited | Semiconductor module |
| USD937231S1 (en) * | 2020-04-06 | 2021-11-30 | Wolfspeed, Inc. | Power semiconductor package |
| USD945384S1 (en) * | 2019-09-26 | 2022-03-08 | Lapis Semiconductor Co., Ltd. | Semiconductor module |
| USD1043594S1 (en) * | 2022-11-01 | 2024-09-24 | Rohm Co., Ltd. | Semiconductor device |
| USD1043595S1 (en) * | 2022-11-01 | 2024-09-24 | Rohm Co., Ltd. | Semiconductor device |
| USD1052545S1 (en) * | 2022-11-01 | 2024-11-26 | Rohm Co., Ltd. | Semiconductor device |
| USD1059315S1 (en) * | 2022-11-02 | 2025-01-28 | Ganrich Semiconductor Corporation | Package structure for a semiconductor element |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5401910A (en) | 1992-12-03 | 1995-03-28 | Murata Manufacturing Co. Ltd. | Electronic component |
| US5450286A (en) | 1992-12-04 | 1995-09-12 | Parlex Corporation | Printed circuit having a dielectric covercoat |
| US5459641A (en) | 1994-02-18 | 1995-10-17 | Rohm Co. Ltd. | Polar electronic component and mounting structure therefor |
| US5726859A (en) | 1995-07-26 | 1998-03-10 | Dell Usa, L.P. | Circuit board component retainer and extractor |
| USD396846S (en) | 1997-04-16 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
| US6232655B1 (en) | 1997-01-10 | 2001-05-15 | Kabushiki Kaisha Toshiba | Semiconductor element having external connection terminals, method of manufacturing the semiconductor element, and semiconductor device equipped with the semiconductor element |
| USD444132S1 (en) | 2000-08-23 | 2001-06-26 | Kabushiki Kaisha Toshiba | Semiconductor element |
| US6330165B1 (en) | 1998-07-06 | 2001-12-11 | Hitachi, Ltd. | Semiconductor device |
| US6459048B1 (en) | 1999-06-25 | 2002-10-01 | Murata Manufacturing Co., Ltd. | Surface-mount electronic component |
-
2002
- 2002-09-03 TW TW091304883F patent/TWD101174S1/en unknown
- 2002-09-10 US US29/167,132 patent/USD475028S1/en not_active Expired - Lifetime
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5401910A (en) | 1992-12-03 | 1995-03-28 | Murata Manufacturing Co. Ltd. | Electronic component |
| US5450286A (en) | 1992-12-04 | 1995-09-12 | Parlex Corporation | Printed circuit having a dielectric covercoat |
| US5459641A (en) | 1994-02-18 | 1995-10-17 | Rohm Co. Ltd. | Polar electronic component and mounting structure therefor |
| US5726859A (en) | 1995-07-26 | 1998-03-10 | Dell Usa, L.P. | Circuit board component retainer and extractor |
| US6232655B1 (en) | 1997-01-10 | 2001-05-15 | Kabushiki Kaisha Toshiba | Semiconductor element having external connection terminals, method of manufacturing the semiconductor element, and semiconductor device equipped with the semiconductor element |
| USD396846S (en) | 1997-04-16 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
| US6330165B1 (en) | 1998-07-06 | 2001-12-11 | Hitachi, Ltd. | Semiconductor device |
| US6459048B1 (en) | 1999-06-25 | 2002-10-01 | Murata Manufacturing Co., Ltd. | Surface-mount electronic component |
| USD444132S1 (en) | 2000-08-23 | 2001-06-26 | Kabushiki Kaisha Toshiba | Semiconductor element |
Non-Patent Citations (2)
| Title |
|---|
| Catalog of a Chip Size Package (VMN4). |
| Extract of Nihon Kogyo Shimbun (Newspaper) showing a Chip-Type Transistor Package (E-CSP). |
Cited By (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD578969S1 (en) * | 2007-03-30 | 2008-10-21 | Rohm Co., Ltd. | Light emitting diode module |
| USD578084S1 (en) * | 2007-03-30 | 2008-10-07 | Rohm Co., Ltd. | Light emitting diode module |
| USD627310S1 (en) * | 2009-11-27 | 2010-11-16 | Lite-On Technology Corp. | Package of a light emitting diode |
| USD640994S1 (en) * | 2010-09-27 | 2011-07-05 | Lite-On Technology Corporation | Packing structure of light-emitting diode |
| USD640996S1 (en) * | 2010-09-27 | 2011-07-05 | Lite-On Technology Corporation | Packing structure of light-emitting diode |
| USD640995S1 (en) * | 2010-09-27 | 2011-07-05 | Lite-On Technology Corporation | Packing structure of light-emitting diode |
| USD675582S1 (en) * | 2011-06-27 | 2013-02-05 | Uninet Imaging, Inc. | Chip assembly |
| USD714745S1 (en) * | 2012-02-14 | 2014-10-07 | Panasonic Corporation | Semiconductor |
| USD769832S1 (en) * | 2013-02-19 | 2016-10-25 | Sony Corporation | Semiconductor device |
| USD839220S1 (en) | 2013-02-19 | 2019-01-29 | Sony Corporation | Semiconductor device |
| USRE45712E1 (en) * | 2013-03-18 | 2015-10-06 | Photonics Electronics Technology Research Association (PETRA) | Signal conversion device |
| USRE45741E1 (en) * | 2013-03-18 | 2015-10-13 | Photonics Electronics Technology Research Association (PETRA) | Signal conversion device |
| USD706733S1 (en) * | 2013-09-16 | 2014-06-10 | Photonics Electronics Technology Research Association (PETRA) | Signal conversion device |
| USD707193S1 (en) * | 2013-09-16 | 2014-06-17 | Photonics Electronics Technology Research Association (PETRA) | Signal conversion device |
| USD796459S1 (en) * | 2016-04-11 | 2017-09-05 | Rohm Co., Ltd. | Packaged semiconductor circuit module |
| USD832228S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
| USD832227S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
| USD822629S1 (en) * | 2017-01-26 | 2018-07-10 | Kyocera Corporation | Semiconductor package |
| USD904325S1 (en) * | 2019-03-20 | 2020-12-08 | Sansha Electric Manufacturing Company, Limited | Semiconductor module |
| USD945384S1 (en) * | 2019-09-26 | 2022-03-08 | Lapis Semiconductor Co., Ltd. | Semiconductor module |
| USD937231S1 (en) * | 2020-04-06 | 2021-11-30 | Wolfspeed, Inc. | Power semiconductor package |
| USD969762S1 (en) | 2020-04-06 | 2022-11-15 | Wolfspeed, Inc. | Power semiconductor package |
| USD1043594S1 (en) * | 2022-11-01 | 2024-09-24 | Rohm Co., Ltd. | Semiconductor device |
| USD1043595S1 (en) * | 2022-11-01 | 2024-09-24 | Rohm Co., Ltd. | Semiconductor device |
| USD1052545S1 (en) * | 2022-11-01 | 2024-11-26 | Rohm Co., Ltd. | Semiconductor device |
| USD1059315S1 (en) * | 2022-11-02 | 2025-01-28 | Ganrich Semiconductor Corporation | Package structure for a semiconductor element |
Also Published As
| Publication number | Publication date |
|---|---|
| TWD101174S1 (en) | 2004-11-01 |
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