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USD259783S - Semiconductor - Google Patents

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Publication number
USD259783S
USD259783S US06/015,160 US1516079F USD259783S US D259783 S USD259783 S US D259783S US 1516079 F US1516079 F US 1516079F US D259783 S USD259783 S US D259783S
Authority
US
United States
Prior art keywords
semiconductor
view
ornamental design
front perspective
new design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US06/015,160
Inventor
Hidetoshi Mochizuki
Keizo Otsuki
Hideki Kosaka
Gen Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Assigned to HITACHI, LTD. reassignment HITACHI, LTD. ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: KOSAKA, HIDEKI, MOCHIZUKI HIDETOSHI, MURAKAMI, GEN, OTSUKI, KEIZO
Application granted granted Critical
Publication of USD259783S publication Critical patent/USD259783S/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a right side, top and front perspective view of a semiconductor showing our new design;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a left side view thereof;
FIG. 4 is a bottom view thereof.

Claims (1)

  1. The ornamental design for a semiconductor, as shown.
US06/015,160 1978-08-25 1979-02-26 Semiconductor Expired - Lifetime USD259783S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP3573278 1978-08-25
JP53-35732 1978-08-25

Publications (1)

Publication Number Publication Date
USD259783S true USD259783S (en) 1981-07-07

Family

ID=69778618

Family Applications (1)

Application Number Title Priority Date Filing Date
US06/015,160 Expired - Lifetime USD259783S (en) 1978-08-25 1979-02-26 Semiconductor

Country Status (1)

Country Link
US (1) USD259783S (en)

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD432097S (en) * 1999-11-20 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor package
USD432096S (en) * 1999-11-24 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor module
USD658602S1 (en) * 2010-06-15 2012-05-01 Toshiba Lighting & Technology Corporation Light emitting diode module
USD658601S1 (en) * 2010-06-15 2012-05-01 Toshiba Lighting & Technology Corporation Light emitting diode module
USD658605S1 (en) * 2010-06-15 2012-05-01 Toshiba Lighting & Technology Corporation Light emitting diode module
USD658600S1 (en) * 2010-06-15 2012-05-01 Toshiba Lighting & Technology Corporation Light emitting diode module
USD658604S1 (en) * 2010-06-15 2012-05-01 Toshiba Lighting & Technology Corporation Light emitting diode module
USD702690S1 (en) * 2012-10-17 2014-04-15 Kingston Digital, Inc. Memory module
USD702689S1 (en) * 2012-08-17 2014-04-15 Kingston Digital, Inc. Memory module
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD904325S1 (en) * 2019-03-20 2020-12-08 Sansha Electric Manufacturing Company, Limited Semiconductor module
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
USD945384S1 (en) * 2019-09-26 2022-03-08 Lapis Semiconductor Co., Ltd. Semiconductor module
USD1042376S1 (en) * 2022-02-25 2024-09-17 Rohm Co., Ltd. Semiconductor module
USD1094859S1 (en) * 2022-12-22 2025-09-23 Hangzhou Hpwinner Opto Corporation LED lead frame

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3208892A (en) 1960-09-15 1965-09-28 Westinghouse Electric Corp Sealed articles and methods of forming the same
US3436451A (en) 1966-06-29 1969-04-01 Servonic Instr Inc Method of making molded ceramic articles
US4012766A (en) 1973-08-28 1977-03-15 Western Digital Corporation Semiconductor package and method of manufacture thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3208892A (en) 1960-09-15 1965-09-28 Westinghouse Electric Corp Sealed articles and methods of forming the same
US3436451A (en) 1966-06-29 1969-04-01 Servonic Instr Inc Method of making molded ceramic articles
US4012766A (en) 1973-08-28 1977-03-15 Western Digital Corporation Semiconductor package and method of manufacture thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Electronics, 11-24-1977, p. 145, Integrated Circuit Housing (bottom right).

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD432097S (en) * 1999-11-20 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor package
USD432096S (en) * 1999-11-24 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor module
USD658602S1 (en) * 2010-06-15 2012-05-01 Toshiba Lighting & Technology Corporation Light emitting diode module
USD658601S1 (en) * 2010-06-15 2012-05-01 Toshiba Lighting & Technology Corporation Light emitting diode module
USD658605S1 (en) * 2010-06-15 2012-05-01 Toshiba Lighting & Technology Corporation Light emitting diode module
USD658600S1 (en) * 2010-06-15 2012-05-01 Toshiba Lighting & Technology Corporation Light emitting diode module
USD658604S1 (en) * 2010-06-15 2012-05-01 Toshiba Lighting & Technology Corporation Light emitting diode module
USD702689S1 (en) * 2012-08-17 2014-04-15 Kingston Digital, Inc. Memory module
USD702690S1 (en) * 2012-10-17 2014-04-15 Kingston Digital, Inc. Memory module
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD864135S1 (en) 2017-10-26 2019-10-22 Mitsubishi Electric Corporation Semiconductor device
USD904325S1 (en) * 2019-03-20 2020-12-08 Sansha Electric Manufacturing Company, Limited Semiconductor module
USD945384S1 (en) * 2019-09-26 2022-03-08 Lapis Semiconductor Co., Ltd. Semiconductor module
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
USD969762S1 (en) 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package
USD1042376S1 (en) * 2022-02-25 2024-09-17 Rohm Co., Ltd. Semiconductor module
USD1094859S1 (en) * 2022-12-22 2025-09-23 Hangzhou Hpwinner Opto Corporation LED lead frame

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