TH2812C3 - Lead-free high temperature solder - Google Patents
Lead-free high temperature solderInfo
- Publication number
- TH2812C3 TH2812C3 TH603000328U TH0603000328U TH2812C3 TH 2812 C3 TH2812 C3 TH 2812C3 TH 603000328 U TH603000328 U TH 603000328U TH 0603000328 U TH0603000328 U TH 0603000328U TH 2812 C3 TH2812 C3 TH 2812C3
- Authority
- TH
- Thailand
- Prior art keywords
- lead
- high temperature
- free high
- temperature solder
- weight
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910017052 cobalt Inorganic materials 0.000 claims abstract 2
- 239000010941 cobalt Substances 0.000 claims abstract 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052802 copper Inorganic materials 0.000 claims abstract 2
- 239000010949 copper Substances 0.000 claims abstract 2
- 229910052759 nickel Inorganic materials 0.000 claims abstract 2
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Abstract
โลหะบัดกรีอุณหภูมิสูงชนิดไร้สารตะกั่วผสม ซึ่งมีส่วนประกอบของโลหะต่าง ๆ อยู่ในเนื้อของโลหะบัดกรี และที่ใช้เป็นส่วนประกอบในขั้นตอนกระบวนการประดิษฐ์ ผลิตภัณฑ์ ประกอบด้วย ทองแดง มากกว่า 0.02-1.5% นิเกิล มากกว่า 0.002-1.5 โดยน้ำหนัก โคบอลท์ มากกว่า 0.001-0.4 % โดยน้ำหนักและค่าสมดุลจะเป็นดีบุก Lead-free high temperature solder Which contains various metal components in the texture of the solder And used as a component in the fabrication process, the product contains copper more than 0.02-1.5%, nickel greater than 0.002-1.5 with cobalt weight greater than 0.001-0.4% by weight and the balance value is tin.
Claims (1)
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TH2812A3 TH2812A3 (en) | 2006-09-07 |
| TH2812C3 true TH2812C3 (en) | 2006-09-07 |
Family
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