TH2815C3 - Lead-free high temperature solder - Google Patents
Lead-free high temperature solderInfo
- Publication number
- TH2815C3 TH2815C3 TH603000331U TH0603000331U TH2815C3 TH 2815 C3 TH2815 C3 TH 2815C3 TH 603000331 U TH603000331 U TH 603000331U TH 0603000331 U TH0603000331 U TH 0603000331U TH 2815 C3 TH2815 C3 TH 2815C3
- Authority
- TH
- Thailand
- Prior art keywords
- lead
- high temperature
- weight
- free high
- temperature solder
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052759 nickel Inorganic materials 0.000 claims abstract 2
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract 2
- 239000011574 phosphorus Substances 0.000 claims abstract 2
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 239000002131 composite material Substances 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Abstract
โลหะบัดกรีอุณหภูมิสูงชนิดไร้สารตะกั่วผสม ซึ่งมีส่วนประกอบของโลหะต่าง ๆ อยู่ในเนื้อของโลหะบัดกรี และที่ใช้เป็นส่วนประกอบในขั้นตอนกระบวนการประดิษฐ์ ผลิตภัณฑ์ ประกอบ ฟอสฟอรัส มากกว่า 0.001-5 % โดย น้ำหนัก ทองแดง มากกว่า 0.01-4 % โดยน้ำหนัก นิเกิล มากกว่า 0.001-1.5 % โดยน้ำหนัก และค่าสมดุลจะเป็นดีบุก Lead-free high temperature solder Which contains various metal components in the texture of the solder And used as a component in the process of fabrication of phosphorus composite products greater than 0.001-5% by weight of copper more than 0.01-4% by weight of nickel greater than 0.001-1.5% by weight and balance is tin
Claims (1)
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TH2815C3 true TH2815C3 (en) | 2006-09-07 |
| TH2815A3 TH2815A3 (en) | 2006-09-07 |
Family
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