TH2814C3 - Lead-free high temperature solder - Google Patents
Lead-free high temperature solderInfo
- Publication number
- TH2814C3 TH2814C3 TH603000330U TH0603000330U TH2814C3 TH 2814 C3 TH2814 C3 TH 2814C3 TH 603000330 U TH603000330 U TH 603000330U TH 0603000330 U TH0603000330 U TH 0603000330U TH 2814 C3 TH2814 C3 TH 2814C3
- Authority
- TH
- Thailand
- Prior art keywords
- lead
- high temperature
- weight
- free high
- temperature solder
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052802 copper Inorganic materials 0.000 claims abstract 2
- 239000010949 copper Substances 0.000 claims abstract 2
- 229910052759 nickel Inorganic materials 0.000 claims abstract 2
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract 2
- 239000011574 phosphorus Substances 0.000 claims abstract 2
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Abstract
โลหะบัดกรีอุณหภูมิสูงชนิดไร้สารตะกั่วผสม ซึ่งมีส่วนประกอบของโลหะต่าง ๆ อยู่ในเนื้อของโลหะบัดกรี และที่ใช้เป็นส่วนประกอบในขั้นตอนกระบวนการประดิษฐ์ ผลิตภัณฑ์ ประกอบ ฟอสฟอรัส มากกว่า 0.001-5 % โดย น้ำหนัก ทองแดงมากกว่า 0.1-3 % โดยน้ำหนัก นิเกิล มากกว่า 0.001-1.5 % โดยน้ำหนัก และค่าสมดุลจะเป็นดีบุก Lead-free high temperature solder Which contains various metal components in the texture of the solder And used as a component in the fabrication process, the product contains more than 0.001-5% phosphorus by weight of copper more than 0.1-3% by weight of nickel greater than 0.001-1.5% by weight and balance is tin.
Claims (1)
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TH2814C3 true TH2814C3 (en) | 2006-09-07 |
| TH2814A3 TH2814A3 (en) | 2006-09-07 |
Family
ID=
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2010029942A5 (en) | ||
| BR112015002414A2 (en) | High temperature lead-free soldering alloy | |
| MX2018002650A (en) | Lead-free high reliability solder alloys. | |
| WO2011068357A3 (en) | Brazing alloy | |
| TH2814A3 (en) | Lead-free high temperature solder | |
| TH2814C3 (en) | Lead-free high temperature solder | |
| TH2815A3 (en) | Lead-free high temperature solder | |
| TH2815C3 (en) | Lead-free high temperature solder | |
| WO2019094241A3 (en) | Cost-effective lead-free solder alloy for electronic applications | |
| TH2813A3 (en) | Lead-free high temperature solder | |
| TH2813C3 (en) | Lead-free high temperature solder | |
| TH2816C3 (en) | Lead-free high temperature solder | |
| TH2816A3 (en) | Lead-free high temperature solder | |
| TH2812C3 (en) | Lead-free high temperature solder | |
| TH2812A3 (en) | Lead-free high temperature solder | |
| TH2818A3 (en) | Lead-free high temperature solder | |
| TH2818C3 (en) | Lead-free high temperature solder | |
| TH2817A3 (en) | Lead-free high temperature solder | |
| TH2817C3 (en) | Lead-free high temperature solder | |
| TH1185C3 (en) | Lead-free high temperature solder | |
| TH1185A3 (en) | Lead-free high temperature solder | |
| TH1184A3 (en) | Lead-free high temperature solder | |
| TH1184C3 (en) | Lead-free high temperature solder | |
| TH1306A3 (en) | Lead-free high temperature solder | |
| TH1305A3 (en) | Lead-free high temperature solder |