TH2813A3 - Lead-free high temperature solder - Google Patents
Lead-free high temperature solderInfo
- Publication number
- TH2813A3 TH2813A3 TH603000329U TH0603000329U TH2813A3 TH 2813 A3 TH2813 A3 TH 2813A3 TH 603000329 U TH603000329 U TH 603000329U TH 0603000329 U TH0603000329 U TH 0603000329U TH 2813 A3 TH2813 A3 TH 2813A3
- Authority
- TH
- Thailand
- Prior art keywords
- lead
- high temperature
- free high
- temperature solder
- weight
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910017052 cobalt Inorganic materials 0.000 claims abstract 2
- 239000010941 cobalt Substances 0.000 claims abstract 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052802 copper Inorganic materials 0.000 claims abstract 2
- 239000010949 copper Substances 0.000 claims abstract 2
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract 2
- 239000011574 phosphorus Substances 0.000 claims abstract 2
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Abstract
โลหะบัดกรีอุณหภูมิสูงชนิดไร้สารตะกั่วผสม ซึ่งมีส่วนประกอบของโลหะต่างๆ อยู่ในเนื้อของโลหะบัดกรีและที่ ใช้เป็นส่วนประกอบในขั้นตอนกระบวนการประดิษฐ์ ผลิตภัณฑ์ ประกอบ ฟอสฟอรัส มากกว่า 0.001-5 % โดยน้ำ หนัก ทองแดง มากกว่า 0.1-3 % โดยน้ำหนัก โคบอลท์ มากกว่า 0.001-.04 % โดยน้ำหนัก และค่าสมดุลจะเป็นดีบุก Lead-free high temperature solder Which contains various metals In the texture of solder and where Used as a component in the fabrication process, the product contains more than 0.001-5% phosphorus with more than 0.1-3% copper weight, with cobalt weight greater than 0.001-.04% by weight and the balance is tin.
Claims (1)
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TH2813A3 true TH2813A3 (en) | 2006-09-07 |
| TH2813C3 TH2813C3 (en) | 2006-09-07 |
Family
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