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WO2009008457A1 - Heat radiating component for electronic component, case for electronic component, carrier for electronic component, and package for electronic component - Google Patents

Heat radiating component for electronic component, case for electronic component, carrier for electronic component, and package for electronic component Download PDF

Info

Publication number
WO2009008457A1
WO2009008457A1 PCT/JP2008/062425 JP2008062425W WO2009008457A1 WO 2009008457 A1 WO2009008457 A1 WO 2009008457A1 JP 2008062425 W JP2008062425 W JP 2008062425W WO 2009008457 A1 WO2009008457 A1 WO 2009008457A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
component
mass
heat radiating
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/062425
Other languages
French (fr)
Japanese (ja)
Inventor
Hoshiaki Terao
Hiroki Ota
Hideaki Kobiki
Takashi Sawai
Tetsurou Abumita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JFE Steel Corp
JFE Precision Corp
Original Assignee
JFE Steel Corp
JFE Precision Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JFE Steel Corp, JFE Precision Corp filed Critical JFE Steel Corp
Publication of WO2009008457A1 publication Critical patent/WO2009008457A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/24—After-treatment of workpieces or articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/24—After-treatment of workpieces or articles
    • B22F3/26—Impregnating
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/0425—Copper-based alloys
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/045—Alloys based on refractory metals
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
    • C22C27/06—Alloys based on chromium
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/24—After-treatment of workpieces or articles
    • B22F2003/248—Thermal after-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • B22F2998/10—Processes characterised by the sequence of their steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Powder Metallurgy (AREA)

Abstract

This invention provides a heat radiating component for an electric component using a Cr-Cu alloy, and a case for an electronic component, a carrier for an electronic component, or a package for an electronic component using the heat radiating component. The heat radiating component comprises a molded product produced by cold pressing a Cr-Cu alloy plate produced by subjecting a Cr-Cu alloy to powder metallurgy. The molded product comprises more than 30% by mass and not more than 80% by mass of Cr with the balance consisting of Cu and unavoidable impurities. The unavoidable impurities are O: not more than 0.15% by mass, N: not more than 0.1% by mass, C: not more than 0.1% by mass, Al: not more than 0.05% by mass, and Si: not more than 0.1% by mass.
PCT/JP2008/062425 2007-07-09 2008-07-09 Heat radiating component for electronic component, case for electronic component, carrier for electronic component, and package for electronic component Ceased WO2009008457A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007179617 2007-07-09
JP2007-179617 2007-07-09

Publications (1)

Publication Number Publication Date
WO2009008457A1 true WO2009008457A1 (en) 2009-01-15

Family

ID=40228628

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062425 Ceased WO2009008457A1 (en) 2007-07-09 2008-07-09 Heat radiating component for electronic component, case for electronic component, carrier for electronic component, and package for electronic component

Country Status (2)

Country Link
JP (3) JP5216981B2 (en)
WO (1) WO2009008457A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102612745A (en) * 2009-10-01 2012-07-25 Jfe精密株式会社 Radiating plate for electronic equipment and manufacturing method thereof
WO2016190130A1 (en) * 2015-05-28 2016-12-01 日本電波工業株式会社 Oscillation device
CN111584371A (en) * 2020-05-25 2020-08-25 苏州融睿电子科技有限公司 Manufacturing method of packaging shell and packaging shell

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8766430B2 (en) 2012-06-14 2014-07-01 Infineon Technologies Ag Semiconductor modules and methods of formation thereof
US9041460B2 (en) 2013-08-12 2015-05-26 Infineon Technologies Ag Packaged power transistors and power packages
JP6981846B2 (en) * 2017-10-26 2021-12-17 Jfe精密株式会社 Heat dissipation plate and its manufacturing method
JP6775071B2 (en) * 2018-10-05 2020-10-28 日本特殊陶業株式会社 Wiring board
JP6936839B2 (en) * 2018-10-05 2021-09-22 日本特殊陶業株式会社 Wiring board

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0536492B2 (en) * 1983-03-02 1993-05-31 Sumitomo Metal Ind
JP2002332503A (en) * 2001-05-08 2002-11-22 Japan Atom Energy Res Inst Method for producing Fe-50Cr alloy using plasma discharge sintering method
JP2003055739A (en) * 2001-06-05 2003-02-26 Nippon Steel Corp Ferritic thin steel sheet with excellent shape freezing properties
JP2003089853A (en) * 2001-09-14 2003-03-28 Nisshin Steel Co Ltd HIGH PURITY Fe-Cr ALLOY HAVING EXCELLENT FORMING WORKABILITY
JP2005314740A (en) * 2004-04-28 2005-11-10 Nippon Steel & Sumikin Stainless Steel Corp Ferritic stainless steel excellent in heat resistance and workability and method for producing the same
JP2005325377A (en) * 2004-05-12 2005-11-24 Nippon Steel & Sumikin Stainless Steel Corp Manufacturing method of heat-resistant ferritic stainless steel sheet with excellent workability
JP2005330583A (en) * 2004-04-15 2005-12-02 Jfe Seimitsu Kk Cu-Cr alloy and method for producing Cu-Cr alloy
WO2007094507A1 (en) * 2006-02-15 2007-08-23 Jfe Precision Corporation Cr-Cu ALLOY, PROCESS FOR PRODUCING THE SAME, HEAT SINK FOR SEMICONDUCTOR, AND HEAT DISSIPATING COMPONENT FOR SEMICONDUCTOR

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04198439A (en) * 1990-11-29 1992-07-17 Sumitomo Electric Ind Ltd Semiconductor device material and its manufacture
JPH09324230A (en) * 1996-06-06 1997-12-16 Furukawa Electric Co Ltd:The Highly conductive wire
JP3490853B2 (en) * 1996-11-08 2004-01-26 独立行政法人物質・材料研究機構 High-strength, high-conductivity, high-chromium-containing copper alloy material and method for producing the same
JP4346142B2 (en) * 1999-02-24 2009-10-21 古河電気工業株式会社 Low thermal expansion coefficient high thermal conductivity copper alloy and electrical and electronic equipment parts using the copper alloy
JP2006013420A (en) * 2004-01-28 2006-01-12 Kyocera Corp Electronic component storage package and electronic device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0536492B2 (en) * 1983-03-02 1993-05-31 Sumitomo Metal Ind
JP2002332503A (en) * 2001-05-08 2002-11-22 Japan Atom Energy Res Inst Method for producing Fe-50Cr alloy using plasma discharge sintering method
JP2003055739A (en) * 2001-06-05 2003-02-26 Nippon Steel Corp Ferritic thin steel sheet with excellent shape freezing properties
JP2003089853A (en) * 2001-09-14 2003-03-28 Nisshin Steel Co Ltd HIGH PURITY Fe-Cr ALLOY HAVING EXCELLENT FORMING WORKABILITY
JP2005330583A (en) * 2004-04-15 2005-12-02 Jfe Seimitsu Kk Cu-Cr alloy and method for producing Cu-Cr alloy
JP2005314740A (en) * 2004-04-28 2005-11-10 Nippon Steel & Sumikin Stainless Steel Corp Ferritic stainless steel excellent in heat resistance and workability and method for producing the same
JP2005325377A (en) * 2004-05-12 2005-11-24 Nippon Steel & Sumikin Stainless Steel Corp Manufacturing method of heat-resistant ferritic stainless steel sheet with excellent workability
WO2007094507A1 (en) * 2006-02-15 2007-08-23 Jfe Precision Corporation Cr-Cu ALLOY, PROCESS FOR PRODUCING THE SAME, HEAT SINK FOR SEMICONDUCTOR, AND HEAT DISSIPATING COMPONENT FOR SEMICONDUCTOR

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102612745A (en) * 2009-10-01 2012-07-25 Jfe精密株式会社 Radiating plate for electronic equipment and manufacturing method thereof
CN102612745B (en) * 2009-10-01 2016-02-24 Jfe精密株式会社 Radiating plate for electronic equipment and manufacturing method thereof
US9299636B2 (en) 2009-10-01 2016-03-29 Jfe Precision Corporation Heat sink for electronic device and process for production thereof
WO2016190130A1 (en) * 2015-05-28 2016-12-01 日本電波工業株式会社 Oscillation device
US10305491B2 (en) 2015-05-28 2019-05-28 Nihon Dempa Kogyo Co., Ltd. Oscillator
CN111584371A (en) * 2020-05-25 2020-08-25 苏州融睿电子科技有限公司 Manufacturing method of packaging shell and packaging shell

Also Published As

Publication number Publication date
JP2012216844A (en) 2012-11-08
JP2009038366A (en) 2009-02-19
JP5531329B2 (en) 2014-06-25
JP2009239299A (en) 2009-10-15
JP5216981B2 (en) 2013-06-19

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