TH1185C3 - Lead-free high temperature solder - Google Patents
Lead-free high temperature solderInfo
- Publication number
- TH1185C3 TH1185C3 TH303000421U TH0303000421U TH1185C3 TH 1185 C3 TH1185 C3 TH 1185C3 TH 303000421 U TH303000421 U TH 303000421U TH 0303000421 U TH0303000421 U TH 0303000421U TH 1185 C3 TH1185 C3 TH 1185C3
- Authority
- TH
- Thailand
- Prior art keywords
- lead
- high temperature
- free high
- temperature solder
- weight
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract 2
- 229910052802 copper Inorganic materials 0.000 claims abstract 2
- 239000010949 copper Substances 0.000 claims abstract 2
- 229910052709 silver Inorganic materials 0.000 claims abstract 2
- 239000004332 silver Substances 0.000 claims abstract 2
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Abstract
โลหะบัดกรีอุณหภูมิสูงชนิดไร้สารตะกั่วผสม ซึ่งมีส่วนประกอบของโลหะต่างๆ อยู่ในเนื้อของโลหะบัดกรีและ ที่ใช้เป็นส่วนประกอบในขั้นตอนกระบวนการประดิษฐ์ ผลิตภัณฑ์ ประกอบด้วย เงินมากกว่า 4.5 ~5.5% โดยน้ำหนัก ทองแดงมากกว่า 1.5 ~ 3.5% โดยน้ำหนักและค่าสมดุลจะเป็นดีบุก Lead-free high temperature solder Which contains various metals In the texture of solder and Used as a component in the fabrication process, the product contains more than 4.5 ~ 5.5% silver by weight, more than 1.5 ~ 3.5% copper by weight and the balance is tin.
Claims (1)
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TH1185A3 TH1185A3 (en) | 2003-12-22 |
| TH1185C3 true TH1185C3 (en) | 2003-12-22 |
Family
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