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WO2021085686A1 - Appareil microphone directionnel - Google Patents

Appareil microphone directionnel Download PDF

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Publication number
WO2021085686A1
WO2021085686A1 PCT/KR2019/014626 KR2019014626W WO2021085686A1 WO 2021085686 A1 WO2021085686 A1 WO 2021085686A1 KR 2019014626 W KR2019014626 W KR 2019014626W WO 2021085686 A1 WO2021085686 A1 WO 2021085686A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
mems transducer
directional microphone
microphone device
mems
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2019/014626
Other languages
English (en)
Korean (ko)
Inventor
윤상영
민철규
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Partron Co Ltd
Original Assignee
Partron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Partron Co Ltd filed Critical Partron Co Ltd
Publication of WO2021085686A1 publication Critical patent/WO2021085686A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04—Structural association of microphone with electric circuitry therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use

Definitions

  • the present invention relates to a microphone device, and more particularly, to a directional MEMS microphone device including a MEMS transducer.
  • MEMS Micro Electro Mechanical System
  • MEMS technology can be applied to fabricate micro-units of micro-sensors, actuators, or electromechanical structures by using micro machining technology applying integrated circuit technology.
  • the MEMS microphone to which the MEMS technology is applied can not only implement a very small device, but also can manufacture a plurality of MEMS microphones on a single wafer, enabling mass production.
  • Korean Patent Laid-Open Patent No. 10-2007-0053763 (published on May 25, 2007) of'silicon condenser microphone and its manufacturing method'
  • Korean Laid-Open Patent No. 10-2007-0078391 (published date 2007) July 31)'Small microphone elastomer shield'
  • Korean Patent Laid-Open Patent No. 10-0971293 (announced July 13, 2010)'Microphone', and the like.
  • the problem to be solved by the present invention is to provide a microphone device having a directional characteristic.
  • Another problem to be solved by the present invention is to reduce the manufacturing cost of the microphone device.
  • Another problem to be solved by the present invention is to easily determine the acoustic direction of the microphone device.
  • a directional microphone device for solving the above problem includes a first substrate, a second substrate having a first acoustic hole facing the first substrate, and between the first substrate and the second substrate.
  • a spacer positioned at and separating the first substrate from the second substrate, a first MEMS transducer positioned to face the first acoustic hole, a lower housing positioned on the first substrate and having a second acoustic hole, and And a second MEMS transducer positioned on the first surface of the first substrate to face the lower housing.
  • the lower housing may be made of metal.
  • the lower housing may be in the form of a can in which the second MEMS transducer is embedded.
  • the first MEMS transducer may be located on a second surface of the first substrate that is a surface opposite to the first surface.
  • the first MEMS transducer may be positioned on the second substrate to face the first sound hole.
  • the first substrate and the second substrate may be formed of a circuit board.
  • the first MEMS transducer may be attached to one of the first and second substrates with a non-conductive adhesive
  • the second MEMS transducer may be attached to the first substrate with a non-conductive adhesive
  • Each of the first substrate and the second substrate may include a signal line.
  • the spacer may include a via hole, and a signal line positioned on the first substrate and a signal line positioned on the second substrate may be connected through the via hole.
  • a signal processing unit that may be connected to the first MEMS transducer and the second MEMS transducer, and determines the direction of the sound using a reception time difference of the electrical signal output from the first MEMS transducer and the second MEMS transducer. It may further include.
  • the signal processing unit may be located on the first substrate or the second substrate.
  • the position of the sound is accurately determined by using the time difference between the output signals applied from different MEMS transducers.
  • the chamber of the MEMS transducer is formed by using the can-shaped lower housing made of metal, the manufacturing cost of the directional microphone device is reduced, and the back chamber area of the MEMS transducer is increased. The performance of the microphone device is improved.
  • the direction of sound is determined using two sound holes and two MEMS transducers respectively located in the substrate and the lower housing without forming a plurality of physically different sound receiving paths in the substrate or the housing. Accordingly, the structure of the directional microphone device is simplified and the manufacturing cost is reduced.
  • FIG. 1 is a schematic cross-sectional view of a directional microphone device according to an embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view of a directional microphone device according to another embodiment of the present invention.
  • the microphone device of this example is located on the first substrate 100 and faces the first substrate 100 on the first substrate 100, and an acoustic hole (eg, a first acoustic hole) H200
  • a second substrate 200 having a, a spacer 300 positioned between the first substrate 100 and the second substrate 200 to space the first substrate 100 and the second substrate 200 1
  • a lower housing 400 positioned below the substrate 100 and having an acoustic hole (eg, a second acoustic hole) H400, and first and second first and second housings positioned above and below the first substrate 100, respectively.
  • MEMS transducers (11, 12), and first and second signal processing units (21, 21, respectively) positioned on the upper and lower portions of the first substrate 100 and connected to the first and second MEMS transducers (11, 12) 22) can be provided.
  • the first substrate 100 may be formed in a plate shape as a component constituting the lower portion of the directional microphone device, and the first substrate 100 may be formed of a circuit board (eg, a rigid circuit board).
  • a circuit board eg, a rigid circuit board
  • the second substrate 200 is a constituent element constituting the top of the directional microphone device and may also be formed in a plate shape, and the second substrate 200 may also be formed of a rigid circuit board, a semiconductor substrate, or a ceramic substrate.
  • the first sound hole H200 completely penetrates the corresponding portion of the second substrate 100 and is a hole through which sound is introduced from the outside, and the introduced sound is the first MEMS transducer 11 ) Can be delivered.
  • the spacer 300 is for separating the space between the first substrate 100 and the second substrate 200, and the upper end of the spacer 300 is the lower surface of the second substrate 200 It is positioned in contact with and the lower end is positioned in contact with the upper surface of the first substrate 100.
  • the spacer 300 of this example may include at least one via hole H300 electrically connecting the first substrate 100 and the second substrate 200.
  • the via hole H300 is positioned along the height direction of the spacer 300 and is formed to completely penetrate the corresponding portion of the spacer 300 in the height direction.
  • the inside of the via hole H300 is provided with a metal portion 310 made of a conductive material such as metal, so that signal transmission between the first substrate 100 and the second substrate 200 can be performed through the via hole H300. have.
  • each of the first and second substrates 100 and 200 may have at least one signal line (S100, S200) positioned on the surface (eg, inner surface) of the corresponding substrate 100 or 200 or in the substrate. have. Accordingly, the signal line S100 located on the first substrate 100 and the signal line S200 located on the second substrate 200 may be electrically connected to each other through the metal part 310 of the via hole H300.
  • the spacer 300 and the second substrate 200 positioned on the upper surface of the first substrate 100 are opposite to the lower housing 400 and cover the upper surface of the first substrate 100, and the first substrate 100 It may function as an upper housing that surrounds and protects the first MEMS transducer 11 and the first signal processing unit 21 positioned on the upper surface of the.
  • the lower housing 400 is positioned on the lower surface of the first substrate 100 to cover the lower surface of the first substrate 100.
  • the lower housing 400 may be of a can type having an open upper portion and a side surface and a lower surface connected to each other.
  • the lower housing 400 is coupled to the lower surface of the first substrate 100, and the open upper portion is covered by the lower surface of the first substrate 100. ), a space surrounded by the side and bottom surfaces is formed.
  • the second MEMS transducer 12 and the second signal processing unit 22 positioned on the lower surface of the first substrate 100 are positioned in this inner space, and are protected by the lower housing 400.
  • the lower housing 400 may be connected to the first substrate 100 through solder or the like. Although not shown in the drawings, a ground portion having a ground potential may be formed on the first substrate 100, and the lower housing 400 may be electrically connected to and coupled to the ground portion of the first substrate 100.
  • the lower housing 400 may contain, for example, a metal such as stainless steel.
  • the second sound hole H400 located in the lower housing 400 is also a hole that completely penetrates the corresponding part of the lower housing 400, the same as the first sound hole H200, and the sound is introduced from the outside to form the second MEMS. To flow into the transducer 12.
  • the number of the first and second sound holes H200 and H400, respectively, in the second substrate 200 and the lower housing 400 is one, but in some cases, a plurality of holes may be densely located. .
  • the first and second substrates 100 and 200 may have a substantially cylindrical shape or a polygonal shape such as a rectangular parallelepiped, and the spacer 300 and the lower housing 400 have an empty space in the middle and have an upper surface. It may have a polygonal shape such as an open rectangular parallelepiped.
  • first sound hole H200 located on the second substrate 200 and the second sound hole H400 located on the lower housing 400 may be holes having a circular, elliptical, or polygonal planar shape.
  • the second acoustic hole H400 may be located at a different position of the lower housing 400 rather than the lower surface, such as a side surface, depending on a desired acoustic direction.
  • the first MEMS transducer 11 is an element that is positioned to face the first sound hole H200 and converts an sound signal corresponding to the sound input through the first sound hole H200 into an electrical signal and outputs it.
  • the MEMS transducer 12 is an element that faces the lower housing 400 and converts an acoustic signal corresponding to the sound input through the second acoustic hole H400 into an electrical signal and outputs it.
  • the mounting positions of the first and second MEMS transducers 11 and 12 may be determined according to the formation positions of the first and second sound holes H200 and H400.
  • the first MEMS transducer 11 corresponds to the first sound hole H200 and is located near the sound hole H200
  • the second MEMS transducer 12 corresponds to the second sound hole H400. It can be located close to the sound hall (H4 00).
  • each of the MEMS transducers 11 and 12 can detect the detection of the sound flowing through the corresponding sound holes H200 and H400 before the other MEMS transducers 12 and 11.
  • the first and second MEMS transducers 11 and 12 are both positioned to face each other on the upper and lower surfaces with the first substrate 100 as the center, but are not limited thereto. They can be positioned so that they do not face each other.
  • the first MEMS transducer 11 and the second MEMS transducer 12 may be respectively attached to the upper and lower surfaces of the first substrate 100 through a non-conductive adhesive, and the non-conductive adhesive may be epoxy.
  • the sound generated at the same point is generated by the first MEMS transducer 11 and the second MEMS transducer 12 at a time difference from each other. Each is detected and output as an electrical signal in the corresponding state.
  • one of the first and second MEMS transducers 11 and 12 determines whether to output the input sound to the corresponding device (not shown) according to the determined sound direction. Losing is the main MEMS transducer, and the remaining MEMS transducers (eg, 12) may be auxiliary MEMS transducers for determining the acoustic direction.
  • the first and second signal processing units 21 and 22 electrically and physically connected to the corresponding MEMS transducers 11 and 12 through wires W11 and W12 are applied from the corresponding MEMS transducers 11 and 12 It receives and processes the electrical signal.
  • the first and second signal processing units 21 and 22 may be formed of an application specific integrated circuit (ASIC) or the like.
  • ASIC application specific integrated circuit
  • first and second signal processing units 21 and 22 may include a timer, etc., determine the reception time of the electric signal applied from the corresponding MEMS transducers 11 and 12, and the determined reception time Is transmitted to one of the first and second signal processing units 21 and 22 (eg, 21).
  • the signal processing unit 21 compares the reception time of the sound signal for each of the first and second MEMS transducers 11 and 12 and calculates the reception time difference, and the first and second MEMS transducers 11 , 12), the direction of the sound is determined by determining the MEMS transducers 11 and 12 in which the sound signal was first received.
  • the signal processing unit 21 controls whether or not the electrical signal generated by the designated main MEMS transducer 11 is output according to the determined sound direction.
  • first and second signal processing units 21 and 22 connected to the first and second MEMS transducers 11 and 12 are provided, respectively.
  • the first signal processing unit 21 and the second MEMS transducer 12 positioned on the opposite side of the first substrate 100 form a via hole or the like in the first substrate 100 so that they are electrically connected to each other.
  • the electrical signal output from the second MEMS transducer 12 can be transmitted to the signal processing unit 21.
  • the correct sound direction is determined simply by using the sound holes H200 and H400 and the first and second MEMS transducers 11 and 12 corresponding thereto. .
  • the manufacturing time of the directional microphone device is reduced, and the manufacturing cost is also reduced.
  • FIG. 2 Compared with FIG. 1, components having the same structure and performing the same function are denoted by the same reference numerals as in FIG. 1, and detailed descriptions thereof are also omitted.
  • the directional microphone device of the present example includes a first substrate 100, a second substrate 200 positioned above the first substrate 100 and having a first acoustic hole H200, and a first substrate.
  • a spacer 300 that separates the 100 and the second substrate 200, a lower housing 400 located under the first substrate 100 and having a second acoustic hole H400, the first substrate 100 ) May be provided with a second MEMS transducer 12 located on the lower surface.
  • the first MEMS transducer 11 is located on the inner surface of the second substrate 200, and the first MEMS transducer 11 and the first MEMS transducer 11 are electrically and
  • the signal processing unit 21 physically connected is also located on the inner surface of the second substrate 200, that is, on the surface facing the first substrate 100.
  • the electrical connection between the second MEMS transducer 12 and the signal processing unit 21 is a metal located on the signal lines S100 and S200 formed on the first and second substrates 100 and 200 and the spacer 300. It may be achieved through the connection of the unit 310.
  • the second MEMS transducer 12 is electrically connected to the signal processing unit 21 mounted on the second substrate 200 and has only one signal processing unit 21, but as already described, As shown in FIG. 1, first and second signal processing units may be provided that are electrically and physically connected to the first and second MEMS transducers 11 and 12, respectively.
  • the first MEMS transducer 11 and the signal processing unit may be attached to the inner surface of the second substrate 200 using a non-conductive adhesive such as epoxy.
  • the first MEMS transducer 11 corresponds to the first sound hole H200 and is positioned to block the first sound hole H200, so that the first sound hole H200 is 1 It is facing the corresponding surface (eg, lower surface) of the MEMS transducer 11.
  • the empty space S100 surrounded by the first substrate 100, the spacer 300 and the second substrate 200 is used as a back chamber for sound reverberation in the directional microphone device. Can function.
  • the signal to noise ratio [SNR (signal to noise ratio)] improves.
  • the entire internal space S100 functions as a back chamber, so that the performance of the directional microphone device is further improved. An additional effect occurs.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

La présente invention concerne un appareil de microphone directionnel. L'appareil de microphone directionnel comprend : un premier substrat; un second substrat ayant un premier trou sonore faisant face au premier substrat; des matériaux d'espacement situés entre le premier substrat et le second substrat pour espacer le premier substrat et le second substrat l'un de l'autre; un premier transducteur MEMS situé de manière à faire face au premier trou sonore; un boîtier inférieur situé sur le premier substrat et ayant un second trou sonore; et un second transducteur MEMS situé sur une première surface du premier substrat de manière à faire face au boîtier inférieur.
PCT/KR2019/014626 2019-10-29 2019-10-31 Appareil microphone directionnel Ceased WO2021085686A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020190135205A KR102209688B1 (ko) 2019-10-29 2019-10-29 지향성 마이크로폰 장치
KR10-2019-0135205 2019-10-29

Publications (1)

Publication Number Publication Date
WO2021085686A1 true WO2021085686A1 (fr) 2021-05-06

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PCT/KR2019/014626 Ceased WO2021085686A1 (fr) 2019-10-29 2019-10-31 Appareil microphone directionnel

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KR (1) KR102209688B1 (fr)
WO (1) WO2021085686A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002315089A (ja) * 2001-04-19 2002-10-25 Nec Eng Ltd 話者方向検出回路
US20120250897A1 (en) * 2011-04-02 2012-10-04 Mwm Acoustics, Llc Dual Cell MEMS Assembly
US20150315013A1 (en) * 2014-04-30 2015-11-05 Solid State System Co., Ltd. Micro-electrical-mechanical system (mems) microphone
KR101931168B1 (ko) * 2017-12-19 2018-12-20 (주)파트론 지향성 마이크로폰
KR20190060158A (ko) * 2017-11-24 2019-06-03 (주)파트론 지향성 마이크로폰

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7434305B2 (en) 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
DE602007005405D1 (de) 2006-01-26 2010-05-06 Sonion Mems As Elastomerschild für Miniaturmikrofone
KR100971293B1 (ko) 2008-03-25 2010-07-20 주식회사 비에스이 마이크로폰

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002315089A (ja) * 2001-04-19 2002-10-25 Nec Eng Ltd 話者方向検出回路
US20120250897A1 (en) * 2011-04-02 2012-10-04 Mwm Acoustics, Llc Dual Cell MEMS Assembly
US20150315013A1 (en) * 2014-04-30 2015-11-05 Solid State System Co., Ltd. Micro-electrical-mechanical system (mems) microphone
KR20190060158A (ko) * 2017-11-24 2019-06-03 (주)파트론 지향성 마이크로폰
KR101931168B1 (ko) * 2017-12-19 2018-12-20 (주)파트론 지향성 마이크로폰

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