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WO2020101093A1 - Dispositif de microphone directionnel - Google Patents

Dispositif de microphone directionnel Download PDF

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Publication number
WO2020101093A1
WO2020101093A1 PCT/KR2018/014421 KR2018014421W WO2020101093A1 WO 2020101093 A1 WO2020101093 A1 WO 2020101093A1 KR 2018014421 W KR2018014421 W KR 2018014421W WO 2020101093 A1 WO2020101093 A1 WO 2020101093A1
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WO
WIPO (PCT)
Prior art keywords
substrate
sound
directional microphone
signal
microphone device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2018/014421
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English (en)
Korean (ko)
Inventor
박두영
임형열
민철규
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Partron Co Ltd
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Partron Co Ltd
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Filing date
Publication date
Application filed by Partron Co Ltd filed Critical Partron Co Ltd
Publication of WO2020101093A1 publication Critical patent/WO2020101093A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/04Microphones
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/20Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/32Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only
    • H04R1/326Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only for microphones
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003Mems transducers or their use

Definitions

  • the present invention relates to a microphone device, and more particularly, to a directional MEMS microphone device having directional acoustic characteristics including a MEMS transducer.
  • MEMS Micro Electro Mechanical System
  • MEMS technology may be applied to fabricate micro-sized micro-sized sensors, actuators, or electromechanical structures using micro machining technology using integrated circuit technology.
  • the MEMS microphone to which MEMS technology is applied can not only implement a very small device, but also can manufacture a large number of MEMS microphones on a single wafer, thereby enabling mass production.
  • Patent Document 1 Republic of Korea Patent Publication No. 10-2007-0053763 (published on May 25, 2007)
  • Patent Document 2 Republic of Korea Patent Publication No. 10-2007-0078391 (published on July 31, 2007)
  • Patent Document 3 Republic of Korea Patent Publication No. 10-0971293 (published on July 13, 2010)
  • An object of the present invention is to provide a microphone device having directional characteristics.
  • Another problem to be solved by the present invention is to easily determine the acoustic direction of the microphone device.
  • the directional microphone device of the present invention for solving the above problems is a first substrate having a first acoustic hole, the first substrate corresponding to the first acoustic hole and corresponding to the sound input to the first acoustic hole A first MEMS transducer for outputting a first output signal, a second substrate having a second acoustic hole, and corresponding to the second acoustic hole located on the second substrate and corresponding to the sound input to the second acoustic hole A second MEMS transducer for outputting a second output signal, a spacer positioned between the first substrate and the second substrate to separate the first substrate and the second substrate, and the first substrate or the second substrate And a signal processing unit processing first and second output signals applied from the first and second MEMS transducers, wherein the signal processing unit receives a time difference between the first output signal and the second output signal. Calculate to determine the direction of the sound, and control the output states of the first and second output signals according to the determined direction of the sound.
  • the directional microphone device of the present invention further includes a storage unit connected to the signal control unit and storing an acoustic directivity profile, wherein the signal processor comprises the first output signal and the audio signal according to the acoustic directivity profile according to the direction of the sound.
  • the output state of the second output signal can be controlled.
  • the first substrate and the second substrate are made of a circuit board, and the first MEMS transducer and the second MEMS transducer each use the first and second substrates using a non-conductive adhesive. It may be attached to the substrate.
  • the non-conductive adhesive may be made of epoxy.
  • the first substrate and the second substrate may each include a signal line.
  • the spacer has a via hole, and the signal line located on the first substrate and the signal line located on the second substrate may be connected through the via hole.
  • the signal processing unit includes a first signal processing unit and a second signal processing unit, and the first signal processing unit is mounted on the first substrate and is a first output signal applied from the first MEMS transducer.
  • the second signal processor may be mounted on the second substrate to process a second output signal applied from the second MEMS transducer.
  • the first substrate may include an input / output terminal formed on an outer surface.
  • the first substrate may further include a sealing member coupling pad formed around the first acoustic hole on the outer surface.
  • the position of the sound is accurately determined using the time difference of the output signal applied from different MEMS transducers.
  • the structure of the directional microphone device is simplified and manufacturing costs are reduced.
  • FIG. 1 is a block diagram of a directional microphone device according to an embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view of a directional microphone device according to an embodiment of the present invention.
  • FIG. 3 is a flowchart of an operation of a signal processor of a directional microphone device according to an embodiment of the present invention.
  • FIG. 4 is a schematic cross-sectional view of a directional microphone device according to another embodiment of the present invention.
  • FIG. 5 is a schematic cross-sectional view of a directional microphone device according to another embodiment of the present invention.
  • FIGS. 1 to 3 a directional microphone device according to an exemplary embodiment of the present invention will be described with reference to FIGS. 1 to 3.
  • the directional microphone device of this example is a signal connected to the first MEMS transducer 11, the second MEMS transducer 12, and the first and second MEMS transducers 11, 12
  • a processing unit 20 is provided.
  • the first and second MEMS transducers 11 and 12 are devices for converting and outputting an acoustic signal corresponding to the input sound into an electrical signal, and have the same function only in different positions.
  • the first and second MEMS transducers 11 and 12 may include first substrate 100 and first substrate 100 corresponding to the first substrate 100 as illustrated in FIG. 2.
  • a directional microphone having a spacer 300 positioned between the first substrate 100 and the second substrate 200 to be spaced apart between the second substrate 200 and the first substrate 100 and the second substrate 200 Located inside the device, it forms part of a directional microphone device.
  • the first substrate 100 is a component that forms a lower portion of the directional microphone device 1 and is formed in a plate shape, and the first substrate 100 may be formed of a circuit board (eg, a rigid circuit board). have. As shown in FIG. 2, the substrate 100 is provided with one acoustic hole (for example, a first acoustic hole) H110 that completely penetrates a corresponding portion of the substrate 100.
  • acoustic hole for example, a first acoustic hole
  • the second substrate 200 is a component that forms an upper portion of the directional microphone device, and is also formed in a plate shape.
  • the second substrate 200 may also be formed of a rigid circuit board, a semiconductor substrate, or a ceramic substrate.
  • the spacer 300 is for separating the gap between the first substrate 100 and the second substrate 200, as described above, the upper end of the spacer 300 is the lower surface of the second substrate 100 It is located in contact with the bottom of the first substrate 200 in contact with the top surface.
  • the spacer 300 of this example includes at least one via hole H300 that electrically connects the first substrate 100 and the second substrate 200 as shown in FIG. 1.
  • the via hole H300 is positioned along the height direction of the spacer 300 and is formed to completely penetrate the corresponding portion of the spacer 300 in the height direction.
  • the inside of the via hole H300 is made of a metal part 310 made of a conductive material such as metal.
  • each of the first substrate 100 and the second substrate 200 has at least one signal line located on a corresponding surface (eg, an inner surface) surface or substrate of the corresponding substrates 100 and 200, and a via hole H300 ),
  • the signal line located on the first substrate 100 and the signal line located on the second substrate 200 may be electrically connected to each other through the metal part 310.
  • the first and second sound holes H100 and H200 formed in the first substrate 100 and the second substrate 200 are holes through which sound is introduced from the outside, and the first and second sound holes H100, H200), the mounting positions of the first MEMS transducer 11 and the second MEMS transducer 12 are determined.
  • the first MEMS transducer 11 corresponds to the first acoustic hole H100 and is located close to the acoustic hole H100
  • the second MEMS transducer 12 corresponds to the second acoustic hole H200 Located near the acoustic hole (H200), each MEMS transducer (11, 12) detects the sound flowing through the corresponding acoustic hole (H100, H200) prior to other MEMS transducer (11, 12) Is done.
  • the first MEMS transducer 11 corresponds to the first acoustic hole H100 and is positioned in a form of blocking the first acoustic hole H100, so that the first acoustic hole H100 Is facing the corresponding surface (eg, bottom surface) of the first MEMS transducer 11, and the second MEMS transducer 12 also corresponds to the second acoustic hole H200 to block the second acoustic hole H200.
  • the second acoustic hole H200 faces the corresponding surface (eg, lower surface) of the second MEMS transducer 12.
  • the first MEMS transducer 11 and the second transducer 12 may be attached to the corresponding substrates 100 and 200 through a non-conductive adhesive, respectively, and the non-conductive adhesive may be epoxy.
  • the sounds generated at the same point are separated by the first MEMS transducer 11 and the second MEMS transducer 12 at a time difference from each other. Each is detected.
  • the first and second MEMS transducers 11 and 12 are electrically connected to the signal processing unit 20 located on the first substrate 100, and the signal processing unit 20 receives electrical signals corresponding to the sensed acoustic signals, respectively. ).
  • the signal processing unit 20 is located on the first substrate 100 as shown in FIG. 2, but may be located on the second substrate 200, and the storage unit 21 and a timer 22 It is provided.
  • the signal processing unit 20 includes an output signal applied from the first MEMS transducer 11 (eg, a first output signal) and an output signal applied from the second MEMS transducer 12 (eg, a second output signal). To receive.
  • the signal processing unit 20 can receive the corresponding output signal directly through the wire W11 with the corresponding MEMS transducer 11 located on the same substrate (eg, the first substrate 100) as itself, and The output signal is transmitted through the via hole (H300) of the signal line and the spacer 300 located in the corresponding substrate 200 and the corresponding MEMS transducer 12 located in a different substrate (eg, the second substrate 200).
  • Can receive can receive
  • the second MEMS transducer 12 positioned on the second substrate 200 is connected to a signal line located on the substrate 200 using a wire W11. Accordingly, the second output signal of the second MEMS transducer 12 is transmitted to the signal line of the second substrate 200 through the corresponding wire W11, and the signal line of the second substrate 200 is connected to the via hole H300 ), The second output signal is applied to the signal processing unit 20 through the corresponding signal line of the first substrate 100 connected to the signal line of the second substrate 200 because it is connected to the corresponding signal line of the first substrate 100 do.
  • the reception time of the two output signals is determined using the timer 22 to determine the time difference between the reception times of the two output signals, that is, the reception signal difference.
  • the direction of the sound is determined using the received time difference between the two determined output signals, and the determined direction of the sound and the output signal received using the acoustic directivity profile stored in the storage unit 21. Determine the output status.
  • the storage unit 21 stores data necessary for the operation of the signal processing unit 20, a sound directing profile, and location information of each sound hole H100 and H200.
  • the storage unit 21 and the timer 22 may be provided as separate components from the signal processing unit 20 outside the signal processing unit 20.
  • the sound oriented profile is determined according to a setting operation by the user, and is data that sets the output state of the output signal according to the determined sound direction.
  • the signal processing unit 20 controls the output state of the output signals input to the first and second sound holes H100 and H200 using the determined sound direction and sound direction profile.
  • the signal processing unit 20 determines whether the first and second output signals are received from the first MEMS transducer 11 and the second MEMS transducer 12, respectively (S11, S12). .
  • the signal processing unit 20 starts the timer 22.
  • the time at which the first and second output signals are received is determined by using and stored in the storage unit 21 (S13 to S14).
  • the signal processor 20 calculates a reception time difference between the first and second output signals using the received time of the stored first and second output signals (S15), and calculates the difference between the calculated first and second output signals.
  • the sound direction is determined using the reception time difference (S16).
  • the signal processing unit 20 determines the output states of the first and second output signals in a state defined in the sound directivity profile using the determined sound direction and the sound directivity profile of the storage unit 21 (S17). , Generates and outputs audio signals corresponding to the first and second output signals in a corresponding state (S18).
  • the signal processing unit 20 initializes the reception times of the counted first and second output signals (S19).
  • the present example simply does not need to change the first substrate 100 or the second substrate 200 to form a plurality of physically different acoustic reception paths, and the acoustic holes H100, H200 and the corresponding first and The correct direction of sound is determined using the second MEMS transducers 11 and 12.
  • the directional microphone device of this example includes two signal processing units 20.
  • the signal processing unit 20 includes a first signal processing unit 20-1 and a second signal processing unit 20-2.
  • the first signal processor 20-1 may be mounted on the first substrate 100 to process the first output signal applied from the first MEMS transducer 11.
  • the second signal processing unit 20-2 may be mounted on the second substrate 200 to process the first output signal applied from the second MEMS transducer 12.
  • a plurality of signal processing units may further process each output signal of a MEMS transducer to further improve processing performance.
  • the directional microphone device 1 of this example may be mounted on a mounting substrate 2 of an electronic device and used. Specifically, the first substrate 100 may be coupled to the mounting substrate 2.
  • the first substrate 100 includes at least one input / output terminal 101 through which signals are input or output on the lower surface (outer surface).
  • the input / output terminal 101 is electrically connected to a connection pad formed on the mounting substrate 2.
  • the first substrate 100 further includes a sealing member coupling pad 102 formed around the first acoustic hole H110 on the lower surface.
  • the sealing member 103 may be coupled to the sealing member coupling pad 102.
  • the sealing member 103 may seal the gap between the first substrate 100 and the mounting substrate 2 to suppress the outflow of sound flowing into the first acoustic hole H110.
  • first substrate 200 second substrate
  • metal part 11 first MEMS transducer

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Obtaining Desirable Characteristics In Audible-Bandwidth Transducers (AREA)

Abstract

La présente invention concerne un dispositif de microphone directionnel comprenant : un premier substrat comportant un premier trou sonore ; un premier transducteur MEMS positionné au niveau du premier substrat pour correspondre au premier trou sonore, et émettant un premier signal de sortie correspondant à une entrée sonore à travers le premier trou sonore ; un second substrat comportant un second trou sonore ; un second transducteur MEMS positionné au niveau du second substrat pour correspondre au second trou sonore, et émettant un second signal de sortie correspondant à une entrée sonore à travers le second trou sonore ; un espaceur positionné entre le premier substrat et le second substrat, et espaçant le premier substrat et le second substrat ; et une unité de traitement de signal positionnée au niveau du premier substrat ou du second substrat, et traitant les premier et second signaux de sortie appliqués à partir des premier et second transducteurs MEMS, l'unité de traitement de signal calculant une différence de temps de réception entre le premier signal de sortie et le second signal de sortie pour déterminer la direction d'un son, et commandant des états de sortie des premier et second signaux de sortie selon la direction déterminée du son.
PCT/KR2018/014421 2018-11-15 2018-11-22 Dispositif de microphone directionnel Ceased WO2020101093A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2018-0140485 2018-11-15
KR1020180140485A KR102085210B1 (ko) 2018-11-15 2018-11-15 지향성 마이크로폰 장치

Publications (1)

Publication Number Publication Date
WO2020101093A1 true WO2020101093A1 (fr) 2020-05-22

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PCT/KR2018/014421 Ceased WO2020101093A1 (fr) 2018-11-15 2018-11-22 Dispositif de microphone directionnel

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WO (1) WO2020101093A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025220912A1 (fr) * 2024-04-19 2025-10-23 엘지이노텍 주식회사 Microphone mems

Citations (5)

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US20120250897A1 (en) * 2011-04-02 2012-10-04 Mwm Acoustics, Llc Dual Cell MEMS Assembly
KR20140138407A (ko) * 2013-05-23 2014-12-04 (주)파트론 단일지향성 멤스 마이크로폰
KR101610145B1 (ko) * 2014-11-28 2016-04-08 현대자동차 주식회사 마이크로폰 모듈 및 그 제어방법
KR101702561B1 (ko) * 2010-08-30 2017-02-03 삼성전자 주식회사 음원출력장치 및 이를 제어하는 방법
KR20180090022A (ko) * 2017-02-02 2018-08-10 한국전자통신연구원 다중 전방향 카메라 및 마이크 기반 가상현실 제공 방법 및 가상 현실 제공 방법을 수행하는 음향 신호 처리 장치 및 영상 신호 처리 장치

Family Cites Families (5)

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Publication number Priority date Publication date Assignee Title
US7434305B2 (en) 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
ATE462276T1 (de) 2006-01-26 2010-04-15 Sonion Mems As Elastomerschild für miniaturmikrofone
KR100971293B1 (ko) 2008-03-25 2010-07-20 주식회사 비에스이 마이크로폰
US9552840B2 (en) * 2010-10-25 2017-01-24 Qualcomm Incorporated Three-dimensional sound capturing and reproducing with multi-microphones
US9491539B2 (en) * 2012-08-01 2016-11-08 Knowles Electronics, Llc MEMS apparatus disposed on assembly lid

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101702561B1 (ko) * 2010-08-30 2017-02-03 삼성전자 주식회사 음원출력장치 및 이를 제어하는 방법
US20120250897A1 (en) * 2011-04-02 2012-10-04 Mwm Acoustics, Llc Dual Cell MEMS Assembly
KR20140138407A (ko) * 2013-05-23 2014-12-04 (주)파트론 단일지향성 멤스 마이크로폰
KR101610145B1 (ko) * 2014-11-28 2016-04-08 현대자동차 주식회사 마이크로폰 모듈 및 그 제어방법
KR20180090022A (ko) * 2017-02-02 2018-08-10 한국전자통신연구원 다중 전방향 카메라 및 마이크 기반 가상현실 제공 방법 및 가상 현실 제공 방법을 수행하는 음향 신호 처리 장치 및 영상 신호 처리 장치

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KR102085210B1 (ko) 2020-03-04

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