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WO2011145790A1 - Ensemble microphone - Google Patents

Ensemble microphone Download PDF

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Publication number
WO2011145790A1
WO2011145790A1 PCT/KR2010/008452 KR2010008452W WO2011145790A1 WO 2011145790 A1 WO2011145790 A1 WO 2011145790A1 KR 2010008452 W KR2010008452 W KR 2010008452W WO 2011145790 A1 WO2011145790 A1 WO 2011145790A1
Authority
WO
WIPO (PCT)
Prior art keywords
printed circuit
circuit board
microphone
case
sound hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2010/008452
Other languages
English (en)
Korean (ko)
Inventor
송청담
심용현
김창원
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BSE Co Ltd
Original Assignee
BSE Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BSE Co Ltd filed Critical BSE Co Ltd
Publication of WO2011145790A1 publication Critical patent/WO2011145790A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials

Definitions

  • the present invention relates to a microphone assembly, and more particularly, to a microphone assembly having a configuration in which a sufficient back chamber volume is secured to improve acoustic characteristics.
  • a condenser microphone widely used in a mobile communication terminal or an audio device includes a voltage bias element, a diaphragm / back plate pair forming a capacitor C that changes in response to sound pressure, and an electric field for buffering an output signal.
  • Effect transistor JFET
  • the diaphragm, spacer ring, insulation ring, back plate, and conduction ring are sequentially inserted in one case, and finally, the printed circuit board mounted with circuit parts is inserted, and the end of the case is printed circuit. It was bent to the substrate side to complete one assembly.
  • MEMS Micro Electro Mechanical System
  • MEMS chip microphones manufactured using this micromachining technology are designed for miniaturization, high performance, multifunctionalization, and integration of conventional microphone parts such as diaphragm, spacer ring, insulation ring, back plate, and conduction ring through ultra-precision micro machining. And there is an advantage that can improve the reliability.
  • the silicon condenser microphone 100 includes a case in which a printed circuit board 110, a MEMS chip 120 mounted on the printed circuit board 110, a special purpose semiconductor (ASIC) chip 130, and a sound hole 140 are formed ( 150).
  • ASIC special purpose semiconductor
  • the MEMS chip 120 has a structure in which a back plate 121 is formed on a silicon wafer by using MEMS technology, and then a vibrating membrane 123 is formed with a spacer 122 interposed therebetween. A sound hole 124 is formed in the back plate 121.
  • a sound hole 140 is provided in an upper part of a case, and a MEMS chip 120 is mounted on a lower single printed circuit board.
  • the lower side of the printed circuit board is provided with a connection terminal for electrical coupling with an external device.
  • the external sound is introduced into the sound hole 140 formed in the case 150 to vibrate the vibrating membrane 123.
  • the internal space of the MEMS chip indicated by reference numeral 126 is a back chamber; 126) space.
  • the back chamber space refers to a space opposite to the side on which the external sound is introduced based on the vibration membrane.
  • the MEMS chip when the MEMS chip is mounted on the substrate as in the microphone 100 illustrated in FIG. 1, the external sound is introduced through the sound hole 140 to be transmitted to the vibrating membrane 123 of the MEMS chip.
  • the space 126 defined on the opposite side of the vibrating membrane becomes a back chamber space.
  • the back chamber space is secured enough to secure the overall performance of the microphone, in this case, since the size of the map chip 120 is very small, in the case of the configuration in which the back chamber space should be provided inside the MEMS chip, It is difficult to secure the back chamber space. This causes a problem that the sound quality of the microphone is degraded.
  • the present invention has been proposed to solve the above problems, and an object thereof is to provide a microphone capable of sufficiently securing the back chamber space.
  • Microphone of the present invention one side is open, the other side is the case formed with an external sound hole;
  • a first printed circuit board coupled to the other side of the case and having an inner sound hole communicating with the outer sound hole;
  • a MEMS chip mounted on an inner surface of the first printed circuit board and mounted to face the inner sound hole;
  • a second printed circuit board coupled to an open side of the case, positioned apart from the first printed circuit board, and having a plurality of connection terminals formed on an outer surface thereof;
  • a plurality of conductive connecting members electrically connecting the first printed circuit board and the second printed circuit board; Characterized in that formed.
  • the conductive connecting member coil-shaped conductive spring, columnar form, or preferably have elasticity.
  • the first support circuit board and the second printed circuit board is provided with a spaced apart support member that can be supported while maintaining a mutual gap.
  • the spaced apart support member has a size corresponding to the shape of the first printed circuit board and the second printed circuit board, and the first and second printed circuit boards have a thickness equal to a distance from each other. It is preferable that it is formed to have an internal space which is an empty space.
  • the spaced support member it is also preferably provided with a receiving portion that can be accommodated and supported by each conductive connection member.
  • the outer sound hole of the case and the inner sound hole of the first printed circuit board is provided so as not to face each other, the outer sound hole and the inner sound hole, the sound path formed between the case and the first printed circuit board It is preferred to be configured to communicate.
  • a plating layer may be provided on an outer surface of the first printed circuit board, and the acoustic path may include a path formed by corrosion of the plating layer on the outer surface of the first printed circuit board.
  • the back chamber space can be sufficiently secured, and the effect of improving the acoustic characteristics of the microphone can be obtained.
  • the assembly when provided with a spaced apart supporting member, the assembly is easy, it is possible to obtain the effect of easy adjustment of the back chamber space.
  • the internal parts including the map chip can be prevented from being directly exposed to light.
  • 1 is a schematic cross-sectional view of a conventional microphone
  • FIG. 2 is a perspective view of a microphone of one embodiment according to the present invention.
  • FIG. 3 is an exploded perspective view of the microphone of FIG. 2;
  • FIG. 6 is a schematic cross-sectional view of the microphone of FIG. 2;
  • 7 and 8 are reference graphs comparing acoustic characteristics of the microphone of FIG. 2 and the conventional microphone of FIG. 1.
  • connection terminal 50 ... conductive connection member
  • the microphone 1 of the present embodiment is a device for converting sound waves such as voice, sound, sound, etc. into electrical signals, and includes a case 10, a first printed circuit board 20, a MEMS chip 30, and a second printed circuit. It comprises a substrate 40, a conductive connecting member 50 and the spaced apart support member 60.
  • the microphone 1 of the present invention is mainly used for personal mobile communication terminals such as mobile phones, PDAs, and smart phones.
  • the case 10 forms an external appearance of the microphone. Various components are mounted in the inside. One side of the case 10 is open, and the other side 11 is formed with an external sound hole 12. Since the external sound hole 12 is penetrated, external sound flows into the case.
  • the case 10 is a hexahedron whose surface is rectangular.
  • the overall shape of the case may be variously modified. That is, the case may have a cylindrical shape, or may have a columnar shape having an elliptical cross section in the horizontal direction.
  • the case 10 has four side surfaces 14 extending downward from the other side 11.
  • the lower end of each side 14 is provided with a curling portion 16.
  • the curling unit 16 is fixed as the shape shown in FIGS. 4 and 6 after the other parts shown inside the case are inserted to fix the internal parts.
  • the interior parts are fixed and assembled by curing the curling portion 16 at the lower end of the case side. Therefore, there is no need for a fixing means such as a separate adhesive for fixing between internal parts.
  • the case 10 is formed of a conductive material such as nickel, copper, aluminum, copper, or an alloy thereof having excellent noise blocking characteristics.
  • the first printed circuit board 20 is coupled to the inside of the other side 11 of the case 10.
  • electrical components such as the MEMS chip 30 and the amplifier 70 are mounted on the lower surface of the first printed circuit board 20 based on the directions of FIGS. 2 and 4.
  • the first printed circuit board 20 is also called a die (DIE) printed circuit board because various electrical components are mounted thereon.
  • DIE die
  • the outer sound hole 12 and the inner sound hole 22 are configured not to face each other as shown in FIG. That is, the outer sound hole 12 and the inner sound hole 22 are positioned so as to shift from each other. Therefore, the external sound introduced through the external sound hole 12 passes through the sound path 24 formed between the case 10 and the first printed circuit board, and then through the internal sound hole 22 to the MEMS chip 30. Delivered.
  • an outer surface of the first printed circuit board 20 is provided with a copper plating layer 26.
  • the center portion of the plating layer 26 is configured to be removed by corrosion to form the acoustic path 24.
  • the length, direction, shape, or height of the sound path may be variously modified according to the needs of the user.
  • the method of cutting, mold, injection, or the like can be used in addition to the method of corroding and forming the copper layer as in the present embodiment.
  • the acoustic path is not limited to that formed in the first printed circuit board as in the present embodiment, and may be formed in the case as long as the external sound hole and the internal sound hole communicate with each other. You may.
  • the MEMS chip 30 is mounted on the inner surface of the first printed circuit board.
  • the inner surface refers to the surface facing the inner space 62.
  • the MEMS chip 30 is mounted to face the internal sound hole 22.
  • the MEMS chip 30 is mounted to face the internal sound hole so that the MEMS chip 30 can receive the sound signal introduced through the internal sound hole 22. 22) is mounted on the formed portion.
  • the MEMS chip 30 converts the received acoustic signal into an electrical signal.
  • the MEMS chip 30 includes a configuration such as a vibrating membrane, a spacer, and a back plate as described in the background art section above.
  • the amplifier 70 is mounted on the inner surface of the first printed circuit board 20 together with the MEMS chip 30.
  • the amplifier 70 receives and amplifies the electrical signal received from the MEMS chip 30.
  • the amplifier 70 is also called a special purpose semiconductor (ASIC) chip.
  • ASIC special purpose semiconductor
  • the MEMS chip 30 and the amplifier 70 are connected to each other by a gold bonding wire.
  • the amplifier 70 is electrically connected to the first printed circuit board 20.
  • the second printed circuit board 40 is coupled to one open side of the case 10. While coupled to the open side of the case 10, it defines an inner space 62 with the case 10. The second printed circuit board 40 is spaced apart from the first printed circuit board 20.
  • connection terminals 42 are provided on the outer surface of the second printed circuit board 40.
  • connection terminal is also called a connection terminal or pad.
  • the second printed circuit board 40 is also called a pad printed circuit board.
  • the connection terminal 42 is electrically connected to the MEMS chip 30 and the amplifier 70 inside, and is configured to connect with an external device.
  • the number of connection terminals 42 can be increased or decreased as needed, and the provided position can be changed as needed.
  • the conductive connection member 50 is provided in plural and serves to electrically connect the first printed circuit board 20 and the second printed circuit board 40.
  • Each conductive connecting member 50 is a spring in which a conductive metal wire is bent in a coil form. Because of the spring, even if the assembly tolerance is not precise, the electrical connection between the first and second printed circuit boards 20, 40 is made simple and reliable.
  • the conductive connection member may be variously modified in a shape and a material, in addition to a spring shape formed by bending a conductive metal wire within the range for electrically connecting the first and second printed circuit boards.
  • the conductive connecting member 50 does not necessarily need to be a metal in the material thereof, and may be conductive silicon, or may be formed of a non-conductive material and provided with a conductive layer by plating on its outer surface.
  • the conductive connecting member may also be a simple cylinder or pin shape instead of a spring.
  • each of the first and second printed circuit boards includes a groove portion capable of fixing both ends of the conductive connecting member, and the conductive connecting member is directly connected to the first and second printed circuit boards without assistance of other configurations. It may be fixed to a printed circuit board.
  • the first printed circuit board 20 and the second printed circuit board 40 maintain a mutual gap. And it is further provided with a space supporting member 60 that can be supported.
  • the spaced support member 60 has a rectangular frame shape so as to correspond to the shapes of the first printed circuit board 20 and the second printed circuit board 40.
  • the spaced apart supporting member 60 has an empty center portion to define the inner space 62 together with the first and second printed circuit boards 20 and 40.
  • the portion surrounding the inner space 62 is the edge portion 64.
  • the spaced apart supporting member 60 has a thickness equal to a distance from which the first and second printed circuit boards 20 and 40 are spaced apart from each other.
  • the spaced supporting member 60 is provided with a receiving portion 66 in which each of the plurality of conductive connecting members can be accommodated and supported.
  • the accommodating part 66 has a cylindrical shape in which a part of the side surface is open, and thus the spring-shaped conductive connecting member 50 is easily coupled in the vertical direction, and thus is not separated in the horizontal direction.
  • Four receiving portions 66 are provided, one for each corner. After inserting the spring-shaped conductive connection member 50 into the receiving portion 66, and inserting the other with the other parts in the case and the curling portion 16 is cured, the assembly of the microphone 1 is simply completed.
  • the inner space 62 is a back chamber space. That is, the back chamber means a space on the opposite side to the external sound is transmitted based on the vibration membrane configuration of the MEMS chip 30, in this embodiment, the MEMS chip 30 is opposed to the internal sound hole 22 When mounted so that the inner space 62, based on the vibration membrane provided in the MEMS chip 30 is a space located on the opposite side to the external sound is transmitted, the inner space 62 is a back chamber.
  • the thickness of the spaced support member 60 and the volume of the edge portion 64 is adjusted, the size and shape of the back chamber space can be adjusted.
  • the microphone 1 includes a first printed circuit board 20 and a second printed circuit board 40 that are electrically connected to each other by the conductive connecting members 50 and are spaced apart from each other. And the MEMS chip 30 is provided to face the internal sound holes 22 of the first printed circuit board 20, and thus formed between the first and second printed circuit boards 20 and 40.
  • the internal space can be used as a back chamber space.
  • the present invention it is possible to sufficiently secure the back chamber space, which in turn has the advantage that the acoustic characteristics of the microphone are improved.
  • the size of the back chamber space there is an advantage that can be easily adjusted by adjusting the distance between the first, second printed circuit board (20, 40).
  • the spaced apart supporting member 60 is provided between the first and second printed circuit boards 20 and 40, it is easy to variously change the shape and shape of the first and second printed circuit boards. There is an advantage that it is also possible to easily adjust the volume of the inner space 62 to the required.
  • the spaced apart support member 60 has the advantage that the first and second printed circuit boards 20 and 40 can be stably fixed in a spaced apart state.
  • the spaced support member 60 includes the receiving portion 66, there is an advantage that the assembly of the spring-shaped conductive connection member 50 is made simple and robust.
  • the MEMS chip 120 used in the conventional microphone 100 illustrated in FIG. 1 is a type in which sound holes are formed in a case and mounted on a substrate, a back chamber space must be provided therein.
  • Such a MEMS chip 120 has a configuration different from that of a MEMS chip used for a microphone having a configuration in which sound holes are formed in a substrate and mounted in the sound holes.
  • the structure of the MEMS chip used had to be different depending on where the sound holes of the microphone were formed.
  • the outer sound hole 12 formed in the case 10 and the inner sound hole 22 formed in the first printed circuit board 20 are configured to be shifted without facing each other, and these are arranged in the acoustic path 24. Since it is communicated through, there is an advantage that it is possible to diversify the acoustic path 24.
  • external sound holes 12 and the internal sound holes 22 do not face each other and are shifted away from each other, electronic components such as internal MEMS chips and amplifiers may be used for various external lights such as visible light, ultraviolet light, infrared light, or the like. There is an advantage that the direct exposure to the same various light can be prevented.
  • the printed circuit boards are physically separated and used as two, it is possible to use a single layer instead of a structure in which a plurality of layers are laminated and bonded. Therefore, there is an advantage that the manufacturing of the printed circuit board is simple and the cost is reduced compared to the conventional.
  • Figure 7 and Figure 8 shows the results of experiments with the acoustic characteristics of the microphone 1 of the present embodiment and the conventional microphone 100 as illustrated in FIG. Looking at the high-frequency range on the right side of each graph, it can be seen that the microphone 1 of this embodiment has a significant improvement in acoustic characteristics due to sufficient back chamber space being secured as compared with the prior art.
  • the present invention is not limited thereto. That is, even without a spaced support member, the first and second printed circuit boards may be configured to be spaced apart from each other using only the conductive connection members.
  • the outer sound hole and the inner sound hole do not face each other, but the present invention is not limited thereto. That is, the external sound hole and the internal sound hole may be configured to face each other, but the embodiment of this configuration may obtain all of the remaining effects described above, except for effects obtained by the two sound holes not facing each other. .

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  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Micromachines (AREA)

Abstract

La présente invention se rapporte à un microphone comprenant : un boîtier dont un côté est ouvert et dont l'autre côté comporte un trou externe pour la tonalité ; une première carte de circuit imprimé qui est couplée à cet autre côté du boîtier et qui possède un trou interne pour la tonalité en communication avec le trou externe pour la tonalité ; une puce MEMS qui est montée sur un côté intérieur de la première carte de circuit imprimé de manière à être placée en regard du trou interne pour la tonalité ; une seconde carte de circuit imprimé qui est couplée audit côté ouvert du boîtier, qui est séparée de la première carte de circuit imprimé et qui possède une pluralité de bornes de connexion situées sur son côté extérieur ; et une pluralité d'éléments de connexion conducteurs qui connectent électriquement la première et la seconde carte de circuit imprimé. Le microphone faisant l'objet de la présente invention a l'avantage de laisser un espace suffisant pour une chambre arrière.
PCT/KR2010/008452 2010-05-20 2010-11-26 Ensemble microphone Ceased WO2011145790A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0047662 2010-05-20
KR20100047662A KR101094452B1 (ko) 2010-05-20 2010-05-20 마이크로폰 조립체

Publications (1)

Publication Number Publication Date
WO2011145790A1 true WO2011145790A1 (fr) 2011-11-24

Family

ID=44983125

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/008452 Ceased WO2011145790A1 (fr) 2010-05-20 2010-11-26 Ensemble microphone

Country Status (4)

Country Link
KR (1) KR101094452B1 (fr)
CN (2) CN102256190A (fr)
TW (1) TWI527469B (fr)
WO (1) WO2011145790A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015197105A1 (fr) * 2014-06-23 2015-12-30 Epcos Ag Microphone et procédé de fabrication d'un microphone
US20220132231A1 (en) * 2020-06-23 2022-04-28 Knowles Electronics, Llc Adapters for microphones and combinations thereof

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI573469B (zh) * 2012-02-22 2017-03-01 美律實業股份有限公司 微機電麥克風封裝模組
CN102892064A (zh) * 2012-10-30 2013-01-23 无锡芯奥微传感技术有限公司 微机电声学传感器封装结构
KR101496192B1 (ko) * 2013-04-11 2015-02-27 싸니코전자 주식회사 피에조 진동판이 구비된 멤스 마이크로폰
CN112399733A (zh) * 2019-08-16 2021-02-23 Oppo（重庆）智能科技有限公司 一种电子设备
TWI730834B (zh) * 2020-07-03 2021-06-11 加高電子股份有限公司 麥克風結構

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007081614A (ja) * 2005-09-13 2007-03-29 Star Micronics Co Ltd コンデンサマイクロホン
JP2007082034A (ja) * 2005-09-16 2007-03-29 Matsushita Electric Works Ltd シリコンマイクロホンパッケージ

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Publication number Priority date Publication date Assignee Title
KR100722686B1 (ko) 2006-05-09 2007-05-30 주식회사 비에스이 부가적인 백 챔버를 갖고 기판에 음향홀이 형성된 실리콘콘덴서 마이크로폰
KR100982239B1 (ko) * 2007-11-02 2010-09-14 주식회사 비에스이 피시비에 음공이 형성된 멤스 마이크로폰 패키지
CN201274566Y (zh) 2008-09-26 2009-07-15 瑞声声学科技(深圳)有限公司 Mems麦克风

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007081614A (ja) * 2005-09-13 2007-03-29 Star Micronics Co Ltd コンデンサマイクロホン
JP2007082034A (ja) * 2005-09-16 2007-03-29 Matsushita Electric Works Ltd シリコンマイクロホンパッケージ

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015197105A1 (fr) * 2014-06-23 2015-12-30 Epcos Ag Microphone et procédé de fabrication d'un microphone
US10499161B2 (en) 2014-06-23 2019-12-03 Tdk Corporation Microphone and method of manufacturing a microphone
US20220132231A1 (en) * 2020-06-23 2022-04-28 Knowles Electronics, Llc Adapters for microphones and combinations thereof
US11659310B2 (en) * 2020-06-23 2023-05-23 Knowles Electronics, Llc Adapters for microphones and combinations thereof
US20230254619A1 (en) * 2020-06-23 2023-08-10 Knowles Electronics, Llc Adapters for microphones and combinations thereof
US11968487B2 (en) * 2020-06-23 2024-04-23 Knowles Electronics, Llc Adapters for microphones and combinations thereof
US20240236537A1 (en) * 2020-06-23 2024-07-11 Knowles Electronics, Llc Adapters for microphones and combinations thereof
US12317019B2 (en) * 2020-06-23 2025-05-27 Knowles Electronics, Llc Adapters for microphones and combinations thereof

Also Published As

Publication number Publication date
TWI527469B (zh) 2016-03-21
KR20110128058A (ko) 2011-11-28
TW201216723A (en) 2012-04-16
KR101094452B1 (ko) 2011-12-15
CN102256190A (zh) 2011-11-23
CN202135311U (zh) 2012-02-01

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