201216723 六、發明說明： 【發明所屬之技術領域】 本發明係關於-種麥克風，更具體而言，尤指一種關 於以下結構的麥克馳裝體：透過充分確保背腔空間（back chamber volume)而能夠提高音頻特性。 【先前技術】 通常’廣泛使用於移動通信終端機或音頻系統等的電 • 容式麥克風，由偏壓元件、形成與聲壓對應地發生變化的 電容C之一對膜片/背板、以及用於緩衝輸出信號的結型場 效應電晶體（JFET)構成。這種傳統方式的電容式麥克風是 透過以下方式構成的。在一個殼體内依序漱入振動板、墊 片環、絕緣環、背板、通電環之後，最後放入安裝有電路 部件的印刷電路基板，然後將殼體的末端部分向印刷電路 基板側折彎，進而完成一個組裝體。 近年來’在麥克風上整合小型裝置的技術，係利用微 細加工的半導體加工技術。稱做微機電系統（MEMS : Micro201216723 VI. Description of the Invention: [Technical Field] The present invention relates to a microphone, and more particularly to a microphone body of the following structure: by sufficiently ensuring a back chamber volume Can improve audio characteristics. [Prior Art] Generally, an electric microphone that is widely used in a mobile communication terminal or an audio system, a biasing element, a capacitor C that changes in accordance with sound pressure, a diaphragm/backplane, and A junction field effect transistor (JFET) for buffering the output signal. This conventional mode of condenser microphone is constructed in the following manner. After inserting the vibrating plate, the spacer ring, the insulating ring, the back plate, and the energizing ring in a casing, the printed circuit board on which the circuit component is mounted is finally placed, and then the end portion of the casing is directed to the side of the printed circuit board. Bend and complete an assembly. In recent years, the technology of integrating small devices on a microphone is a semiconductor processing technology using microfabrication. Microelectromechanical system (MEMS: Micro
Electro Mechanical System)的這種技術中，透過應用半 ' 導體工序’特別是積體電路技術的微細加工技術’能夠製 * 造出以為單位的超小型感測器或致動器及電子機械構 ie物利用樣的微細加工技術而製造的MEMS晶片麥克風 具有以下優點：透過超精密微細加工，將以往的振動板、 墊片環、絕緣環、背板、通電環等傳統的麥克風部件小型 化、高性能化、多功能化、整合化，進而能夠提高穩定性 201216723 及可靠性。 第^圖是概略性地表示彻微機電系統（MEMS)晶片 ―之、知的矽電容式麥克風1⑼的一示範例之剖面圖。矽 電今式麥克風1GG *以下部件構成：印刷電路基板11〇、安 裝在印刷電路基板11Q上的微機電系統晶片12()、特殊目的 型半導體（ASIC)晶片13〇 ; α及形成有聲孔14〇的殼體 150。 /該微機電系統晶片120為以下結構：利用微機電系統 技術，在矽片上形成背板121之後，隔著墊片122形成有 振動模123。在背板121上形成有聲孔124。 在第1圖所示的石夕電容式麥克風100中，在殼體上部 具有聲孔14G，在下部的單—印刷電路基板上安裝微機電系 統曰Β片120。雖然未以圖式表示，在印刷電路基板的下側面 具有用於與外部裝置進行電連接的連接端子。 在該情況下’外部的聲音引入到形成於殼體15〇上的 聲孔140中而使得振動模123振動，此時由元件符號126 表示微機電系統晶片的内部空間就是背腔空間。背腔空間 是指，以振動模為基準，引入外部音頻的一側的相反侧的 空間。 即，以第1圖所示的麥克風100,在基板上安裝微機電 系統晶片的情況下，外部音頻透過聲孔14〇而引入並傳達 到微機電系統晶片的振動膜123，而此時在被傳達外部音頻 的振動膜的相反側所限定的空間126就是背腔空間。 只有充分確保背腔空間才能確保麥克風的整體性能， ⑧ 4 201216723 但在該情況下由於微機電系統晶片120的尺寸非常小，因 此在微機電系統晶片内部形成背腔空間的情況下，難以確 保充分大小的背腔空間。因此，存在麥克風音質下降的問 題。 【發明内容】 本發明是鑒於上述問題而進行研發，本發明的目的在 於提供一種能夠充分確保背腔空間的麥克風。 本發明麥克風的特徵包括：殼體，其一側面為開放， 在另一侧面形成有外部聲孔；第一印刷電路基板，其與該 殼體的另一側面結合’並形成有與該外部聲孔連通的内部 聲孔，微機電系統晶片，其與該内部聲孔以相對的方式安 裝於該第m路基板的關面u卩刷電路基板， 其與該殼體之開放的—側面結合，與該第—印刷電路基板 隔開配置’並且在該第二印刷電路基板的外側面形成有多 個連接端子’以及將該第—印刷電路基板和第二印刷電路 基板電連接的多個導電性連接部件。 另外’較佳地’該導電性連接部件為線目形狀的導電 性彈簧，或者為柱狀，又或者具有彈性。 另外’較佳地，在該第一印刷電路基板與第二印刷電 路基板之間具有關支撐部件，錢第—印刷電路基板與 第P刷電路基板在保持彼此間的間隔的狀態下得到支 撐。 另外’較佳地，該隔P支撐料係與該第—印刷電路 201216723 土^及第—印刷電路基板的形狀對應的尺寸，並具有與該 第P刷電路基板和該第二印刷電路基板彼此隔開的距離 對應的厚度’且在其中間具有空的内部空間。 另外’較佳地，在該隔開支樓部件上具有收納部，該 用於收納並支撐各該導電性連接部件。 另外，較佳地’該殼體的外部聲孔和該第一印刷電路 二反的，4聲孔以彼此不接觸的方式配置，該外部聲孔和 =内广聲孔透過形成於殼體與第—印刷電路基板之間的音 頻路彳空而連通。 另外’較佳地，在該第— 有鍍層，該音頻路徑包括該第 錢層被腐蝕而形成的路徑。 根據本發明的麥克風，能 麥克風的音頻特性。 印刷電路基板的外侧面上具 一印刷電路基板的外侧面的 夠充分確保背腔空間而改善 另外 ^明㈣根據需求而調整背腔”的大小。 且办总i *備隔開支撐部件的情況T，組裝方便，並 且令易進行背腔空間的調整。 另外’在將外部聲孔和内部聲孔以彼此不接觸的方式 -己置，並透過音頻路徑使得外部音引入到内部空間的情況 倉b夠防止包括微機電系統晶片在内的内部部件直接暴 露在光下。 【實施方式】 以下，參照第2圖至第6圖，詳細說明根據本發明一 ⑤ 201216723 實施例的麥克風。本實施例的麥克風1作為將語音、音頻、 聲音等聲波轉換為電信號的裝置，包括：殼體10、第一印 刷電路基板20、微機電系統晶片30、第二印刷電路基板 40、導電性連接部件50及隔開支撐部件60。特別是，本發 明的麥克風1主要使用於便攜電話、PDA、3G手機等個人 用移動通信終端機。 該殼體10構成麥克風的外形。在其内部安裝各種部 件。殼體10的一側面為開放，在另一側面11形成有外部 聲孔12。外部聲孔12以貫通的方式形成，藉此將外部的音 頻引入到殼體内部。 在本實施例的情況下，殼體10是各面形成為直四角形 的六面體。但是，在其他實施例的情況下，殼體的整體形 狀可進行各種變形。即，殼體可以是圓筒形狀，也可以是 水平方向的剖面為橢圓形的柱狀。 殼體10具備從另一側面11向下方延伸而形成4個側 面14。在各侧面14的下端部具有捲曲部16。在第3圖和 第5圖所示的狀態下，將圖式的其他部件嵌入殼體内部之 後，捲曲部16捲曲如第4圖和第6圖所示的形狀，進而固 定内部部件。 在本實施例的情況下，透過捲曲殼體側面下端的捲曲 部16而完成内部部件的固定及組裝。因此，無需單獨地使 用粘接劑之類的固定手段將内部部件之間進行固定。 殼體10由具有優異地噪音切斷特性的鎳、銅、鋁等導 電材料或它們的合金構成。 201216723 2第-印刷電路基板2G與殼體1Q的另—侧面u的内 :二I:電路基板2°以第2圖及第4圖的方向為 i子部件:二=== 日2?°及放大器7。等 * _電路基板20上安裝各種電子部 具（DIE^該印刷電路基板2〇又稱為印刷電路基板模 在f卩刷電路基板2〇上以貫通的方式形成内部聲孔 ，該内部聲孔22與殼體1G的外部聲孔 通過的狀態）。 a在本實施例的情況下，如第6圖所示，外部聲孔12與 内部聲孔22以彼此不接觸的方式構成4卩，外部聲孔12 與内部聲孔22以彼此錯_方式配置。因此，透過外部聲 而引入的外部音頻，經過形成於殼體10與第一印刷 土板之間的音頻路徑24之後，透過内部聲孔U而傳 達至微機電系統晶片3〇。 其板2、、、、 3圖’在本實施例的情況下，在第一印刷電路 土 的外側面具有銅鍍層26 。銅鐘層26的中間部分被 腐蝕而形成音頻路徑24。 另夕卜 ’在其他實施例的情況下，根據使用者的需求， 外9 的長度、方向、形狀或高度進行各種變形。另 /關於形成音頻路徑的方式，除了本實施例的腐蝕銅層 $ $的S式IX外’還可以利用切肖彳、金屬鎊型、注塑等 方式。 夕卜 \r ’音頻路徑不限於本實施例這樣形成在第一印刷 ⑧ 201216723 電路基板上，只要能夠連通外部聲孔和内部聲孔，則可以 形成在殼體上’也可以在兩侧分別形成之後彼此聯合而構 成。 該微機電系統晶片30安裝在第一印刷電路基板的内側 面。在此，所謂内侧面是指，朝向内部空間62的面。微機 電系統晶片30與内部聲孔22相對而配置。所謂相對配置 是指，微機電系統晶片30安裝在形成有内部聲孔22的部 分’以使微機電系統晶片30能夠接收透過内部聲孔22而 引入的音頻信號。 微機電系統晶片3 0產生將接收到的音頻信號轉換為電 信號的作用。如背景技術中所述，微機電系統晶片30包括 振動膜、墊片、背板等構成。另外’在第一印刷電路基板 20的内侧面安裝有微機電系統晶片30的同時，還安裝有放 大器70。 放大器70產生接收由微機電系統晶片30產生的電信 號而進行放大的作用。放大器70又被稱為特殊目的型半導 體（ASIC)晶片。雖然未詳細以圖式表示’微機電系統晶 片30與放大器7〇透過鍵合金絲（g〇ld bonding wire)彼此 連接。放大器7〇與第一印刷電路基板20電連接。 該第二印刷電路基板4〇與殼體的開放的一側面結 合。透過與殼體之開放的面結合’進而與殼體10共同 限定内部空間62。第二印刷電路基板40與第一印刷電路基 板20隔開配置。 在第二印刷電路基板40的外側面上具有多個連接端子 201216723 42。在本實施例中，連接端子42共具有4個。連接端子又 被稱為接續端子或襯墊。該第二印刷電路基板40又稱為概 墊印刷電路基板。連接端子42與内部的微機電系統晶片3〇 及放大器70電連接而產生與外部裝置進行連接的作用。連 接端子42的數量可以根據需求而進行增減’並且也可以根 據需求而變更配置位置。 並且，該導電性連接部件5〇的數量為複數個，該導電 性連接部件50產生將第一印刷電路基板2〇和第二印刷電 路基板40電連接的作用。 在本實施例中，導電性連接部件5〇以在每個角落設置 一個的方式共設置4個。各導電性連接部件5〇是將導電性 金屬線折彎成線圈形狀的彈簧。由於構成為彈簧，因此即 使組裝公差不夠精確，也能夠簡單且可靠地實現第一印刷 電路基板20與第二印刷電路基板4〇之間的電連接。 另外’在其他實施例的情況下，導電性連接部件在形 狀和材質等上除了將導電金屬線折f而構成的彈簧形狀之 外在將第-印刷電路基板和第二印刷電路基板電連 範圍内可進行各種變形。 即:導電性連接部件5G在其材質上無需4是金屬， 也：以Si電k性矽’或者也可以由非導電性物質構成形狀 :其—是單純的圓柱形狀或= 的情況下’第一印刷 在導電性連接部件形成為銷形狀 201216723 電路基板和第二印刷電路基板分職有能_定這種導電 性連接部件的兩端部的槽部，進而在沒有其他結構的協助 的情況下，也能夠將#電性連接部件i接固定到第一印刷 電路基板和第二印刷電路基板。 另外，在本實施例中，第一印刷電路基板2〇與第二印 刷電路基板40之間還具有隔開支撐部件6〇，該隔開支撐部 件60使得第一印刷電路基板20和第二印刷電路基板仞在 保持彼此間的間隔狀態下得到支撐。 參照第3圖及第5圖可知，隔開支撐部件6〇形成為四 角形的框架形狀’與第一印刷電路基板2〇及第二印刷電路 基板40的形狀對應。隔開支撐部件6〇的中間部分是空的， 藉此與第一印刷電路基板20及第二印刷電路基板4〇共同 限定内部空間62。並且’圍繞内部空間62的部分是輪廓部 64。隔開支撐部件60具有與第一印刷電路基板2〇和第二 印刷電路基板40彼此隔開的距離對應的寬度。 隔開支撐部件60具有收納部66，該收納部66收納並 支撐多個導電性連接部件中的每一個。收納部66為側面的 一部分係開放的圓筒形狀’藉此彈簧形狀的導電性連接部 件50在上下方向簡單地結合之後不會向水平方向脫離。並 且’收納部66以在每個角部設置一個的方式共配置4個。 將彈簧形狀的導電性連接部件50夾入收納部66之後，將 其收納部66與其他部件一起嵌入殼體中，然後將捲曲部16 捲曲則可簡單地完成麥克風1的組裝。 另外’在本實施例中，内部空間62為背腔空間。即， 11 201216723 背腔表示以微機電系統晶片30的振動模結構為基準，外部 音頻被傳達的一側的相反側的空間，因此在本實施例中， 在以與内部聲孔22相對的方式安裝微機電系統晶片30的 情況下，以微機電系統晶片30所具有的振動模為基準時， 内部空間62成為位於外部音頻被傳達的一側的相反侧的空 間，因此内部空間62為背腔空間。 因此，只要調整隔開支撐部件60的厚度和輪廓部64 的體積就能夠調整背腔的空間的大小和形狀。 以下將對具備該結構之本發明一實施例的麥克風1，其 作用和效果進行說明。 在本實施例的麥克風1中，在殼體10内部具有根據導 電性連接部件50而彼此電連接且彼此隔開配置的第一印刷 電路基板20和第二印刷電路基板40,並且以與第一印刷電 路基板20的内部聲孔22相對的方式設有微機電系統晶片 3 0，因此能夠將形成於第一印刷電路基板2 0和第二印刷電 路基板40之間的内部空間用作背腔空間。 因此，根據本發明，能夠充分確保背腔空間，其結果 能夠改善麥克風的音頻特性。 另外，透過調整第一印刷電路基板20和第二印刷電路 基板4 0之間的間隔而能夠容易地調整背腔空間的大小。 特別是，在本實施例的情況下，由於在第一印刷電路 基板20與第二印刷電路基板40之間具有隔開支撐部件 60，因此能夠容易地變更其形狀和模樣，也能夠將產生背 腔作用的内部空間62之體積容易地調整到必要的程度。 ⑧ 201216723 另外，透過隔開支撐部件60，能夠將第一印刷電路基 板20和第二印刷電路基板4〇在彼此隔開的狀態下穩定地 固定。並且，隔開支撐部件60具有收納部66，因此能夠簡 單且堅固地組裝彈簣形狀的導電性連接部件5〇。 另外，由於使用於第i圖所示之習知的麥克風1〇〇中 的微機電系統晶片120是在殼體上形成聲孔並安裝到基板 上的類型，因此需要在其内部具備背腔空間。這種微機電 系統晶片120與在基板上形成聲孔且在該聲孔中安裝微機 電系統晶片的麥克風中的微機電系統晶片的結構是不同 的。即，根據麥克風聲孔之配置位置的不同，微機電系統 晶片的結構也不同。 但是，在本實施例的情況下，利用兩個分離的基板， 靠近形成於殼體的外部聲孔而設置微機電系統晶片，因此 能夠充分確保背腔空間，進而能夠使用與在基板上形成聲 孔類31的麥克風中的微機電系統晶片相同的微機電系統晶 片。 另外’在本實施例的情況下’殼體1 〇的外部聲孔12 和第一印刷電路基板20的内部聲孔22彼此不接觸而錯開 形成，並且外部聲孔12和内部聲孔22透過音頻路徑24而 連通，因此能夠將音頻路徑24多樣化。 另外’由於外部聲孔Π和内部聲孔22彼此不接觸而 錯開形成，因此能夠防止内部的微機電系統晶片或放大器 等電子部件直接暴露在外部的各種光’例如可視光線、紫 外線、紅外線等。 13 201216723 而上述優點可透過測試來得到確認。即，在50Hz的條 件下，對習知的麥克風100和本實施例的麥克風1的光敏 度（light sensitivity)進行了測試，其結果在習知的麥克風 的情況下獲得了 -44.9dB的值’在本實施例的麥克風的情況 下獲得了-63.6dB的值。 另外’將印刷電路基板在物理上分為兩個基板而使 用，因此能夠使用單層結構的印刷電路基板，而不是使用 結合為多層結構的印刷電路基板。因此，印刷電路基板簡 單的製造’與以往情況相比，能夠節省費用。 另外，第7圖和第8圖表示對本實施例的麥克風j和 第1圖所示之習知的麥克風100,其音頻特性進行實驗的結 果資料。從各圖表右侧的高音記錄可知，本實施例的麥克 風1與習知的麥克風相比，因充分確保了背腔空間，因此 顯著改善了音頻特性。 n rr 、丄甲，以在第一印刷電路 基板和第二㈣電路基板之間具備隔開支撐部件為 了說明，但本發明不限於此。即，也可以不使用隔開 部件，而是僅·導電性連接部件來將第—印刷電路= 和第一印刷電路基板保持為彼此隔開的狀熊。 土板 另外，在本實施例的麥克心中，以^部聲 聲孔彼此不接觸的情況為例進行了說明，曰a 内# 於此。即，也可以外部聲孔和内部聲孔彼==限 成’並且在這種結構的實施例中，能 s 力式形 孔彼此不接觸喊得的效果之外的其^_除了 ®兩個聲 I vj w'J 0 201216723 【圖式簡單說明】 第1圖係習知的麥克風之概略性剖面圖。 第2圖係本發明一實施例之麥克風的立體圖。 第3圖係第2圖之麥克風的分解立體圖。 第4圖係第2圖之麥克風的仰視立體圖。 第5圖係第2圖之麥克風的仰視分解圖。 第6圖係第2圖之麥克風的概略性剖面圖。 第7圖和第8圖係對第2圖之麥克風和第1圖之習知 的麥克風，其音頻特性進行比較的參照圖表。 【主要元件符號說明】 1 麥克風 10 殼體 11 殼體的另一侧面 12 外部聲孔 14 側面 16 捲曲部 20 第一印刷電路基板 22 内部聲孔 24 音頻路徑 26 銅鍵層 30 微機電系統晶片 40 第二印刷電路基板 42 連接端子 15 導電性連接部件 隔開支撐部件 内部空間 輪廓部 收納部 放大器 矽電容式麥克風 印刷電路基板 微機電系統（MEMS)晶片 背板 墊片 振動膜 聲孔 背腔空間 特殊目的型半導體(ASIC)晶片 聲孔 殼體 16In this technology of Electro Mechanical System, ultra-small sensors or actuators and electromechanical structures can be fabricated by applying a semi-conductor process, especially microfabrication technology of integrated circuit technology. The MEMS wafer microphone manufactured by the micro-machining technique has the following advantages: miniaturization and high precision of conventional microphone components such as a vibrating plate, a spacer ring, an insulating ring, a back plate, and an energized ring by ultra-precision micro-machining Performance, multi-functionality, and integration, which in turn improves stability 201216723 and reliability. Fig. 4 is a cross-sectional view showing an exemplary example of a tantalum condenser microphone 1 (9) of a microelectromechanical system (MEMS) chip. The electric microphone 1GG* is composed of a printed circuit board 11A, a microelectromechanical system chip 12 () mounted on the printed circuit board 11Q, a special purpose semiconductor (ASIC) wafer 13A, and a sound hole 14 formed therein. The housing 150 of the crucible. The MEMS wafer 120 has a structure in which a vibration mode 123 is formed via a spacer 122 after forming the back plate 121 on the cymbal by means of MEMS technology. A sound hole 124 is formed in the back plate 121. In the Shishi condenser microphone 100 shown in Fig. 1, an acoustic hole 14G is provided in the upper portion of the casing, and the microelectromechanical system cymbal 120 is mounted on the lower single-printed circuit board. Although not shown in the drawings, a connection terminal for electrically connecting to an external device is provided on the lower side surface of the printed circuit board. In this case, the external sound is introduced into the sound hole 140 formed in the casing 15 to vibrate the vibration mode 123, and at this time, the internal space of the MEMS wafer by the component symbol 126 is the back cavity space. The back cavity space refers to a space on the opposite side to the side on which the external audio is introduced, based on the vibration mode. That is, in the case of the microphone 100 shown in Fig. 1, when the MEMS wafer is mounted on the substrate, the external audio is introduced through the sound hole 14 and transmitted to the diaphragm 123 of the MEMS wafer, and at this time The space 126 defined by the opposite side of the diaphragm that conveys the external audio is the back cavity space. Only by fully ensuring the back cavity space can the overall performance of the microphone be ensured, 8 4 201216723. However, in this case, since the size of the MEMS wafer 120 is very small, it is difficult to ensure sufficient space in the case of forming a back cavity space inside the MEMS wafer. The size of the back cavity space. Therefore, there is a problem that the sound quality of the microphone is degraded. SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to provide a microphone capable of sufficiently securing a back cavity space. The microphone of the present invention is characterized in that: the housing has one side open, and the other side has an external sound hole; the first printed circuit board is combined with the other side of the housing and is formed with the external sound An internal acoustic hole communicating with the hole, the MEMS wafer being mounted to the closing surface of the m-th substrate in a manner opposite to the internal acoustic hole, and the circuit board is coupled to the open side of the housing. a plurality of connection terminals ′ disposed on the outer surface of the second printed circuit board and a plurality of conductive layers electrically connecting the first printed circuit board and the second printed circuit board Connecting parts. Further, the conductive connecting member is preferably a conductive spring of a line shape, or has a columnar shape or has elasticity. Further, preferably, a support member is provided between the first printed circuit board and the second printed circuit board, and the printed circuit board and the P-th circuit board are supported while maintaining a space therebetween. Further, preferably, the spacer P support material has a size corresponding to the shape of the first printed circuit 201216723 and the printed circuit board, and has a relationship with the first P brush circuit substrate and the second printed circuit substrate The spaced apart distances correspond to a thickness 'with an empty interior space therebetween. Further, preferably, the partition member has a accommodating portion for accommodating and supporting each of the conductive connecting members. In addition, preferably, the outer sound hole of the casing and the first printed circuit are opposite to each other, and the four sound holes are arranged not to be in contact with each other, and the outer sound hole and the inner sound hole are transparently formed in the casing and The audio path between the first and the printed circuit boards is hollowed out and connected. Further, preferably, in the first plating, the audio path includes a path formed by the corrosive layer being etched. The microphone according to the present invention is capable of the audio characteristics of the microphone. The outer surface of the printed circuit board has a printed circuit board on the outer side surface sufficient to ensure the back cavity space, and the size of the back cavity is improved according to the requirements. (4) The total i * is provided to separate the support members. T, easy to assemble, and easy to adjust the back cavity space. In addition, 'the external sound hole and the internal sound hole are not in contact with each other - and the external sound is introduced into the internal space through the audio path. It is sufficient to prevent internal components including the MEMS wafer from being directly exposed to light. [Embodiment] Hereinafter, a microphone according to an embodiment of the present invention 5 201216723 will be described in detail with reference to FIGS. 2 to 6 . The microphone 1 is a device for converting sound waves such as voice, audio, sound, etc. into an electrical signal, and includes a housing 10, a first printed circuit board 20, a microelectromechanical system chip 30, a second printed circuit board 40, and a conductive connecting member 50. And the support member 60 is spaced apart. In particular, the microphone 1 of the present invention is mainly used for personal mobile communication terminals such as mobile phones, PDAs, and 3G mobile phones. The casing 10 constitutes an outer shape of a microphone, and various components are mounted inside thereof. One side of the casing 10 is open, and an outer sound hole 12 is formed on the other side surface 11. The outer sound hole 12 is formed in a penetrating manner, thereby The external audio is introduced into the inside of the casing. In the case of the present embodiment, the casing 10 is a hexahedron in which the faces are formed in a straight square shape. However, in the case of other embodiments, the overall shape of the casing can be variously performed. That is, the casing may have a cylindrical shape or a columnar shape having an elliptical cross section in the horizontal direction. The casing 10 is provided to extend downward from the other side surface 11 to form four side faces 14. On each side surface 14 The lower end portion has a curled portion 16. In the state shown in Figs. 3 and 5, after the other members of the drawing are fitted into the inside of the casing, the curled portion 16 is curled as shown in Figs. 4 and 6 . Further, the inner member is fixed. In the case of the present embodiment, the fixing and assembly of the inner member are completed by crimping the curled portion 16 at the lower end of the side surface of the casing. Therefore, it is not necessary to separately use the fixing means such as an adhesive to the inner member. between The casing 10 is made of a conductive material such as nickel, copper or aluminum having excellent noise-cutting characteristics or an alloy thereof. 201216723 2 - Printed circuit board 2G and the other side of the casing 1Q: I: The circuit board 2° is the i sub-part in the directions of the second and fourth figures: two === day 2?° and the amplifier 7. etc. * _ Various electronic components are mounted on the circuit board 20 (DIE^ this printing The circuit board 2 is also referred to as a printed circuit board mold, and an internal sound hole is formed in a penetrating manner on the circuit board 2, and the internal sound hole 22 passes through the external sound hole of the casing 1G.) In the case of the embodiment, as shown in Fig. 6, the outer sound hole 12 and the inner sound hole 22 are formed so as not to be in contact with each other, and the outer sound hole 12 and the inner sound hole 22 are arranged in a wrong manner. Therefore, external audio introduced through the external sound passes through the internal acoustic hole U through the audio path 24 formed between the casing 10 and the first printed earth plate, and is transmitted to the MEMS wafer 3A. In the case of this embodiment, the plates 2, 3, and 3 have a copper plating layer 26 on the outer side surface of the first printed circuit soil. The middle portion of the copper clock layer 26 is etched to form the audio path 24. In addition, in the case of other embodiments, various variations of the length, direction, shape or height of the outer 9 are made according to the needs of the user. In addition, as for the manner of forming the audio path, in addition to the S-type IX of the corroded copper layer of the present embodiment, it is also possible to use a cut-off 金属, a metal pound type, an injection molding or the like. The audio path of the present invention is not limited to being formed on the first printed circuit 8 201216723 circuit substrate as long as it can connect the external sound hole and the internal sound hole, and may be formed on the casing or may be formed on both sides. Then they are combined with each other. The MEMS wafer 30 is mounted on the inner side of the first printed circuit board. Here, the inner side surface means a surface that faces the inner space 62. The microcomputer system chip 30 is disposed opposite to the internal sound hole 22. By the relative arrangement is meant that the MEMS wafer 30 is mounted in the portion formed with the internal acoustic aperture 22 to enable the MEMS wafer 30 to receive the audio signal introduced through the internal acoustic aperture 22. The MEMS wafer 30 produces the effect of converting the received audio signal into an electrical signal. As described in the background, the MEMS wafer 30 includes a diaphragm, a spacer, a back sheet, and the like. Further, the MEMS wafer 30 is mounted on the inner side surface of the first printed circuit board 20, and an amplifier 70 is mounted. Amplifier 70 produces the function of receiving the electrical signals generated by MEMS wafer 30 for amplification. Amplifier 70 is also known as a special purpose semiconductor (ASIC) wafer. Although not shown in detail in the drawings, the microelectromechanical system wafer 30 and the amplifier 7 are connected to each other by a bonding wire. The amplifier 7A is electrically connected to the first printed circuit board 20. The second printed circuit board 4 is joined to an open side of the casing. The interior space 62 is defined by the housing 10 in conjunction with the open face of the housing. The second printed circuit board 40 is disposed apart from the first printed circuit board 20. A plurality of connection terminals 201216723 42 are provided on the outer surface of the second printed circuit board 40. In the present embodiment, the connection terminals 42 have a total of four. The connection terminals are also referred to as connection terminals or pads. The second printed circuit board 40 is also referred to as a blanket printed circuit board. The connection terminal 42 is electrically connected to the internal MEMS wafer 3A and the amplifier 70 to cause connection with an external device. The number of connection terminals 42 can be increased or decreased as needed' and the configuration position can also be changed as needed. Further, the number of the conductive connecting members 5A is plural, and the conductive connecting member 50 functions to electrically connect the first printed circuit board 2'' to the second printed circuit board 40. In the present embodiment, the conductive connecting members 5 are provided in a total of four in each corner. Each of the conductive connecting members 5A is a spring that bends a conductive metal wire into a coil shape. Since it is constituted as a spring, electrical connection between the first printed circuit board 20 and the second printed circuit board 4 can be realized simply and reliably even if the assembly tolerance is not accurate enough. In addition, in the case of the other embodiments, the conductive connecting member electrically connects the first printed circuit board and the second printed circuit board in addition to the spring shape formed by folding the conductive metal wire in shape, material, or the like. Various deformations can be made inside. In other words, the conductive connecting member 5G does not need to be a metal in its material, and may have a shape of a Si or a non-conductive material: a simple cylindrical shape or a case of = A printed wiring member is formed into a pin shape 201216723. The circuit board and the second printed circuit board are divided into groove portions at both ends of the conductive connecting member, and further, without the assistance of other structures. It is also possible to fix the #electric connection member i to the first printed circuit board and the second printed circuit board. In addition, in the embodiment, the first printed circuit board 2 〇 and the second printed circuit board 40 further have a partition supporting member 6 〇, the partition supporting member 60 such that the first printed circuit board 20 and the second printing The circuit boards are supported while being spaced apart from each other. Referring to Figs. 3 and 5, the frame shape ′ in which the partition supporting members 6 are formed in a rectangular shape corresponds to the shapes of the first printed circuit board 2 and the second printed circuit board 40. The intermediate portion separating the support members 6A is empty, thereby defining the internal space 62 together with the first printed circuit board 20 and the second printed circuit board 4''. And the portion surrounding the inner space 62 is the contour portion 64. The partition supporting member 60 has a width corresponding to a distance separating the first printed circuit board 2A and the second printed circuit board 40 from each other. The partition supporting member 60 has a housing portion 66 that accommodates and supports each of the plurality of conductive connecting members. The accommodating portion 66 has a cylindrical shape in which a part of the side surface is opened. The spring-shaped conductive connecting member 50 is simply detached in the horizontal direction after being simply joined in the vertical direction. Further, the storage unit 66 is disposed in a total of four at each corner. After the spring-shaped conductive connecting member 50 is sandwiched between the accommodating portions 66, the accommodating portion 66 is fitted into the casing together with other members, and then the crimping portion 16 is crimped to easily assemble the mic 1. Further, in the present embodiment, the internal space 62 is a back cavity space. That is, the 11 201216723 back cavity represents the space on the opposite side of the side on which the external audio is transmitted based on the vibration mode structure of the MEMS wafer 30, and thus in the present embodiment, in a manner opposite to the internal sound hole 22 When the MEMS wafer 30 is mounted, when the vibration mode of the MEMS wafer 30 is used as a reference, the internal space 62 becomes a space on the opposite side to the side on which the external audio is transmitted, and thus the internal space 62 is a back cavity. space. Therefore, the size and shape of the space of the back cavity can be adjusted by adjusting the thickness of the support member 60 and the volume of the contour portion 64. The operation and effect of the microphone 1 according to an embodiment of the present invention having this configuration will be described below. In the microphone 1 of the present embodiment, the first printed circuit board 20 and the second printed circuit board 40 which are electrically connected to each other and are spaced apart from each other according to the conductive connecting member 50 are provided inside the casing 10, and are first and The internal acoustic hole 22 of the printed circuit board 20 is provided with the MEMS wafer 30 in a relatively opposed manner, so that the internal space formed between the first printed circuit board 20 and the second printed circuit board 40 can be used as the back cavity space. . Therefore, according to the present invention, the back cavity space can be sufficiently ensured, with the result that the audio characteristics of the microphone can be improved. Further, the size of the back cavity space can be easily adjusted by adjusting the interval between the first printed circuit board 20 and the second printed circuit board 40. In particular, in the case of the present embodiment, since the support member 60 is provided between the first printed circuit board 20 and the second printed circuit board 40, the shape and the pattern can be easily changed, and the back can be generated. The volume of the internal space 62 of the cavity is easily adjusted to the extent necessary. 8 201216723 Further, by separating the support members 60, the first printed circuit board 20 and the second printed circuit board 4 can be stably fixed in a state of being separated from each other. Further, since the partition supporting member 60 has the accommodating portion 66, the elastic connecting member 5A of the magazine shape can be assembled simply and firmly. In addition, since the microelectromechanical system wafer 120 used in the conventional microphone 1 shown in the figure i is a type in which a sound hole is formed in the casing and mounted on the substrate, it is necessary to have a back cavity space inside thereof. . Such a MEMS wafer 120 differs in structure from a MEMS wafer in which a sound hole is formed in a substrate and a microphone of a microcomputer system is mounted in the sound hole. That is, the structure of the MEMS wafer differs depending on the arrangement position of the microphone sound holes. However, in the case of the present embodiment, the microelectromechanical system wafer is provided close to the outer acoustic hole formed in the casing by using two separate substrates, so that the back cavity space can be sufficiently ensured, and the sound can be formed and formed on the substrate. The microelectromechanical system wafer in the microphone of the hole type 31 is the same MEMS wafer. Further, in the case of the present embodiment, the outer sound hole 12 of the casing 1 and the inner sound hole 22 of the first printed circuit board 20 are staggered without being in contact with each other, and the outer sound hole 12 and the inner sound hole 22 are transmitted through the sound. The path 24 is connected, so the audio path 24 can be diversified. Further, since the outer acoustic aperture Π and the inner acoustic aperture 22 are formed in a staggered manner, it is possible to prevent various electronic components such as visible light, ultraviolet rays, infrared rays, and the like from being directly exposed to external electronic components such as MEMS wafers or amplifiers. 13 201216723 And the above advantages can be confirmed by testing. Namely, the light sensitivity of the conventional microphone 100 and the microphone 1 of the present embodiment was tested under the condition of 50 Hz, and as a result, a value of -44.9 dB was obtained in the case of a conventional microphone' A value of -63.6 dB was obtained in the case of the microphone of the present embodiment. Further, since the printed circuit board is physically divided into two substrates, it is possible to use a printed circuit board having a single-layer structure instead of using a printed circuit board combined with a multilayer structure. Therefore, the simple manufacture of the printed circuit board can save costs compared with the conventional case. Further, Fig. 7 and Fig. 8 show the results of experiments on the audio characteristics of the microphone j of the present embodiment and the conventional microphone 100 shown in Fig. 1. As can be seen from the treble recording on the right side of each graph, the microphone 1 of the present embodiment significantly improves the audio characteristics as compared with the conventional microphone because the back cavity space is sufficiently secured. n rr and armor are described as being provided with a partition supporting member between the first printed circuit board and the second (four) circuit board, but the present invention is not limited thereto. In other words, the first printed circuit board and the first printed circuit board may be held apart from each other only by the conductive connecting member without using the partition member. In addition, in the microphone core of the present embodiment, the case where the sound holes are not in contact with each other has been described as an example, and 曰a inside # is here. That is, it is also possible that the outer sound hole and the inner sound hole are limited to 'and in the embodiment of such a structure, the s-force type holes are not in contact with each other except for the effect of the shouting. Sound I vj w'J 0 201216723 [Simplified Schematic] Fig. 1 is a schematic cross-sectional view of a conventional microphone. Fig. 2 is a perspective view of a microphone according to an embodiment of the present invention. Fig. 3 is an exploded perspective view of the microphone of Fig. 2. Figure 4 is a bottom perspective view of the microphone of Figure 2. Figure 5 is a bottom exploded view of the microphone of Figure 2. Fig. 6 is a schematic cross-sectional view of the microphone of Fig. 2. Fig. 7 and Fig. 8 are reference charts for comparing the audio characteristics of the microphone of Fig. 2 and the conventional microphone of Fig. 1. [Main component symbol description] 1 Microphone 10 Housing 11 The other side of the housing 12 External sound hole 14 Side 16 Curl 20 First printed circuit board 22 Internal sound hole 24 Audio path 26 Copper bond layer 30 MEMS wafer 40 Second printed circuit board 42 connection terminal 15 conductive connection member partition support member internal space contour portion housing portion amplifier tantalum microphone printed circuit board microelectromechanical system (MEMS) wafer back plate gasket diaphragm sound hole back cavity space special Target semiconductor (ASIC) wafer acoustic hole housing 16