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WO2021080068A1 - Boîtier de microphone mems - Google Patents

Boîtier de microphone mems Download PDF

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Publication number
WO2021080068A1
WO2021080068A1 PCT/KR2019/014627 KR2019014627W WO2021080068A1 WO 2021080068 A1 WO2021080068 A1 WO 2021080068A1 KR 2019014627 W KR2019014627 W KR 2019014627W WO 2021080068 A1 WO2021080068 A1 WO 2021080068A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
mems transducer
microphone package
case
additive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2019/014627
Other languages
English (en)
Korean (ko)
Inventor
윤상영
민철규
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Partron Co Ltd
Original Assignee
Partron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Partron Co Ltd filed Critical Partron Co Ltd
Publication of WO2021080068A1 publication Critical patent/WO2021080068A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
    • H01L25/0652—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00 the devices being arranged next and on each other, i.e. mixed assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/46—Structure, shape, material or disposition of the wire connectors prior to the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04—Structural association of microphone with electric circuitry therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use

Definitions

  • the size of the back chamber is limited according to the height of the MEMS transducer protruding on the substrate.
  • the problem to be solved by the present invention is to improve the adhesion between the substrate and the MEMS transducer.
  • the microphone package 1 includes a substrate 100, a MEMS transducer 200 positioned on the substrate 100, a signal processing unit 300 positioned on the substrate 100, and a substrate 100.
  • a case 400 positioned above, a first bonding portion 501 for bonding the MEMS transducer 200 to the substrate 100, and a second bonding portion 502 for bonding the case 400 to the substrate 100 are provided. .
  • the first bonding portion 501 of this example may contain an additive 5011, as shown in FIG. 1.
  • the case 400 may be made of metal or plastic, and may be manufactured through an injection process. In some cases, the case 400 may be made of the same material as the substrate 100.
  • the MEMS transducer 200 may be adhered to the substrate 100a through the first bonding portion 501 containing the resin portion 5011 and the ball-shaped additive 5012, and the case 400 2 It may be bonded to the substrate 100a through the bonding portion 502.
  • the distance between the outer upper surface of the MEMS transducer 200 facing each other compared to FIG. 1 and the inner upper surface of the case 100 Is increased by the depression depth (D13).

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Micromachines (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

La présente invention concerne un boîtier de microphone. Le boîtier de microphone comprend : un substrat ; un transducteur MEMS situé sur le substrat et convertissant, en signal électrique, un son appliqué depuis l'extérieur ; une unité de traitement de signal située sur le substrat et traitant et émettant le signal électrique entré à partir du transducteur MEMS ; et une première partie de liaison pour faire adhérer le transducteur MEMS au substrat et contenant plusieurs additifs à l'intérieur, le transducteur MEMS étant situé au-dessus des multiples additifs.
PCT/KR2019/014627 2019-10-21 2019-10-31 Boîtier de microphone mems Ceased WO2021080068A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020190130531A KR102293940B1 (ko) 2019-10-21 2019-10-21 마이크로폰 패키지
KR10-2019-0130531 2019-10-21

Publications (1)

Publication Number Publication Date
WO2021080068A1 true WO2021080068A1 (fr) 2021-04-29

Family

ID=75620757

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2019/014627 Ceased WO2021080068A1 (fr) 2019-10-21 2019-10-31 Boîtier de microphone mems

Country Status (2)

Country Link
KR (1) KR102293940B1 (fr)
WO (1) WO2021080068A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030092326A1 (en) * 2000-06-16 2003-05-15 Hidenobu Nishikawa Electronic parts packaging method and electronic parts package
KR20070042491A (ko) * 2003-12-19 2007-04-23 인터내셔널 비지네스 머신즈 코포레이션 미소 전자기계 시스템의 부품들을 자동 정렬하기 위한 방법및 시스템
KR20150060469A (ko) * 2013-11-26 2015-06-03 삼성전기주식회사 멤스 마이크로폰 패키지 및 멤스 마이크로폰 패키지의 제조 방법
KR20170126768A (ko) * 2016-05-09 2017-11-20 앰코 테크놀로지 인코포레이티드 반도체 패키지 및 그 제조 방법
KR20190060158A (ko) * 2017-11-24 2019-06-03 (주)파트론 지향성 마이크로폰

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7434305B2 (en) 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
JP2006211468A (ja) * 2005-01-31 2006-08-10 Sanyo Electric Co Ltd 半導体センサ
GB2451921A (en) * 2007-08-17 2009-02-18 Wolfson Microelectronics Plc MEMS package

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030092326A1 (en) * 2000-06-16 2003-05-15 Hidenobu Nishikawa Electronic parts packaging method and electronic parts package
KR20070042491A (ko) * 2003-12-19 2007-04-23 인터내셔널 비지네스 머신즈 코포레이션 미소 전자기계 시스템의 부품들을 자동 정렬하기 위한 방법및 시스템
KR20150060469A (ko) * 2013-11-26 2015-06-03 삼성전기주식회사 멤스 마이크로폰 패키지 및 멤스 마이크로폰 패키지의 제조 방법
KR20170126768A (ko) * 2016-05-09 2017-11-20 앰코 테크놀로지 인코포레이티드 반도체 패키지 및 그 제조 방법
KR20190060158A (ko) * 2017-11-24 2019-06-03 (주)파트론 지향성 마이크로폰

Also Published As

Publication number Publication date
KR102293940B1 (ko) 2021-08-26
KR20210047014A (ko) 2021-04-29

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