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WO2019066365A1 - Partie de contact conductrice et feuille conductrice anisotrope la comprenant - Google Patents

Partie de contact conductrice et feuille conductrice anisotrope la comprenant Download PDF

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Publication number
WO2019066365A1
WO2019066365A1 PCT/KR2018/011049 KR2018011049W WO2019066365A1 WO 2019066365 A1 WO2019066365 A1 WO 2019066365A1 KR 2018011049 W KR2018011049 W KR 2018011049W WO 2019066365 A1 WO2019066365 A1 WO 2019066365A1
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WO
WIPO (PCT)
Prior art keywords
conductive
elastic matrix
spring
contact
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2018/011049
Other languages
English (en)
Korean (ko)
Inventor
전중수
백병선
김석민
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SAE HAN MICRO TECH Co Ltd
Original Assignee
SAE HAN MICRO TECH Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=65902494&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2019066365(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by SAE HAN MICRO TECH Co Ltd filed Critical SAE HAN MICRO TECH Co Ltd
Priority to CN201880062530.5A priority Critical patent/CN111149003B/zh
Publication of WO2019066365A1 publication Critical patent/WO2019066365A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes

Definitions

  • the present invention relates to an anisotropic conductive sheet for use in testing a semiconductor device or the like, and more particularly, to an anisotropic conductive sheet used for inspecting semiconductor devices and the like, and more particularly to an anisotropic conductive sheet having a plurality of contact portions having conductive springs and conductive powder and insulating portions for insulating and supporting adjacent contact portions To an anisotropic conductive sheet.
  • test socket for electrically connecting a contact pad of an inspection apparatus and a terminal of a semiconductor element is required for inspection of a semiconductor element.
  • test socket with the anisotropically conductive sheet having the contact portion in which the conductive powder is arranged in the longitudinal direction of the silicone rubber and the insulating portion which insulates and supports the adjacent contact portions among the test socket is absorbed by the mechanical shock or deformation, And the manufacturing cost is low.
  • the anisotropic conductive sheet 10 of the prior art test socket comprises a contact portion 11 which contacts the terminal 2 of the semiconductor element 1 and an insulating portion 15 which insulates and supports the adjacent contact portions 11 .
  • the upper end portion and the lower end portion of the contact portion 11 come into contact with the terminal 2 of the semiconductor element 1 and the contact pad 4 of the semiconductor inspecting apparatus 3 to electrically connect the terminal 2 and the contact pad 4 electrically Connect.
  • the contact portion 11 is hardened by mixing spherical conductive particles 12 having a small size into a silicone resin, and functions as a conductor through which electricity flows.
  • a metal frame is coupled to the peripheral portion of the anisotropic conductive sheet 10.
  • a guide hole corresponding to a guide pin (not shown) of the inspection apparatus 3 is formed in the metal frame. The guide pin and the guide hole are used to align the test socket with respect to the inspection apparatus 3.
  • the contact portion 11 of the anisotropic conductive sheet 10 is subjected to upward and downward pressures upon contact for inspection of the semiconductor element 1.
  • the conductive particles 12 at both ends of the contact portion 11 are pushed down and the conductive particles 12 at the middle portion are pushed to the side. Therefore, after performing a number of inspections, the spherical conductive particles 12 are separated from the contact portions 11, and the electrical and mechanical characteristics of the anisotropic conductive sheet 10 deteriorate. That is, the conventional anisotropic conductive sheet 10 has a short life.
  • a conductive spring 23 is disposed inside a silicone rubber matrix 21, and a conductive spring 23 is disposed Discloses a semiconductor test socket in which conductive particles 22 are arranged in a space other than a space in which a contact portion 20 is formed and adjacent contact portions 20 are insulated and supported by using a silicone rubber 25.
  • Such a semiconductor test socket has an advantage that the life span is extended by the conductive spring and the current capacity is increased.
  • An object of the present invention is to provide an anisotropic conductive sheet which can reduce the amount of conductive particles and increase the conductivity of the contact portion.
  • the present invention provides an anisotropic conductive sheet which is disposed between an element to be inspected and an inspection apparatus and electrically connects the terminals of the element and the contact pads of the inspection apparatus to each other.
  • the anisotropically conductive sheet includes a plurality of contact portions disposed at positions corresponding to the terminals of the device and the contact pads of the device and having electrical conductivity in the thickness direction, and an insulating portion for insulating adjacent contact portions from each other and supporting the contact portions.
  • the contact portion includes an elastic matrix, a conductive spring disposed in the elastic matrix, and a plurality of conductive particles arranged in the thickness direction of the elastic matrix.
  • the characteristic feature of the present invention is that the conductive particles are arranged at a higher density than the central portion of the elastic matrix at the periphery of the wire forming the conductive spring. With this characteristic construction, the present invention has an advantage that the conductivity of the contact portion can be increased while reducing the amount of conductive particles.
  • the present invention also provides an anisotropic conductive sheet characterized in that the conductive particles are disposed at both ends of the elastic matrix at a higher density than a central portion of the elastic matrix.
  • the conductive spring may be a coil spring.
  • the ratio of the thickness of the insulating portion to the length of the contact portion may be 0.7 or more and less than 0.9. According to this characteristic configuration, since the insulating portion can be prevented from being in contact with the semiconductor element at the time of inspection, there is an advantage that the semiconductor element is prevented from being contaminated or the semiconductor element and the insulating portion are prevented from adhering to each other. Since the contact portion of the present invention includes the conductive spring, it is easy to make the contact portion thicker than the insulating portion.
  • the conductive spring is an hourglass-shaped coil spring having a larger diameter as it goes from the center to the both ends, thereby providing an anisotropic conductive sheet. According to this characteristic configuration, the contact portion can be made more easily in the direction perpendicular to the thickness direction, so that even when misalignment occurs between the terminal and the contact pad, a smooth connection state can be maintained.
  • the present invention further provides an anisotropic conductive sheet, wherein the conductive plate is disposed adjacent to at least one of both ends of the conductive spring in the elastic matrix.
  • the present invention also provides an anisotropic conductive sheet characterized in that a through hole is formed in the central portion of the conductive plate.
  • a method of manufacturing a conductive elastic member including: providing an elastic matrix, a conductive spring disposed in the elastic matrix, and a plurality of conductive particles arranged in the thickness direction of the elastic matrix, A conductive contact disposed at a higher density than the central portion of the elastic matrix is provided.
  • the present invention has the advantage that the conductive particles can be concentrated around the wire material of the conductive spring, thereby reducing the amount of conductive particles and enhancing the conductivity of the contact portion. More specifically, conductive powder concentrated intensively around the wire forming the conductive spring fills the space between the wires of the conductive spring, so that the elongated conductive path by the conductive spring is changed to a short, thick conductive path, The conductivity is improved.
  • FIG. 1 and 2 are views showing an anisotropic conductive sheet of a test socket according to the prior art.
  • FIG. 3 is a view showing an anisotropic conductive sheet according to an embodiment of the present invention.
  • FIG. 4 is a cross-sectional view showing a change in the contact portion according to the pressure applied in the thickness direction.
  • FIG. 5 is a view showing an anisotropic conductive sheet according to another embodiment of the present invention.
  • FIG. 6 is a view showing an anisotropic conductive sheet according to another embodiment of the present invention.
  • FIG. 7 is a view showing an anisotropic conductive sheet according to another embodiment of the present invention.
  • FIG. 3 is a view showing an anisotropic conductive sheet according to an embodiment of the present invention.
  • the anisotropic conductive sheet 100 serves to electrically connect the contact pad 4 of the inspection apparatus 3 and the terminal 2 of the semiconductor element 1.
  • the anisotropic conductive sheet 100 has conductivity in a thickness direction at positions corresponding to the contact pads 4 of the inspection apparatus 3 and the terminals 2 of the semiconductor element 1. However, it does not have conductivity in the direction orthogonal to the thickness direction.
  • the anisotropic conductive sheet 100 includes a contact portion 110 and an insulating portion 115.
  • the contact portions 110 are disposed at positions corresponding to the terminals 2 of the semiconductor element 1 and the contact pads 4 of the inspection apparatus 3, respectively.
  • the contact portion 110 has electrical conductivity in the thickness direction.
  • the contact portion 110 includes an elastic matrix 111, a conductive spring 113, and conductive particles 112.
  • the contact portion 110 may be integrally formed with the insulating portion 115 or may be formed to be detachable from the insulating portion 115. In the case of being formed so as to be detachable from the insulating portion 115, there is an advantage that only the contact portion 115 in which a defect has occurred can be replaced.
  • the elastic matrix 111 is generally cylindrical.
  • the elastic matrix 111 serves to support the conductive spring 113 and the conductive particles 112.
  • the contact portion 110 is elastically deformed at the time of measurement to reduce the pressure applied to the terminal 2 and the contact pad 4 and to bring the contact portion 110 into close contact with the terminal 2 and the contact pad 4.
  • the elastic matrix 111 can be formed of various kinds of high molecular materials.
  • a silicone rubber can be obtained by curing the liquid silicone rubber.
  • the hardness of the silicone rubber is suitably from 10 to 40 (shore A), and the elongation is about 300 to 700%. If the hardness exceeds 40, there is a fear that a micro die crack may be generated in the element 1.
  • the elongation is less than 300%, it acts as a restraining force against contraction and expansion of the contact portion 110, which causes a load increase.
  • restoration force may be weakened after restoration after expansion.
  • the conductive spring 113 is made of a material having excellent electrical conductivity.
  • the conductive spring 113 may be made of stainless steel, aluminum, bronze, nickel, gold, silver, palladium, or an alloy thereof. In addition, a plating layer having high conductivity may be provided.
  • the conductive spring 113 may be in the form of a coil spring formed by spirally winding a wire.
  • the conductive spring 113 preferably has an outer diameter equal to or slightly smaller than the diameter of the elastic matrix 111.
  • the length of the conductive spring 113 may be equal to the thickness of the insulating portion 115 or may be longer than the thickness of the insulating portion 115.
  • the outer diameter of the conductive spring 113 is about 10% larger than the size of the terminal 2 of the semiconductor element 1. [ If the outer diameter is smaller than this, there is a problem that the electrical conductivity is lowered and the spring constant is increased, leading to an increase in load. If the outer diameter is larger than this, interference may occur in the adjacent terminal 2.
  • the spring constant is appropriate to be 30 or less. When the spring constant exceeds 30, there is a fear of damage to the measured object.
  • the effective number of turns of the coil spring is about once per 0.128 mm. If it is smaller than this, there is a possibility that the spring constant increases and the load is increased.
  • the conductive particles 112 are arranged in the thickness direction of the elastic matrix 111.
  • the conductive particles 112 together with the conductive springs 113 impart conductivity to the anisotropic conductive sheet 100 in the thickness direction. If pressure is applied in the direction in which the terminals 2 of the semiconductor element 1 and the contact pads 4 of the inspection apparatus 3 are brought close to each other for inspection of the semiconductor element 1, 100) is compressed in the thickness direction. And the conductive particles 112 are brought close to each other, thereby further increasing the electric conductivity.
  • the conductive particles 112 may be embodied as a single conductive metal such as iron, copper, zinc, chromium, nickel, silver, cobalt, aluminum, or the like or alloys of two or more of these metal materials.
  • the conductive particles 112 may be formed by a method of coating the surface of the core metal with a metal such as gold, which is excellent in conductivity.
  • the conductive particles 112 are not evenly distributed in the elastic matrix 111, but are arranged at different densities according to positions. That is, the conductive particles 112 are arranged at a high density around the periphery of the wire member constituting the electrically conductive spring 113, that is, around the wire member, thereby filling the space between the wire members. In addition, the conductive particles 112 are arranged more densely at both ends of the elastic matrix 111 than at the center of the elastic matrix 111. [ As a result, the electrically conductive spring 113 and the conductive particles 112 together form a generally cylindrical shape.
  • the conductive particles 112 when the pressure is applied, the conductive particles 112 are pushed toward the central portion of the elastic matrix 111 having a low density of the conductive particles 112, The conductive particles 112 also contact each other, further increasing the contact area. As a result, the electric conductivity is further increased.
  • the insulating portion 115 serves to insulate adjacent contact portions 110 from each other. It also serves to support the contact portions 110.
  • the insulating portion 115 can be used without any particular limitation if it is an insulating material having elasticity.
  • diene-type rubbers such as silicone, polybutadiene, polyisoprene, SBR, NBR, etc., and their hydrogen compounds. They may also be embodied as block copolymers such as styrene butadiene blocks, copolymers, styrene isoprene block copolymers, etc., and their hydrogen compounds. It may also be embodied with chloroprene, urethane rubber, polyethylene rubber, epichlorohydrin rubber, ethylene-propylene copolymer, ethylene propylene diene copolymer and the like.
  • a metal frame can be coupled to the periphery of the insulating portion 115.
  • the metal frame is formed with a guide hole into which a guide pin provided in the inspection apparatus 3 is inserted.
  • the guide pin and the guide hole are used to align the anisotropic sheet with respect to the inspection apparatus 3.
  • the anisotropic conductive sheet according to the present embodiment includes a contact portion 210 and an insulating portion 215.
  • the contact portion 210 includes an elastic matrix 211, a conductive spring 213, and conductive particles 212.
  • the present embodiment is different from the embodiment shown in FIG. 3 in that the length of the contact portion 210 is longer than the thickness of the insulating portion 215.
  • the ratio of the thickness t of the insulating portion 215 to the length l of the contact portion 210 may be 0.7 or more and less than 0.9.
  • both ends of the contact portion 210 may protrude, and only one of both ends may protrude.
  • the present embodiment having such a characteristic configuration can prevent the insulating portion 215 from contacting the semiconductor element 1 at the time of inspection so that the semiconductor element 1 is contaminated or the semiconductor element 1 and the insulating portion 215) can be prevented. Since the contact portion 210 of the present invention includes the conductive spring 213, it is easy to increase the thickness of the contact portion 210 as compared with the insulating portion 215.
  • the anisotropic conductive sheet according to the present embodiment includes a contact portion 310 and an insulating portion 315.
  • the contact portion 310 includes an elastic matrix 311, a conductive spring 313, and conductive particles 312.
  • an hourglass-shaped coil spring 313 is used unlike the embodiment shown in FIG.
  • the present embodiment is advantageous in that a smooth connection state can be maintained even when misalignment occurs between the terminal 2 and the contact pad 4 because the contact portion 310 can be made more easily in the direction perpendicular to the thickness direction .
  • the anisotropic conductive sheet according to the present embodiment includes a contact portion 410 and an insulating portion 415.
  • the contact portion 410 includes an elastic matrix 411, a conductive spring 413, and conductive particles 412.
  • the present embodiment further includes conductive plates 416 that are provided adjacent to the upper and lower ends of the coil spring 413, unlike the embodiment shown in Fig. Through holes are formed in the conductive plates 416, respectively.
  • the through holes are a passage through which the conductive particles 412 and the elastic matrix 411 can pass.
  • This embodiment has an advantage that the terminal 2 and the contact pad 4 can be prevented from being damaged by the tip portion of the coil spring 413. It is also advantageous that the conductive plates 416 can be in direct contact with the terminals 2 and the contact pads 4 or through the conductive particles 412 disposed therebetween to increase the current capacity.
  • the conductive plates are shown as being disposed at both ends of the coil spring in Fig. 7, they may be disposed only on one of the upper end and the lower end.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)

Abstract

La présente invention concerne une feuille conductrice anisotrope utilisée pour une prise d'essai ou analogue, utilisée pour inspecter un élément semi-conducteur ou analogue et, plus particulièrement, une feuille conductrice anisotrope comprenant : une pluralité de parties de contact comprenant des ressorts conducteurs et de la poudre conductrice ; et une partie isolante destinée à soutenir des parties de contact adjacentes tout en les isolant. La présente invention concerne une feuille conductrice anisotrope agencée entre un élément (cible d'inspection) et un dispositif d'inspection de façon à connecter électriquement une borne de l'élément et un plot de contact du dispositif d'inspection l'une avec l'autre. La feuille conductrice anisotrope comprend : une pluralité de parties conductrices qui sont positionnées afin de correspondre à la borne de l'élément et au plot de contact du dispositif d'inspection, et qui ont une conductivité électrique dans la direction de l'épaisseur ; et une partie isolante qui isole des parties de contact adjacentes les unes des autres, et qui soutient les parties de contact. Chaque partie de contact comprend une matrice élastique, un ressort conducteur agencé à l'intérieur de la matrice élastique, et de multiples particules conductrices agencées dans la direction de l'épaisseur de la matrice élastique. La présente invention est caractérisée en ce que les particules conductrices sont agencées sur la partie périphérique d'un élément filaire qui constitue le ressort conducteur à une densité supérieure à la densité dans le cas de la partie centrale de la matrice élastique. La présente invention est avantageuse en ce que, en agençant les particules conductrices sur la partie périphérique de l'élément filaire qui constitue le ressort conducteur d'une manière concentrée, la conductivité des parties de contact peut être accrue tout en réduisant la quantité de particules conductrices.
PCT/KR2018/011049 2017-09-29 2018-09-19 Partie de contact conductrice et feuille conductrice anisotrope la comprenant Ceased WO2019066365A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201880062530.5A CN111149003B (zh) 2017-09-29 2018-09-19 导电接触件以及具有其的各向异性导电片

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020170127164A KR102002694B1 (ko) 2017-09-29 2017-09-29 전도성 접촉부 및 이를 포함하는 이방 전도성 시트
KR10-2017-0127164 2017-09-29

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WO2019066365A1 true WO2019066365A1 (fr) 2019-04-04

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KR (1) KR102002694B1 (fr)
CN (1) CN111149003B (fr)
TW (1) TWI692642B (fr)
WO (1) WO2019066365A1 (fr)

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