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WO2015186932A1 - Feuille de contact et structure de douille - Google Patents

Feuille de contact et structure de douille Download PDF

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Publication number
WO2015186932A1
WO2015186932A1 PCT/KR2015/005451 KR2015005451W WO2015186932A1 WO 2015186932 A1 WO2015186932 A1 WO 2015186932A1 KR 2015005451 W KR2015005451 W KR 2015005451W WO 2015186932 A1 WO2015186932 A1 WO 2015186932A1
Authority
WO
WIPO (PCT)
Prior art keywords
contact
sheet
contact sheet
socket
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2015/005451
Other languages
English (en)
Korean (ko)
Inventor
정영배
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ISC Co Ltd
Original Assignee
ISC Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ISC Co Ltd filed Critical ISC Co Ltd
Priority to CN201580027259.8A priority Critical patent/CN106560003B/zh
Publication of WO2015186932A1 publication Critical patent/WO2015186932A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices

Definitions

  • the present invention relates to a contact sheet, and more particularly, to a contact sheet in contact with a device under test having an electrode pattern having a predetermined arrangement and electrically connected to the device under test, wherein the contact sheet has a predetermined area and A sheet body having a thickness, the sheet body constituting the main body and made of an insulating material and having a predetermined area; and a plurality of contact patterns arranged on the sheet body and electrically connected to electrode patterns of the device under test;
  • the contact sheet is provided, and the contact sheet is related with the contact sheet formed in which the thickness of an outer part and the thickness of a center part differ.
  • the socket is a member that mediates the connection of a given electrical device and is used with the device to facilitate the connection. These sockets are used in various fields, such as testing various electrical components in addition to the ordinary electrical components.
  • FIG. 1 shows a case in which the outer portion of the device D1 is lowered downward, and in this case, a poor connection between the terminal between the socket D2 and the device D1 may occur, in particular, the center portion. There is a high probability that a bad connection will occur at the terminal.
  • the opposite case is also possible, and in the opposite case, in particular, a connection failure of a terminal located at an outer circumferential portion may occur.
  • the present invention has been made to solve the above-described problem, and is a contact sheet in contact with a device under test having an electrode pattern having a predetermined arrangement and electrically connected to the device under test, wherein the contact sheet has a predetermined area and A sheet body having a thickness, the sheet body constituting the main body and made of an insulating material and having a predetermined area; and a plurality of contact patterns arranged on the sheet body and electrically connected to electrode patterns of the device under test;
  • the contact sheet is provided to provide a contact sheet in which the thickness of the outer portion and the thickness of the center portion are different from each other.
  • the contact sheet according to an embodiment of the present invention is a contact sheet that is in contact with the device under test in contact with the device under test having an electrode pattern having a predetermined arrangement, and the contact sheet has a predetermined area and thickness. And a sheet body constituting a main body and composed of an insulating material and having a predetermined area; and a plurality of contact patterns arranged on the sheet body and electrically connected to electrode patterns of the device under test. The thickness of the outer portion and the center portion is different from the contact sheet.
  • the contact sheet is configured to become thicker from the outer portion to the center portion.
  • the contact sheet is configured such that the thickness becomes thinner from the outer portion to the center portion.
  • the contact sheet is configured to have a curvature by rounding at least one cross-sectional shape of an upper surface and a lower surface.
  • the contact sheet has a flat lower surface and an upper surface configured to have a convex surface ascending from the outer portion to the center portion, or to have a concave surface descending toward the central portion at the outer portion.
  • the contact pattern is formed by containing a conductive powder in the elastic insulating material.
  • the contact sheet further comprises an upper film covering an upper surface.
  • a socket structure includes a socket structure in electrical contact with a device under test in contact with a device under test having an electrode pattern having a predetermined arrangement, the socket body having a predetermined socket pattern;
  • a plurality of contact patterns arranged on the body and electrically connected to the electrode pattern of the device under test and the socket pattern of the socket body, wherein the contact sheet is formed so that the thickness of the outer portion and the thickness of the center portion are different from each other.
  • the contact film may further include a contact film disposed between the contact sheet and the socket body, wherein the contact film comprises a film body constituting the body and made of an insulating material and having a predetermined area; and arranged on the film body. And a plurality of contact patterns electrically connected to the contact patterns of the contact sheet and the socket patterns of the socket body, wherein the contact patterns constitute a conductive elastic region.
  • the contact pattern is formed by containing a conductive powder in the elastic insulating material.
  • the film body has a partially penetrated through area, and the contact pattern is disposed in the through area.
  • the contact sheet according to the present invention has a thickness different from that of the center portion and the thickness of the outer portion, it is possible to ensure a reliable electrical connection when contacting the device under test requiring inspection, thereby ensuring the reliability of the overall test.
  • FIG. 1 illustrates a connection between a socket structure and a device according to the prior art.
  • FIG. 2 illustrates a contact sheet according to an embodiment of the present invention.
  • FIG 3 illustrates a contact sheet according to an embodiment of the present invention.
  • FIG. 4 is an enlarged view of a contact sheet according to an embodiment of the present invention.
  • FIG 5 is an enlarged view of a contact sheet according to an embodiment of the present invention.
  • FIG. 6 is a view illustrating a socket structure provided with a contact sheet according to an embodiment of the present invention.
  • FIG. 7 is a view illustrating a socket structure having a contact sheet according to an embodiment of the present invention.
  • FIG. 8 is a view illustrating a socket structure provided with a contact sheet according to an embodiment of the present invention.
  • FIG. 9 is a view illustrating a socket structure provided with a contact sheet according to an embodiment of the present invention.
  • FIG. 10 is a view illustrating a socket structure having a contact sheet according to an embodiment of the present invention.
  • FIG. 11 is a view illustrating a connection between a socket structure having a contact sheet and a device under test according to an embodiment of the present invention.
  • FIG. 12 is a view illustrating a connection between a socket structure having a contact sheet and a device under test according to an embodiment of the present invention.
  • 13 to 15 are steps illustrating a method of manufacturing a contact sheet according to an embodiment of the present invention.
  • FIGS. 2 and 3 are views illustrating a contact sheet 100 according to an embodiment of the present invention
  • FIGS. 4 and 5 are enlarged views of a contact sheet 100 according to an embodiment of the present invention
  • 6 to 10 illustrate a socket structure having a contact sheet 100 according to an embodiment of the present invention
  • FIGS. 11 and 12 illustrate a contact sheet 100 according to an embodiment of the present invention
  • 13 is a view illustrating a connection between a socket structure provided with a device under test
  • FIGS. 13 to 15 are steps illustrating a method of manufacturing a contact sheet 100 according to an embodiment of the present invention.
  • the contact sheet 100 is a contact sheet 100 that is in contact with the device under test having an electrode pattern and is electrically connected to the device under test, wherein the contact sheet 100 has a predetermined area. And a sheet body having a thickness, the sheet body constituting the main body and made of an insulating material and having a predetermined area; And a plurality of contact patterns 120 arranged on the sheet body 110 and electrically connected to the electrode patterns of the device under test, wherein the contact sheet 100 has a thickness different from that of the outer portion and the thickness of the center portion. Is formed.
  • the contact sheet 100 according to the present invention has a sheet-like configuration as a whole having a predetermined area and thickness.
  • the contact sheet 100 constitutes a main body and has a sheet body 110 made of an insulating material and having a predetermined area.
  • the seat body 110 is a sheet-like member having a predetermined thickness and area, and substantially constitutes the main body of the contact sheet 100 according to the present invention.
  • the seat body 110 may be made of a material having insulation and flexibility, and may include, for example, a synthetic resin sheet made of rubber, polyimide resin, liquid crystal polymer, polyester, fluorine resin, silicone, and the like, but is not limited thereto. No.
  • a plurality of contact patterns 120 may be provided and arranged on the sheet body 110 in a form corresponding to an electrode pattern of a device under test requiring contact.
  • the arrangement form of the contact pattern 120, and the number thereof is not limited, and any form of arrangement form that can be connected to the electrode pattern corresponding to the electrode pattern formed in the device in which the contact sheet 100 according to the present invention is used. It is possible.
  • the contact pattern 120 is a pad-shaped member having a predetermined area and thickness, and a plurality of contact patterns 120 are arranged in the sheet body 110 to partially occupy an area on the sheet body 110.
  • the contact pattern 120 has a structure in which conductive powder is arranged in a thickness direction in an elastic insulating material such as silicone rubber.
  • the contact pattern 120 has an arrangement in which at least one portion overlaps an electrode pattern provided in a predetermined device. That is, each contact pattern 120 may be arranged so that at least one portion overlaps with the electrode pattern provided in the device so as to have an arrangement corresponding to the electrode pattern provided in the predetermined device.
  • the overlap means that the contact pattern 120 provided in the contact sheet 100 and the electrode pattern of the device are mutually seen when the state in which the contact sheet 100 according to the present invention is placed and covered on a predetermined device is viewed from above. It can be understood at least in part to overlap.
  • the thickness of the outer portion and the center portion is different. That is, as an example, as shown in Figure 2, the thickness M of the outer portion may be formed thinner than the thickness N of the central portion. Accordingly, the contact sheet 100 according to the present invention may have a predetermined inclined surface and may have a shape in which a central portion thereof rises relatively upward. Meanwhile, as shown in FIG. 2, the present invention is not necessarily limited to the case where the outermost part has a pointed attachment, and may also have a region having a partly the same thickness.
  • the thickness M of the outer portion may be thicker than the thickness N of the center portion.
  • the contact sheet 100 according to the present invention may have a predetermined inclined surface and may have a shape in which an outer portion thereof rises in a relatively upward direction.
  • it is not necessarily limited to the case where all have different thicknesses, and likewise, may also have a region having a partly the same thickness.
  • the contact sheet 100 may be thicker or thinner from the outer portion to the center portion, or may be formed to have a curvature by rounding a cross-sectional shape. That is, the contact sheet 100 according to the exemplary embodiment may have an inclined surface having a cross section, but may have a smooth inclined surface that is rounded to form a curved surface rather than a straight inclined surface.
  • the contact sheet 100 is formed to have a convex surface ascending from the flat lower surface and the outer portion toward the center, or having a concave surface descending toward the central portion from the outer portion. That is, according to one embodiment, the contact sheet 100, the inner side is formed to be thick, the lower surface is formed to have a flat lower surface, the upper surface may be formed to have a convex surface rising from the outer portion to the center portion. have. According to another example, the contact sheet 100 may be formed to have a thin outer shell portion and a thick center portion, the lower surface of which is flat and has a flat lower surface, and an upper surface thereof rises from the center portion to the outer portion to have a concave surface. .
  • the thickness of the center portion and the thickness of the outer portion are different, so that the contact sheet 100 according to the present invention is contacted with a predetermined device to perform a predetermined electrical test.
  • the electrical connection can be secured reliably.
  • the contact between the electrodes provided in the device may not be reliably performed as a whole due to a uniform height. That is, for example, when the electrode connection between the predetermined device under test D1 and the socket structure D2 is performed, a warpage occurs as the number of terminals constituting the electrode pattern included in the device D1 increases and the size of the device D1 increases.
  • the height of the electrode pattern of the outer portion of the device D1 placed on the upper portion is formed to be low, resulting in nonuniformity of the spacing H between the electrode patterns, and thus the outer portion of the device D1.
  • the height of the outer portion is high and the height of the center portion is formed low so that a failure occurs in contact between the electrode patterns of the outer portion.
  • the contact between the device and the socket structure is mediated using the contact sheets 100 having partially different thicknesses, such as the contact sheet 100 of the present invention, such a defect can be prevented, Thus, the contact between the devices can be made reliably.
  • the contact sheet 100 is formed in the thickness of the outer portion and the center portion differently as in the present invention, as described above, poor contact due to the difference between the electrode pattern of the outer portion and the inner portion can be easily prevented. have.
  • the seat body 110 includes a silicone rubber
  • the contact pattern 120 is composed of a mixture of silicon and the conductive powder 122 contained in the silicon.
  • the contact pattern 120, the conductive powder 122 is contained in the elastic insulating material 124 is configured.
  • the elastic insulating material 124 may be silicone rubber as having good elasticity and insulating property, but is not limited thereto.
  • the elastic insulating material 124 may be urethane resin, epoxy resin, acrylic resin, or the like, but is not limited thereto.
  • Conductive powder 122 is composed of a plurality of conductive particles having a predetermined size, is made of a material having an electrical conductivity as described above is contained in the silicon 124 is dispersed.
  • the conductive powder 122 is preferably a material that exhibits magnetic properties in terms of being easily oriented in the thickness direction within the contact pattern.
  • Specific examples of the conductive powder 122 include particles of metals showing magnetic properties such as iron, cobalt, and nickel, particles of alloys thereof, particles containing these metals, or these particles as core particles.
  • Metals having good conductivity such as gold, silver, palladium and rhodium are plated on the surface, or inorganic material particles or polymer particles such as nonmagnetic metal particles or glass beads as core particles, and nickel on the surface of the core particles. Plating of a conductive magnetic material such as cobalt, or coating both the conductive magnetic material and a metal having good conductivity to the core particles.
  • nickel particle as a core particle, and to apply the metal plating of metals, such as gold, silver, rhodium, palladium, ruthenium, tungsten, molybdenum, platinum, iridium, to the surface, and nickel plating is carried out to nickel particle. It is also preferable to use what coated several different metals, such as particle
  • the coverage of the conductive metal (the ratio of the coating area of the conductive metal to the surface area of the core particles) on the particle surface is 40% or more in terms of obtaining good conductivity. It is preferable, More preferably, it is 45% or more, Especially preferably, it is 47 to 95%.
  • the coating amount of the conductive metal is preferably 0.5 to 50% by weight of the core particles, more preferably 2 to 30% by weight, still more preferably 3 to 25% by weight, particularly preferably 4 to 20% by weight. to be.
  • the coating amount thereof is preferably 0.5 to 30% by weight of the core particles, more preferably 2 to 20% by weight, still more preferably 3 to 15% by weight, particularly preferably 4 To 10% by weight.
  • the coating amount thereof is preferably 4 to 50% by weight of the core particles, more preferably 5 to 40% by weight, still more preferably 10 to 30% by weight.
  • the particle diameter of each particle in the conductive powder 122 is preferably 1 to 1000 ⁇ m, more preferably 2 to 500 ⁇ m, still more preferably 5 to 300 ⁇ m, and particularly preferably 10 to 200 ⁇ m.
  • the particle size distribution (Dw / Dn) of the conductive powder 122 is preferably 1 to 10, more preferably 1.01 to 7, still more preferably 1.05 to 5, particularly preferably 1.1 to 4.
  • each particle in the conductive powder 122 is not specifically limited, since it can be easily disperse
  • the arrangement between the contact pattern 120 and the seat body 110 may include a through area through which the sheet body 110 partially penetrates. It may have a configuration disposed in the through area.
  • a plurality of pattern electrodes forming the contact pattern 120 are disposed to be spaced apart from each other, and the sheet body 110 is disposed between the pattern electrodes to support the contact pattern. It may be understood.
  • the conductive powder 122 is contained in the silicon 124, the conductive powder 122 is applied when predetermined terminals of a device under test press the contact pattern 120. As they come into contact with each other, they have an electrical contact state and energization is possible.
  • the contact pattern 120 may have a conductive elastic region, and may have a configuration in which electricity may be supplied according to contact pressure.
  • the contact pattern 120 is composed of a conductive elastic region having elasticity, it is possible to prevent the pressure caused by electrical contact between the terminal and the device and the occurrence of scratches and breakage. That is, the contact pattern 120 of the contact sheet 100 according to the present invention is disposed between the electrodes formed in a predetermined device, and the contact pattern 120 has conductivity and elasticity to mediate contact between the electrodes and to scratch and It is possible to prevent damage due to impact.
  • the contact sheet 100 may further include an upper film 140 covering an upper surface thereof.
  • the upper film 140 may have a conductive region and a non-conductive region, which may be energized, like the contact sheet 100 described above, and the contact pattern 120 and The top surface of the seat body 110 may be disposed to cover the top surface.
  • the conductive region of the upper film 140 may be located above the contact pattern 120. Accordingly, the upper surface of the contact sheet 100 may be protected from external impact and foreign matter.
  • the upper film is shown only for the embodiment in which the center part is thicker than the outer part, but the upper film 140 may be provided even when the outer part is thin.
  • FIGS. 6 to 10 illustrate a socket structure according to an embodiment of the present invention
  • FIGS. 11 and 12 illustrate a connection between a socket structure and a device.
  • the socket structure is a socket structure which is in contact with the device under test 300 having the electrode pattern 310 having a predetermined arrangement and is electrically connected to the device under test 300.
  • a socket body 200 having a socket pattern 210;
  • a contact sheet 100 disposed on the socket body 200, wherein the contact sheet 100 is formed in a sheet form having a predetermined area and thickness, and constitutes a main body and is made of an insulating material and A seat body (110) having an area of;
  • a plurality of contact patterns 120 arranged in the body and electrically connected to an electrode pattern 310 of the device under test 300 and a socket pattern 210 of the socket body 200.
  • the sheet 100 is formed so that the thickness of an outer part and the thickness of a center part differ.
  • the contact sheet 100 according to the present invention may be used for a socket structure for performing a test of a predetermined device 300.
  • the socket structure may comprise a contact sheet 100 according to the present invention. Therefore, the socket structure according to the present invention has the socket body 200 and the socket pattern 210 provided in the socket body 200 and composed of predetermined electrodes, and further include the contact sheet 100 as described above. Can be.
  • the socket pattern 210 is electrically connected in contact with the contact pattern 120 provided in the contact sheet 100
  • the contact sheet 100 includes a different thickness as described above, the outer shell The thickness of the part and the thickness of the center part are formed differently.
  • each of the figures shows the case where the thickness of the outer peripheral portion is thicker than the center portion, and the case where the thickness of the outer peripheral portion is thinner than the central portion, respectively.
  • FIG. 10 shows an embodiment in which the contact sheet 100 according to the present invention described above includes the upper film 140.
  • a contact film 400 disposed between the contact sheet 100 and the socket body 200, wherein the contact film 400, the body is composed of an insulating material and predetermined A film body having an area; And a plurality of film patterns arranged on the film body and electrically connected to the contact patterns 120 of the contact sheet 100 and the socket patterns 210 of the socket body 200.
  • the contact pattern 120 may include a conductive elastic region.
  • the contact film 400 is a member in the form of a thin sheet having a predetermined area and thickness, and may include a film body made of an insulating material, and a film pattern arranged on the film body and having conductivity.
  • the film pattern may be disposed between the socket pattern formed on the socket body 200 and the contact pattern formed on the contact sheet to electrically connect them.
  • the film body comprises a silicone rubber
  • the film pattern may be composed of a mixture of silicon and conductive powder contained in the silicon.
  • the film pattern may have a configuration capable of energizing according to the contact pressure, and is composed of a conductive elastic region having elasticity, thereby preventing pressure and electrical damage caused by electrical contact between the terminal and the device. can do.
  • the film body may have a partially penetrated through area, and the film pattern may be disposed in the through area. That is, the film body may have a partially penetrated through region, and a material forming the film pattern may be disposed in the through region to form a conductive elastic region.
  • the socket structure according to an embodiment of the present invention can easily achieve the connection between the device under test.
  • 13 to 15 are steps illustrating a method for manufacturing a contact sheet 100 according to an embodiment of the present invention.
  • the predetermined mold M is prepared.
  • the mold (M) has a predetermined depression so as to suit the shape of the contact sheet 100 according to the present invention
  • the contact sheet 100 has a shape having a shape having a different thickness of the outer portion and the center portion It may have the shape of an appropriate depression.
  • the inner side may have a forming frame P formed of a recessed portion deeply recessed, and vice versa.
  • a forming frame P having a recessed portion in which the inner side is thin and the outer portion is deeply recessed may be provided.
  • silicon (S) or the like is injected into the forming mold P to form the contact sheet 100 according to the present invention.
  • the silicon (S) may include a synthetic resin or the like as described above, and the contact sheet 100 according to the present invention is cured by heat or various processes in the state injected into the forming mold (P) Can be prepared.
  • a predetermined mold pin Q may be provided in the forming mold P formed in the mold M.
  • the mold pin Q is a member capable of applying an electric current or the like to form an electric field.
  • the mold pin Q may be provided in plurality in the forming mold P.
  • the above-described conductive powder 122 may be contained in the liquid silicon S injected into the forming mold P.
  • the conductive powder 122 may be contained in the liquid silicon (S), and may be configured to control its distribution by an electric field or the like as described above.
  • the mold pin Q is formed by applying a magnetic field to the mold pin Q before curing.
  • the conductive powder 122 may be concentrated in a region. Accordingly, the contact pattern 120 may be formed in a region where the conductive powder 122 is concentrated, so that the contact sheet 100 according to the present invention may be manufactured.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

La présente invention concerne une feuille de contact, et plus spécifiquement, une feuille de contact qui est connectée électriquement à un dispositif cible d'essai en venant en contact avec le dispositif cible d'essai qui présente des motifs d'électrode ayant un réseau prédéterminé, la feuille de contact étant prévue sous la forme d'une feuille ayant une surface et une épaisseur prédéterminées, la feuille de contact comprenant : un corps de feuille qui constitue le corps principal, est constitué d'un matériau isolant, et présente une surface prédéterminée ; et une pluralité de motifs de contact qui sont disposés sur le corps de feuille et sont connectés électriquement aux motifs d'électrode sur le dispositif cible d'essai, et la feuille de contact présente une épaisseur de la partie extérieure et une épaisseur de la partie centrale différentes.
PCT/KR2015/005451 2014-06-05 2015-06-01 Feuille de contact et structure de douille Ceased WO2015186932A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201580027259.8A CN106560003B (zh) 2014-06-05 2015-06-01 接触片与接脚座

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2014-0068582 2014-06-05
KR1020140068582A KR101567956B1 (ko) 2014-06-05 2014-06-05 컨택 시트 및 소켓 구조체

Publications (1)

Publication Number Publication Date
WO2015186932A1 true WO2015186932A1 (fr) 2015-12-10

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Application Number Title Priority Date Filing Date
PCT/KR2015/005451 Ceased WO2015186932A1 (fr) 2014-06-05 2015-06-01 Feuille de contact et structure de douille

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Country Link
KR (1) KR101567956B1 (fr)
CN (1) CN106560003B (fr)
TW (1) TWI550977B (fr)
WO (1) WO2015186932A1 (fr)

Cited By (1)

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CN113823241A (zh) * 2021-09-30 2021-12-21 武汉华星光电技术有限公司 驱动芯片及显示面板

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Publication number Priority date Publication date Assignee Title
KR102102816B1 (ko) * 2019-01-08 2020-04-22 (주)티에스이 신호 전송 커넥터 및 그 제조방법
KR102063763B1 (ko) * 2019-01-08 2020-01-08 (주)티에스이 신호 전송 커넥터 및 그 제조방법
US11656273B1 (en) * 2021-11-05 2023-05-23 Advantest Test Solutions, Inc. High current device testing apparatus and systems

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JP2001013207A (ja) * 1999-06-28 2001-01-19 Hitachi Ltd 半導体素子検査用ソケット、半導体装置の検査方法及び製造方法
JP2001185259A (ja) * 1999-12-27 2001-07-06 Daito:Kk Ｉｃソケットのコンタクト構造
JP2005249448A (ja) * 2004-03-02 2005-09-15 Matsushita Electric Ind Co Ltd 半導体部品検査装置
KR20060123910A (ko) * 2005-05-30 2006-12-05 삼성전자주식회사 두께 보상 부재를 구비하는 도전성 고무 테스트 소켓조립체

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CN101131967A (zh) * 2006-08-24 2008-02-27 育霈科技股份有限公司 半导体组件保护结构及其制造方法

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Publication number Priority date Publication date Assignee Title
JP2001013207A (ja) * 1999-06-28 2001-01-19 Hitachi Ltd 半導体素子検査用ソケット、半導体装置の検査方法及び製造方法
JP2001185259A (ja) * 1999-12-27 2001-07-06 Daito:Kk Ｉｃソケットのコンタクト構造
JP2005249448A (ja) * 2004-03-02 2005-09-15 Matsushita Electric Ind Co Ltd 半導体部品検査装置
KR20060123910A (ko) * 2005-05-30 2006-12-05 삼성전자주식회사 두께 보상 부재를 구비하는 도전성 고무 테스트 소켓조립체

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113823241A (zh) * 2021-09-30 2021-12-21 武汉华星光电技术有限公司 驱动芯片及显示面板
CN113823241B (zh) * 2021-09-30 2022-09-27 武汉华星光电技术有限公司 驱动芯片及显示面板

Also Published As

Publication number Publication date
KR101567956B1 (ko) 2015-11-10
CN106560003A (zh) 2017-04-05
CN106560003B (zh) 2020-01-21
TWI550977B (zh) 2016-09-21
TW201611443A (zh) 2016-03-16

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