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WO2013100560A1 - Contacteur électrique et procédé de fabrication de contacteur électrique - Google Patents

Contacteur électrique et procédé de fabrication de contacteur électrique Download PDF

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Publication number
WO2013100560A1
WO2013100560A1 PCT/KR2012/011462 KR2012011462W WO2013100560A1 WO 2013100560 A1 WO2013100560 A1 WO 2013100560A1 KR 2012011462 W KR2012011462 W KR 2012011462W WO 2013100560 A1 WO2013100560 A1 WO 2013100560A1
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WO
WIPO (PCT)
Prior art keywords
conductive
substrate member
electrical contactor
substrate
device under
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2012/011462
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English (en)
Korean (ko)
Inventor
이재학
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ISC Co Ltd
Original Assignee
ISC Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ISC Co Ltd filed Critical ISC Co Ltd
Publication of WO2013100560A1 publication Critical patent/WO2013100560A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors

Definitions

  • the present invention relates to a method for manufacturing an electrical contactor and an electrical contactor, and more particularly, to a method for manufacturing an electrical contactor and an electrical contactor including a substrate member and a sheet member.
  • the electrical contactor is used in the inspection process for determining whether the manufactured device under test is defective. That is, the manufactured device under test performs a predetermined electrical test to determine whether there is a defect. At this time, the device under test and the test board for the test are not in direct contact with each other. Indirectly connected through.
  • the reason for the electrical inspection using the electrical contactor which is a medium socket, is that the inspection apparatus including the inspection substrate is relatively expensive, so that it is not easy to replace or wear when damaged or damaged due to frequent contact of the inspected device. Because. Accordingly, the electrical contactor is replaceably mounted on the upper side of the test substrate, and the device under test is electrically connected to the test substrate by contacting the electric contactor rather than the test substrate. Therefore, the test signal from the test substrate is transmitted to the device under test through the electrical contactor.
  • pogo pins or anisotropic conductive sheets are mainly used.
  • the pogo pin is composed of a pin and a spring, and the terminal of the device under test is in contact with the pin, and the pressure applied from the device under test allows the spring to be absorbed to allow easy electrical connection.
  • an anisotropic conductive sheet exhibits conductivity only in the thickness direction when pressed in the thickness direction, and is obtained by uniformly dispersing conductive particles made of a metal material in a sheet such as silicone rubber.
  • the anisotropic conductive sheet is capable of achieving a compact electrical connection without using low temperature soldering or mechanical fitting, and has such characteristics as being capable of smooth connection by absorbing mechanical shock or distortion.
  • circuit devices for example printed circuit boards and leadless chip carriers, liquid crystal panels, etc., in the fields of electronic calculators, electronic digital clocks, electronic cameras, computer keyboards, and the like. It is widely used as a connector for.
  • an anisotropic conductive sheet has a limit in thickness.
  • a predetermined thickness or more is required.
  • the anisotropic conductive sheet is based on an elastic material such as silicone rubber, which has a disadvantage in that the overall durability becomes weak when the thickness of the anisotropic conductive sheet becomes thick.
  • the PCB substrate for thickness correction is used in the anisotropic conductive sheet.
  • an electrical contactor 100 according to the prior art is disclosed. That is, in FIG. 1, the anisotropic conductive sheet 110 mounted on the test substrate, the PCB substrate 110 disposed above the anisotropic conductive sheet 110 and having a predetermined thickness, and the PCB substrate 120.
  • Pusher means for pressurizing the insert 130, which is seated therein and the device under test 150 seated therein, and the device under test 150 that may be disposed inside the insert 130, to the test substrate 160. 140 is disclosed.
  • the lower end of the insert 130 allows the device under test 150 to be stably seated in the insert 130 and the device under test 150 is brought into direct contact with the PCB substrate 120.
  • An anisotropic conductive sheet 131 for insert attachment for preventing damage from occurring on the terminal 151 of () is additionally arranged.
  • the device to be inspected 150, the anisotropic conductive sheet 131 for attaching the insert, the PCB substrate 120, and the anisotropic conductive sheet 110. ) May be sequentially stacked on the test substrate, and when a predetermined electrical signal is applied from the test substrate 160, the signal may be anisotropic conductive sheet 110, PCB substrate 120, or anisotropic conductivity for insert attachment.
  • the sheet 131 and the device under test 150 are delivered in this order.
  • the inspection connector according to the prior art has a problem in that the anisotropically conductive sheet, the PCB board, and the anisotropically conductive sheet for insert attachment are separately manufactured and installed in necessary parts, thereby making the manufacturing process cumbersome and increasing the manufacturing cost.
  • the inspection connector according to the prior art is disposed between the terminal of the device under test and the pad of the inspection substrate, due to the contact between the insert-attached anisotropic conductive sheet and the PCB substrate, the contact between the PCB substrate and the anisotropic conductive sheet, and the like.
  • the contact portion is increased and thus the contact point is increased, the electrical transmission efficiency is reduced.
  • the components are configured to contact each other, rather than a single configuration, the electrical resistance is increased due to the increase of the contact point has the disadvantage that the overall transmission efficiency is reduced.
  • the present invention has been made to solve the above-described problems, it is easy to manufacture by manufacturing a single component, and to provide an electrical contactor and a method of manufacturing the electrical contactor can be improved electrical properties due to the reduction of the contact point The purpose.
  • a conductive filler filling the through hole of the substrate member and made of a material having electrical conductivity;
  • An upper sheet member disposed above the conductive filler and including a first conductive portion having a plurality of conductive particles distributed in an insulating material, and a first insulating portion supporting the first conductive portion and disposed above the substrate member;
  • a lower sheet disposed under the conductive filler and having a second conductive portion in which a plurality of conductive particles are distributed in an insulating material, and a second insulating portion supporting the second conductive portion and disposed above the substrate member.
  • the substrate member may be a PCB substrate.
  • the substrate member may have a thickness of 0.1 mm to 4 mm.
  • the through hole may be formed with a metal plating layer surrounding the inner wall.
  • the metal plating layer may be a copper plating layer.
  • the conductive filler may be made of a ferromagnetic material.
  • the conductive filler may be any one of iron or nickel.
  • An upper surface of the first conductive portion may protrude upward from an upper surface of the first insulating portion, and a lower surface of the second conductive portion may protrude downward than a lower surface of the second insulating portion.
  • the upper sheet member and the lower sheet member may be integrally coupled to the substrate member.
  • a substrate member having through holes formed at positions corresponding to the terminals of the device under test;
  • a conductive filler filling the through hole of the substrate member and made of a material having electrical conductivity;
  • a sheet member disposed on one of an upper side and a lower side of the conductive filler, the sheet member including a conductive part having a plurality of conductive particles distributed in an insulating material, and an insulating part supporting the conductive part and integrally coupled to the substrate member;
  • the through hole may be formed with a metal plating layer surrounding the inner wall.
  • a metal plating layer forming step of plating may be further included to form a metal plating layer on the surface of the substrate member.
  • the conductive filler is made of a ferromagnetic material, the conductive filler may induce the direction of the magnetic field when the magnetic field is applied in the conductive portion forming step.
  • the substrate member is located in the center of the inner space of the mold, and the sheet molding material may be filled on the upper side and the lower side of the substrate member, respectively.
  • the electrical contactor since the upper sheet member and the lower sheet member are disposed on the substrate member, the electrical contactor may be easily manufactured and the overall electrical characteristics may be improved by reducing the contact point.
  • FIG. 2 is a coupling diagram of FIG.
  • FIG 3 illustrates an electrical contactor in accordance with one embodiment of the present invention.
  • FIG. 4 is a combined view of FIG.
  • 5 to 11 is a view showing a state of manufacturing an electrical contactor according to an embodiment of the present invention.
  • FIG 12 illustrates an electrical contactor in accordance with another embodiment of the present invention.
  • the electrical contactor 1 is for electrically connecting the terminal 81 of the device under test 80 with the pad 91 of the test substrate 90, and the board member 10. , The metal plating layer 20, the conductive filler 30, the upper sheet member 40, and the lower sheet member 50.
  • the substrate member 10 has a predetermined thickness and is made of the same material as a conventional PCB substrate.
  • it may be made of an insulating synthetic resin such as an epoxy resin or an engineering plastic.
  • the substrate member 10 is provided with a through hole 11 penetrating the upper and lower surfaces in the thickness direction at positions corresponding to the terminals 81 of the device under test 80.
  • a plurality of such through holes 11 are formed on the substrate member 10 in accordance with the number of terminals 81, and the respective through holes 11 are spaced apart from each other. It is preferable that the diameter of the through hole 11 is somewhat larger in diameter than the terminal 81 of the device under test 80.
  • the substrate member 10 is preferably 0.1mm to 4mm, but is not limited thereto. Various thicknesses may be used.
  • the metal plating layer 20 is disposed to surround the inner wall of the through hole 11. Specifically, the metal plating layer 20 is disposed on the inner wall of the through hole 11 and extends in the thickness direction of the substrate member.
  • the upper electrode part 22 extending along the upper surface of the substrate member 10 from the connecting electrode part 21, and the lower electrode part extending along the lower surface of the substrate member 10 from the connecting electrode part 21 ( 23).
  • the metal plating layer 20 is preferably a copper plating layer, but is not limited thereto and may be anything as long as the conductivity is good.
  • the conductive filler 30 is formed of a material having electrical conductivity while filling the through hole 11 of the substrate member 10.
  • the conductive filler 30 is made of a conductive and ferromagnetic material, nickel or iron may be used.
  • the conductive filler 30 is filled in the through hole 11 and extends along the upper surface of the upper electrode part 22 from the upper end of the connection charging part 31 having a cylindrical shape and the connection charging part 31. It consists of the upper charging portion 32 and the lower charging portion 33 extending along the lower surface of the lower electrode portion 23 from the lower end of the connection charging portion 31.
  • the conductive filler 30 serves to induce a magnetic field when the conductive particles of the upper sheet member 40 or the lower sheet member 50 are arranged in the thickness direction by the magnetic field.
  • the upper sheet member 40 is disposed above the substrate member 10, and is specifically integrated with the substrate member 10.
  • the upper sheet member 40 is composed of a first conductive portion 41 and a first insulating portion 42.
  • the first conductive portion 41 is disposed above the conductive filler 30, and a plurality of conductive particles are distributed in the insulating material.
  • a heat resistant polymer material having a crosslinked structure is preferable.
  • the curable polymer material-forming material that can be used to obtain such a crosslinked polymer material various materials can be used, and specific examples thereof include silicone rubber, polybutadiene rubber, natural rubber, polyisoprene rubber, styrene-butadiene copolymer rubber, and acryl.
  • Conjugated diene rubbers such as ronitrile-butadiene copolymer rubbers and these hydrogenated compounds, block copolymer rubbers such as styrene-butadiene-diene block copolymer rubbers and styrene-isoprene block copolymers, and these hydrogenated compounds, chloroprene and urethane Rubber, polyester-based rubber, epichlorohydrin rubber, ethylene-propylene copolymer rubber, ethylene-propylene-diene copolymer rubber, soft liquid epoxy rubber, and the like.
  • silicone rubber is preferable in view of molding processability and electrical properties.
  • the liquid silicone rubber preferably has a viscosity of 10 ⁇ 1 seconds and 10 5 poise or less, and may be any of condensation type, addition type, and vinyl group or hydroxyl group. Specifically, a dimethyl silicone raw rubber, a methyl vinyl silicone raw rubber, a methylphenyl vinyl silicone raw rubber, etc. are mentioned.
  • a curing catalyst for curing the polymer material forming material can be contained.
  • a curing catalyst an organic peroxide, fatty acid azo compound, hydrosilylation catalyst, or the like can be used.
  • organic peroxide used as the curing catalyst examples include benzoyl peroxide, bisdicyclobenzoyl peroxide, dimycyl peroxide, and butyl peroxide.
  • electroconductive particle P it is preferable to use what shows magnetic.
  • grains containing these metals, or these particles are made into the core particle, and the said core
  • the surface of the core particle is formed by coating a surface of the particle with a metal having good conductivity such as gold, silver, palladium, or radium, or inorganic material particles or polymer particles such as nonmagnetic metal particles or glass beads as core particles.
  • a metal having good conductivity such as gold, silver, palladium, or radium, or inorganic material particles or polymer particles such as nonmagnetic metal particles or glass beads as core particles.
  • covered both the electroconductive magnetic substance and the metal with good electroconductivity, etc. are mentioned.
  • the particle diameter of electroconductive particle P is 1-500 micrometers, More preferably, it is 2-400 micrometers, More preferably, it is 5-300 micrometers, Especially preferably, it is 10-150 micrometers.
  • electroconductive particle P is not specifically limited, Since it can disperse
  • the first insulating part 42 supports the first conductive part 41 but is integrally attached to the upper side of the substrate member 10.
  • the first insulating portion 42 is preferably made of the same material as the insulating material of the first conductive portion 41, specifically, may be silicone rubber.
  • the upper end of the first conductive part 41 protrudes above the upper end of the first insulating part 42.
  • the protruding shape of the first conductive part 41 may have a rectangular cross section.
  • the lower sheet member 50 is disposed under the conductive filler 30 and has a second conductive portion 51 in which a plurality of conductive particles P are distributed in an insulating material, and the second conductive portion 51. ), But is composed of a second insulating portion 52 disposed above the substrate member 10.
  • the lower surface of the second conductive portion 51 is protruded to the lower side than the lower surface of the second insulating portion 52, so that the pad 91 of the test substrate 90 can be easily contacted. .
  • the manufacturing method of the electrical contactor according to the embodiment of the present invention is as follows.
  • a substrate member 10 made of epoxy resin and having a predetermined thickness is prepared. (Substrate preparation step; see FIG. 5)
  • the metal plating layer 20 is preferably a copper foil plating layer, and various methods such as electroplating or electroless plating may be used as the plating method. (Filling material forming step; see Fig. 7)
  • the conductive filler 30 is plated to cover the substrate member 10 by a predetermined thickness while filling the through hole 11 of the substrate member 10. Specifically, plating is performed using the conductive filler 30 having the ferromagnetic property. Since the method of plating the conductive filler 30 may use conventional electroplating or electroless plating, a detailed description thereof will be omitted. (Metal plating layer forming step; see FIG. 8)
  • the conductive fillers 30 filling the respective through holes 11 are etched so as to be spaced apart and separated from each other. Specifically, etching is performed so that an electrode structure passing through each through hole 11 may be formed. The adjacent through-hole 11 and the through-hole 11 are corroded and removed by an etching process so that an electrode having an approximately I-shaped cross section can be formed. (Etching step; see Fig. 9)
  • the sheet forming material 40a in which the plurality of conductive particles P are distributed in the insulating material is filled in the mold 60. (Insertion and filling step; see FIG. 10)
  • the mold 60 for the molding, the upper mold 61 and the lower mold 65, but the inside of the cavity is a predetermined space is formed.
  • the substrate member 10 is located at the center of the space of the mold 60, and the sheet forming material 40a is filled on the upper side and the lower side of the substrate member 10.
  • the upper die 61 is formed with a ferromagnetic layer 62 according to a pattern symmetrical to an arrangement pattern of the first conductive portion 41 of the upper sheet member 40 to be formed on the bottom surface of the ferromagnetic substrate 64.
  • a nonmagnetic layer 63 is formed in a region other than the region where these ferromagnetic layers 62 are formed, and a molding surface is formed by the ferromagnetic layer 62 and the nonmagnetic layer 63.
  • each of the ferromagnetic layers 62 has a thickness smaller than the thickness of the non-magnetic layer 63, thereby forming a shape in which the first conductive portion 41 to be molded protrudes from the molding surface of the upper die 61.
  • recesses 62a are formed.
  • the lower die 65 is disposed to be symmetrical with the upper die 61, and specifically, a ferromagnetic substrate 68, a ferromagnetic layer 66, a nonmagnetic layer 67, and a recess 66a are provided. do.
  • the conductive particles (P) can be arranged up and down at each position corresponding to the terminal 81 of the device under test (80).
  • the conductive portions (the first conductive portion and the second conductive portion) are formed. (Conductive section forming step; Fig. 11)
  • a pair of electromagnets are disposed on the upper surface of the ferromagnetic substrate 64 in the upper mold 61 and the lower surface of the ferromagnetic substrate 64 in the lower mold 65.
  • the ferromagnetic layer 62 of the upper die 61 and the ferromagnetic layer of the lower die 65 corresponding thereto. Between 66 the magnetic field is formed which has a greater intensity than its surrounding area.
  • the conductive filler 30 made of a ferromagnetic material for inducing a large intensity magnetic field together with the ferromagnetic layer 62 is provided inside the substrate member 10, the magnetic field having a large strength passing in the thickness direction is provided. Make sure this is formed.
  • the conductive particles P dispersed in the sheet forming material are ferromagnetic layer 62 of the upper mold 61, the conductive filler 30 and the ferromagnetic layer of the lower mold 65. It gathers in the part corresponding to (66), and orients so that it may line up in thickness direction.
  • the strength of the magnetic field acting at this time is preferably a size of 0.1 to 2.5 Tesla on average.
  • the plurality of first conductive parts 41 and the second conductive parts 51 constituted in a state in which the conductive particles P are aligned in the thickness direction in the insulating material.
  • a first insulating portion and a second insulating portion having no or almost no conductive particles P are provided between the first conductive portion 41 and the second conductive portion 51.
  • hardening process is suitably selected by the material used, it is normally performed by heat processing. What is necessary is just to provide a heater in an electromagnet, when performing hardening process of the sheet molding material by heating.
  • the specific heating temperature and the heating time are appropriately selected in consideration of the kind of the polymer material forming material constituting the molding material, the time required for the movement of the conductive particles, and the like.
  • the electrical contactor according to the embodiment of the present invention has the following effects.
  • the insert 70 on which the device under test 80 is to be seated is lowered.
  • the terminal 81 of the device under test 80 is pressed by the pusher means 71 to the first conductive portion 41 of the electrical contactor 1.
  • the second conductive portion 51 of the electrical contactor 1 is in contact with the pad 91 of the test substrate 90.
  • the signal passes through the second conductive part 51, the conductive filler 30, the metal plating layer 20, and the first conductive part 41. Is transmitted to the terminal 81.
  • the electrical contactor according to the embodiment of the present invention has the advantage that the manufacturing process is simplified compared to the individual manufacturing because the substrate member, the upper sheet member and the lower sheet member is manufactured as a single.
  • the electrical contactor because the substrate member, the upper sheet member and the lower sheet member is integrally coupled to the advantage that can solve the problem of the increase in resistance or electrical conductivity that can be caused in the process of the contact between each other is coupled have.
  • the manufacturing method of the present invention even when a thick substrate member is used, since the conductive filler made of a ferromagnetic material is disposed inside the substrate member, the magnetic field has a strong strength in the upper sheet member and the lower sheet member. I can pass it. That is, although the thickness of the substrate member is thick, if a separate ferromagnetic material is not disposed in the middle, the strength of the magnetic force may be weakened. Accordingly, the conductive particles may not be arranged in a desired direction. Conductive fillers reduce such concerns.
  • the electrical contactor according to the present invention may be modified as follows.
  • the protruding shapes of the first conductive part 41 and the second conductive part 42 were rectangular, but are not limited thereto.
  • the first conductive part 41 'and the second conductive part 51' are not limited thereto.
  • the substrate member 10 ', the metal plating layer 20', and the conductive filler 30 'constituting the electrical contactor 1' are similar to the corresponding configurations of the above-described embodiment, detailed description thereof will be omitted.
  • the upper sheet member and the lower sheet member are respectively installed on the upper side and the lower side of the substrate member.
  • the present invention is not limited thereto, and the sheet member including the conductive portion and the insulating portion is provided only on the upper side of the conductive filler. It is, of course, also possible that the sheet member including the conductive portion and the insulating portion is provided only on the lower side.
  • the sheet member is formed in the same shape as the upper sheet member or the lower sheet member, and the conductive portion and the insulating portion of the sheet member are the first conductive portion, the first insulating portion, or the second conductive portion of the lower sheet member. And a second insulating part.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Measuring Leads Or Probes (AREA)
PCT/KR2012/011462 2011-12-26 2012-12-26 Contacteur électrique et procédé de fabrication de contacteur électrique Ceased WO2013100560A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020110142393A KR101204940B1 (ko) 2011-12-26 2011-12-26 전기적 콘택터 및 전기적 콘택터의 제조방법
KR10-2011-0142393 2011-12-26

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WO2013100560A1 true WO2013100560A1 (fr) 2013-07-04

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017111198A1 (fr) * 2015-12-21 2017-06-29 주식회사 이노글로벌 Module de contact bidirectionnel pour essai de semi-conducteur et prise d'essai de semi-conducteur l'utilisant
WO2021106753A1 (fr) * 2019-11-26 2021-06-03 デクセリアルズ株式会社 Feuille de sonde et procédé de production associé

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101650134B1 (ko) * 2015-02-27 2016-08-24 주식회사 오킨스전자 컨택부재 및 이를 포함하는 반도체 패키지 테스트용 소켓
WO2021167178A1 (fr) * 2020-02-21 2021-08-26 신종천 Connecteur de transmission de signal et procédé de fabrication d'ensemble douille pour connecteur de transmission de signal
KR102229483B1 (ko) * 2020-11-17 2021-03-17 신종천 신호 전송 커넥터

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KR20070027697A (ko) * 2004-07-15 2007-03-09 제이에스알 가부시끼가이샤 이방 도전성 커넥터 장치 및 회로 장치의 검사 장치
KR100926777B1 (ko) * 2008-06-13 2009-11-16 주식회사 아이에스시테크놀러지 돌출도전부가 도전패드에 마련된 테스트 소켓
KR20100084316A (ko) * 2009-01-16 2010-07-26 주식회사 아이에스시테크놀러지 전기적 접속체 및 그 전기적 접속체를 포함한 테스트 소켓
KR20110085788A (ko) * 2010-01-21 2011-07-27 이재학 테스트 소켓 및 그 테스트 소켓의 제조방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070027697A (ko) * 2004-07-15 2007-03-09 제이에스알 가부시끼가이샤 이방 도전성 커넥터 장치 및 회로 장치의 검사 장치
KR100926777B1 (ko) * 2008-06-13 2009-11-16 주식회사 아이에스시테크놀러지 돌출도전부가 도전패드에 마련된 테스트 소켓
KR20100084316A (ko) * 2009-01-16 2010-07-26 주식회사 아이에스시테크놀러지 전기적 접속체 및 그 전기적 접속체를 포함한 테스트 소켓
KR20110085788A (ko) * 2010-01-21 2011-07-27 이재학 테스트 소켓 및 그 테스트 소켓의 제조방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017111198A1 (fr) * 2015-12-21 2017-06-29 주식회사 이노글로벌 Module de contact bidirectionnel pour essai de semi-conducteur et prise d'essai de semi-conducteur l'utilisant
WO2021106753A1 (fr) * 2019-11-26 2021-06-03 デクセリアルズ株式会社 Feuille de sonde et procédé de production associé

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