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WO2015186932A1 - Contact sheet and socket structure - Google Patents

Contact sheet and socket structure Download PDF

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Publication number
WO2015186932A1
WO2015186932A1 PCT/KR2015/005451 KR2015005451W WO2015186932A1 WO 2015186932 A1 WO2015186932 A1 WO 2015186932A1 KR 2015005451 W KR2015005451 W KR 2015005451W WO 2015186932 A1 WO2015186932 A1 WO 2015186932A1
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WO
WIPO (PCT)
Prior art keywords
contact
sheet
contact sheet
socket
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2015/005451
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French (fr)
Korean (ko)
Inventor
정영배
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ISC Co Ltd
Original Assignee
ISC Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ISC Co Ltd filed Critical ISC Co Ltd
Priority to CN201580027259.8A priority Critical patent/CN106560003B/en
Publication of WO2015186932A1 publication Critical patent/WO2015186932A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices

Definitions

  • the present invention relates to a contact sheet, and more particularly, to a contact sheet in contact with a device under test having an electrode pattern having a predetermined arrangement and electrically connected to the device under test, wherein the contact sheet has a predetermined area and A sheet body having a thickness, the sheet body constituting the main body and made of an insulating material and having a predetermined area; and a plurality of contact patterns arranged on the sheet body and electrically connected to electrode patterns of the device under test;
  • the contact sheet is provided, and the contact sheet is related with the contact sheet formed in which the thickness of an outer part and the thickness of a center part differ.
  • the socket is a member that mediates the connection of a given electrical device and is used with the device to facilitate the connection. These sockets are used in various fields, such as testing various electrical components in addition to the ordinary electrical components.
  • FIG. 1 shows a case in which the outer portion of the device D1 is lowered downward, and in this case, a poor connection between the terminal between the socket D2 and the device D1 may occur, in particular, the center portion. There is a high probability that a bad connection will occur at the terminal.
  • the opposite case is also possible, and in the opposite case, in particular, a connection failure of a terminal located at an outer circumferential portion may occur.
  • the present invention has been made to solve the above-described problem, and is a contact sheet in contact with a device under test having an electrode pattern having a predetermined arrangement and electrically connected to the device under test, wherein the contact sheet has a predetermined area and A sheet body having a thickness, the sheet body constituting the main body and made of an insulating material and having a predetermined area; and a plurality of contact patterns arranged on the sheet body and electrically connected to electrode patterns of the device under test;
  • the contact sheet is provided to provide a contact sheet in which the thickness of the outer portion and the thickness of the center portion are different from each other.
  • the contact sheet according to an embodiment of the present invention is a contact sheet that is in contact with the device under test in contact with the device under test having an electrode pattern having a predetermined arrangement, and the contact sheet has a predetermined area and thickness. And a sheet body constituting a main body and composed of an insulating material and having a predetermined area; and a plurality of contact patterns arranged on the sheet body and electrically connected to electrode patterns of the device under test. The thickness of the outer portion and the center portion is different from the contact sheet.
  • the contact sheet is configured to become thicker from the outer portion to the center portion.
  • the contact sheet is configured such that the thickness becomes thinner from the outer portion to the center portion.
  • the contact sheet is configured to have a curvature by rounding at least one cross-sectional shape of an upper surface and a lower surface.
  • the contact sheet has a flat lower surface and an upper surface configured to have a convex surface ascending from the outer portion to the center portion, or to have a concave surface descending toward the central portion at the outer portion.
  • the contact pattern is formed by containing a conductive powder in the elastic insulating material.
  • the contact sheet further comprises an upper film covering an upper surface.
  • a socket structure includes a socket structure in electrical contact with a device under test in contact with a device under test having an electrode pattern having a predetermined arrangement, the socket body having a predetermined socket pattern;
  • a plurality of contact patterns arranged on the body and electrically connected to the electrode pattern of the device under test and the socket pattern of the socket body, wherein the contact sheet is formed so that the thickness of the outer portion and the thickness of the center portion are different from each other.
  • the contact film may further include a contact film disposed between the contact sheet and the socket body, wherein the contact film comprises a film body constituting the body and made of an insulating material and having a predetermined area; and arranged on the film body. And a plurality of contact patterns electrically connected to the contact patterns of the contact sheet and the socket patterns of the socket body, wherein the contact patterns constitute a conductive elastic region.
  • the contact pattern is formed by containing a conductive powder in the elastic insulating material.
  • the film body has a partially penetrated through area, and the contact pattern is disposed in the through area.
  • the contact sheet according to the present invention has a thickness different from that of the center portion and the thickness of the outer portion, it is possible to ensure a reliable electrical connection when contacting the device under test requiring inspection, thereby ensuring the reliability of the overall test.
  • FIG. 1 illustrates a connection between a socket structure and a device according to the prior art.
  • FIG. 2 illustrates a contact sheet according to an embodiment of the present invention.
  • FIG 3 illustrates a contact sheet according to an embodiment of the present invention.
  • FIG. 4 is an enlarged view of a contact sheet according to an embodiment of the present invention.
  • FIG 5 is an enlarged view of a contact sheet according to an embodiment of the present invention.
  • FIG. 6 is a view illustrating a socket structure provided with a contact sheet according to an embodiment of the present invention.
  • FIG. 7 is a view illustrating a socket structure having a contact sheet according to an embodiment of the present invention.
  • FIG. 8 is a view illustrating a socket structure provided with a contact sheet according to an embodiment of the present invention.
  • FIG. 9 is a view illustrating a socket structure provided with a contact sheet according to an embodiment of the present invention.
  • FIG. 10 is a view illustrating a socket structure having a contact sheet according to an embodiment of the present invention.
  • FIG. 11 is a view illustrating a connection between a socket structure having a contact sheet and a device under test according to an embodiment of the present invention.
  • FIG. 12 is a view illustrating a connection between a socket structure having a contact sheet and a device under test according to an embodiment of the present invention.
  • 13 to 15 are steps illustrating a method of manufacturing a contact sheet according to an embodiment of the present invention.
  • FIGS. 2 and 3 are views illustrating a contact sheet 100 according to an embodiment of the present invention
  • FIGS. 4 and 5 are enlarged views of a contact sheet 100 according to an embodiment of the present invention
  • 6 to 10 illustrate a socket structure having a contact sheet 100 according to an embodiment of the present invention
  • FIGS. 11 and 12 illustrate a contact sheet 100 according to an embodiment of the present invention
  • 13 is a view illustrating a connection between a socket structure provided with a device under test
  • FIGS. 13 to 15 are steps illustrating a method of manufacturing a contact sheet 100 according to an embodiment of the present invention.
  • the contact sheet 100 is a contact sheet 100 that is in contact with the device under test having an electrode pattern and is electrically connected to the device under test, wherein the contact sheet 100 has a predetermined area. And a sheet body having a thickness, the sheet body constituting the main body and made of an insulating material and having a predetermined area; And a plurality of contact patterns 120 arranged on the sheet body 110 and electrically connected to the electrode patterns of the device under test, wherein the contact sheet 100 has a thickness different from that of the outer portion and the thickness of the center portion. Is formed.
  • the contact sheet 100 according to the present invention has a sheet-like configuration as a whole having a predetermined area and thickness.
  • the contact sheet 100 constitutes a main body and has a sheet body 110 made of an insulating material and having a predetermined area.
  • the seat body 110 is a sheet-like member having a predetermined thickness and area, and substantially constitutes the main body of the contact sheet 100 according to the present invention.
  • the seat body 110 may be made of a material having insulation and flexibility, and may include, for example, a synthetic resin sheet made of rubber, polyimide resin, liquid crystal polymer, polyester, fluorine resin, silicone, and the like, but is not limited thereto. No.
  • a plurality of contact patterns 120 may be provided and arranged on the sheet body 110 in a form corresponding to an electrode pattern of a device under test requiring contact.
  • the arrangement form of the contact pattern 120, and the number thereof is not limited, and any form of arrangement form that can be connected to the electrode pattern corresponding to the electrode pattern formed in the device in which the contact sheet 100 according to the present invention is used. It is possible.
  • the contact pattern 120 is a pad-shaped member having a predetermined area and thickness, and a plurality of contact patterns 120 are arranged in the sheet body 110 to partially occupy an area on the sheet body 110.
  • the contact pattern 120 has a structure in which conductive powder is arranged in a thickness direction in an elastic insulating material such as silicone rubber.
  • the contact pattern 120 has an arrangement in which at least one portion overlaps an electrode pattern provided in a predetermined device. That is, each contact pattern 120 may be arranged so that at least one portion overlaps with the electrode pattern provided in the device so as to have an arrangement corresponding to the electrode pattern provided in the predetermined device.
  • the overlap means that the contact pattern 120 provided in the contact sheet 100 and the electrode pattern of the device are mutually seen when the state in which the contact sheet 100 according to the present invention is placed and covered on a predetermined device is viewed from above. It can be understood at least in part to overlap.
  • the thickness of the outer portion and the center portion is different. That is, as an example, as shown in Figure 2, the thickness M of the outer portion may be formed thinner than the thickness N of the central portion. Accordingly, the contact sheet 100 according to the present invention may have a predetermined inclined surface and may have a shape in which a central portion thereof rises relatively upward. Meanwhile, as shown in FIG. 2, the present invention is not necessarily limited to the case where the outermost part has a pointed attachment, and may also have a region having a partly the same thickness.
  • the thickness M of the outer portion may be thicker than the thickness N of the center portion.
  • the contact sheet 100 according to the present invention may have a predetermined inclined surface and may have a shape in which an outer portion thereof rises in a relatively upward direction.
  • it is not necessarily limited to the case where all have different thicknesses, and likewise, may also have a region having a partly the same thickness.
  • the contact sheet 100 may be thicker or thinner from the outer portion to the center portion, or may be formed to have a curvature by rounding a cross-sectional shape. That is, the contact sheet 100 according to the exemplary embodiment may have an inclined surface having a cross section, but may have a smooth inclined surface that is rounded to form a curved surface rather than a straight inclined surface.
  • the contact sheet 100 is formed to have a convex surface ascending from the flat lower surface and the outer portion toward the center, or having a concave surface descending toward the central portion from the outer portion. That is, according to one embodiment, the contact sheet 100, the inner side is formed to be thick, the lower surface is formed to have a flat lower surface, the upper surface may be formed to have a convex surface rising from the outer portion to the center portion. have. According to another example, the contact sheet 100 may be formed to have a thin outer shell portion and a thick center portion, the lower surface of which is flat and has a flat lower surface, and an upper surface thereof rises from the center portion to the outer portion to have a concave surface. .
  • the thickness of the center portion and the thickness of the outer portion are different, so that the contact sheet 100 according to the present invention is contacted with a predetermined device to perform a predetermined electrical test.
  • the electrical connection can be secured reliably.
  • the contact between the electrodes provided in the device may not be reliably performed as a whole due to a uniform height. That is, for example, when the electrode connection between the predetermined device under test D1 and the socket structure D2 is performed, a warpage occurs as the number of terminals constituting the electrode pattern included in the device D1 increases and the size of the device D1 increases.
  • the height of the electrode pattern of the outer portion of the device D1 placed on the upper portion is formed to be low, resulting in nonuniformity of the spacing H between the electrode patterns, and thus the outer portion of the device D1.
  • the height of the outer portion is high and the height of the center portion is formed low so that a failure occurs in contact between the electrode patterns of the outer portion.
  • the contact between the device and the socket structure is mediated using the contact sheets 100 having partially different thicknesses, such as the contact sheet 100 of the present invention, such a defect can be prevented, Thus, the contact between the devices can be made reliably.
  • the contact sheet 100 is formed in the thickness of the outer portion and the center portion differently as in the present invention, as described above, poor contact due to the difference between the electrode pattern of the outer portion and the inner portion can be easily prevented. have.
  • the seat body 110 includes a silicone rubber
  • the contact pattern 120 is composed of a mixture of silicon and the conductive powder 122 contained in the silicon.
  • the contact pattern 120, the conductive powder 122 is contained in the elastic insulating material 124 is configured.
  • the elastic insulating material 124 may be silicone rubber as having good elasticity and insulating property, but is not limited thereto.
  • the elastic insulating material 124 may be urethane resin, epoxy resin, acrylic resin, or the like, but is not limited thereto.
  • Conductive powder 122 is composed of a plurality of conductive particles having a predetermined size, is made of a material having an electrical conductivity as described above is contained in the silicon 124 is dispersed.
  • the conductive powder 122 is preferably a material that exhibits magnetic properties in terms of being easily oriented in the thickness direction within the contact pattern.
  • Specific examples of the conductive powder 122 include particles of metals showing magnetic properties such as iron, cobalt, and nickel, particles of alloys thereof, particles containing these metals, or these particles as core particles.
  • Metals having good conductivity such as gold, silver, palladium and rhodium are plated on the surface, or inorganic material particles or polymer particles such as nonmagnetic metal particles or glass beads as core particles, and nickel on the surface of the core particles. Plating of a conductive magnetic material such as cobalt, or coating both the conductive magnetic material and a metal having good conductivity to the core particles.
  • nickel particle as a core particle, and to apply the metal plating of metals, such as gold, silver, rhodium, palladium, ruthenium, tungsten, molybdenum, platinum, iridium, to the surface, and nickel plating is carried out to nickel particle. It is also preferable to use what coated several different metals, such as particle
  • the coverage of the conductive metal (the ratio of the coating area of the conductive metal to the surface area of the core particles) on the particle surface is 40% or more in terms of obtaining good conductivity. It is preferable, More preferably, it is 45% or more, Especially preferably, it is 47 to 95%.
  • the coating amount of the conductive metal is preferably 0.5 to 50% by weight of the core particles, more preferably 2 to 30% by weight, still more preferably 3 to 25% by weight, particularly preferably 4 to 20% by weight. to be.
  • the coating amount thereof is preferably 0.5 to 30% by weight of the core particles, more preferably 2 to 20% by weight, still more preferably 3 to 15% by weight, particularly preferably 4 To 10% by weight.
  • the coating amount thereof is preferably 4 to 50% by weight of the core particles, more preferably 5 to 40% by weight, still more preferably 10 to 30% by weight.
  • the particle diameter of each particle in the conductive powder 122 is preferably 1 to 1000 ⁇ m, more preferably 2 to 500 ⁇ m, still more preferably 5 to 300 ⁇ m, and particularly preferably 10 to 200 ⁇ m.
  • the particle size distribution (Dw / Dn) of the conductive powder 122 is preferably 1 to 10, more preferably 1.01 to 7, still more preferably 1.05 to 5, particularly preferably 1.1 to 4.
  • each particle in the conductive powder 122 is not specifically limited, since it can be easily disperse
  • the arrangement between the contact pattern 120 and the seat body 110 may include a through area through which the sheet body 110 partially penetrates. It may have a configuration disposed in the through area.
  • a plurality of pattern electrodes forming the contact pattern 120 are disposed to be spaced apart from each other, and the sheet body 110 is disposed between the pattern electrodes to support the contact pattern. It may be understood.
  • the conductive powder 122 is contained in the silicon 124, the conductive powder 122 is applied when predetermined terminals of a device under test press the contact pattern 120. As they come into contact with each other, they have an electrical contact state and energization is possible.
  • the contact pattern 120 may have a conductive elastic region, and may have a configuration in which electricity may be supplied according to contact pressure.
  • the contact pattern 120 is composed of a conductive elastic region having elasticity, it is possible to prevent the pressure caused by electrical contact between the terminal and the device and the occurrence of scratches and breakage. That is, the contact pattern 120 of the contact sheet 100 according to the present invention is disposed between the electrodes formed in a predetermined device, and the contact pattern 120 has conductivity and elasticity to mediate contact between the electrodes and to scratch and It is possible to prevent damage due to impact.
  • the contact sheet 100 may further include an upper film 140 covering an upper surface thereof.
  • the upper film 140 may have a conductive region and a non-conductive region, which may be energized, like the contact sheet 100 described above, and the contact pattern 120 and The top surface of the seat body 110 may be disposed to cover the top surface.
  • the conductive region of the upper film 140 may be located above the contact pattern 120. Accordingly, the upper surface of the contact sheet 100 may be protected from external impact and foreign matter.
  • the upper film is shown only for the embodiment in which the center part is thicker than the outer part, but the upper film 140 may be provided even when the outer part is thin.
  • FIGS. 6 to 10 illustrate a socket structure according to an embodiment of the present invention
  • FIGS. 11 and 12 illustrate a connection between a socket structure and a device.
  • the socket structure is a socket structure which is in contact with the device under test 300 having the electrode pattern 310 having a predetermined arrangement and is electrically connected to the device under test 300.
  • a socket body 200 having a socket pattern 210;
  • a contact sheet 100 disposed on the socket body 200, wherein the contact sheet 100 is formed in a sheet form having a predetermined area and thickness, and constitutes a main body and is made of an insulating material and A seat body (110) having an area of;
  • a plurality of contact patterns 120 arranged in the body and electrically connected to an electrode pattern 310 of the device under test 300 and a socket pattern 210 of the socket body 200.
  • the sheet 100 is formed so that the thickness of an outer part and the thickness of a center part differ.
  • the contact sheet 100 according to the present invention may be used for a socket structure for performing a test of a predetermined device 300.
  • the socket structure may comprise a contact sheet 100 according to the present invention. Therefore, the socket structure according to the present invention has the socket body 200 and the socket pattern 210 provided in the socket body 200 and composed of predetermined electrodes, and further include the contact sheet 100 as described above. Can be.
  • the socket pattern 210 is electrically connected in contact with the contact pattern 120 provided in the contact sheet 100
  • the contact sheet 100 includes a different thickness as described above, the outer shell The thickness of the part and the thickness of the center part are formed differently.
  • each of the figures shows the case where the thickness of the outer peripheral portion is thicker than the center portion, and the case where the thickness of the outer peripheral portion is thinner than the central portion, respectively.
  • FIG. 10 shows an embodiment in which the contact sheet 100 according to the present invention described above includes the upper film 140.
  • a contact film 400 disposed between the contact sheet 100 and the socket body 200, wherein the contact film 400, the body is composed of an insulating material and predetermined A film body having an area; And a plurality of film patterns arranged on the film body and electrically connected to the contact patterns 120 of the contact sheet 100 and the socket patterns 210 of the socket body 200.
  • the contact pattern 120 may include a conductive elastic region.
  • the contact film 400 is a member in the form of a thin sheet having a predetermined area and thickness, and may include a film body made of an insulating material, and a film pattern arranged on the film body and having conductivity.
  • the film pattern may be disposed between the socket pattern formed on the socket body 200 and the contact pattern formed on the contact sheet to electrically connect them.
  • the film body comprises a silicone rubber
  • the film pattern may be composed of a mixture of silicon and conductive powder contained in the silicon.
  • the film pattern may have a configuration capable of energizing according to the contact pressure, and is composed of a conductive elastic region having elasticity, thereby preventing pressure and electrical damage caused by electrical contact between the terminal and the device. can do.
  • the film body may have a partially penetrated through area, and the film pattern may be disposed in the through area. That is, the film body may have a partially penetrated through region, and a material forming the film pattern may be disposed in the through region to form a conductive elastic region.
  • the socket structure according to an embodiment of the present invention can easily achieve the connection between the device under test.
  • 13 to 15 are steps illustrating a method for manufacturing a contact sheet 100 according to an embodiment of the present invention.
  • the predetermined mold M is prepared.
  • the mold (M) has a predetermined depression so as to suit the shape of the contact sheet 100 according to the present invention
  • the contact sheet 100 has a shape having a shape having a different thickness of the outer portion and the center portion It may have the shape of an appropriate depression.
  • the inner side may have a forming frame P formed of a recessed portion deeply recessed, and vice versa.
  • a forming frame P having a recessed portion in which the inner side is thin and the outer portion is deeply recessed may be provided.
  • silicon (S) or the like is injected into the forming mold P to form the contact sheet 100 according to the present invention.
  • the silicon (S) may include a synthetic resin or the like as described above, and the contact sheet 100 according to the present invention is cured by heat or various processes in the state injected into the forming mold (P) Can be prepared.
  • a predetermined mold pin Q may be provided in the forming mold P formed in the mold M.
  • the mold pin Q is a member capable of applying an electric current or the like to form an electric field.
  • the mold pin Q may be provided in plurality in the forming mold P.
  • the above-described conductive powder 122 may be contained in the liquid silicon S injected into the forming mold P.
  • the conductive powder 122 may be contained in the liquid silicon (S), and may be configured to control its distribution by an electric field or the like as described above.
  • the mold pin Q is formed by applying a magnetic field to the mold pin Q before curing.
  • the conductive powder 122 may be concentrated in a region. Accordingly, the contact pattern 120 may be formed in a region where the conductive powder 122 is concentrated, so that the contact sheet 100 according to the present invention may be manufactured.

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  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

The present invention relates to a contact sheet, and more specifically, to a contact sheet which is electrically connected with a test target device by coming into contact with the test target device which has electrode patterns having a predetermined array, the contact sheet being provided in the form of a sheet having a predetermined area and thickness, wherein the contact sheet comprises: a sheet body which constitutes the main body, is made of an insulating material, and has a predetermined area; and a plurality of contact patterns which are arranged on the sheet body and are electrically connected to the electrode patterns on the test target device, and the contact sheet has the thickness of the outer part and the thickness of the center part to be different.

Description

컨택 시트 및 소켓 구조체Contact Sheet and Socket Structure

본 발명은 컨택 시트에 관한 것으로서, 보다 상세하게는, 소정의 배열을 갖는 전극 패턴을 갖는 피검사 디바이스와 접촉하여 상기 피검사 디바이스와 전기적으로 연결되는 컨택 시트로서, 상기 컨택 시트는 소정의 면적 및 두께를 갖는 시트 형태로 구성되되, 본체를 구성하며 절연성 재질로 구성되고 소정의 면적을 갖는 시트 바디;및 상기 시트 바디에 배열되며 피검사 디바이스의 전극 패턴과 전기적으로 연결되는 복수의 컨택 패턴;을 구비하고, 상기 컨택 시트는, 외각부의 두께와 중앙부의 두께가 상이하게 형성되는 컨택 시트에 관한 것이다.The present invention relates to a contact sheet, and more particularly, to a contact sheet in contact with a device under test having an electrode pattern having a predetermined arrangement and electrically connected to the device under test, wherein the contact sheet has a predetermined area and A sheet body having a thickness, the sheet body constituting the main body and made of an insulating material and having a predetermined area; and a plurality of contact patterns arranged on the sheet body and electrically connected to electrode patterns of the device under test; The contact sheet is provided, and the contact sheet is related with the contact sheet formed in which the thickness of an outer part and the thickness of a center part differ.

소켓은 소정의 전기적 디바이스의 연결을 매개하는 부재로서, 디바이스와 함께 사용되어 그 연결을 용이하게 한다. 이러한 소켓은 일상적인 전기 부품 외에 각종 전기 부품의 시험 등 다양한 방면에서 사용된다.The socket is a member that mediates the connection of a given electrical device and is used with the device to facilitate the connection. These sockets are used in various fields, such as testing various electrical components in addition to the ordinary electrical components.

이러한 소켓과 소정의 디바이스 사이의 연결을 통해 테스트를 수행할 때, 상기 소켓에 형성된 패드와 디바이스 사이의 단자 사이의 접촉을 신뢰성 있게 달성하는 것은 매우 중요하다.When performing a test through such a connection between a socket and a given device, it is very important to reliably achieve contact between the pad formed in the socket and the terminal between the device.

그러나, 디바이스의 단자 수가 많아지고 사이즈가 커지면서 warpage 가 발생하며, 외각 부분과 중앙 부분의 편평도가 서로 상이하여 단자 사이의 높이가 상이해져 컨택불량이 발생할 수 있다.However, as the number of terminals of the device increases and the size increases, warpage occurs, and the flatness of the outer portion and the center portion is different from each other, so that the height between the terminals is different so that contact failure may occur.

예컨대, 도 1 은 디바이스(D1)의 외각 부분이 하방향으로 치우쳐 하강된 케이스를 나타내며, 이때, 소켓(D2)와 디바이스(D1) 사이의 단자 사이의 연결의 불량이 발생할 수 있으며, 특히 중앙 부분에 위치한 단자의 연결이 불량이 발생할 확률이 높다. 물론, 이와 반대의 경우도 가능하며, 이와 반대의 경우에는 특히 외주 부분에 위치한 단자의 연결 불량이 발생할 수 있다.For example, FIG. 1 shows a case in which the outer portion of the device D1 is lowered downward, and in this case, a poor connection between the terminal between the socket D2 and the device D1 may occur, in particular, the center portion. There is a high probability that a bad connection will occur at the terminal. Of course, the opposite case is also possible, and in the opposite case, in particular, a connection failure of a terminal located at an outer circumferential portion may occur.

이에 따라서, 소켓과 디바이스 사이의 연결을 신뢰성 있게 달성하는 부재를 개발할 필요가 있다.Accordingly, there is a need to develop a member that reliably achieves the connection between the socket and the device.

본 발명은 전술한 문제점을 해결하기 위해 안출된 것으로서, 소정의 배열을 갖는 전극 패턴을 갖는 피검사 디바이스와 접촉하여 상기 피검사 디바이스와 전기적으로 연결되는 컨택 시트로서, 상기 컨택 시트는 소정의 면적 및 두께를 갖는 시트 형태로 구성되되, 본체를 구성하며 절연성 재질로 구성되고 소정의 면적을 갖는 시트 바디;및 상기 시트 바디에 배열되며 피검사 디바이스의 전극 패턴과 전기적으로 연결되는 복수의 컨택 패턴;을 구비하고, 상기 컨택 시트는, 외각부의 두께와 중앙부의 두께가 상이하게 형성되는 컨택 시트를 제공하는 데 그 목적이 있다.SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problem, and is a contact sheet in contact with a device under test having an electrode pattern having a predetermined arrangement and electrically connected to the device under test, wherein the contact sheet has a predetermined area and A sheet body having a thickness, the sheet body constituting the main body and made of an insulating material and having a predetermined area; and a plurality of contact patterns arranged on the sheet body and electrically connected to electrode patterns of the device under test; The contact sheet is provided to provide a contact sheet in which the thickness of the outer portion and the thickness of the center portion are different from each other.

본 발명의 일 실시예에 따른 컨택 시트는, 소정의 배열을 갖는 전극 패턴을 갖는 피검사 디바이스와 접촉하여 상기 피검사 디바이스와 전기적으로 연결되는 컨택 시트로서, 상기 컨택 시트는 소정의 면적 및 두께를 갖는 시트 형태로 구성되되, 본체를 구성하며 절연성 재질로 구성되고 소정의 면적을 갖는 시트 바디;및 상기 시트 바디에 배열되며 피검사 디바이스의 전극 패턴과 전기적으로 연결되는 복수의 컨택 패턴;을 구비하고, 상기 컨택 시트는, 외각부의 두께와 중앙부의 두께가 상이하게 형성된다.The contact sheet according to an embodiment of the present invention is a contact sheet that is in contact with the device under test in contact with the device under test having an electrode pattern having a predetermined arrangement, and the contact sheet has a predetermined area and thickness. And a sheet body constituting a main body and composed of an insulating material and having a predetermined area; and a plurality of contact patterns arranged on the sheet body and electrically connected to electrode patterns of the device under test. The thickness of the outer portion and the center portion is different from the contact sheet.

바람직하게는, 상기 컨택 시트는, 외각부에서 중앙부로 갈수록 두께가 두꺼워지도록 구성된다.Preferably, the contact sheet is configured to become thicker from the outer portion to the center portion.

바람직하게는, 상기 컨택 시트는, 외각부에서 중앙부로 갈수록 두께가 얇아지도록 구성된다.Preferably, the contact sheet is configured such that the thickness becomes thinner from the outer portion to the center portion.

바람직하게는, 상기 컨택 시트는, 상면 및 하면 중 적어도 하나의 단면 형상이 라운딩되어 곡률을 갖게 구성된다.Preferably, the contact sheet is configured to have a curvature by rounding at least one cross-sectional shape of an upper surface and a lower surface.

바람젝하게는, 상기 컨택 시트는, 편평한 하면과, 외각부에서 중앙부로 갈수록 상승하여 볼록면을 갖거나, 또는 외각부에서 중앙부로 갈수록 하강하여 오목면을 갖게 구성된 상면을 갖게 구성된다.Preferably, the contact sheet has a flat lower surface and an upper surface configured to have a convex surface ascending from the outer portion to the center portion, or to have a concave surface descending toward the central portion at the outer portion.

바람직하게, 상기 컨택 패턴은 탄성 절연물질 내에 전도성 분말이 함유되어 구성된다.Preferably, the contact pattern is formed by containing a conductive powder in the elastic insulating material.

바람직하게는, 상기 컨택 시트는, 상면을 커버하는 상부 필름;을 더 포함한다.Preferably, the contact sheet further comprises an upper film covering an upper surface.

본 발명의 일 실시예에 따른 소켓 구조체는, 소정의 배열을 갖는 전극 패턴을 갖는 피검사 디바이스와 접촉하여 상기 피검사 디바이스과 전기적으로 연결되는 소켓 구조체로서, 소정의 소켓 패턴을 갖는 소켓 본체; 상기 소켓 본체 상에 배치되는 컨택 시트;를 포함하며, 상기 컨택 시트는 소정의 면적 및 두께를 갖는 시트 형태로 구성되되, 본체를 구성하며 절연성 재질로 구성되고 소정의 면적을 갖는 시트 바디;및 상기 바디에 배열되며 피검사 디바이스의 전극 패턴 및 상기 소켓 본체의 소켓 패턴과 전기적으로 연결되는 복수의 컨택 패턴;을 구비하고, 상기 컨택 시트는, 외각부의 두께와 중앙부의 두께가 서로 상이하게 형성된다.A socket structure according to an embodiment of the present invention includes a socket structure in electrical contact with a device under test in contact with a device under test having an electrode pattern having a predetermined arrangement, the socket body having a predetermined socket pattern; A contact sheet disposed on the socket body, wherein the contact sheet is configured in the form of a sheet having a predetermined area and thickness, and comprises a sheet body constituting the main body and made of an insulating material and having a predetermined area; and And a plurality of contact patterns arranged on the body and electrically connected to the electrode pattern of the device under test and the socket pattern of the socket body, wherein the contact sheet is formed so that the thickness of the outer portion and the thickness of the center portion are different from each other.

바람직하게는, 상기 컨택 시트와 소켓 본체 사이에 배치되는 컨택 필름;을 더 포함하며, 상기 컨택 필름은, 본체를 구성하며 절연성 재질로 구성되고 소정의 면적을 갖는 필름 바디;및 상기 필름 바디에 배열되며 상기 컨택 시트의 컨택 패턴, 및 상기 소켓 본체의 소켓 패턴과 접촉하여 전기적으로 연결되는 복수의 컨택 패턴;를 구비하며, 상기 컨택 패턴은, 도전성 탄성 영역을 구성한다.The contact film may further include a contact film disposed between the contact sheet and the socket body, wherein the contact film comprises a film body constituting the body and made of an insulating material and having a predetermined area; and arranged on the film body. And a plurality of contact patterns electrically connected to the contact patterns of the contact sheet and the socket patterns of the socket body, wherein the contact patterns constitute a conductive elastic region.

바람직하게 컨택 패턴은 탄성 절연물질 내에 전도성 분말이 함유되어 구성된다.Preferably, the contact pattern is formed by containing a conductive powder in the elastic insulating material.

바람직하게는, 상기 필름 바디는 부분적으로 관통된 관통 영역을 가지며, 상기 컨택 패턴은 상기 관통 영역에 배치된다.Preferably, the film body has a partially penetrated through area, and the contact pattern is disposed in the through area.

본 발명에 따른 컨택 시트는 중앙부의 두께와 외각부의 두께를 서로 다르게 구성함에 따라서, 검사가 요구되는 피검사 디바이스에 접촉할 때 확실한 전기적 연결을 가능하게 하여 전체적인 테스트의 신뢰성을 확보할 수 있다.Since the contact sheet according to the present invention has a thickness different from that of the center portion and the thickness of the outer portion, it is possible to ensure a reliable electrical connection when contacting the device under test requiring inspection, thereby ensuring the reliability of the overall test.

도 1 은 종래 기술에 따른 소켓 구조체와 디바이스 사이의 연결을 도시한 도면이다.1 illustrates a connection between a socket structure and a device according to the prior art.

도 2 는 본 발명의 일 실시예에 따른 컨택 시트를 도시한 도면이다.2 illustrates a contact sheet according to an embodiment of the present invention.

도 3 은 본 발명의 일 실시예에 따른 컨택 시트를 도시한 도면이다.3 illustrates a contact sheet according to an embodiment of the present invention.

도 4 는 본 발명의 일 실시예에 따른 컨택 시트를 확대 도시한 도면이다.4 is an enlarged view of a contact sheet according to an embodiment of the present invention.

도 5 는 본 발명의 일 실시예에 따른 컨택 시트를 확대 도시한 도면이다.5 is an enlarged view of a contact sheet according to an embodiment of the present invention.

도 6 은 본 발명의 일 실시예에 따른 컨택 시트가 구비된 소켓 구조체를 도시한 도면이다.6 is a view illustrating a socket structure provided with a contact sheet according to an embodiment of the present invention.

도 7 은 본 발명의 일 실시예에 따른 컨택 시트가 구비된 소켓 구조체를 도시한 도면이다.7 is a view illustrating a socket structure having a contact sheet according to an embodiment of the present invention.

도 8 은 본 발명의 일 실시예에 따른 컨택 시트가 구비된 소켓 구조체를 도시한 도면이다.8 is a view illustrating a socket structure provided with a contact sheet according to an embodiment of the present invention.

도 9 는 본 발명의 일 실시예에 따른 컨택 시트가 구비된 소켓 구조체를 도시한 도면이다.9 is a view illustrating a socket structure provided with a contact sheet according to an embodiment of the present invention.

도 10 은 본 발명의 일 실시예에 따른 컨택 시트가 구비된 소켓 구조체를 도시한 도면이다.10 is a view illustrating a socket structure having a contact sheet according to an embodiment of the present invention.

도 11 은 본 발명의 일 실시예에 따른 컨택 시트가 구비된 소켓 구조체와 피검사 디바이스 사이의 연결을 나타낸 도면이다.FIG. 11 is a view illustrating a connection between a socket structure having a contact sheet and a device under test according to an embodiment of the present invention. FIG.

도 12 는 본 발명의 일 실시예에 따른 컨택 시트가 구비된 소켓 구조체와 피검사 디바이스 사이의 연결을 나타낸 도면이다.12 is a view illustrating a connection between a socket structure having a contact sheet and a device under test according to an embodiment of the present invention.

도 13 내지 도 15 는 본 발명의 일 실시예에 따른 컨택 시트의 제조 방법을 단계적으로 나타낸 도면이다.13 to 15 are steps illustrating a method of manufacturing a contact sheet according to an embodiment of the present invention.

이하, 첨부된 도면을 참조하여, 본 발명에 따른 바람직한 실시예에 대하여 설명한다. Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

도 2 및 도 3 은 본 발명의 일 실시예에 따른 컨택 시트(100)를 도시한 도면이며, 도 4 및 도 5 은 본 발명의 일 실시예에 따른 컨택 시트(100)를 확대 도시한 도면이고, 도 6 내지 도 10 은 본 발명의 일 실시예에 따른 컨택 시트(100)가 구비된 소켓 구조체를 도시한 도면이고, 도 11 및 도 12 는 본 발명의 일 실시예에 따른 컨택 시트(100)가 구비된 소켓 구조체와 피검사 디바이스 사이의 연결을 나타낸 도면이며, 도 13 내지 도 15 는 본 발명의 일 실시예에 따른 컨택 시트(100)의 제조 방법을 단계적으로 나타낸 도면이다. 2 and 3 are views illustrating a contact sheet 100 according to an embodiment of the present invention, and FIGS. 4 and 5 are enlarged views of a contact sheet 100 according to an embodiment of the present invention. 6 to 10 illustrate a socket structure having a contact sheet 100 according to an embodiment of the present invention, and FIGS. 11 and 12 illustrate a contact sheet 100 according to an embodiment of the present invention. 13 is a view illustrating a connection between a socket structure provided with a device under test and FIGS. 13 to 15 are steps illustrating a method of manufacturing a contact sheet 100 according to an embodiment of the present invention.

본 발명의 일 실시예에 따른 컨택 시트(100)는, 전극 패턴을 갖는 피검사 디바이스와 접촉하여 상기 피검사 디바이스과 전기적으로 연결되는 컨택 시트(100)로서, 상기 컨택 시트(100)는 소정의 면적 및 두께를 갖는 시트 형태로 구성되되, 본체를 구성하며 절연성 재질로 구성되고 소정의 면적을 갖는 시트 바디(110); 및 상기 시트 바디(110)에 배열되며 피검사 디바이스의 전극 패턴과 전기적으로 연결되는 복수의 컨택 패턴(120);을 구비하고, 상기 컨택 시트(100)는, 외각부의 두께와 중앙부의 두께가 상이하게 형성된다.The contact sheet 100 according to an embodiment of the present invention is a contact sheet 100 that is in contact with the device under test having an electrode pattern and is electrically connected to the device under test, wherein the contact sheet 100 has a predetermined area. And a sheet body having a thickness, the sheet body constituting the main body and made of an insulating material and having a predetermined area; And a plurality of contact patterns 120 arranged on the sheet body 110 and electrically connected to the electrode patterns of the device under test, wherein the contact sheet 100 has a thickness different from that of the outer portion and the thickness of the center portion. Is formed.

본 발명에 따른 컨택 시트(100)는 전체적으로 소정의 면적 및 두께를 갖는 시트(sheet) 형 구성을 갖는다. The contact sheet 100 according to the present invention has a sheet-like configuration as a whole having a predetermined area and thickness.

컨택 시트(100)는 본체를 구성하며 절연성 재질로 구성되고 소정의 면적을 갖는 시트 바디(110)를 갖는다. 시트 바디(110)는 소정의 두께 및 면적을 갖는 시트형 부재로서, 실질적으로 본 발명에 따른 컨택 시트(100)의 본체를 구성한다. 시트 바디(110)는 절연성 및 유연성을 갖는 재질로 구성되며, 일 예로, 고무, 폴리이미드 수지, 액정 중합체, 폴리에스테르, 불소계 수지 등으로 구성된 합성 수지 시트, 실리콘 등으로 구성될 수 있고 이에 한정하지 아니한다. The contact sheet 100 constitutes a main body and has a sheet body 110 made of an insulating material and having a predetermined area. The seat body 110 is a sheet-like member having a predetermined thickness and area, and substantially constitutes the main body of the contact sheet 100 according to the present invention. The seat body 110 may be made of a material having insulation and flexibility, and may include, for example, a synthetic resin sheet made of rubber, polyimide resin, liquid crystal polymer, polyester, fluorine resin, silicone, and the like, but is not limited thereto. No.

컨택 패턴(120)은 복수 개 구비되며, 접촉이 요구되는 피검사 디바이스의 전극 패턴과 대응되는 형태로 상기 시트 바디(110)에 배열된다. 컨택 패턴(120)의 배열 형태, 및 그 수는 한정하지 아니하며, 본 발명에 따른 컨택 시트(100)가 사용되는 디바이스에 형성된 전극 패턴에 대응하여 상기 전극 패턴과 연결될 수 있는 배열 형태면 어떠한 형태도 가능하다. 컨택 패턴(120)은 소정의 면적 및 두께를 갖는 패드형 부재로서 상기 시트 바디(110)에 복수 개가 배열되어 시트 바디(110) 상에서 부분적으로 영역을 차지한다. 컨택 패턴(120)은 실리콘 고무와 같은 탄성 절연물질 내에 전도성 분말이 두께방향으로 배열된 구조로 이루어진다.A plurality of contact patterns 120 may be provided and arranged on the sheet body 110 in a form corresponding to an electrode pattern of a device under test requiring contact. The arrangement form of the contact pattern 120, and the number thereof is not limited, and any form of arrangement form that can be connected to the electrode pattern corresponding to the electrode pattern formed in the device in which the contact sheet 100 according to the present invention is used. It is possible. The contact pattern 120 is a pad-shaped member having a predetermined area and thickness, and a plurality of contact patterns 120 are arranged in the sheet body 110 to partially occupy an area on the sheet body 110. The contact pattern 120 has a structure in which conductive powder is arranged in a thickness direction in an elastic insulating material such as silicone rubber.

상기 컨택 패턴(120)은, 적어도 일 부분이 소정의 디바이스에 구비된 전극 패턴과 중첩되는 배열을 갖는다. 즉, 각각의 컨택 패턴(120)은 소정의 디바이스에 구비된 전극 패턴에 대응하는 배열을 갖도록 적어도 일 부분이 디바이스에 구비된 전극 패턴과 중첩되게 배열될 수 있다. 여기서, 중첩이라 함은 본 발명에 따른 컨택 시트(100)를 소정의 디바이스 상에 놓아 덮은 상태를 상방향에서 볼 때 컨택 시트(100)에 구비된 컨택 패턴(120)과 디바이스의 전극 패턴이 서로 적어도 일 부분 겹치는 것으로 이해될 수 있다.The contact pattern 120 has an arrangement in which at least one portion overlaps an electrode pattern provided in a predetermined device. That is, each contact pattern 120 may be arranged so that at least one portion overlaps with the electrode pattern provided in the device so as to have an arrangement corresponding to the electrode pattern provided in the predetermined device. Here, the overlap means that the contact pattern 120 provided in the contact sheet 100 and the electrode pattern of the device are mutually seen when the state in which the contact sheet 100 according to the present invention is placed and covered on a predetermined device is viewed from above. It can be understood at least in part to overlap.

본 발명에 따른 컨택 시트(100)는, 외각부와 중앙부의 두께가 상이하게 형성된다. 즉, 일 예로, 도 2 에 도시된 바와 같이, 외각부의 두께 M 이 중앙부의 두께 N 보다 얇게 형성될 수 있다. 이에 따라서, 본 발명에 따른 컨택 시트(100)는, 소정의 경사면을 가지며 중앙부가 비교적 상방향으로 솟은 형상을 가질 수 있다. 한편, 이때 도 2 에 도시된 바와 같이 반드시 최외각부가 뾰족한 첨부를 갖는 경우에 한정하는 것은 아니며, 아울러, 부분적으로 동일한 두께를 갖는 영역 또한 가질 수 있다.In the contact sheet 100 according to the present invention, the thickness of the outer portion and the center portion is different. That is, as an example, as shown in Figure 2, the thickness M of the outer portion may be formed thinner than the thickness N of the central portion. Accordingly, the contact sheet 100 according to the present invention may have a predetermined inclined surface and may have a shape in which a central portion thereof rises relatively upward. Meanwhile, as shown in FIG. 2, the present invention is not necessarily limited to the case where the outermost part has a pointed attachment, and may also have a region having a partly the same thickness.

다른 예로, 도 3 과 같이, 외각부의 두께 M 이 중앙부의 두께 N 보다 두껍게 형성될 수 있다. 이에 따라서, 본 발명에 따른 컨택 시트(100)는, 소정의 경사면을 가지며 외각부가 비교적 상방향으로 솟은 형상을 가질 수 있다. 한편, 반드시 모두 상이한 두께를 갖는 경우만 한정하지 아니하며, 마찬가지로, 부분적으로 동일한 두께를 갖는 영역 또한 가질 수 있다.As another example, as shown in FIG. 3, the thickness M of the outer portion may be thicker than the thickness N of the center portion. Accordingly, the contact sheet 100 according to the present invention may have a predetermined inclined surface and may have a shape in which an outer portion thereof rises in a relatively upward direction. On the other hand, it is not necessarily limited to the case where all have different thicknesses, and likewise, may also have a region having a partly the same thickness.

이때, 일 실시예에 따르면, 상기 컨택 시트(100)는, 외각부에서 중앙부로 갈수록 두께가 두꺼워지거나, 또는 얇아지되, 단면 형상이 라운딩되어 곡률을 갖게 형성될 수 있다. 즉, 일 실시예에 따른 컨택 시트(100)는 단면이 경사면을 갖게 형성되되, 직선형태의 경사면이 아닌, 라운딩되어 곡면을 형성하는 완만한 경사면을 가질 수 있다. In this case, according to an embodiment, the contact sheet 100 may be thicker or thinner from the outer portion to the center portion, or may be formed to have a curvature by rounding a cross-sectional shape. That is, the contact sheet 100 according to the exemplary embodiment may have an inclined surface having a cross section, but may have a smooth inclined surface that is rounded to form a curved surface rather than a straight inclined surface.

일 실시예에 따르면, 상기 컨택 시트(100)는, 편평한 하면과 외각부에서 중앙부로 갈수록 상승하여 볼록면을 갖거나, 또는 외각부에서 중앙부로 갈수록 하강하여 오목면을 갖는 상면을 갖게 형성된다. 즉, 일 실시예에 따르면, 상기 컨택 시트(100)는, 내측이 두껍게 형성되되, 하면은 편평하게 형성되어 편평한 하면을 갖고, 상면은 외각부에서 중앙부로 갈수록 상승하여 볼록면을 갖게 형성될 수 있다. 다른 예에 의하면, 상기 컨택 시트(100)는, 외각부가 얇고 중앙부가 두껍게 형성되되, 하면은 편평하게 형성되어 편평한 하면을 갖고, 상면은 중앙부에서 외각부로 갈수록 상승하여 오목면을 갖게 형성될 수 있다.According to an embodiment, the contact sheet 100 is formed to have a convex surface ascending from the flat lower surface and the outer portion toward the center, or having a concave surface descending toward the central portion from the outer portion. That is, according to one embodiment, the contact sheet 100, the inner side is formed to be thick, the lower surface is formed to have a flat lower surface, the upper surface may be formed to have a convex surface rising from the outer portion to the center portion. have. According to another example, the contact sheet 100 may be formed to have a thin outer shell portion and a thick center portion, the lower surface of which is flat and has a flat lower surface, and an upper surface thereof rises from the center portion to the outer portion to have a concave surface. .

상기와 같이, 본 발명에 따른 컨택 시트(100)는 중앙부의 두께와 외각부의 두께가 상이하게 구성됨에 따라서, 본 발명에 따른 컨택 시트(100)를 소정의 디바이스에 접촉시켜 소정의 전기적 테스트를 수행할 때 전기적 연결이 신뢰성있게 확보될 수 있다.As described above, in the contact sheet 100 according to the present invention, the thickness of the center portion and the thickness of the outer portion are different, so that the contact sheet 100 according to the present invention is contacted with a predetermined device to perform a predetermined electrical test. The electrical connection can be secured reliably.

일 예로, 종래의 피검사 디바이스의 경우, 도 1 에 도시된 바와 같이, 균일한 높이를 가짐에 따라서 디바이스에 구비된 전극 사이의 접촉이 전체적으로 신뢰성있게 이루어지지 않는 경우가 발생할 수 있다. 즉, 예컨대 소정의 피검사 디바이스 D1 와 소켓 구조체 D2 사이의 전극 연결을 수행할 경우, 디바이스 D1 에 구비된 전극 패턴을 구성하는 단자의 수가 많아지고 디바이스 D1 의 사이즈가 커짐에 따라서 warpage 가 발생한다. 이때, 일 예에 의하면, 도 1 에 도시된 바와 같이 상부에 놓인 디바이스 D1 의 외각 부분의 전극 패턴의 높이가 낮게 형성되어 전극 패턴 사이의 간격 H 의 불균일이 발생하며, 이에 따라서 디바이스 D1 의 외각 부분의 전극 패턴 사이의 접촉에 비해 내측 부분의 전극 패턴 사이의 접촉은 신뢰성있게 이루어지지 아니하며 따라서 접촉 불량이 발생할 수 있다. 물론, 이와 반대로, 외각 부분의 높이가 높고 중앙부의 높이가 낮게 형성되어 외각 부분의 전극 패턴 사이의 접촉에 불량이 발생하는 경우도 가능하다.For example, in the case of a conventional device under test, as shown in FIG. 1, the contact between the electrodes provided in the device may not be reliably performed as a whole due to a uniform height. That is, for example, when the electrode connection between the predetermined device under test D1 and the socket structure D2 is performed, a warpage occurs as the number of terminals constituting the electrode pattern included in the device D1 increases and the size of the device D1 increases. At this time, according to an example, as shown in FIG. 1, the height of the electrode pattern of the outer portion of the device D1 placed on the upper portion is formed to be low, resulting in nonuniformity of the spacing H between the electrode patterns, and thus the outer portion of the device D1. Compared with the contact between the electrode patterns of the contact between the electrode pattern of the inner portion is not made reliably and therefore a contact failure may occur. Of course, on the contrary, it is also possible that the height of the outer portion is high and the height of the center portion is formed low so that a failure occurs in contact between the electrode patterns of the outer portion.

그러나, 본 발명의 컨택 시트(100)와 같이, 부분적으로 서로 상이한 두께를 갖는 컨택 시트(100)를 사용하여 디바이스와 소켓 구조체 사이의 접촉을 매개할 경우, 상기와 같은 불량을 방지할 수 있으며, 따라서 디바이스 사이의 접촉이 신뢰성있게 이루어질 수 있다. 아울러, 본 발명에서와 같이 컨택 시트(100)가 외각부와 중앙부의 두께가 상이하게 형성됨에 따라서, 상술한 바와 같이 외각 부분과 내측부의 전극 패턴의 간격 차이에 따른 접촉 불량이 용이하게 방지될 수 있다. However, when the contact between the device and the socket structure is mediated using the contact sheets 100 having partially different thicknesses, such as the contact sheet 100 of the present invention, such a defect can be prevented, Thus, the contact between the devices can be made reliably. In addition, as the contact sheet 100 is formed in the thickness of the outer portion and the center portion differently as in the present invention, as described above, poor contact due to the difference between the electrode pattern of the outer portion and the inner portion can be easily prevented. have.

바람직하게는, 상기 시트 바디(110)는, 실리콘 고무을 포함하며, 상기 컨택 패턴(120)은, 실리콘과 실리콘 내에 함유된 전도성 분말(122)의 혼합체로 구성된다. Preferably, the seat body 110 includes a silicone rubber, and the contact pattern 120 is composed of a mixture of silicon and the conductive powder 122 contained in the silicon.

본 발명의 일 실시예에 따르면, 바람직하게는, 상기 컨택 패턴(120)은, 탄성 절연물질(124) 내에 전도성 분말(122)이 함유되어 구성된다. 탄성 절연물질(124)은 탄력성이 좋으면서 절연성을 가지는 것으로서 실리콘 고무일 수 있으나, 이에 한정되는 것은 아니며, 탄성을 갖는 재질로서 우레탄수지, 에폭시계 수지, 및 아크릴계 수지 등일 수 있고 이에 한정하지 아니한다. According to one embodiment of the present invention, preferably, the contact pattern 120, the conductive powder 122 is contained in the elastic insulating material 124 is configured. The elastic insulating material 124 may be silicone rubber as having good elasticity and insulating property, but is not limited thereto. The elastic insulating material 124 may be urethane resin, epoxy resin, acrylic resin, or the like, but is not limited thereto.

전도성 분말(122)은 소정의 크기를 갖는 다수의 전도성 입자로 구성되며, 상술한 바와 같이 전기 전도성을 갖는 재질로 구성되어 상기 실리콘(124) 내에 함유되어 분산된다.Conductive powder 122 is composed of a plurality of conductive particles having a predetermined size, is made of a material having an electrical conductivity as described above is contained in the silicon 124 is dispersed.

이러한 전도성 분말(122)은 컨택 패턴 내에서 두께방향으로 용이하게 배향시킬 수 있는 측면에서 자성을 나타내는 소재를 이용하는 것이 바람직하다. 이러한 전도성 분말(122)의 구체예로서는, 철, 코발트, 니켈 등의 자성을 나타내는 금속의 입자 또는 이들의 합금의 입자 또는 이들 금속을 함유하는 입자, 또는 이들 입자를 코어 입자로 하고, 상기 코어 입자의 표면에 금, 은, 팔라듐, 로듐 등의 도전성이 양호한 금속의 도금을 실시한 것, 또는 비자성 금속 입자 또는 유리 비드 등의 무기 물질 입자 또는 중합체 입자를 코어 입자로 하고, 상기 코어 입자의 표면에 니켈, 코발트 등의 도전성 자성체의 도금을 실시한 것, 또는 코어 입자에 도전성 자성체 및 도전성이 양호한 금속 둘 다를 피복한 것 등을 들 수 있다. The conductive powder 122 is preferably a material that exhibits magnetic properties in terms of being easily oriented in the thickness direction within the contact pattern. Specific examples of the conductive powder 122 include particles of metals showing magnetic properties such as iron, cobalt, and nickel, particles of alloys thereof, particles containing these metals, or these particles as core particles. Metals having good conductivity such as gold, silver, palladium and rhodium are plated on the surface, or inorganic material particles or polymer particles such as nonmagnetic metal particles or glass beads as core particles, and nickel on the surface of the core particles. Plating of a conductive magnetic material such as cobalt, or coating both the conductive magnetic material and a metal having good conductivity to the core particles.

이들 중에서는 니켈 입자를 코어 입자로 하고, 그의 표면에 금이나 은, 로듐, 팔라듐, 루테늄, 텅스텐, 몰리브덴, 백금, 이리듐 등의 금속의 도금을 실시한 것을 이용하는 것이 바람직하고, 니켈 입자에 은 도금을 바탕 도금으로 하여 표층에 금 도금한 입자 등 복수의 상이한 금속을 피복한 것을 이용하는 것도 바람직하다. 코어 입자의 표면에 도전성 금속을 피복하는 수단으로서는 특별히 한정되는 것은 아니지만, 예를 들면 화학 도금 또는 전해 도금에 의해 행할 수 있다.In these, it is preferable to use nickel particle as a core particle, and to apply the metal plating of metals, such as gold, silver, rhodium, palladium, ruthenium, tungsten, molybdenum, platinum, iridium, to the surface, and nickel plating is carried out to nickel particle. It is also preferable to use what coated several different metals, such as particle | grains which carried out gold plating on the surface layer as background plating. Although it does not specifically limit as a means which coat | covers a conductive metal on the surface of a core particle, For example, it can carry out by chemical plating or electrolytic plating.

코어 입자의 표면에 도전성 금속이 피복되어 이루어지는 것을 이용하는 경우에는, 양호한 도전성이 얻어지는 측면에서 입자 표면에서의 도전성 금속의 피복률(코어 입자의 표면적에 대한 도전성 금속의 피복 면적의 비율)이 40% 이상인 것이 바람직하고, 더욱 바람직하게는 45% 이상, 특히 바람직하게는 47 내지 95%이다. 또한, 도전성 금속의 피복량은 코어 입자의 0.5 내지 50 중량%인 것이 바람직하고, 보다 바람직하게는 2 내지 30 중량%, 더욱 바람직하게는 3 내지 25 중량%, 특히 바람직하게는 4 내지 20 중량%이다. 피복되는 도전성 금속이 금인 경우에는 그의 피복량은 코어 입자의 0.5 내지 30 중량%인 것이 바람직하고, 보다 바람직하게는 2 내지 20 중량%, 더욱 바람직하게는 3 내지 15 중량%, 특히 바람직하게는 4 내지 10 중량%이다. 또한, 피복되는 도전성 금속이 은인 경우에는, 그의 피복량은 코어 입자의 4 내지 50 중량%인 것이 바람직하고, 보다 바람직하게는 5 내지 40 중량%, 더욱 바람직하게는 10 내지 30 중량%이다. In the case where the conductive metal is coated on the surface of the core particles, the coverage of the conductive metal (the ratio of the coating area of the conductive metal to the surface area of the core particles) on the particle surface is 40% or more in terms of obtaining good conductivity. It is preferable, More preferably, it is 45% or more, Especially preferably, it is 47 to 95%. In addition, the coating amount of the conductive metal is preferably 0.5 to 50% by weight of the core particles, more preferably 2 to 30% by weight, still more preferably 3 to 25% by weight, particularly preferably 4 to 20% by weight. to be. When the conductive metal to be coated is gold, the coating amount thereof is preferably 0.5 to 30% by weight of the core particles, more preferably 2 to 20% by weight, still more preferably 3 to 15% by weight, particularly preferably 4 To 10% by weight. In addition, when the conductive metal to be coated is silver, the coating amount thereof is preferably 4 to 50% by weight of the core particles, more preferably 5 to 40% by weight, still more preferably 10 to 30% by weight.

또한, 전도성 분말(122)에서 각 입자들의 입경은 1 내지 1000 ㎛인 것이 바람직하고, 보다 바람직하게는 2 내지 500 ㎛, 더욱 바람직하게는 5 내지 300 ㎛, 특히 바람직하게는 10 내지 200 ㎛이다. 또한, 전도성 분말(122)의 입경 분포(Dw/Dn)는 1 내지 10인 것이 바람직하고, 보다 바람직하게는 1.01 내지 7, 더욱 바람직하게는 1.05 내지 5, 특히 바람직하게는 1.1 내지 4이다. 이러한 조건을 만족시키는 전도성 분말(122)을 이용함으로써, 얻어지는 전극패턴은 가압 변형이 용이하게 되고, 또한 전도성 분말(122)의 각 입자들 간에 충분한 전기적 접촉이 얻어진다. 또한, 전도성 분말(122)에서 각 입자들의 형상은 특별히 한정되는 것은 아니지만, 고분자 형성 재료 내에 용이하게 분산시킬 수 있는 점에서, 구형의 것, 별 형상의 것 또는 이들이 응집한 2차 입자에 의한 괴상의 것이 바람직하다. In addition, the particle diameter of each particle in the conductive powder 122 is preferably 1 to 1000 μm, more preferably 2 to 500 μm, still more preferably 5 to 300 μm, and particularly preferably 10 to 200 μm. In addition, the particle size distribution (Dw / Dn) of the conductive powder 122 is preferably 1 to 10, more preferably 1.01 to 7, still more preferably 1.05 to 5, particularly preferably 1.1 to 4. By using the conductive powder 122 that satisfies these conditions, the resulting electrode pattern is easily deformed under pressure, and sufficient electrical contact is obtained between the respective particles of the conductive powder 122. In addition, although the shape of each particle in the conductive powder 122 is not specifically limited, since it can be easily disperse | distributed in a polymer forming material, it is a spherical thing, a star shape, or the mass by the secondary particle which they aggregated. Is preferable.

상기와 같은 컨택 패턴(120)과 시트 바디(110) 사이의 배치는, 도 3 에 도시된 바와 같이, 상기 시트 바디(110)가 부분적으로 관통된 관통 영역을 가지며, 상기 컨택 패턴(120)이 상기 관통 영역에 배치되는 구성을 가질 수 있다. 반대로 해석하면, 컨택 패턴(120)을 형성하는 각각의 패턴 전극이 복수 개 서로 이격되게 배치되고, 각각의 패턴 전극 사이에 상기 시트 바디(110)가 배치되어 시트 바디가 상기 컨택 패턴을 지지하는 것으로 이해될 수도 있다. As shown in FIG. 3, the arrangement between the contact pattern 120 and the seat body 110 may include a through area through which the sheet body 110 partially penetrates. It may have a configuration disposed in the through area. On the contrary, a plurality of pattern electrodes forming the contact pattern 120 are disposed to be spaced apart from each other, and the sheet body 110 is disposed between the pattern electrodes to support the contact pattern. It may be understood.

상기 구성과 같이, 전도성 분말(122)이 실리콘(124) 내에 함유되는 구성을 가짐에 따라서, 소정의 피검사 디바이스의 소정의 단자들이 상기 컨택 패턴(120)을 가압할 때는 상기 전도성 분말(122)들이 서로 접촉되면서 전기적인 접촉 상태를 갖게 되며 통전이 가능하게 된다.As described above, as the conductive powder 122 is contained in the silicon 124, the conductive powder 122 is applied when predetermined terminals of a device under test press the contact pattern 120. As they come into contact with each other, they have an electrical contact state and energization is possible.

상기와 같은 구성을 가짐에 따라서, 상기 컨택 패턴(120)은, 도전성 탄성 영역을 구성하며, 접촉 압력에 따라서 통전이 가능한 구성을 가질 수 있다. 이와 같이 상기 컨택 패턴(120)이 탄성을 갖는 도전성 탄성 영역으로 구성됨에 따라서, 단자와 디바이스 사이의 전기적 접촉에 따른 압력 및 그에 따른 스크래치 및 파손 발생을 방지할 수 있다. 즉, 소정의 디바이스에 형성된 전극 사이에 본 발명에 따른 컨택 시트(100)의 컨택 패턴(120)이 배치되며, 상기 컨택 패턴(120)은 전도성 및 탄성을 가져서 전극 사이의 접촉을 매개하고 스크래치 및 충격에 의한 파손 등을 방지할 수 있다.As described above, the contact pattern 120 may have a conductive elastic region, and may have a configuration in which electricity may be supplied according to contact pressure. As the contact pattern 120 is composed of a conductive elastic region having elasticity, it is possible to prevent the pressure caused by electrical contact between the terminal and the device and the occurrence of scratches and breakage. That is, the contact pattern 120 of the contact sheet 100 according to the present invention is disposed between the electrodes formed in a predetermined device, and the contact pattern 120 has conductivity and elasticity to mediate contact between the electrodes and to scratch and It is possible to prevent damage due to impact.

이때, 바람직하게는, 도 5 에 도시된 바와 같이, 본 발명에 따른 상기 컨택 시트(100)는, 상면을 커버하는 상부 필름(140);을 더 포함할 수 있다. 명료히 도시되지는 아니하였으나, 상부 필름(140)은 바람직하게는 상술한 컨택 시트(100)와 마찬가지로, 통전이 가능한 도전성 영역, 및 비도전성 영역을 가질 수 있으며, 상술한 컨택 패턴(120) 및 시트 바디(110)의 상면에 배치되어 상면을 커버할 수 있다. 이때, 상기 상부 필름(140)의 도전성 영역은 상기 컨택 패턴(120)의 상부에 위치할 수 있다. 이에 따라서, 컨택 시트(100)의 상면이 외부 충격, 이물질로부터 보호될 수 있다. 한편, 도 5 에서는 외각부에 비해 중앙부가 두꺼운 실시 형태에 대해서만 상부 필름을 나타내었으나, 외각부가 얇은 경우에도 상기 상부 필름(140)이 마련될 수도 있음은 물론이다.At this time, preferably, as shown in FIG. 5, the contact sheet 100 according to the present invention may further include an upper film 140 covering an upper surface thereof. Although not clearly illustrated, the upper film 140 may have a conductive region and a non-conductive region, which may be energized, like the contact sheet 100 described above, and the contact pattern 120 and The top surface of the seat body 110 may be disposed to cover the top surface. In this case, the conductive region of the upper film 140 may be located above the contact pattern 120. Accordingly, the upper surface of the contact sheet 100 may be protected from external impact and foreign matter. Meanwhile, in FIG. 5, the upper film is shown only for the embodiment in which the center part is thicker than the outer part, but the upper film 140 may be provided even when the outer part is thin.

도 6 내지 도 10 은 본 발명의 일 실시예에 따른 소켓 구조체를 나타낸 도면이고, 도 11 및 도 12 는 소켓 구조체와 디바이스 사이의 연결을 나타낸 도면이다.6 to 10 illustrate a socket structure according to an embodiment of the present invention, and FIGS. 11 and 12 illustrate a connection between a socket structure and a device.

본 발명의 일 실시예에 따른 소켓 구조체는, 소정의 배열을 갖는 전극 패턴(310)을 갖는 피검사 디바이스(300)와 접촉하여 상기 피검사 디바이스(300)와 전기적으로 연결되는 소켓 구조체로서, 소정의 소켓 패턴(210)을 갖는 소켓 본체(200); 상기 소켓 본체(200) 상에 배치되는 컨택 시트(100);를 포함하며, 상기 컨택 시트(100)는 소정의 면적 및 두께를 갖는 시트 형태로 구성되되, 본체를 구성하며 절연성 재질로 구성되고 소정의 면적을 갖는 시트 바디(110); 및 상기 바디에 배열되며 피검사 디바이스(300)의 전극 패턴(310) 및 상기 소켓 본체(200)의 소켓 패턴(210)과 전기적으로 연결되는 복수의 컨택 패턴(120);을 구비하고, 상기 컨택 시트(100)는, 외각부의 두께와 중앙부의 두께가 상이하게 형성된다.The socket structure according to an embodiment of the present invention is a socket structure which is in contact with the device under test 300 having the electrode pattern 310 having a predetermined arrangement and is electrically connected to the device under test 300. A socket body 200 having a socket pattern 210; And a contact sheet 100 disposed on the socket body 200, wherein the contact sheet 100 is formed in a sheet form having a predetermined area and thickness, and constitutes a main body and is made of an insulating material and A seat body (110) having an area of; And a plurality of contact patterns 120 arranged in the body and electrically connected to an electrode pattern 310 of the device under test 300 and a socket pattern 210 of the socket body 200. The sheet 100 is formed so that the thickness of an outer part and the thickness of a center part differ.

본 발명에 따른 컨택 시트(100)는 소정의 디바이스(300)의 테스트를 수행하는 소켓 구조체에 사용될 수 있다. 이에 따라서, 소켓 구조체는 본 발명에 따른 컨택 시트(100)를 포함할 수 있다. 따라서, 본 발명에 따른 소켓 구조체는 소켓 본체(200) 및 상기 소켓 본체(200)에 구비되며 소정의 전극으로 구성된 소켓 패턴(210)을 가지며, 아울러 상술한 바와 같은 컨택 시트(100)를 포함할 수 있다. 이때, 상기 소켓 패턴(210)은 상기 컨택 시트(100)에 마련된 컨택 패턴(120)과 접촉하여 전기적으로 연결되며, 상기 컨택 시트(100)는 상술한 바와 같이 부분적으로 상이한 두께를 포함하되, 외각부의 두께와 중앙부의 두께가 상이하게 형성된다.The contact sheet 100 according to the present invention may be used for a socket structure for performing a test of a predetermined device 300. Accordingly, the socket structure may comprise a contact sheet 100 according to the present invention. Therefore, the socket structure according to the present invention has the socket body 200 and the socket pattern 210 provided in the socket body 200 and composed of predetermined electrodes, and further include the contact sheet 100 as described above. Can be. In this case, the socket pattern 210 is electrically connected in contact with the contact pattern 120 provided in the contact sheet 100, the contact sheet 100 includes a different thickness as described above, the outer shell The thickness of the part and the thickness of the center part are formed differently.

이에 따라서, 소켓 구조체의 상면의 높이가 중앙부와 외각부가 상이하게 형성되며, 상술한 바와 같이 외각 부분과 내측부의 전극 패턴(310)의 간격 차이에 따른 접촉 불량이 용이하게 방지될 수 있다. 이때, 각각의 도면은 외주부의 두께가 중앙부보다 두꺼운 경우, 및 외주부의 두께가 중앙부보다 얇은 경우를 각각 나타낸다. 아울러, 도 10 은 상술한, 본 발명에 따른 컨택 시트(100)가 상부 필름(140)을 포함하는 실시 형태를 나타낸다.Accordingly, the height of the upper surface of the socket structure is different from the center portion and the outer portion, and as described above, poor contact due to the difference between the outer portion and the electrode pattern 310 of the inner portion can be easily prevented. At this time, each of the figures shows the case where the thickness of the outer peripheral portion is thicker than the center portion, and the case where the thickness of the outer peripheral portion is thinner than the central portion, respectively. In addition, FIG. 10 shows an embodiment in which the contact sheet 100 according to the present invention described above includes the upper film 140.

바람직하게는, 상기 컨택 시트(100)와 소켓 본체(200) 사이에 배치되는 컨택 필름(400);을 더 포함하며, 상기 컨택 필름(400)은, 본체를 구성하며 절연성 재질로 구성되고 소정의 면적을 갖는 필름 바디; 및 상기 필름 바디에 배열되며 상기 컨택 시트(100)의 컨택 패턴(120), 및 상기 소켓 본체(200)의 소켓 패턴(210)과 접촉하여 전기적으로 연결되는 복수의 필름 패턴; 를 구비하며, 상기 컨택 패턴(120)은, 도전성 탄성 영역을 구성할 수 있다.Preferably, further comprising a contact film 400 disposed between the contact sheet 100 and the socket body 200, wherein the contact film 400, the body is composed of an insulating material and predetermined A film body having an area; And a plurality of film patterns arranged on the film body and electrically connected to the contact patterns 120 of the contact sheet 100 and the socket patterns 210 of the socket body 200. The contact pattern 120 may include a conductive elastic region.

컨택 필름(400)은 소정의 면적 및 두께를 갖는 얇은 시트 형태의 부재로서, 절연성 재질로 구성되는 필름 바디, 및 상기 필름 바디에 배열되며 전도성을 갖는 필름 패턴을 포함할 수 있다. 필름 패턴은 상기 소켓 본체(200)에 형성된 소켓 패턴과 상기 컨택 시트에 형성된 컨택 패턴 사이에 배치되어 이를 전기적으로 연결할 수 있다. 바람직하게는, 상기 필름 바디는, 실리콘 고무을 포함하며, 상기 필름 패턴은, 실리콘과 실리콘 내에 함유된 전도성 분말의 혼합체로 구성될 수 있다. 이에 따라서, 상기 필름 패턴은 접촉 압력에 따라서 통전이 가능한 구성을 가질 수 있고, 탄성을 갖는 도전성 탄성 영역으로 구성됨에 따라서, 단자와 디바이스 사이의 전기적 접촉에 따른 압력 및 그에 따른 스크래치 및 파손 발생을 방지할 수 있다.The contact film 400 is a member in the form of a thin sheet having a predetermined area and thickness, and may include a film body made of an insulating material, and a film pattern arranged on the film body and having conductivity. The film pattern may be disposed between the socket pattern formed on the socket body 200 and the contact pattern formed on the contact sheet to electrically connect them. Preferably, the film body comprises a silicone rubber, the film pattern may be composed of a mixture of silicon and conductive powder contained in the silicon. Accordingly, the film pattern may have a configuration capable of energizing according to the contact pressure, and is composed of a conductive elastic region having elasticity, thereby preventing pressure and electrical damage caused by electrical contact between the terminal and the device. can do.

아울러, 상기 필름 바디는 부분적으로 관통된 관통 영역을 가지며, 상기 필름 패턴은 상기 관통 영역에 배치될 수 있다. 즉, 상기 필름 바디는 부분적으로 관통된 관통 영역을 갖되, 상기 필름 패턴을 형성하는 재질이 상기 관통 영역에 배치되어 도전성 탄성 영역을 형성할 수 있다.In addition, the film body may have a partially penetrated through area, and the film pattern may be disposed in the through area. That is, the film body may have a partially penetrated through region, and a material forming the film pattern may be disposed in the through region to form a conductive elastic region.

상기와 같은 구성을 가짐에 따라서, 본 발명의 일 실시예에 따른 소켓 구조체는 피검사 디바이스 사이의 연결을 용이하게 달성할 수 있다.With such a configuration, the socket structure according to an embodiment of the present invention can easily achieve the connection between the device under test.

도 13 내지 도 15 는 본 발명의 일 실시예에 따른 컨택 시트(100)를 제조하는 방법을 단계적으로 나타낸 도면이다.13 to 15 are steps illustrating a method for manufacturing a contact sheet 100 according to an embodiment of the present invention.

먼저, 소정의 몰드(M)를 마련한다. 이때, 몰드(M)는 본 발명에 따른 컨택 시트(100)의 형상에 적합하도록 소정의 함몰부를 갖되, 컨택 시트(100)의 형상이 외각부와 중앙부가 상이한 두께를 갖는 형상을 갖는 것에 대응하여 적절한 함몰부의 형상을 가질 수 있다. 일 예로, 외각부의 두께가 얇은 컨택 시트(100)를 제조하기 위해서, 도 13 내지 도 15 에 도시된 바와 같이, 내측이 깊게 함몰된 함몰부로 구성된 형성 틀(P)을 가질 수 있으며, 반대의 경우, 도시되지는 아니하였으나, 내측이 얇고 외각부가 깊게 함몰된 함몰부를 갖는 형성 틀(P)이 마련될 수 있다. First, the predetermined mold M is prepared. At this time, the mold (M) has a predetermined depression so as to suit the shape of the contact sheet 100 according to the present invention, the contact sheet 100 has a shape having a shape having a different thickness of the outer portion and the center portion It may have the shape of an appropriate depression. For example, in order to manufacture a contact sheet 100 having a thin outer portion, as shown in FIGS. 13 to 15, the inner side may have a forming frame P formed of a recessed portion deeply recessed, and vice versa. Although not shown, a forming frame P having a recessed portion in which the inner side is thin and the outer portion is deeply recessed may be provided.

이어서, 상기 형성 틀(P) 내에 실리콘(S) 등을 주입하여 본 발명에 따른 컨택 시트(100)를 형성한다. 이때, 상기 실리콘(S)은 상술한 바와 같이 합성 수지 등을 포함할 수 있고, 형성 틀(P) 내에 주입된 상태에서 열, 또는 각종 공정 등에 의해 경화되어 본 발명에 따른 컨택 시트(100)가 제조될 수 있다.Subsequently, silicon (S) or the like is injected into the forming mold P to form the contact sheet 100 according to the present invention. At this time, the silicon (S) may include a synthetic resin or the like as described above, and the contact sheet 100 according to the present invention is cured by heat or various processes in the state injected into the forming mold (P) Can be prepared.

이때, 상기 몰드(M)에 형성된 상기 형성 틀(P)에는 소정의 몰드 핀(Q)이 구비될 수 있다. 상기 몰드 핀(Q)은 예컨대 소정의 전류 등이 인가되어 전기장 등을 형성할 수 있는 부재로서, 상기 형성 틀(P)에 복수 개 구비되어 배치될 수 있다.In this case, a predetermined mold pin Q may be provided in the forming mold P formed in the mold M. For example, the mold pin Q is a member capable of applying an electric current or the like to form an electric field. The mold pin Q may be provided in plurality in the forming mold P.

아울러, 이때, 상기 형성 틀(P)에 주입되는 액상 실리콘(S)에는 상술한 전도성 분말(122)이 함유될 수 있다. 전도성 분말(122)은 액상의 실리콘(S) 내에 함유되어 있을 수 있고, 상술한 바와 같이 전기장 등에 의해 그 분포가 제어되도록 구성될 수 있다.In addition, in this case, the above-described conductive powder 122 may be contained in the liquid silicon S injected into the forming mold P. The conductive powder 122 may be contained in the liquid silicon (S), and may be configured to control its distribution by an electric field or the like as described above.

상기와 같이 형성 틀(P)에 전도성 분말(122)이 함유된 액상의 실리콘(S)을 주입한 후, 경화하기 전에 상기 몰드 핀(Q)에 자기장을 인가하여 상기 몰드 핀(Q)이 형성된 영역에 상기 전도성 분말(122)이 집중적으로 분포하도록 할 수 있다. 이에 따라서, 전도성 분말(122)이 집중적으로 분포된 영역에 상기 컨택 패턴(120)이 형성되어 본 발명에 따른 컨택 시트(100)가 제조될 수 있다.After injecting the liquid silicon S containing the conductive powder 122 into the forming mold P as described above, the mold pin Q is formed by applying a magnetic field to the mold pin Q before curing. The conductive powder 122 may be concentrated in a region. Accordingly, the contact pattern 120 may be formed in a region where the conductive powder 122 is concentrated, so that the contact sheet 100 according to the present invention may be manufactured.

이상에서는 바람직한 실시예에 대하여 도시하고 설명하였지만, 본 발명은 상술한 특정의 실시예에 한정되지 아니하며, 청구범위에서 청구하는 본 발명의 요지를 벗어남이 없이 당해 발명이 속하는 기술분야에서 통상의 지식을 가진자에 의해 다양한 변형실시가 가능한 것은 물론이고, 이러한 변형실시들은 본 발명의 기술적 사상이나 전망으로부터 개별적으로 이해되어져서는 안될 것이다.Although the preferred embodiments have been illustrated and described above, the invention is not limited to the specific embodiments described above, and does not depart from the gist of the invention as claimed in the claims. Various modifications can be made by the vibrator, and these modifications should not be understood individually from the technical idea or the prospect of the present invention.

Claims (11)

소정의 배열을 갖는 전극 패턴을 갖는 피검사 디바이스와 접촉하여 상기 피검사 디바이스와 전기적으로 연결되는 컨택 시트에 있어서,A contact sheet in contact with a device under test having an electrode pattern having a predetermined arrangement and electrically connected to the device under test, 상기 컨택 시트는 소정의 면적 및 두께를 갖는 시트 형태로 구성되되,The contact sheet is configured in the form of a sheet having a predetermined area and thickness, 본체를 구성하며 절연성 재질로 구성되고 소정의 면적을 갖는 시트 바디;및A seat body constituting the main body and made of an insulating material and having a predetermined area; and 상기 시트 바디에 배열되며 피검사 디바이스의 전극 패턴과 전기적으로 연결되는 복수의 컨택 패턴;을 구비하고,A plurality of contact patterns arranged on the sheet body and electrically connected to the electrode patterns of the device under test; 상기 컨택 시트는,The contact sheet, 외각부의 두께와 중앙부의 두께가 상이하게 형성된 컨택 시트.The contact sheet is formed in which the thickness of the outer portion and the thickness of the center portion is different. 제1항에 있어서,The method of claim 1, 상기 컨택 시트는,The contact sheet, 외각부에서 중앙부로 갈수록 두께가 두꺼워지도록 구성된 컨택 시트.A contact sheet configured to be thicker from the outer portion to the center portion. 제1항에 있어서,The method of claim 1, 상기 컨택 시트는,The contact sheet, 외각부에서 중앙부로 갈수록 두께가 얇아지도록 구성된 컨택 시트.A contact sheet configured to become thinner from the outer portion to the center portion. 제1항에 있어서,The method of claim 1, 상기 컨택 시트는,The contact sheet, 상면 및 하면 중 적어도 하나의 단면 형상이 라운딩되어 곡률을 갖게 형성된 컨택 시트.A contact sheet formed by rounding a cross-sectional shape of at least one of an upper surface and a lower surface to have a curvature. 제1항에 있어서,The method of claim 1, 상기 컨택 시트는,The contact sheet, 편평한 하면과,Flat bottom surface, 외각부에서 중앙부로 갈수록 상승하여 볼록면을 갖거나, 또는 외각부에서 중앙부로 갈수록 하강하여 오목면을 갖게 구성된 상면을 갖게 형성된 컨택 시트.A contact sheet having a top surface configured to have a convex surface ascending from the outer portion to the center portion, or to have a concave surface as it descends from the outer portion to the center portion. 제1항에 있어서,The method of claim 1, 상기 컨택 패턴은,The contact pattern is, 탄성 절연물질 내에 전도성 분말이 함유되어 구성된 컨택 시트.A contact sheet comprising conductive powder in an elastic insulating material. 제1항에 있어서,The method of claim 1, 상기 컨택 시트는,The contact sheet, 상면을 커버하는 상부 필름;을 더 포함하는 컨택 시트.The upper sheet to cover the upper surface; contact sheet further comprising. 소정의 배열을 갖는 전극 패턴을 갖는 피검사 디바이스와 접촉하여 상기 피검사 디바이스과 전기적으로 연결되는 소켓 구조체에 있어서,A socket structure in electrical contact with a device under test in contact with a device under test having an electrode pattern having a predetermined arrangement, 소정의 소켓 패턴을 갖는 소켓 본체;A socket body having a predetermined socket pattern; 상기 소켓 본체 상에 배치되는 컨택 시트;를 포함하며,And a contact sheet disposed on the socket body. 상기 컨택 시트는 소정의 면적 및 두께를 갖는 시트 형태로 구성되되,The contact sheet is configured in the form of a sheet having a predetermined area and thickness, 본체를 구성하며 절연성 재질로 구성되고 소정의 면적을 갖는 시트 바디;및A seat body constituting the main body and made of an insulating material and having a predetermined area; and 상기 바디에 배열되며 피검사 디바이스의 전극 패턴 및 상기 소켓 본체의 소켓 패턴과 전기적으로 연결되는 복수의 컨택 패턴;을 구비하고,And a plurality of contact patterns arranged on the body and electrically connected to the electrode pattern of the device under test and the socket pattern of the socket body. 상기 컨택 시트는,The contact sheet, 외각부의 두께와 중앙부의 두께가 서로 상이하게 형성된 소켓 구조체.A socket structure in which the thickness of the outer portion and the thickness of the center portion are different from each other. 제8항에 있어서,The method of claim 8, 상기 컨택 시트와 소켓 본체 사이에 배치되는 컨택 필름;을 더 포함하며,It further comprises a contact film disposed between the contact sheet and the socket body, 상기 컨택 필름은,The contact film, 본체를 구성하며 절연성 재질로 구성되고 소정의 면적을 갖는 필름 바디;및A film body constituting the body and made of an insulating material and having a predetermined area; and 상기 필름 바디에 배열되며 상기 컨택 시트의 컨택 패턴, 및 상기 소켓 본체의 소켓 패턴과 접촉하여 전기적으로 연결되는 복수의 컨택 패턴;를 구비하며,And a plurality of contact patterns arranged on the film body and electrically connected to the contact patterns of the contact sheet and the socket patterns of the socket body. 상기 컨택 패턴은,The contact pattern is, 도전성 탄성 영역을 구성하는 소켓 구조체.A socket structure forming a conductive elastic region. 제9항에 있어서,The method of claim 9, 상기 컨택 패턴은,The contact pattern is, 탄성 절연물질 내에 전도성 분말이 혼합되어 구성된 소켓 구조체.A socket structure composed of a conductive powder mixed in an elastic insulating material. 제9항에 있어서,The method of claim 9, 상기 필름 바디는 부분적으로 관통된 관통 영역을 가지며,The film body has a partially penetrated through area, 상기 컨택 패턴은 상기 관통 영역에 배치되는 소켓 구조체.And the contact pattern is disposed in the through area.
PCT/KR2015/005451 2014-06-05 2015-06-01 Contact sheet and socket structure Ceased WO2015186932A1 (en)

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