[go: up one dir, main page]

WO2008139788A1 - 有機エレクトロルミネッセンス素子の製造方法及び有機エレクトロルミネッセンス素子の製造装置 - Google Patents

有機エレクトロルミネッセンス素子の製造方法及び有機エレクトロルミネッセンス素子の製造装置 Download PDF

Info

Publication number
WO2008139788A1
WO2008139788A1 PCT/JP2008/056577 JP2008056577W WO2008139788A1 WO 2008139788 A1 WO2008139788 A1 WO 2008139788A1 JP 2008056577 W JP2008056577 W JP 2008056577W WO 2008139788 A1 WO2008139788 A1 WO 2008139788A1
Authority
WO
WIPO (PCT)
Prior art keywords
organic electroluminescence
substrate
electroluminescence element
layer
manufacturing organic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/056577
Other languages
English (en)
French (fr)
Inventor
Yoshikazu Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Silver Seiko Ltd
SO KEN Co Ltd
Original Assignee
Silver Seiko Ltd
SO KEN Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Silver Seiko Ltd, SO KEN Co Ltd filed Critical Silver Seiko Ltd
Publication of WO2008139788A1 publication Critical patent/WO2008139788A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

　本発明の有機エレクトロルミネッセンス素子の製造方法は、基板１２と、基板１２上に形成され、陽極１４、正孔輸送層１６、有機発光層１８、電子輸送層２０及び陰極２４を有する積層構造体と、封止膜２６とを備える有機エレクトロルミネッセンス素子１０の製造方法であって、基板までの距離が１５ｍｍ以下の位置に配置したノズルから気化材料を基板に向けて吐出することにより、有機発光層１８を形成する有機発光層形成工程を含む。 　本発明によれば、有機エレクトロルミネッセンス素子の長寿命化を図ることが可能で、かつ、従来よりも製造コストを安価なものにすることが可能となる。
PCT/JP2008/056577 2007-05-16 2008-04-02 有機エレクトロルミネッセンス素子の製造方法及び有機エレクトロルミネッセンス素子の製造装置 Ceased WO2008139788A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007130949A JP4881789B2 (ja) 2007-05-16 2007-05-16 有機エレクトロルミネッセンス素子の製造方法及び有機エレクトロルミネッセンス素子の製造装置
JP2007-130949 2007-05-16

Publications (1)

Publication Number Publication Date
WO2008139788A1 true WO2008139788A1 (ja) 2008-11-20

Family

ID=40002011

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/056577 Ceased WO2008139788A1 (ja) 2007-05-16 2008-04-02 有機エレクトロルミネッセンス素子の製造方法及び有機エレクトロルミネッセンス素子の製造装置

Country Status (3)

Country Link
JP (1) JP4881789B2 (ja)
TW (1) TW200847845A (ja)
WO (1) WO2008139788A1 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012147493A1 (ja) * 2011-04-26 2012-11-01 日東電工株式会社 有機ｅｌ素子の製造方法及び製造装置
US20130288402A1 (en) * 2010-12-28 2013-10-31 Nitto Denko Corporation Organic el device manufacturing method and apparatus
CN103503567A (zh) * 2011-10-24 2014-01-08 日东电工株式会社 有机el器件的制造方法及制造装置
US9224953B2 (en) 2011-10-19 2015-12-29 Nitto Denko Corporation Method and apparatus for manufacturing organic el device
JP2016111016A (ja) * 2014-12-03 2016-06-20 ユニバーサル ディスプレイ コーポレイション Ｏｌｅｄの作製方法
CN118625875A (zh) * 2024-08-13 2024-09-10 国鲸科技(广东横琴粤澳深度合作区)有限公司 一种用于柔性发光材料制备的喷淋头的电路温控系统

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5326098B2 (ja) * 2009-02-05 2013-10-30 シャープ株式会社 基板表面の封止装置と有機ｅｌパネルの製造方法
JP5772826B2 (ja) * 2010-07-16 2015-09-02 コニカミノルタ株式会社 有機エレクトロルミネッセンス素子の製造方法
JP5694023B2 (ja) * 2011-03-23 2015-04-01 小島プレス工業株式会社 積層構造体の製造装置
JP2013179019A (ja) * 2012-02-02 2013-09-09 Nitto Denko Corp ガイド部材、ガイド機構及び有機ｅｌデバイスの製造方法
JP5284443B2 (ja) * 2011-10-19 2013-09-11 日東電工株式会社 有機ｅｌデバイスの製造方法及び製造装置
JP5269970B2 (ja) * 2011-10-24 2013-08-21 日東電工株式会社 有機ｅｌデバイスの製造方法及び製造装置
JP5856871B2 (ja) * 2012-02-21 2016-02-10 日東電工株式会社 有機ｅｌデバイスの製造装置及び製造方法
JP5401583B2 (ja) 2012-06-11 2014-01-29 日東電工株式会社 有機ｅｌデバイスの製造方法、および、有機ｅｌデバイス
CN107464890B (zh) 2016-06-03 2020-04-28 清华大学 有机发光二极管制备方法和制备装置
WO2019064417A1 (ja) 2017-09-28 2019-04-04 シャープ株式会社 成膜方法及びそれを用いた表示装置の製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06326354A (ja) * 1993-05-13 1994-11-25 Denki Kagaku Kogyo Kk 有機電界発光素子の製造方法
JPH10105965A (ja) * 1996-09-27 1998-04-24 Fuji Photo Film Co Ltd 磁気記録媒体の製造方法および装置
JP2004103442A (ja) * 2002-09-11 2004-04-02 Ulvac Japan Ltd 有機ｅｌ素子及びその製造方法
WO2005040450A2 (en) * 2003-10-14 2005-05-06 Battelle Memorial Institute Method and apparatus for making an organic thin film
JP2006193545A (ja) * 2005-01-11 2006-07-27 Konica Minolta Medical & Graphic Inc 放射線像変換パネルの製造方法および蒸着装置
JP2006278021A (ja) * 2005-03-28 2006-10-12 Pioneer Electronic Corp 有機機能素子封止膜検査方法及び構造
WO2007026649A1 (ja) * 2005-08-29 2007-03-08 Matsushita Electric Industrial Co., Ltd. 蒸着ヘッド装置及び蒸着塗布方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004087130A (ja) * 2002-06-24 2004-03-18 Victor Co Of Japan Ltd 有機電界発光素子及びその製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06326354A (ja) * 1993-05-13 1994-11-25 Denki Kagaku Kogyo Kk 有機電界発光素子の製造方法
JPH10105965A (ja) * 1996-09-27 1998-04-24 Fuji Photo Film Co Ltd 磁気記録媒体の製造方法および装置
JP2004103442A (ja) * 2002-09-11 2004-04-02 Ulvac Japan Ltd 有機ｅｌ素子及びその製造方法
WO2005040450A2 (en) * 2003-10-14 2005-05-06 Battelle Memorial Institute Method and apparatus for making an organic thin film
JP2006193545A (ja) * 2005-01-11 2006-07-27 Konica Minolta Medical & Graphic Inc 放射線像変換パネルの製造方法および蒸着装置
JP2006278021A (ja) * 2005-03-28 2006-10-12 Pioneer Electronic Corp 有機機能素子封止膜検査方法及び構造
WO2007026649A1 (ja) * 2005-08-29 2007-03-08 Matsushita Electric Industrial Co., Ltd. 蒸着ヘッド装置及び蒸着塗布方法

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130288402A1 (en) * 2010-12-28 2013-10-31 Nitto Denko Corporation Organic el device manufacturing method and apparatus
WO2012147493A1 (ja) * 2011-04-26 2012-11-01 日東電工株式会社 有機ｅｌ素子の製造方法及び製造装置
CN103493593A (zh) * 2011-04-26 2014-01-01 日东电工株式会社 有机el元件的制造方法及制造装置
EP2704533A4 (en) * 2011-04-26 2014-12-17 Nitto Denko Corp METHOD AND DEVICE FOR PREPARING AN ORGANIC EL ELEMENT
CN103493593B (zh) * 2011-04-26 2016-08-17 日东电工株式会社 有机el元件的制造方法及制造装置
US9647224B2 (en) 2011-04-26 2017-05-09 Nitto Denko Corporation Method and apparatus for manufacturing organic EL device
US9224953B2 (en) 2011-10-19 2015-12-29 Nitto Denko Corporation Method and apparatus for manufacturing organic el device
CN103503567A (zh) * 2011-10-24 2014-01-08 日东电工株式会社 有机el器件的制造方法及制造装置
JP2016111016A (ja) * 2014-12-03 2016-06-20 ユニバーサル ディスプレイ コーポレイション Ｏｌｅｄの作製方法
CN118625875A (zh) * 2024-08-13 2024-09-10 国鲸科技(广东横琴粤澳深度合作区)有限公司 一种用于柔性发光材料制备的喷淋头的电路温控系统

Also Published As

Publication number Publication date
JP4881789B2 (ja) 2012-02-22
TW200847845A (en) 2008-12-01
JP2008287996A (ja) 2008-11-27

Similar Documents

Publication Publication Date Title
WO2008139788A1 (ja) 有機エレクトロルミネッセンス素子の製造方法及び有機エレクトロルミネッセンス素子の製造装置
WO2008149499A1 (ja) 有機ｅｌディスプレイパネルおよびその製造方法
WO2008149498A1 (ja) 有機ｅｌ素子、およびその製造方法
US10186674B2 (en) Thin-film device having barrier film and manufacturing method thereof
WO2009022555A1 (ja) 有機エレクトロルミネッセンス素子、製造方法及び塗布液
WO2008082665A3 (en) Process for forming an organic light-emitting diode and devices made by the process
CN106505159B (zh) 用于打印oled显示器件的凹槽结构及oled显示器件的制作方法
WO2008023322A3 (en) Electrochemical energy source, and method for manufacturing of such an electrochemical energy source
WO2007127870A3 (en) Organic light emitting diodes with structured electrodes
WO2007145975A3 (en) Process for forming an organic light-emitting diode and devices made by the process
WO2009022554A1 (ja) 有機エレクトロルミネッセンス素子及び製造方法
WO2009017032A1 (ja) バリア層つき基板、表示素子および表示素子の製造方法
WO2007127063A3 (en) Electroluminescent devices including organic eil layer
TW200711173A (en) Arrangement for an organic pin-type light-emitting diode and method for manufacturing
EP2184333A3 (en) Quantum dot electroluminescent device and method for fabricating the same
WO2008120453A1 (ja) 有機ｅｌパネルおよびその製造方法
WO2009022552A1 (ja) 金属ドープモリブデン酸化物層を含む有機エレクトロルミネッセンス素子及び製造方法
WO2008090969A1 (ja) 有機半導体コンポジット、有機トランジスタ材料ならびに有機電界効果型トランジスタ
JP2009117823A5 (ja)
CN105470408A (zh) 用于打印成膜工艺的凹槽结构及其制作方法
EP1763287A3 (en) A method for fabricating organic electroluminescent devices
WO2009022556A1 (ja) 有機エレクトロルミネッセンス素子及び製造方法
CN105519237B (zh) 顶部发射型有机电致发光显示装置的制造方法和顶部发射型有机电致发光显示装置形成用盖材
WO2009044675A1 (ja) 有機ｅｌ素子、有機ｅｌ素子製造方法
WO2007070529A3 (en) Electrode stacks for electroactive devices and methods of fabricating the same

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08739688

Country of ref document: EP

Kind code of ref document: A1

DPE1 Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101)
NENP Non-entry into the national phase

Ref country code: DE

DPE1 Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101)
122 Ep: pct application non-entry in european phase

Ref document number: 08739688

Country of ref document: EP

Kind code of ref document: A1