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WO2009017032A1 - バリア層つき基板、表示素子および表示素子の製造方法 - Google Patents

バリア層つき基板、表示素子および表示素子の製造方法 Download PDF

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Publication number
WO2009017032A1
WO2009017032A1 PCT/JP2008/063298 JP2008063298W WO2009017032A1 WO 2009017032 A1 WO2009017032 A1 WO 2009017032A1 JP 2008063298 W JP2008063298 W JP 2008063298W WO 2009017032 A1 WO2009017032 A1 WO 2009017032A1
Authority
WO
WIPO (PCT)
Prior art keywords
display element
substrate
barrier layer
manufacturing
element manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/063298
Other languages
English (en)
French (fr)
Inventor
Shinichi Morishima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Chemical Co Ltd
Original Assignee
Sumitomo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co Ltd filed Critical Sumitomo Chemical Co Ltd
Priority to CN200880101003A priority Critical patent/CN101765870A/zh
Priority to KR1020107002110A priority patent/KR101462704B1/ko
Priority to EP08791550A priority patent/EP2184727A4/en
Priority to US12/671,102 priority patent/US9012017B2/en
Publication of WO2009017032A1 publication Critical patent/WO2009017032A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/23—Sheet including cover or casing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24851—Intermediate layer is discontinuous or differential

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)

Abstract

　本発明に係るバリア層つき基板（１０）は、基板（１１）上にバリア層（１２）が形成されてなるバリア層つき基板（１０）と、該バリア層つき基板（１０）のバリア層（１２）上に形成されてなる複数の表示エレメント（１３）と、該表示エレメント（１３）上に該表示エレメント（１３）を覆うように形成されている上部多層封止膜（１５）とを有してなる表示素子に用いられるバリア層つき基板（１０）であって、前記バリア層（１２）が複数に分割パターニングされて前記基板（１１）上に形成されていることを特徴とする。本発明のバリア層つき基板（１０）を用いて本発明の長寿命な表示素子が製造される。
PCT/JP2008/063298 2007-07-31 2008-07-24 バリア層つき基板、表示素子および表示素子の製造方法 Ceased WO2009017032A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN200880101003A CN101765870A (zh) 2007-07-31 2008-07-24 附阻障层基板、显示元件以及显示元件的制造方法
KR1020107002110A KR101462704B1 (ko) 2007-07-31 2008-07-24 배리어층 부착 기판, 표시 소자 및 표시 소자의 제조 방법
EP08791550A EP2184727A4 (en) 2007-07-31 2008-07-24 SUBSTRATE WITH A BARRIER LAYER, DISPLAY ELEMENT AND DISPLAY ELEMENT MANUFACTURING METHOD
US12/671,102 US9012017B2 (en) 2007-07-31 2008-07-24 Barrier layer-attached substrate, display component, and method for manufacturing display component

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-199906 2007-07-31
JP2007199906A JP5296343B2 (ja) 2007-07-31 2007-07-31 バリア層つき基板、表示素子および表示素子の製造方法

Publications (1)

Publication Number Publication Date
WO2009017032A1 true WO2009017032A1 (ja) 2009-02-05

Family

ID=40304262

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/063298 Ceased WO2009017032A1 (ja) 2007-07-31 2008-07-24 バリア層つき基板、表示素子および表示素子の製造方法

Country Status (7)

Country Link
US (1) US9012017B2 (ja)
EP (1) EP2184727A4 (ja)
JP (1) JP5296343B2 (ja)
KR (1) KR101462704B1 (ja)
CN (1) CN101765870A (ja)
TW (1) TWI462633B (ja)
WO (1) WO2009017032A1 (ja)

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KR101239575B1 (ko) * 2010-08-16 2013-03-05 고려대학교 산학협력단 기체 차단막 형성 장치 및 그 방법
JP5836974B2 (ja) * 2010-12-07 2015-12-24 東京エレクトロン株式会社 表示デバイス製造装置、表示デバイスの製造方法
FR2973939A1 (fr) 2011-04-08 2012-10-12 Saint Gobain Element en couches pour l’encapsulation d’un element sensible
JP2013073880A (ja) * 2011-09-29 2013-04-22 Ulvac Japan Ltd 発光素子の製造方法
US9112181B2 (en) 2012-02-07 2015-08-18 Panasonic Corporation Composite substrate, manufacturing method of the same and organic electroluminescence device
JP2013186984A (ja) * 2012-03-07 2013-09-19 Panasonic Corp 複合基板構造及びその作製方法、並びに、有機エレクトロルミネッセンス素子
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KR20140094916A (ko) * 2013-01-23 2014-07-31 삼성디스플레이 주식회사 표시 장치
WO2014115825A1 (ja) * 2013-01-25 2014-07-31 富士フイルム株式会社 有機電子デバイス
US9368749B2 (en) 2013-03-12 2016-06-14 Samsung Sdi Co., Ltd. Patterned multilayered stack, and system and method for making the same
CN103247233B (zh) * 2013-04-28 2015-09-23 京东方科技集团股份有限公司 柔性基板、显示装置及在柔性基板上贴附电子器件的方法
KR102133433B1 (ko) * 2013-05-24 2020-07-14 삼성디스플레이 주식회사 유기 발광 표시 장치, 이를 포함하는 전자 기기, 및 유기 발광 표시 장치의 제조 방법
KR20170036701A (ko) 2014-07-25 2017-04-03 카티바, 인크. 유기 박막 잉크 조성물 및 방법
US9991326B2 (en) 2015-01-14 2018-06-05 Panasonic Intellectual Property Management Co., Ltd. Light-emitting device comprising flexible substrate and light-emitting element
WO2016132721A1 (ja) * 2015-02-19 2016-08-25 シャープ株式会社 有機ｅｌ表示装置
JP2016186911A (ja) * 2015-03-27 2016-10-27 パイオニア株式会社 発光装置
JP6474337B2 (ja) 2015-08-27 2019-02-27 株式会社ジャパンディスプレイ 表示装置及びその製造方法
CN107922766A (zh) 2015-08-31 2018-04-17 科迪华公司 基于二‑和单(甲基)丙烯酸酯的有机薄膜油墨组合物
JP6396879B2 (ja) * 2015-11-20 2018-09-26 株式会社ジャパンディスプレイ 表示装置
KR102513210B1 (ko) * 2015-12-31 2023-03-22 엘지디스플레이 주식회사 플렉서블 표시장치 및 그의 제조방법
CN106158740A (zh) * 2016-09-26 2016-11-23 昆山工研院新型平板显示技术中心有限公司 柔性衬底基板和柔性oled显示器的制备方法
KR101989086B1 (ko) * 2017-01-25 2019-06-14 한국생산기술연구원 Ｏｌｅｄ 조명 소자 및 그 제조 방법
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Title
See also references of EP2184727A4

Also Published As

Publication number Publication date
EP2184727A1 (en) 2010-05-12
JP5296343B2 (ja) 2013-09-25
TW200915909A (en) 2009-04-01
TWI462633B (zh) 2014-11-21
EP2184727A4 (en) 2011-11-23
KR101462704B1 (ko) 2014-11-17
CN101765870A (zh) 2010-06-30
US9012017B2 (en) 2015-04-21
KR20100055395A (ko) 2010-05-26
JP2009037798A (ja) 2009-02-19
US20100196679A1 (en) 2010-08-05

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