WO2012147493A1 - 有機el素子の製造方法及び製造装置 - Google Patents
有機el素子の製造方法及び製造装置 Download PDFInfo
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- WO2012147493A1 WO2012147493A1 PCT/JP2012/059439 JP2012059439W WO2012147493A1 WO 2012147493 A1 WO2012147493 A1 WO 2012147493A1 JP 2012059439 W JP2012059439 W JP 2012059439W WO 2012147493 A1 WO2012147493 A1 WO 2012147493A1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2101/00—Properties of the organic materials covered by group H10K85/00
Definitions
- the present invention relates to a method and an apparatus for manufacturing an organic EL element having an organic layer on an electrode layer formed on a base material and emitting light from the organic layer.
- organic EL (electroluminescence) elements have attracted attention as elements used in next-generation low power consumption light-emitting display devices.
- the organic EL element basically has at least one organic layer including a light emitting layer made of an organic light emitting material and a pair of electrodes.
- Such an organic EL element is derived from an organic light emitting material, and can emit light of various colors. Further, since it is a self-luminous element, it has been attracting attention as a display application such as a television (TV).
- An organic EL element is configured such that at least one organic layer including a light emitting layer is sandwiched between two electrode layers having opposite electrodes to each other (sandwich structure), and each organic layer has a thickness of several nm to several tens. nm organic film.
- the organic layer sandwiched between the electrode layers is supported on a substrate, and an organic EL element is formed by laminating an anode layer, an organic layer, and a cathode layer in this order on the substrate. It has become.
- the organic layers are sequentially stacked on the anode layer.
- a vacuum deposition method or a coating method is generally known as a method for forming (forming) each organic layer on the anode layer formed on the substrate.
- vacuum deposition is mainly used because the purity of the material for forming the organic layer (organic layer forming material) can be increased and a long life can be easily obtained.
- an organic layer is formed by performing vapor deposition using a vapor deposition source provided at a position facing the substrate in the vacuum chamber of the vapor deposition apparatus.
- a deposition source is provided.
- the organic layer forming material is heated and vaporized by a heating unit arranged in the vapor deposition source, and the vaporized organic layer forming material (vaporized material) is discharged from a nozzle provided in the vapor deposition source. Then, an organic layer forming material is vapor-deposited on the anode layer by depositing on the anode layer formed on the substrate.
- the batch process is a process in which an organic layer is deposited on the anode layer for each substrate on which the anode layer is formed.
- the roll process refers to a surface of a can roll that continuously feeds a belt-like base material formed with an anode layer and wound in a roll shape (so-called roll-to-roll) and rotationally drives the fed base material.
- This is a process in which each organic layer is continuously deposited on the anode layer while being supported and moved along with its rotation, and the substrate on which each organic layer is deposited is wound up in a roll shape.
- the emission color varies from the desired emission color, and a low-quality organic EL element may be manufactured in some cases.
- the flow rate correction member parallel to the moving direction of the base material is used to reduce the difference in the adhesion amount of the organic layer forming material between the center portion and both end portions in the width direction of the base material. It has been proposed that the organic layer forming material is divided into two or more regions in the width direction, and the organic layer forming material is ejected through the slit formed by the flow rate correcting member to adhere to the substrate (see Patent Document 2).
- the opening area of the nozzle is substantially reduced by the amount shielded by the flow rate correction member, so that the formation rate of the organic layer is reduced and the production efficiency of the organic EL element is reduced. There is a risk of inviting.
- the present invention provides an organic EL element that can efficiently manufacture a high-quality organic EL element in which the variation in emission color is suppressed while the distance between the base material and the vapor deposition source is shortened. It is an object to provide a method and a manufacturing apparatus.
- the present inventors diligently studied and found that the width of the nozzle opening (nozzle opening width in the direction perpendicular to the moving direction of the base material) W and the organic layer formed on the base material
- the emission width width in the direction perpendicular to the moving direction of the base material in the light emitting region
- the manufacturing method of the organic EL element according to the present invention is as follows: A method for manufacturing an organic EL element, A vapor deposition step of forming an organic layer on a substrate that moves relative to the nozzle by discharging the vaporized organic layer forming material from the nozzle; The vapor deposition step is performed so as to form a light emitting region made of the organic layer and having a width A (mm) in a direction perpendicular to the substrate moving direction, and When the length of the nozzle opening in the direction perpendicular to the substrate moving direction is W (mm) and the distance between the opening and the substrate is h (mm), the formula W ⁇ A + 2 ⁇ h (provided that H ⁇ 5 mm).
- the manufacturing apparatus of the organic EL element which concerns on this invention is An apparatus for manufacturing an organic EL element, A vapor deposition source for forming an organic layer on a substrate that moves relative to the nozzle by discharging the vaporized organic layer forming material from the nozzle, The organic layer is configured to form a light emitting region having a width A (mm) in a direction perpendicular to the substrate movement direction, and When the length of the nozzle opening in the direction perpendicular to the substrate moving direction is W (mm) and the distance between the opening and the substrate is h (mm), the formula W ⁇ A + 2 ⁇ h (provided that H ⁇ 5 mm).
- FIG. 1 is a schematic side cross-sectional view schematically showing an organic EL element manufacturing apparatus according to an embodiment used in an organic EL element manufacturing method according to an embodiment of the present invention. It is a figure which shows an example of the arrangement
- FIG. 2 is a schematic side cross-sectional view schematically showing the layer configuration of an organic EL element, and shows a case where the organic layer is a single layer
- FIG. 2 is a schematic side cross-sectional view schematically showing the layer configuration of an organic EL element, and shows a case where the organic layer has three layers.
- FIG. 2 is a schematic side cross-sectional view schematically showing the layer configuration of an organic EL element, and shows a case where there are five organic layers
- the organic EL element manufacturing apparatus 1 is a vapor deposition apparatus having a vacuum chamber 3.
- a base material supply device 5 as a base material supply means and a canister are provided.
- a roll 7, a vapor deposition source 9, and a substrate recovery device 6 are disposed.
- the vacuum chamber 3 is decompressed by a vacuum generator (not shown) so that a vacuum region can be formed therein.
- the base material supply device 5 includes a supply roller 5 that feeds out a belt-like base material 21 wound up in a roll shape.
- the base material collecting device 6 includes a winding roller 6 that winds the fed base material 21. That is, the base material 21 fed out from the supply roller 5 is a so-called roll-to-roll system in which the base material 21 is supplied to the can roll 7 and then taken up by the take-up roller 6.
- the can roll 7 is made of cylindrical stainless steel and is driven to rotate.
- the can roll 7 is fed (supplied) from the supply roller 5 and is disposed at a position where the base material 21 wound around the take-up roller 6 is wound with a predetermined tension.
- the surface (front surface) supports the non-electrode layer side of the base material 21 (specifically, the side opposite to the side where the anode layer is provided). Further, by rotating the can roll 7 (counterclockwise in FIG. 1), the wound (supported) base material 21 can be moved together with the can roll 7 in the rotation direction. Yes.
- the can roll 7 preferably has a temperature adjustment mechanism such as a cooling mechanism inside, so that the temperature of the base 21 is stabilized during the formation of the organic layer on the base 21 described later. Can be made.
- the outer diameter of the can roll 7 can be set to 300 to 2000 mm, for example.
- the base material 21 is sequentially fed from the supply roller 5 according to the rotation, and the fed base material 21 is in contact with and supported by the peripheral surface of the can roll 7 in the rotation direction. While moving, the base material 21 away from the can roll 7 is taken up by the take-up roller 6.
- a flexible material that is not damaged even when wound around the can roll 7 is used.
- examples of such a material include a metal material, a non-metallic inorganic material, and a resin material. Can be mentioned.
- the metal material examples include alloys such as stainless steel and iron-nickel alloy, copper, nickel, iron, aluminum, and titanium.
- the iron-nickel alloy described above examples include 36 alloy and 42 alloy.
- the metal material is preferably stainless steel, copper, aluminum, or titanium from the viewpoint of easy application to a roll process.
- the thickness of the base material formed from such a metal material is preferably 5 to 200 ⁇ m from the viewpoints of handleability and base material winding property.
- non-metallic inorganic material examples include glass, and examples of the base material formed from the glass include thin film glass having flexibility.
- the thickness of the substrate formed from the nonmetallic inorganic material is preferably 5 to 500 ⁇ m from the viewpoint of sufficient mechanical strength and appropriate plasticity.
- the resin material examples include synthetic resins such as thermosetting resins and thermoplastic resins.
- synthetic resins include polyimide resins, polyester resins, epoxy resins, polyurethane resins, polystyrene resins, polyethylene resins, and polyamides.
- examples thereof include resins, acrylonitrile-butadiene-styrene (ABS) copolymer resins, polycarbonate resins, silicone resins, and fluorine resins.
- ABS acrylonitrile-butadiene-styrene
- the synthetic resin film can be used as the base material formed from a resin material.
- the thickness of the substrate is preferably 5 to 500 ⁇ m from the viewpoint of sufficient mechanical strength and appropriate plasticity.
- the width of the base material 21 is appropriately designed according to the size of the organic EL element to be formed and is not particularly limited, but is preferably 5 mm to 1000 mm, for example.
- anode layer 23 (see FIG. 2) is formed in advance by sputtering can be used.
- various transparent conductive materials such as indium-zinc oxide (IZO) and indium-tin oxide (ITO), and metals and alloy materials such as gold, silver, and platinum are used. be able to.
- the evaporation source 9 is for forming at least one organic layer (see FIG. 7) including the light emitting layer (organic layer 25a), and one or more evaporation sources 9 are provided depending on the organic layer to be formed.
- one vapor deposition source 9 is provided to form one organic layer 25a.
- the vapor deposition source 9 is disposed at a position facing the support region of the base material 21 on the peripheral surface of the can roll 7, and deposits a material for forming an organic layer (organic layer forming material 22) on the base material 21.
- the organic layer 25a (refer FIG. 2, FIG. 7) is formed on the anode layer 23 formed on the base material 21. As shown in FIG.
- the configuration of the vapor deposition source 9 is not particularly limited as long as it has a nozzle capable of discharging the organic layer forming material 22 vaporized by heating or the like toward the base material 21.
- the vapor deposition source 9 can accommodate the organic layer forming material 22, and has a nozzle 9a and a heating unit (not shown).
- the nozzle 9 a is disposed so as to face the support region of the base material 21 in the can roll 7.
- the heating unit heats and vaporizes the organic layer forming material 22, and the vaporized organic layer forming material 22 is discharged to the outside from the opening 9aa (see FIGS. 4 and 5) of the nozzle 9a. It is supposed to be.
- the opening 9aa is formed in a rectangular shape. Details of the size of the opening 9aa will be described later.
- the organic layer forming material 22 When the organic layer forming material 22 is heated in the vapor deposition source 9, the organic layer forming material 22 is vaporized, and the vaporized organic layer forming material 22 is discharged from the nozzle 9 a toward the base material 21. Then, it is deposited on the substrate 21. The vaporized organic layer forming material 22 is deposited on the base material 21, thereby forming an organic layer 25 a on the anode layer 23 formed on the base material 21 as shown in FIGS. 2 and 7A. Is done.
- the organic layer is not particularly limited as long as it has at least a light emitting layer (organic layer 25a), and a plurality of organic layers can be formed as necessary.
- a hole injection layer (organic layer 25b), a light emitting layer (organic layer 25a), and an electron injection layer (organic layer 25c) may be laminated in this order, and three organic layers may be laminated. it can.
- a hole transport layer organic layer 25d, see FIG. 7C
- four organic layers can be laminated by sandwiching an electron transport layer (organic layer 25e) (see FIG. 7C) between the light emitting layer (organic layer 25a) and the electron injection layer (organic layer 25c).
- an electron transport layer (organic layer 25e) between the layers (organic layer 25c) sandwiching an electron transport layer (organic layer 25e) between the layers (organic layer 25c), five organic layers can be stacked.
- the film thickness of each organic layer is usually designed to be about several nm to several tens of nm, but the film thickness is appropriately designed according to the organic layer forming material 22 and the light emission characteristics. There is no particular limitation.
- the light emitting layer for example, 4,4′-N, N′-dicarba doped with tris (8-hydroxyquinoline) aluminum (Alq3) or iridium complex (Ir (ppy) 3) is used. Zonylbiphenyl (CBP) or the like can be used.
- Examples of the material for forming the hole injection layer 25b include copper phthalocyanine (CuPc), 4,4′-bis [N-4- (N, N-di-m-tolylamino) phenyl] -N-phenyl. Amino] biphenyl (DNTPD) and the like can be used.
- CuPc copper phthalocyanine
- DNTPD Amino] biphenyl
- Examples of the material for forming the hole transport layer include 4,4′-bis [N- (1-naphthyl) -N-phenyl-amino] biphenyl ( ⁇ -NPD) and N, N′-diphenyl. -N, N'-bis (3-methylphenyl) -1,1'biphenyl-4,4'diamine (TPD) or the like can be used.
- lithium fluoride LiF
- cesium fluoride CsF
- lithium oxide Li 2 O
- Examples of the material for forming the electron transport layer include tris (8-hydroxyquinoline) aluminum (Alq3), bis (2-methyl-8-quinolinolato) -4-phenylphenolato-aluminum (BAlq), and OXD. -7 (1,3-bis [5- (p-tert-butylphenyl) -1,3,4-oxadiazol-2-yl]) benzene or the like can be used.
- one or more vapor deposition sources 9 can be arranged according to the laminated structure and the number of laminated organic layers formed on the anode layer 23 of the base material 21 as described above. For example, when three organic layers are stacked as shown in FIG. 7B, three evaporation sources can be arranged along the rotation direction of the can roll 7 as shown in FIG. When a plurality of vapor deposition sources 9 are provided along the rotation direction of the can roll 7 as described above, the first organic layer is formed on the anode layer 23 by the vapor deposition source 9 arranged on the most upstream side with respect to the rotation direction. Is deposited, the second and subsequent organic layers are sequentially deposited on the first organic layer by the vapor deposition source 9 on the downstream side and stacked.
- the cathode layer 27 aluminum (Al), magnesium (Mg), silver (Ag), ITO, an alkali metal, an alloy containing an alkaline earth metal, or the like can be used.
- the cathode layer 27 is formed in a rectangular shape smaller than the organic layer 25a in a portion overlapping the organic layer 25a.
- a vacuum film forming apparatus for forming the anode layer 23 on the upstream side of the vapor deposition source 9 for forming the organic layer with respect to the rotation direction of the can roll 7 and a vacuum film forming device for forming the cathode layer 27 on the downstream side. It is also possible to arrange the film device, deposit the anode layer 23 on the base material 21 that moves while being supported by the can roll 7, and then deposit the organic layer 25a and further form the cathode layer 27.
- the organic EL element 20 can also be formed by successively depositing the anode layer 23, the organic layer 25a, and the cathode layer 27 on the material 21 in this order.
- the organic EL element 20 formed as described above when an anode voltage and a cathode voltage are applied to the anode layer 23 and the cathode layer 27, respectively, current flows in the organic layer 25a.
- region which overlaps with both the anode layer 23 and the cathode layer 27 in the organic layer 25a light-emits in the orthogonal
- the width in the direction perpendicular to the moving direction of the base material 21 in the light emitting region R of the organic layer 25a is defined as a light emitting width A.
- the light emitted from the light emitting region R is emitted by passing through at least one of the anode layer 23 and the cathode layer 27, and the surface of the anode layer 23 or the surface of the cathode layer 27 is the surface of the organic EL element 20. A light emitting surface is formed.
- the length (opening width) W (mm) in the direction perpendicular to the moving direction of the base material 21 in the opening 9aa of the nozzle 9a, the light emission width A (mm) of the organic layer 25a, the opening 9aa and the base material The relationship with the distance h (mm) to 21 will be described. 4 is the width direction of the base material 21, the white arrow in FIG. 5 indicates the movement direction of the base material, and the vertical direction in FIG. 5 is the width direction (movement direction of the base material 21). Perpendicular direction). Further, hereinafter, “the width direction of the base material” may be simply referred to as “width direction”.
- the opening width of the nozzle 9a is W
- the light emission width of the organic layer 25 is A
- the distance between the opening 9aa and the substrate 21 is h.
- W, A, and h are designed to satisfy the expression W ⁇ A + 2 ⁇ h (where h ⁇ 5 mm).
- the vaporized organic layer forming material 22 can reach the base material 21 at a high density, so that the utilization efficiency of the organic layer forming material 22 can be improved. it can.
- the distance h is preferably 5 mm or less, and more preferably 3 mm or less.
- the nozzle 9a may be arranged at a position where the opening 9aa is separated from the base material 21 by the predetermined value.
- the amount of the organic layer forming material 22 attached can be increased at both ends in the width direction of the light emitting region R in the organic layer 25a. It is possible to reduce a difference in the amount of the organic layer forming material 22 between the central portion and both end portions, that is, a difference in film thickness.
- the variation in the film thickness (thickness) of the organic layer in the organic EL element 20 is suppressed, the difference in electrical characteristics and the difference in optical characteristics is reduced, and uneven luminance on the light emitting surface can be suppressed. Therefore, since the fluctuation
- the film thickness variation of the light emitting region R is small. Therefore, as described above, by reducing the variation in the thickness of the organic layer in the width direction of the light emitting region R, the variation in the thickness of the organic layer due to the ejection state is reduced over the entire light emitting region R. It becomes possible.
- the opening width W is not particularly limited as long as h is 5 mm or less and W ⁇ A + 2 ⁇ h is satisfied. However, if the opening width W is too small, an organic layer sufficient to form the light emitting region R may not be formed. If the opening width W is too large, the manufacturing apparatus may be increased in size and the cost may be increased. For example, if the opening width W is less than 5 mm, the light emitting area becomes narrow and the throughput may be reduced. If the opening width W exceeds 1000 mm, the apparatus may be increased in size and the apparatus cost may be increased. Therefore, for example, the opening width W can be appropriately designed in consideration of such a viewpoint.
- the opening width W is preferably 5 mm to 1000 mm, more preferably 5 mm to 100 mm, and more preferably 10 mm to 70 mm. More preferably, it is as follows. In addition, if the opening width W is larger than the width of the base material 21, the organic layer forming material 22 may be wastefully scattered. For this reason, for example, the opening width W is equal to or smaller than the width of the base material 21. It is preferable.
- the light emission width A is not particularly limited as long as h is 5 mm or less and W ⁇ A + 2 ⁇ h is satisfied. However, if A is too small, the light emitting region R may be too small and sufficient light emission as an organic EL element may not be obtained, and if it is too large, the yield may be reduced due to the mixing of minute foreign substances.
- the light emission width A has a property that it is designed according to the use in which the organic EL element is used. Therefore, for example, the light emission width A can be appropriately designed in consideration of such a viewpoint.
- the light emission width A is preferably 3 mm to 900 mm, more preferably 3 mm to 90 mm, and more preferably 5 mm to 60 mm. More preferably, it is as follows.
- the organic layer 25a is ejected from the nozzle 9a by ejecting the vaporized organic layer forming material 22 on the base material 21 that moves relative to the nozzle 9a.
- the vapor deposition step being performed so as to form a light emitting region R having a light emission width (a width in a direction perpendicular to the substrate movement direction) A composed of an organic layer 25a, and moving the substrate.
- the opening width W, the light emission width A, and the distance h are set in advance
- the nozzle 9a is arranged based on the set distance h, the anode layer 23, the organic layer 25a, and The size and positional relationship of the cathode layer 27 are set in advance.
- the numerical value of the distance h out of the opening width W, the light emission width A, and the distance h is set to a predetermined value at 5 mm or less. If the distance h is set first, the light emission width A and the opening width W are set so as to satisfy W ⁇ A + 2 ⁇ h. Next, the size of the light emitting region R is set so as to have the set light emission width A, and the sizes of the organic layer 25a, the anode layer 23, and the cathode layer 27 are set so that the light emitting region R is obtained.
- the formation position that is, the overlapping state
- the opening width W and the distance h are set so that the distance h is 5 mm or less and the formula W ⁇ A + 2 ⁇ h is satisfied.
- W is set, the light emission width A and the distance h are set so that the distance h is 5 mm or less and the formula W ⁇ A + 2 ⁇ h is satisfied.
- the anode layer 23 is formed in advance on one surface side by sputtering or the like, and the substrate 21 wound up in a roll shape is fed out from the substrate supply device 5.
- the vapor deposition source 9 disposed facing the can roll 7.
- the organic layer forming material 22 including the organic layer 25a (see FIG. 7) is vaporized, the vaporized organic layer forming material 22 is discharged from the nozzle 9a, and the anode layer 23 on the substrate 21 supported by the can roll 7 is used. Evaporate on top.
- the organic layer 25a can be formed on the substrate 21 so that h is 5 mm or less and the formula W ⁇ A + 2 ⁇ h is satisfied.
- the substrate 21 on which the organic layer 25a is formed is wound up by the winding roller 6.
- the cathode layer 27 on the organic layer 25a by a vapor deposition apparatus (not shown), the organic EL element 20 in which the anode layer 23, the organic layer 25a, and the cathode layer 27 are laminated on the base material 21 in this order. Can be formed.
- the film thickness variation of the organic layer 25a in the light emitting region R can be suppressed as described above.
- the variation in the thickness is ⁇ 10% or less. It is preferable to do. By setting the variation in the film thickness to be ⁇ 10% or less, it is possible to keep the luminance unevenness on the light emitting surface of the organic EL element 20 within 20%.
- the manufacturing method and the manufacturing apparatus of the organic EL element of the present invention are as described above, but the present invention is not limited to the above-described embodiments, and the design can be changed as appropriate within the scope of the present invention.
- the organic layer forming material 22 is vaporized in the vapor deposition source 9, but the organic layer forming material 22 vaporized by a separate apparatus is introduced into the vapor deposition source 9, and the nozzle of the vapor deposition source 9 is used. It can also be discharged from 9a.
- the base material supply apparatus 5 was arrange
- finished was wound up, it can also use for processes, such as cutting, without winding up this base material 21.
- region R is not specifically limited, Others
- the light emitting region R can also be designed by disposing an insulating layer between the organic layer 25a and the cathode layer 27 and forming the insulating layer in a rectangular shape smaller than the organic layer 25a.
- the case where the light emitting layer is vapor-deposited as the organic layer has been described.
- the case where the hole injection layer, the hole transport layer, the electron injection layer, and the electron transport layer are vapor-deposited as the organic layer The relationship between the opening width W of the vapor deposition source corresponding to each, the light emission width A of each organic layer, and the distance h between the opening of the nozzle of each vapor deposition source and the substrate 21 is the same as described above. Can be applied.
- one evaporation source is arranged in a vacuum chamber, and tris (8-hydroxyquinoline) aluminum (Alq3) is used as a material for forming an organic layer (light emitting layer).
- the opening width W of the nozzle 9a, the light emission width A of the organic layer, and the distance h between the opening and the substrate are variously changed as shown in Tables 1 to 3, so that the organic layer has a thickness of 100 nm. It formed so that it might become.
- the degree of vacuum in the chamber 3 was 5.0 ⁇ 10 ⁇ 5 Pa, and the heating temperature at the vapor deposition source was 300 ° C.
- the formed organic EL element was made to emit light by applying a voltage to the anode layer 23 and the cathode layer 27 so that the current density of the current flowing through the organic layer 25 was 7.5 mA / cm 2 .
- an organic EL characteristic evaluation device organic EL light emission efficiency measuring device, model EL-1003, manufactured by Precise Gauge Co., Ltd.
- luminance unevenness (maximum luminance ⁇ minimum luminance) / maximum luminance ⁇ 100 (%).
- Comparative Examples 1 to 7 it was recognized that those not satisfying the formula W ⁇ A + 2 ⁇ h (indicated by “x” in the table) are both large in film thickness error and luminance unevenness. .
- Comparative Examples 8 to 20 it was recognized that those not satisfying the formula W ⁇ A + 2 ⁇ h (indicated by “x” in the table) are both large in film thickness error and luminance unevenness. .
- Comparative Examples 21 to 27 those not satisfying the formula W ⁇ A + 2 ⁇ h (indicated by “x” in the table) were found to have both large film thickness error and luminance unevenness. .
- the organic EL element manufacturing method and the organic EL element manufacturing apparatus according to the present invention can suppress the variation in the film thickness of the organic layer formed on the base material 21 and the variation in the emission color of the organic EL element. It was found that can be suppressed.
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Abstract
Description
有機EL素子の製造方法であって、
気化された有機層形成材料をノズルから吐出させることにより、該ノズルに対して相対的に移動する基材上に有機層を形成する蒸着工程を含み、
前記蒸着工程を、前記有機層からなり基材移動方向に対して垂直な方向の幅A(mm)を有する発光領域を形成するようにして、且つ、
前記ノズルの開口部における前記基材移動方向と垂直方向の長さをW(mm)、前記開口部と前記基材との距離をh(mm)とするとき、式W≧A+2×h(但し、h≦5mmである。)を満たすようにして行なう。
有機EL素子の製造装置であって、
気化された有機層形成材料をノズルから吐出することにより、該ノズルに対して相対的に移動する基材上に有機層を形成する蒸着源を備え、
前記有機層からなり基材移動方向に対して垂直な方向の幅A(mm)を有する発光領域を形成するように構成され、且つ、
前記ノズルの開口部における前記基材移動方向と垂直方向の長さをW(mm)、前記開口部と前記基材との距離をh(mm)とするとき、式W≧A+2×h(但し、h≦5mmである。)を満たすように構成されている。
陽極層23を形成するための材料としては、インジウム-亜鉛酸化物(IZO)、インジウム-錫酸化物(ITO)等の各種透明導電材料や、金、銀、白金などの金属や合金材料を用いることができる。
有機層の膜厚変動を精度良く測定するために、基材上に直接有機層を形成し、形成された有機層の膜厚を測定し、測定結果から膜厚誤差を算出した。
陽極層として所定パターンのITOが形成された、幅70mm、長さ130mのフレキシブルガラス基板を用い、蒸着源を3つ用いて、該陽極層に有機層として、正孔注入層たるCuPcを膜厚25nm、正孔輸送層たるNPBを膜厚45nm、発光層たるAlq3を膜厚60nm、電子注入層たるLiFを膜厚0.5nm、陰極層たるAlを膜厚10nmとなるようにこの順で、基材上に順次形成した。また、一連のCuPc、NPB及びAlq3の形成ごとに、表1、2及び3に示すように、開口幅W、発光幅A及び距離hを変化させた。
Claims (2)
- 有機EL素子の製造方法であって、
気化された有機層形成材料をノズルから吐出させることにより、該ノズルに対して相対的に移動する基材上に有機層を形成する蒸着工程を含み、
前記蒸着工程を、前記有機層からなり基材移動方向に対して垂直な方向の幅A(mm)を有する発光領域を形成するようにして、且つ、
前記ノズルの開口部における前記基材移動方向と垂直方向の長さをW(mm)、前記開口部と前記基材との距離をh(mm)とするとき、式W≧A+2×h(但し、h≦5mmである。)を満たすようにして行なう有機EL素子の製造方法。 - 有機EL素子の製造装置であって、
気化された有機層形成材料をノズルから吐出することにより、該ノズルに対して相対的に移動する基材上に有機層を形成する蒸着源を備え、
有機層からなり基材移動方向に対して垂直な方向の幅A(mm)を有する発光領域を形成するように構成され、且つ、
前記ノズルの開口部における前記基材移動方向と垂直方向の長さをW(mm)、前記開口部と前記基材との距離をh(mm)とするとき、式W≧A+2×h(但し、h≦5mmである。)を満たすように構成された有機EL素子の製造装置。
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201280020020.4A CN103493593B (zh) | 2011-04-26 | 2012-04-06 | 有机el元件的制造方法及制造装置 |
| EP12776185.6A EP2704533B1 (en) | 2011-04-26 | 2012-04-06 | Method and device for producing organic el element |
| KR1020137017252A KR20140004118A (ko) | 2011-04-26 | 2012-04-06 | 유기 el 소자의 제조 방법 및 제조 장치 |
| US14/114,142 US9647224B2 (en) | 2011-04-26 | 2012-04-06 | Method and apparatus for manufacturing organic EL device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-098172 | 2011-04-26 | ||
| JP2011098172A JP5352620B2 (ja) | 2011-04-26 | 2011-04-26 | 有機el素子の製造方法及び製造装置 |
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| WO2012147493A1 true WO2012147493A1 (ja) | 2012-11-01 |
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| PCT/JP2012/059439 Ceased WO2012147493A1 (ja) | 2011-04-26 | 2012-04-06 | 有機el素子の製造方法及び製造装置 |
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| US (1) | US9647224B2 (ja) |
| EP (1) | EP2704533B1 (ja) |
| JP (1) | JP5352620B2 (ja) |
| KR (1) | KR20140004118A (ja) |
| CN (1) | CN103493593B (ja) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US10868252B2 (en) | 2015-09-10 | 2020-12-15 | Showa Denko Materials Co., Ltd. | Organic electronics material and use thereof |
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| JP2014114491A (ja) * | 2012-12-11 | 2014-06-26 | Yuutekku:Kk | 蒸着源及び蒸着装置 |
| JP6823470B2 (ja) * | 2017-01-23 | 2021-02-03 | 住友化学株式会社 | 有機デバイスの製造方法及び成膜装置 |
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| Publication number | Publication date |
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| CN103493593A (zh) | 2014-01-01 |
| KR20140004118A (ko) | 2014-01-10 |
| EP2704533A1 (en) | 2014-03-05 |
| EP2704533B1 (en) | 2017-12-13 |
| TW201251172A (en) | 2012-12-16 |
| EP2704533A4 (en) | 2014-12-17 |
| US20140051198A1 (en) | 2014-02-20 |
| US9647224B2 (en) | 2017-05-09 |
| CN103493593B (zh) | 2016-08-17 |
| JP5352620B2 (ja) | 2013-11-27 |
| JP2012230816A (ja) | 2012-11-22 |
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