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WO2008123436A1 - Cu-ni-si-co-based copper alloy for electronic material, and method for production thereof - Google Patents

Cu-ni-si-co-based copper alloy for electronic material, and method for production thereof Download PDF

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Publication number
WO2008123436A1
WO2008123436A1 PCT/JP2008/056142 JP2008056142W WO2008123436A1 WO 2008123436 A1 WO2008123436 A1 WO 2008123436A1 JP 2008056142 W JP2008056142 W JP 2008056142W WO 2008123436 A1 WO2008123436 A1 WO 2008123436A1
Authority
WO
WIPO (PCT)
Prior art keywords
carried out
copper alloy
mass
production
electronic material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/056142
Other languages
French (fr)
Japanese (ja)
Inventor
Hiroshi Kuwagaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mining Holdings Inc
Original Assignee
Nippon Mining and Metals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining and Metals Co Ltd filed Critical Nippon Mining and Metals Co Ltd
Priority to KR1020097021841A priority Critical patent/KR101159562B1/en
Priority to CN2008800101753A priority patent/CN101646791B/en
Publication of WO2008123436A1 publication Critical patent/WO2008123436A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/02—Single bars, rods, wires, or strips

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

Disclosed is a Cu-Ni-Si-Co-based alloy reduced in the production of a coarse second phase particle. In the process for producing a Cu-Ni-Si-Co-based alloy; (1) the hot rolling is carried out after heating at 950 to 1050˚C for 1 hour or longer, and the hot rolling termination temperature is fixed at 850˚C or higher, and the cooling is carried out at a rate of 15˚C/s or more; and (2) the solution treatment is carried out at 850 to 1050˚C, and the cooling is carried out at a rate of 15˚C/s or more. Specifically disclosed is a copper alloy for an electronic material, which comprises 1.0 to 2.5 mass% of Ni, 0.5 to 2.5 mass% of Co and 0.30 to 1.20 mass% of Si, with the remainder being Cu and unavoidable impurities. The copper alloy contains no second phase particle having a particle diameter greater than 10 μm, and contains a second phase particle having a particle diameter of 5 to 10 μm at a density of 50 particles/mm2 or less in a cross-section parallel to the rolling direction.
PCT/JP2008/056142 2007-03-30 2008-03-28 Cu-ni-si-co-based copper alloy for electronic material, and method for production thereof Ceased WO2008123436A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020097021841A KR101159562B1 (en) 2007-03-30 2008-03-28 Cu-ni-si-co-based copper alloy for electronic material, and method for production thereof
CN2008800101753A CN101646791B (en) 2007-03-30 2008-03-28 Cu-ni-si-co-based copper alloy for electronic material, and method for production thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007092269A JP4937815B2 (en) 2007-03-30 2007-03-30 Cu-Ni-Si-Co-based copper alloy for electronic materials and method for producing the same
JP2007-092269 2007-03-30

Publications (1)

Publication Number Publication Date
WO2008123436A1 true WO2008123436A1 (en) 2008-10-16

Family

ID=39830921

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/056142 Ceased WO2008123436A1 (en) 2007-03-30 2008-03-28 Cu-ni-si-co-based copper alloy for electronic material, and method for production thereof

Country Status (5)

Country Link
JP (1) JP4937815B2 (en)
KR (1) KR101159562B1 (en)
CN (1) CN101646791B (en)
TW (1) TW200900515A (en)
WO (1) WO2008123436A1 (en)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009041197A1 (en) * 2007-09-28 2009-04-02 Nippon Mining & Metals Co., Ltd. Cu-ni-si-co-base copper alloy for electronic material and process for producing the copper alloy
JP4596490B2 (en) * 2008-03-31 2010-12-08 Ｊｘ日鉱日石金属株式会社 Cu-Ni-Si-Co-based copper alloy for electronic materials and method for producing the same
KR101331339B1 (en) * 2008-12-01 2013-11-19 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 Cu-ni-si-co based copper ally for electronic materials and manufacturing method therefor
JP5261161B2 (en) * 2008-12-12 2013-08-14 Ｊｘ日鉱日石金属株式会社 Ni-Si-Co-based copper alloy and method for producing the same
JP4708485B2 (en) * 2009-03-31 2011-06-22 Ｊｘ日鉱日石金属株式会社 Cu-Co-Si based copper alloy for electronic materials and method for producing the same
JP5578827B2 (en) * 2009-10-13 2014-08-27 Ｄｏｗａメタルテック株式会社 High-strength copper alloy sheet and manufacturing method thereof
JP4677505B1 (en) 2010-03-31 2011-04-27 Ｊｘ日鉱日石金属株式会社 Cu-Ni-Si-Co-based copper alloy for electronic materials and method for producing the same
JP5961335B2 (en) 2010-04-05 2016-08-02 Ｄｏｗａメタルテック株式会社 Copper alloy sheet and electrical / electronic components
JP4830035B2 (en) 2010-04-14 2011-12-07 Ｊｘ日鉱日石金属株式会社 Cu-Si-Co alloy for electronic materials and method for producing the same
JP4672804B1 (en) * 2010-05-31 2011-04-20 Ｊｘ日鉱日石金属株式会社 Cu-Co-Si based copper alloy for electronic materials and method for producing the same
JP4708497B1 (en) 2010-06-03 2011-06-22 Ｊｘ日鉱日石金属株式会社 Cu-Co-Si alloy plate and method for producing the same
JP4834781B1 (en) 2010-08-24 2011-12-14 Ｊｘ日鉱日石金属株式会社 Cu-Co-Si alloy for electronic materials
JP2012072470A (en) 2010-09-29 2012-04-12 Jx Nippon Mining & Metals Corp Cu-Co-Si-BASED COPPER ALLOY FOR ELECTRONIC MATERIAL AND METHOD FOR PRODUCING THE SAME
CN102560191A (en) * 2010-12-09 2012-07-11 北京有色金属研究总院 High-performance elastic copper alloy and preparation and processing method thereof
JP5441876B2 (en) * 2010-12-13 2014-03-12 Ｊｘ日鉱日石金属株式会社 Cu-Ni-Si-Co-based copper alloy for electronic materials and method for producing the same
JP5451674B2 (en) 2011-03-28 2014-03-26 Ｊｘ日鉱日石金属株式会社 Cu-Si-Co based copper alloy for electronic materials and method for producing the same
JP4799701B1 (en) 2011-03-29 2011-10-26 Ｊｘ日鉱日石金属株式会社 Cu-Co-Si based copper alloy strip for electronic materials and method for producing the same
JP6039999B2 (en) 2012-10-31 2016-12-07 Ｄｏｗａメタルテック株式会社 Cu-Ni-Co-Si based copper alloy sheet and method for producing the same
JP5647703B2 (en) 2013-02-14 2015-01-07 Ｄｏｗａメタルテック株式会社 High-strength Cu-Ni-Co-Si-based copper alloy sheet, its manufacturing method, and current-carrying parts
CN106636734B (en) * 2015-10-30 2019-01-15 北京有色金属研究总院 High-intensitive, highly conductive, high resistance to stress relaxation copper alloy elastic material and preparation method thereof
CN105316523A (en) * 2015-12-02 2016-02-10 苏州龙腾万里化工科技有限公司 Durable resistance alloy for milling machine regulator
WO2017168803A1 (en) * 2016-03-31 2017-10-05 Ｄｏｗａメタルテック株式会社 Cu-ni-si copper alloy sheet and manufacturing method
CN105908015A (en) * 2016-05-05 2016-08-31 太仓小小精密模具有限公司 Anti-oxidization copper alloy mold material
CN106399749B (en) * 2016-10-05 2018-01-05 宁波兴业盛泰集团有限公司 A kind of high strength and high flexibility cupro-nickel Si system alloy material and preparation method thereof
CN106756202A (en) * 2016-11-23 2017-05-31 宁波兴业盛泰集团有限公司 A kind of blaster fuse frame material complicated pluralism Cu alloy material and preparation method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58123846A (en) * 1982-01-20 1983-07-23 Nippon Mining Co Ltd Lead material for semiconductor equipment
JPS63143230A (en) * 1986-12-08 1988-06-15 Nippon Mining Co Ltd Precipitation-strengthened high-strength, high-conductivity copper alloy
JP2006283120A (en) * 2005-03-31 2006-10-19 Nikko Metal Manufacturing Co Ltd Cu-Ni-Si-Co-Cr-based copper alloy for electronic materials and method for producing the same
JP2007136467A (en) * 2005-11-15 2007-06-07 Hitachi Cable Ltd Copper alloy ingot, method for producing copper alloy ingot, method for producing copper alloy strip, and apparatus for producing copper alloy ingot

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3699701B2 (en) * 2002-10-31 2005-09-28 日鉱金属加工株式会社 Easy-to-process high-strength, high-conductivity copper alloy

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58123846A (en) * 1982-01-20 1983-07-23 Nippon Mining Co Ltd Lead material for semiconductor equipment
JPS63143230A (en) * 1986-12-08 1988-06-15 Nippon Mining Co Ltd Precipitation-strengthened high-strength, high-conductivity copper alloy
JP2006283120A (en) * 2005-03-31 2006-10-19 Nikko Metal Manufacturing Co Ltd Cu-Ni-Si-Co-Cr-based copper alloy for electronic materials and method for producing the same
JP2007136467A (en) * 2005-11-15 2007-06-07 Hitachi Cable Ltd Copper alloy ingot, method for producing copper alloy ingot, method for producing copper alloy strip, and apparatus for producing copper alloy ingot

Also Published As

Publication number Publication date
CN101646791B (en) 2011-11-16
KR101159562B1 (en) 2012-06-26
JP2008248333A (en) 2008-10-16
TW200900515A (en) 2009-01-01
JP4937815B2 (en) 2012-05-23
TWI367952B (en) 2012-07-11
KR20090122303A (en) 2009-11-26
CN101646791A (en) 2010-02-10

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