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TW200643191A - Copper alloy and process for producing the same - Google Patents

Copper alloy and process for producing the same

Info

Publication number
TW200643191A
TW200643191A TW095113006A TW95113006A TW200643191A TW 200643191 A TW200643191 A TW 200643191A TW 095113006 A TW095113006 A TW 095113006A TW 95113006 A TW95113006 A TW 95113006A TW 200643191 A TW200643191 A TW 200643191A
Authority
TW
Taiwan
Prior art keywords
copper alloy
precipitates
cast
inclusions
casting
Prior art date
Application number
TW095113006A
Other languages
Chinese (zh)
Inventor
Tsuneaki Nagamichi
Yasuhiro Maehara
Naotsugu Yoshida
Mitsuharu Yonemura
Keiji Nakajima
Takuji Nakahata
Original Assignee
Sumitomo Metal Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Ind filed Critical Sumitomo Metal Ind
Publication of TW200643191A publication Critical patent/TW200643191A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
    • B22D11/001—Continuous casting of metals, i.e. casting in indefinite lengths of specific alloys
    • B22D11/004—Copper alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
    • B22D11/12—Accessories for subsequent treating or working cast stock in situ
    • B22D11/124—Accessories for subsequent treating or working cast stock in situ for cooling
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Continuous Casting (AREA)
  • Conductive Materials (AREA)

Abstract

To provide a beryllium-free copper alloy satisfactory in various performances. The copper alloy has a given chemical composition, the remainder consisting of copper and impurities. In the copper alloy, the crystal structure has an aspect ratio of 5 or lower and the total number of precipitates and inclusions having a particle diameter of 1 m or larger satisfies the following relationship (1). This copper alloy is obtained by melting, casting, subsequently cooling the cast at a rate of 1 DEG C/sec or higher at least in the temperature range of from the temperature of the cast immediately after the casting to 900 DEG C, and subjecting the cast to a solution heat treatment and/or hot rolling. logN=0.4742+17.629exp(-0.1133X) (1) In the relationship (1), N is the total number of the precipitates and inclusions per unit area (mm<SP>2</SP>) and X is the particle diameter of the precipitates and inclusions (m).
TW095113006A 2005-04-12 2006-04-12 Copper alloy and process for producing the same TW200643191A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005114089 2005-04-12

Publications (1)

Publication Number Publication Date
TW200643191A true TW200643191A (en) 2006-12-16

Family

ID=37087072

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095113006A TW200643191A (en) 2005-04-12 2006-04-12 Copper alloy and process for producing the same

Country Status (2)

Country Link
TW (1) TW200643191A (en)
WO (1) WO2006109801A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI400342B (en) * 2008-12-01 2013-07-01 Jx Nippon Mining & Metals Corp Cu-Ni-Si-Co based copper alloy for electronic materials and its manufacturing method
TWI422692B (en) * 2009-03-31 2014-01-11 Jx Nippon Mining & Metals Corp Cu-Co-Si based copper alloy for electronic materials and method for producing the same
CN108350531A (en) * 2015-11-03 2018-07-31 株式会社神户制钢所 Heat dissipation element copper alloy plate
CN110066940A (en) * 2019-05-30 2019-07-30 安徽协同创新设计研究院有限公司 Iron picture wire rod
CN112030033A (en) * 2020-09-14 2020-12-04 江西省科学院应用物理研究所 A rare earth copper alloy for high-strength and high-conductivity contact wire

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JP4830035B2 (en) 2010-04-14 2011-12-07 Ｊｘ日鉱日石金属株式会社 Cu-Si-Co alloy for electronic materials and method for producing the same
JP4834781B1 (en) 2010-08-24 2011-12-14 Ｊｘ日鉱日石金属株式会社 Cu-Co-Si alloy for electronic materials
CN102983082B (en) * 2012-11-07 2015-01-07 江苏威纳德照明科技有限公司 Method of manufacturing integrated circuit
CN103498068B (en) * 2013-10-13 2015-11-18 罗春华 A kind of preparation method of high strength rare earth Yb, Nd copper doped alloy
CN104928523A (en) * 2015-07-10 2015-09-23 苏州科茂电子材料科技有限公司 Copper alloy lead material for communication cable and preparing method thereof
CN105018821A (en) * 2015-08-05 2015-11-04 启东市佳宝金属制品有限公司 High-carbon alloy
CN105002413A (en) * 2015-08-05 2015-10-28 启东市佳宝金属制品有限公司 Super-heat-resisting alloy
CN105400986A (en) * 2015-12-23 2016-03-16 常熟市三荣装饰材料有限公司 File cabinet
CN105506350A (en) * 2015-12-23 2016-04-20 常熟市三荣装饰材料有限公司 File cabinet
CN105543539A (en) * 2015-12-23 2016-05-04 常熟市三荣装饰材料有限公司 Showing stand
CN105543537A (en) * 2015-12-23 2016-05-04 常熟市三荣装饰材料有限公司 Cupboard
CN105506351A (en) * 2015-12-23 2016-04-20 常熟市三荣装饰材料有限公司 Display cabinet
CN105543538A (en) * 2015-12-23 2016-05-04 常熟市三荣装饰材料有限公司 Goods shelf
CN105385885A (en) * 2015-12-25 2016-03-09 苏州露宇电子科技有限公司 Desktop-type micro-detecting nuclear magnetic resonance spectrometer
CN105543541A (en) * 2015-12-28 2016-05-04 苏州众禹环境科技有限公司 Continuous efficient quicksand filter
CN105385887A (en) * 2015-12-28 2016-03-09 苏州众禹环境科技有限公司 Cavitation air floatation machine
CN113652573B (en) * 2021-07-27 2022-05-10 中国兵器科学研究院宁波分院 High-strength, high-conductivity and high-heat-resistance Cu-Ag-Hf alloy material and preparation method thereof
CN115305383B (en) * 2022-07-30 2023-05-12 江西省科学院应用物理研究所 High-strength and high-conductivity Cu-Co alloy material containing mixed rare earth and preparation method thereof
CN116426789B (en) * 2023-04-28 2025-02-18 河南科技大学 Copper-chromium-scandium alloy and preparation method thereof
CN117512385B (en) * 2023-10-31 2024-05-14 江苏康耐特精密机械有限公司 High-precision structural member material with multi-energy-field composite surface post-treatment and preparation method thereof
CN117947314A (en) * 2024-01-29 2024-04-30 宁波金田铜业(集团)股份有限公司 Copper alloy material for wiring terminal and preparation method thereof
CN120619391B (en) * 2025-08-07 2025-11-18 广州众山增材科技有限公司 A process for red light additive manufacturing of thin-walled copper alloys

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JPS63143230A (en) * 1986-12-08 1988-06-15 Nippon Mining Co Ltd Precipitation-strengthened high-strength, high-conductivity copper alloy
JPH04231447A (en) * 1990-12-27 1992-08-20 Nikko Kyodo Co Ltd conductive material
JPH06184666A (en) * 1992-12-23 1994-07-05 Nikko Kinzoku Kk High strength and high electric conductivity copper alloy
JP3520034B2 (en) * 2000-07-25 2004-04-19 古河電気工業株式会社 Copper alloy materials for electronic and electrical equipment parts
JP3520046B2 (en) * 2000-12-15 2004-04-19 古河電気工業株式会社 High strength copper alloy
JP2005113259A (en) * 2003-02-05 2005-04-28 Sumitomo Metal Ind Ltd Cu alloy and method for producing the same
JP2004307905A (en) * 2003-04-03 2004-11-04 Sumitomo Metal Ind Ltd Cu alloy and method for producing the same
JP3731600B2 (en) * 2003-09-19 2006-01-05 住友金属工業株式会社 Copper alloy and manufacturing method thereof
JP2005307334A (en) * 2004-03-26 2005-11-04 Sumitomo Metal Ind Ltd Copper alloy and manufacturing method thereof
JP2005290543A (en) * 2004-03-12 2005-10-20 Sumitomo Metal Ind Ltd Copper alloy and manufacturing method thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI400342B (en) * 2008-12-01 2013-07-01 Jx Nippon Mining & Metals Corp Cu-Ni-Si-Co based copper alloy for electronic materials and its manufacturing method
TWI422692B (en) * 2009-03-31 2014-01-11 Jx Nippon Mining & Metals Corp Cu-Co-Si based copper alloy for electronic materials and method for producing the same
CN108350531A (en) * 2015-11-03 2018-07-31 株式会社神户制钢所 Heat dissipation element copper alloy plate
CN110066940A (en) * 2019-05-30 2019-07-30 安徽协同创新设计研究院有限公司 Iron picture wire rod
CN112030033A (en) * 2020-09-14 2020-12-04 江西省科学院应用物理研究所 A rare earth copper alloy for high-strength and high-conductivity contact wire

Also Published As

Publication number Publication date
WO2006109801A1 (en) 2006-10-19

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