TW200506073A - Cu alloy and method for production thereof - Google Patents
Cu alloy and method for production thereofInfo
- Publication number
- TW200506073A TW200506073A TW093102536A TW93102536A TW200506073A TW 200506073 A TW200506073 A TW 200506073A TW 093102536 A TW093102536 A TW 093102536A TW 93102536 A TW93102536 A TW 93102536A TW 200506073 A TW200506073 A TW 200506073A
- Authority
- TW
- Taiwan
- Prior art keywords
- alloy
- cast
- temperature region
- cooling
- casting
- Prior art date
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title abstract 4
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 229910045601 alloy Inorganic materials 0.000 abstract 3
- 239000000956 alloy Substances 0.000 abstract 3
- 238000001816 cooling Methods 0.000 abstract 3
- 238000005266 casting Methods 0.000 abstract 2
- 238000010438 heat treatment Methods 0.000 abstract 2
- 239000000047 product Substances 0.000 abstract 2
- 239000012535 impurity Substances 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
- 239000002244 precipitate Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/01—Alloys based on copper with aluminium as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/10—Alloys based on copper with silicon as the next major constituent
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
Abstract
A Cu alloy which comprises two or more of Cr, Ti and Zr in respective specific mass percentages and the balanced amount of Cu and inevitable impurities, wherein the number of precipitates and inclusions having a particle diameter of 10 μm or more being present per unit area is 100 pieces/mm2 or less in total; and a method for producing the Cu alloy which comprises preparing and casting a molten alloy, and cooling the cast alloy at a cooling speed of 0.5DEG C/s or higher at least in a temperature region from the temperature of a cast piece immediately after the casting to 450DEG C. A part of Cu may be replaced by, for example, one or more of Ag, P and the like and Mg. It is preferred that after the above cooling the cast alloy is worked in the temperature region of 450 DEG C or lower and subsequently is subjected to a heat treatment of holding the worked product in the temperature region of 280 to 550 DEG C for 10 min to 72 hr. The above working and heat treatment is more preferably applied on the cast product repeatedly. The resultant Cu alloy contains no elements harmful to the environment and is excellent in performance capabilities such as electric conductivity, tensile strength and high temperature strength.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003028828 | 2003-02-05 | ||
| JP2003134745 | 2003-05-13 | ||
| JP2003328894 | 2003-09-19 | ||
| JP2004025066A JP2005113259A (en) | 2003-02-05 | 2004-02-02 | Cu alloy and method for producing the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200506073A true TW200506073A (en) | 2005-02-16 |
Family
ID=32854416
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093102536A TW200506073A (en) | 2003-02-05 | 2004-02-04 | Cu alloy and method for production thereof |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2005113259A (en) |
| TW (1) | TW200506073A (en) |
| WO (1) | WO2004070070A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105936983A (en) * | 2016-06-24 | 2016-09-14 | 河南江河机械有限责任公司 | High-strength and high-conductivity copper alloy material |
| CN116356177A (en) * | 2023-04-03 | 2023-06-30 | 郑州大学 | High-performance copper-based alloy material for lead frame and preparation method thereof |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT7491U1 (en) * | 2004-07-15 | 2005-04-25 | Plansee Ag | MATERIAL FOR CONCRETE ALLOY COPPER ALLOY |
| WO2006109801A1 (en) * | 2005-04-12 | 2006-10-19 | Sumitomo Metal Industries, Ltd. | Copper alloy and process for producing the same |
| JP2007113093A (en) * | 2005-10-24 | 2007-05-10 | Nikko Kinzoku Kk | High-strength, high-electric conductivity, and heat-resistant copper alloy, and producing method therefor |
| JP5040140B2 (en) * | 2006-03-31 | 2012-10-03 | Dowaメタルテック株式会社 | Cu-Ni-Si-Zn-based copper alloy |
| JP4721067B2 (en) * | 2007-07-12 | 2011-07-13 | 日立電線株式会社 | Manufacturing method of copper alloy material for electric and electronic parts |
| JP5873618B2 (en) * | 2009-08-18 | 2016-03-01 | 新日鐵住金株式会社 | Method for producing copper alloy |
| KR101570919B1 (en) | 2010-05-14 | 2015-11-23 | 미쓰비시 마테리알 가부시키가이샤 | Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device |
| JP5903832B2 (en) | 2011-10-28 | 2016-04-13 | 三菱マテリアル株式会社 | Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, rolled copper alloy material for electronic equipment, and electronic equipment parts |
| JP5903838B2 (en) | 2011-11-07 | 2016-04-13 | 三菱マテリアル株式会社 | Copper alloy for electronic equipment, copper material for electronic equipment, copper alloy manufacturing method for electronic equipment, copper alloy plastic working material for electronic equipment, and electronic equipment parts |
| JP5903842B2 (en) * | 2011-11-14 | 2016-04-13 | 三菱マテリアル株式会社 | Copper alloy, copper alloy plastic working material, and method for producing copper alloy plastic working material |
| JP6146964B2 (en) * | 2012-07-06 | 2017-06-14 | 古河電気工業株式会社 | Copper alloy rolled foil for secondary battery current collector and method for producing the same |
| CN103498068B (en) * | 2013-10-13 | 2015-11-18 | 罗春华 | A kind of preparation method of high strength rare earth Yb, Nd copper doped alloy |
| JP5880670B2 (en) * | 2014-11-21 | 2016-03-09 | 新日鐵住金株式会社 | Method for determining melting temperature of copper alloy slabs |
| CN104532042B (en) * | 2014-12-23 | 2017-03-08 | 吉林大学 | A kind of cubic boron nitride particle Reinforced Cu base electrode composite and preparation method thereof |
| CN105002413A (en) * | 2015-08-05 | 2015-10-28 | 启东市佳宝金属制品有限公司 | Super-heat-resisting alloy |
| CN105018821A (en) * | 2015-08-05 | 2015-11-04 | 启东市佳宝金属制品有限公司 | High-carbon alloy |
| CN110512115B (en) * | 2019-09-29 | 2021-08-17 | 宁波金田铜业(集团)股份有限公司 | High-strength and high-elasticity conductive copper-titanium alloy rod and preparation method thereof |
| JP7527115B2 (en) * | 2020-02-13 | 2024-08-02 | 古河電気工業株式会社 | Copper alloy material and its manufacturing method |
| CN111534714B (en) * | 2020-06-24 | 2021-08-31 | 宁波博威合金板带有限公司 | Nb and Al-containing titanium bronze alloy strip and preparation method thereof |
| CN112030032B (en) * | 2020-09-09 | 2022-07-29 | 中铝洛阳铜加工有限公司 | Cu-Cr-Ti-Zr alloy and copper strip preparation method |
| CN112553499B (en) * | 2020-12-04 | 2021-11-16 | 天津大学 | A kind of CuCrZr/WC composite material, preparation method and application thereof |
| CN115305383B (en) * | 2022-07-30 | 2023-05-12 | 江西省科学院应用物理研究所 | High-strength and high-conductivity Cu-Co alloy material containing mixed rare earth and preparation method thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59193233A (en) * | 1983-04-15 | 1984-11-01 | Toshiba Corp | Copper alloy |
| JPS6270540A (en) * | 1985-09-20 | 1987-04-01 | Mitsubishi Metal Corp | Cu-alloy lead material for semiconductor device |
| JPH04231447A (en) * | 1990-12-27 | 1992-08-20 | Nikko Kyodo Co Ltd | conductive material |
| JPH10287939A (en) * | 1997-04-17 | 1998-10-27 | Furukawa Electric Co Ltd:The | Copper alloy for electrical and electronic equipment with excellent punching workability |
| JP3479470B2 (en) * | 1999-03-31 | 2003-12-15 | 日鉱金属株式会社 | Copper alloy foil for hard disk drive suspension and method of manufacturing the same |
-
2004
- 2004-02-02 JP JP2004025066A patent/JP2005113259A/en not_active Withdrawn
- 2004-02-04 WO PCT/JP2004/001150 patent/WO2004070070A1/en not_active Ceased
- 2004-02-04 TW TW093102536A patent/TW200506073A/en unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105936983A (en) * | 2016-06-24 | 2016-09-14 | 河南江河机械有限责任公司 | High-strength and high-conductivity copper alloy material |
| CN116356177A (en) * | 2023-04-03 | 2023-06-30 | 郑州大学 | High-performance copper-based alloy material for lead frame and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2004070070A1 (en) | 2004-08-19 |
| JP2005113259A (en) | 2005-04-28 |
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