TWI367952B - - Google Patents

Info

Publication number: TWI367952B
Authority: TW; Taiwan

Application number

TW097108444A

Other languages

Chinese (zh)

Other versions

TW200900515A (en

Inventor

Hiroshi Kuwagaki

Original Assignee

Jx Nippon Mining & Metals Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2007-03-30

Filing date

2008-03-11

Publication date

2012-07-11

2008-03-11 Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp

2009-01-01 Publication of TW200900515A publication Critical patent/TW200900515A/en

2012-07-11 Application granted granted Critical

2012-07-11 Publication of TWI367952B publication Critical patent/TWI367952B/zh

Classifications

- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/02—Single bars, rods, wires, or strips

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Physics & Mathematics (AREA)
Thermal Sciences (AREA)
Crystallography & Structural Chemistry (AREA)
Conductive Materials (AREA)
Non-Insulated Conductors (AREA)

TW097108444A 2007-03-30 2008-03-11 Cu-Ni-Si-Co-based copper alloy for electronic material, and method for production thereof TW200900515A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2007092269A JP4937815B2 (en)	2007-03-30	2007-03-30	Cu-Ni-Si-Co-based copper alloy for electronic materials and method for producing the same

Publications (2)

Publication Number	Publication Date
TW200900515A TW200900515A (en)	2009-01-01
TWI367952B true TWI367952B (en)	2012-07-11

Family

ID=39830921

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW097108444A TW200900515A (en)	2007-03-30	2008-03-11	Cu-Ni-Si-Co-based copper alloy for electronic material, and method for production thereof

Country Status (5)

Country	Link
JP (1)	JP4937815B2 (en)
KR (1)	KR101159562B1 (en)
CN (1)	CN101646791B (en)
TW (1)	TW200900515A (en)
WO (1)	WO2008123436A1 (en)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO2009041197A1 (en) *	2007-09-28	2009-04-02	Nippon Mining & Metals Co., Ltd.	Cu-ni-si-co-base copper alloy for electronic material and process for producing the copper alloy
JP4596490B2 (en) *	2008-03-31	2010-12-08	Ｊｘ日鉱日石金属株式会社	Cu-Ni-Si-Co-based copper alloy for electronic materials and method for producing the same
KR101331339B1 (en) *	2008-12-01	2013-11-19	제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤	Cu-ni-si-co based copper ally for electronic materials and manufacturing method therefor
JP5261161B2 (en) *	2008-12-12	2013-08-14	Ｊｘ日鉱日石金属株式会社	Ni-Si-Co-based copper alloy and method for producing the same
JP4708485B2 (en) *	2009-03-31	2011-06-22	Ｊｘ日鉱日石金属株式会社	Cu-Co-Si based copper alloy for electronic materials and method for producing the same
JP5578827B2 (en) *	2009-10-13	2014-08-27	Ｄｏｗａメタルテック株式会社	High-strength copper alloy sheet and manufacturing method thereof
JP4677505B1 (en)	2010-03-31	2011-04-27	Ｊｘ日鉱日石金属株式会社	Cu-Ni-Si-Co-based copper alloy for electronic materials and method for producing the same
JP5961335B2 (en)	2010-04-05	2016-08-02	Ｄｏｗａメタルテック株式会社	Copper alloy sheet and electrical / electronic components
JP4830035B2 (en)	2010-04-14	2011-12-07	Ｊｘ日鉱日石金属株式会社	Cu-Si-Co alloy for electronic materials and method for producing the same
JP4672804B1 (en) *	2010-05-31	2011-04-20	Ｊｘ日鉱日石金属株式会社	Cu-Co-Si based copper alloy for electronic materials and method for producing the same
JP4708497B1 (en)	2010-06-03	2011-06-22	Ｊｘ日鉱日石金属株式会社	Cu-Co-Si alloy plate and method for producing the same
JP4834781B1 (en)	2010-08-24	2011-12-14	Ｊｘ日鉱日石金属株式会社	Cu-Co-Si alloy for electronic materials
JP2012072470A (en)	2010-09-29	2012-04-12	Jx Nippon Mining & Metals Corp	Cu-Co-Si-BASED COPPER ALLOY FOR ELECTRONIC MATERIAL AND METHOD FOR PRODUCING THE SAME
CN102560191A (en) *	2010-12-09	2012-07-11	北京有色金属研究总院	High-performance elastic copper alloy and preparation and processing method thereof
JP5441876B2 (en) *	2010-12-13	2014-03-12	Ｊｘ日鉱日石金属株式会社	Cu-Ni-Si-Co-based copper alloy for electronic materials and method for producing the same
JP5451674B2 (en)	2011-03-28	2014-03-26	Ｊｘ日鉱日石金属株式会社	Cu-Si-Co based copper alloy for electronic materials and method for producing the same
JP4799701B1 (en)	2011-03-29	2011-10-26	Ｊｘ日鉱日石金属株式会社	Cu-Co-Si based copper alloy strip for electronic materials and method for producing the same
JP6039999B2 (en)	2012-10-31	2016-12-07	Ｄｏｗａメタルテック株式会社	Cu-Ni-Co-Si based copper alloy sheet and method for producing the same
JP5647703B2 (en)	2013-02-14	2015-01-07	Ｄｏｗａメタルテック株式会社	High-strength Cu-Ni-Co-Si-based copper alloy sheet, its manufacturing method, and current-carrying parts
CN106636734B (en) *	2015-10-30	2019-01-15	北京有色金属研究总院	High-intensitive, highly conductive, high resistance to stress relaxation copper alloy elastic material and preparation method thereof
CN105316523A (en) *	2015-12-02	2016-02-10	苏州龙腾万里化工科技有限公司	Durable resistance alloy for milling machine regulator
WO2017168803A1 (en) *	2016-03-31	2017-10-05	Ｄｏｗａメタルテック株式会社	Cu-ni-si copper alloy sheet and manufacturing method
CN105908015A (en) *	2016-05-05	2016-08-31	太仓小小精密模具有限公司	Anti-oxidization copper alloy mold material
CN106399749B (en) *	2016-10-05	2018-01-05	宁波兴业盛泰集团有限公司	A kind of high strength and high flexibility cupro-nickel Si system alloy material and preparation method thereof
CN106756202A (en) *	2016-11-23	2017-05-31	宁波兴业盛泰集团有限公司	A kind of blaster fuse frame material complicated pluralism Cu alloy material and preparation method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS6045698B2 (en) *	1982-01-20	1985-10-11	日本鉱業株式会社	Lead material for semiconductor equipment
JPS63143230A (en) *	1986-12-08	1988-06-15	Nippon Mining Co Ltd	Precipitation-strengthened high-strength, high-conductivity copper alloy
JP3699701B2 (en) *	2002-10-31	2005-09-28	日鉱金属加工株式会社	Easy-to-process high-strength, high-conductivity copper alloy
JP4068626B2 (en) *	2005-03-31	2008-03-26	日鉱金属株式会社	Cu-Ni-Si-Co-Cr-based copper alloy for electronic materials and method for producing the same
JP2007136467A (en) *	2005-11-15	2007-06-07	Hitachi Cable Ltd	Copper alloy ingot, method for producing copper alloy ingot, method for producing copper alloy strip, and apparatus for producing copper alloy ingot

2007
- 2007-03-30 JP JP2007092269A patent/JP4937815B2/en active Active
2008
- 2008-03-11 TW TW097108444A patent/TW200900515A/en unknown
- 2008-03-28 WO PCT/JP2008/056142 patent/WO2008123436A1/en not_active Ceased
- 2008-03-28 CN CN2008800101753A patent/CN101646791B/en active Active
- 2008-03-28 KR KR1020097021841A patent/KR101159562B1/en active Active

Also Published As

Publication number	Publication date
CN101646791B (en)	2011-11-16
KR101159562B1 (en)	2012-06-26
JP2008248333A (en)	2008-10-16
TW200900515A (en)	2009-01-01
JP4937815B2 (en)	2012-05-23
WO2008123436A1 (en)	2008-10-16
KR20090122303A (en)	2009-11-26
CN101646791A (en)	2010-02-10

Publication	Publication Date	Title
TWI367952B (en)	2012-07-11
BR122019003642A2 (en)	2015-06-16
BR112014019477A2 (en)	2017-06-20
BR0701409A2 (en)	2009-02-17
CN300730287S (zh)	2008-01-09	笔(c17)
CN300730005S (zh)	2008-01-09	数码相册
CN300822476S (zh)	2008-08-27	型材(推拉中梃)
CN300853238S (zh)	2008-11-26	带应急灯的疏散灯(0702)
CN300871020S (zh)	2009-01-07	整体式多功能全自动软双铝包装机
CN300807148S (zh)	2008-07-23	液晶投影机
CN300805786S (zh)	2008-07-23	床头(ct6007)
CN300770029S (zh)	2008-04-23	标贴(长方帖)
CN300762867S (zh)	2008-04-09	袜子(KaiYao-061)
CN300761907S (zh)	2008-04-02	耳机(slr-400mv)
CN300757958S (zh)	2008-03-26	储钱罐(五星形-843)
CN300752869S (zh)	2008-03-05	手机(poison)
CN300885403S (zh)	2009-02-25	外套(pcsp7413)
CN300730706S (zh)	2008-01-09	烛台(145)
CN300730643S (zh)	2008-01-09	烛台(34)
CN300730051S (zh)	2008-01-09	键盘(超薄)
CN300730631S (zh)	2008-01-09	门(君子)
CN300730603S (zh)	2008-01-09	砖(树皮砖)
CN300730518S (zh)	2008-01-09	热水器外壳(jrsrsq-e)
CN300730434S (zh)	2008-01-09	木制玩具(12个正五边形面)
CN300728721S (zh)	2008-01-09	色织复古提花绸(h1553-1)