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WO2008123436A1 - 電子材料用Ｃｕ－Ｎｉ－Ｓｉ－Ｃｏ系銅合金及びその製造方法 - Google Patents

電子材料用Ｃｕ－Ｎｉ－Ｓｉ－Ｃｏ系銅合金及びその製造方法 Download PDF

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Publication number
WO2008123436A1
WO2008123436A1 PCT/JP2008/056142 JP2008056142W WO2008123436A1 WO 2008123436 A1 WO2008123436 A1 WO 2008123436A1 JP 2008056142 W JP2008056142 W JP 2008056142W WO 2008123436 A1 WO2008123436 A1 WO 2008123436A1
Authority
WO
WIPO (PCT)
Prior art keywords
carried out
copper alloy
mass
production
electronic material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/056142
Other languages
English (en)
French (fr)
Inventor
Hiroshi Kuwagaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mining Holdings Inc
Original Assignee
Nippon Mining and Metals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining and Metals Co Ltd filed Critical Nippon Mining and Metals Co Ltd
Priority to KR1020097021841A priority Critical patent/KR101159562B1/ko
Priority to CN2008800101753A priority patent/CN101646791B/zh
Publication of WO2008123436A1 publication Critical patent/WO2008123436A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/02—Single bars, rods, wires, or strips

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

　粗大な第二相粒子の生成が抑制されたＣｕ－Ｎｉ－Ｓｉ－Ｃｏ系合金を提供する。 　Ｃｕ－Ｎｉ－Ｓｉ－Ｃｏ系合金の製造工程において、（１）熱間圧延は９５０°C～１０５０°Cで１時間以上加熱後に行い、熱間圧延終了時の温度を８５０°C以上とし、１５°C/ｓ以上で冷却し、且つ、（２）溶体化処理は８５０°C～１０５０°Cで行い、１５°C/ｓ以上で冷却すること。本発明によれば、Ｎｉ：１．０～２．５質量％、Ｃｏ：０．５～２．５質量％、Ｓｉ：０．３０～１．２０質量％を含有し、残部がＣｕ及び不可避的不純物からなる電子材料用銅合金であって、粒径が１０μｍを超える第二相粒子が存在せず、粒径が５μｍ～１０μｍである第二相粒子が圧延方向に平行な断面で５０個／ｍｍ2以下である電子材料用銅合金が提供される。
PCT/JP2008/056142 2007-03-30 2008-03-28 電子材料用Ｃｕ－Ｎｉ－Ｓｉ－Ｃｏ系銅合金及びその製造方法 Ceased WO2008123436A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020097021841A KR101159562B1 (ko) 2007-03-30 2008-03-28 전자 재료용 Ｃｕ-Ｎｉ-Ｓｉ-Ｃｏ계 구리 합금 및 그 제조 방법
CN2008800101753A CN101646791B (zh) 2007-03-30 2008-03-28 电子材料用Cu-Ni-Si-Co系铜合金及其制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007092269A JP4937815B2 (ja) 2007-03-30 2007-03-30 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
JP2007-092269 2007-03-30

Publications (1)

Publication Number Publication Date
WO2008123436A1 true WO2008123436A1 (ja) 2008-10-16

Family

ID=39830921

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/056142 Ceased WO2008123436A1 (ja) 2007-03-30 2008-03-28 電子材料用Ｃｕ－Ｎｉ－Ｓｉ－Ｃｏ系銅合金及びその製造方法

Country Status (5)

Country Link
JP (1) JP4937815B2 (ja)
KR (1) KR101159562B1 (ja)
CN (1) CN101646791B (ja)
TW (1) TW200900515A (ja)
WO (1) WO2008123436A1 (ja)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009041197A1 (ja) * 2007-09-28 2009-04-02 Nippon Mining & Metals Co., Ltd. 電子材料用Ｃｕ－Ｎｉ－Ｓｉ－Ｃｏ系銅合金及びその製造方法
JP4596490B2 (ja) * 2008-03-31 2010-12-08 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
KR101331339B1 (ko) * 2008-12-01 2013-11-19 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 전자 재료용 Ｃｕ-Ｎｉ-Ｓｉ-Ｃｏ 계 구리 합금 및 그 제조 방법
JP5261161B2 (ja) * 2008-12-12 2013-08-14 Ｊｘ日鉱日石金属株式会社 Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
JP4708485B2 (ja) * 2009-03-31 2011-06-22 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系銅合金及びその製造方法
JP5578827B2 (ja) * 2009-10-13 2014-08-27 Ｄｏｗａメタルテック株式会社 高強度銅合金板材およびその製造方法
JP4677505B1 (ja) 2010-03-31 2011-04-27 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
JP5961335B2 (ja) 2010-04-05 2016-08-02 Ｄｏｗａメタルテック株式会社 銅合金板材および電気・電子部品
JP4830035B2 (ja) 2010-04-14 2011-12-07 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｓｉ−Ｃｏ系合金及びその製造方法
JP4672804B1 (ja) * 2010-05-31 2011-04-20 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系銅合金及びその製造方法
JP4708497B1 (ja) 2010-06-03 2011-06-22 Ｊｘ日鉱日石金属株式会社 Ｃｕ−Ｃｏ−Ｓｉ系合金板及びその製造方法
JP4834781B1 (ja) 2010-08-24 2011-12-14 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系合金
JP2012072470A (ja) 2010-09-29 2012-04-12 Jx Nippon Mining & Metals Corp 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系銅合金及びその製造方法
CN102560191A (zh) * 2010-12-09 2012-07-11 北京有色金属研究总院 一种高性能弹性铜合金及其制备和加工方法
JP5441876B2 (ja) * 2010-12-13 2014-03-12 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
JP5451674B2 (ja) 2011-03-28 2014-03-26 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
JP4799701B1 (ja) 2011-03-29 2011-10-26 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系銅合金条及びその製造方法
JP6039999B2 (ja) 2012-10-31 2016-12-07 Ｄｏｗａメタルテック株式会社 Ｃｕ−Ｎｉ−Ｃｏ−Ｓｉ系銅合金板材およびその製造法
JP5647703B2 (ja) 2013-02-14 2015-01-07 Ｄｏｗａメタルテック株式会社 高強度Ｃｕ−Ｎｉ−Ｃｏ−Ｓｉ系銅合金板材およびその製造法並びに通電部品
CN106636734B (zh) * 2015-10-30 2019-01-15 北京有色金属研究总院 高强度、高导电、高抗应力松弛铜合金弹性材料及其制备方法
CN105316523A (zh) * 2015-12-02 2016-02-10 苏州龙腾万里化工科技有限公司 一种磨削机调节器用耐用电阻合金
WO2017168803A1 (ja) * 2016-03-31 2017-10-05 Ｄｏｗａメタルテック株式会社 Ｃｕ－Ｎｉ－Ｓｉ系銅合金板材および製造法
CN105908015A (zh) * 2016-05-05 2016-08-31 太仓小小精密模具有限公司 一种抗氧化铜合金模具材料
CN106399749B (zh) * 2016-10-05 2018-01-05 宁波兴业盛泰集团有限公司 一种高强高弹铜镍硅系合金材料及其制备方法
CN106756202A (zh) * 2016-11-23 2017-05-31 宁波兴业盛泰集团有限公司 一种引线框架材料用复杂多元铜合金材料及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58123846A (ja) * 1982-01-20 1983-07-23 Nippon Mining Co Ltd 半導体機器用リ−ド材
JPS63143230A (ja) * 1986-12-08 1988-06-15 Nippon Mining Co Ltd 析出強化型高力高導電性銅合金
JP2006283120A (ja) * 2005-03-31 2006-10-19 Nikko Metal Manufacturing Co Ltd 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ−Ｃｒ系銅合金及びその製造方法
JP2007136467A (ja) * 2005-11-15 2007-06-07 Hitachi Cable Ltd 銅合金鋳塊と該銅合金鋳塊の製造方法、および銅合金条の製造方法、並びに銅合金鋳塊の製造装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3699701B2 (ja) * 2002-10-31 2005-09-28 日鉱金属加工株式会社 易加工高力高導電性銅合金

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58123846A (ja) * 1982-01-20 1983-07-23 Nippon Mining Co Ltd 半導体機器用リ−ド材
JPS63143230A (ja) * 1986-12-08 1988-06-15 Nippon Mining Co Ltd 析出強化型高力高導電性銅合金
JP2006283120A (ja) * 2005-03-31 2006-10-19 Nikko Metal Manufacturing Co Ltd 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ−Ｃｒ系銅合金及びその製造方法
JP2007136467A (ja) * 2005-11-15 2007-06-07 Hitachi Cable Ltd 銅合金鋳塊と該銅合金鋳塊の製造方法、および銅合金条の製造方法、並びに銅合金鋳塊の製造装置

Also Published As

Publication number Publication date
CN101646791B (zh) 2011-11-16
KR101159562B1 (ko) 2012-06-26
JP2008248333A (ja) 2008-10-16
TW200900515A (en) 2009-01-01
JP4937815B2 (ja) 2012-05-23
TWI367952B (ja) 2012-07-11
KR20090122303A (ko) 2009-11-26
CN101646791A (zh) 2010-02-10

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