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WO2009041197A1 - 電子材料用Ｃｕ－Ｎｉ－Ｓｉ－Ｃｏ系銅合金及びその製造方法 - Google Patents

電子材料用Ｃｕ－Ｎｉ－Ｓｉ－Ｃｏ系銅合金及びその製造方法 Download PDF

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Publication number
WO2009041197A1
WO2009041197A1 PCT/JP2008/065020 JP2008065020W WO2009041197A1 WO 2009041197 A1 WO2009041197 A1 WO 2009041197A1 JP 2008065020 W JP2008065020 W JP 2008065020W WO 2009041197 A1 WO2009041197 A1 WO 2009041197A1
Authority
WO
WIPO (PCT)
Prior art keywords
mass
copper alloy
electronic material
producing
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/065020
Other languages
English (en)
French (fr)
Inventor
Naohiko Era
Hiroshi Kuwagaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mining Holdings Inc
Original Assignee
Nippon Mining and Metals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining and Metals Co Ltd filed Critical Nippon Mining and Metals Co Ltd
Priority to KR1020097014526A priority Critical patent/KR101161597B1/ko
Priority to CA2669122A priority patent/CA2669122C/en
Priority to AU2008305239A priority patent/AU2008305239B2/en
Priority to CN2008800006528A priority patent/CN101541987B/zh
Priority to JP2009502370A priority patent/JP4303313B2/ja
Priority to EP08833441.2A priority patent/EP2194151B1/en
Priority to US12/312,990 priority patent/US8444779B2/en
Publication of WO2009041197A1 publication Critical patent/WO2009041197A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • B21B2003/005—Copper or its alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

　強度、導電率及びプレス打抜き性に優れたＣｕ－Ｎｉ－Ｓｉ－Ｃｏ系合金を提供する。 　Ｎｉ：１．０～２．５質量％、Ｃｏ：０．５～２．５質量％、Ｓｉ：０．３０～１．２質量％を含有し、残部がＣｕ及び不可避不純物からなる電子材料用銅合金であって、圧延方向に平行な断面で観察したときに、粒径が０．１μｍ以上１μｍ以下である第二相粒子の組成のばらつき及び面積率について、〔Ｎｉ＋Ｃｏ＋Ｓｉ〕量の中央値：ρ（質量％）が２０（質量％）≦ρ≦６０（質量％）、標準偏差：σ（Ｎｉ+Ｃｏ+Ｓｉ）がσ（Ｎｉ+Ｃｏ+Ｓｉ）≦３０（質量％）であり、面積率：Ｓ（％）が１％≦Ｓ≦１０％である電子材料用銅合金。
PCT/JP2008/065020 2007-09-28 2008-08-22 電子材料用Ｃｕ－Ｎｉ－Ｓｉ－Ｃｏ系銅合金及びその製造方法 Ceased WO2009041197A1 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
KR1020097014526A KR101161597B1 (ko) 2007-09-28 2008-08-22 전자 재료용 Ｃｕ-Ｎｉ-Ｓｉ-Ｃｏ계 구리합금 및 그 제조 방법
CA2669122A CA2669122C (en) 2007-09-28 2008-08-22 Cu-ni-si-co copper alloy for electronic materials and method for manufacturing same
AU2008305239A AU2008305239B2 (en) 2007-09-28 2008-08-22 Cu-Ni-Si-Co-base copper alloy for electronic material and process for producing the copper alloy
CN2008800006528A CN101541987B (zh) 2007-09-28 2008-08-22 电子材料用Cu-Ni-Si-Co系铜合金及其制造方法
JP2009502370A JP4303313B2 (ja) 2007-09-28 2008-08-22 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
EP08833441.2A EP2194151B1 (en) 2007-09-28 2008-08-22 Cu-ni-si-co-base copper alloy for electronic material and process for producing the copper alloy
US12/312,990 US8444779B2 (en) 2007-09-28 2008-08-22 Cu—Ni—Si—Co copper alloy for electronic materials and method for manufacturing same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007254197 2007-09-28
JP2007-254197 2007-09-28

Publications (1)

Publication Number Publication Date
WO2009041197A1 true WO2009041197A1 (ja) 2009-04-02

Family

ID=40511091

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/065020 Ceased WO2009041197A1 (ja) 2007-09-28 2008-08-22 電子材料用Ｃｕ－Ｎｉ－Ｓｉ－Ｃｏ系銅合金及びその製造方法

Country Status (10)

Country Link
US (1) US8444779B2 (ja)
EP (1) EP2194151B1 (ja)
JP (1) JP4303313B2 (ja)
KR (1) KR101161597B1 (ja)
CN (1) CN101541987B (ja)
AU (1) AU2008305239B2 (ja)
CA (1) CA2669122C (ja)
RU (1) RU2413021C1 (ja)
TW (1) TWI387657B (ja)
WO (1) WO2009041197A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103526072A (zh) * 2013-04-26 2014-01-22 洛阳新火种节能技术推广有限公司 一种铜基合金制作工艺
JP2016176105A (ja) * 2015-03-19 2016-10-06 Ｊｘ金属株式会社 電子部品用Ｃｕ−Ｎｉ−Ｃｏ−Ｓｉ合金
JP2017071811A (ja) * 2015-10-05 2017-04-13 Ｊｘ金属株式会社 電子部品用Ｃｕ−Ｃｏ−Ｎｉ−Ｓｉ合金
JP2019194361A (ja) * 2019-06-27 2019-11-07 Ｊｘ金属株式会社 電子部品用Ｃｕ−Ｎｉ−Ｃｏ−Ｓｉ合金

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EP2508635B1 (en) * 2009-12-02 2017-08-23 Furukawa Electric Co., Ltd. Copper alloy sheet and process for producing same
JP5400877B2 (ja) * 2009-12-02 2014-01-29 古河電気工業株式会社 銅合金板材およびその製造方法
JP4620173B1 (ja) * 2010-03-30 2011-01-26 Ｊｘ日鉱日石金属株式会社 Ｃｕ−Ｃｏ−Ｓｉ合金材
JP4677505B1 (ja) * 2010-03-31 2011-04-27 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
JP5451674B2 (ja) 2011-03-28 2014-03-26 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
JP4799701B1 (ja) 2011-03-29 2011-10-26 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系銅合金条及びその製造方法
JP5802150B2 (ja) 2012-02-24 2015-10-28 株式会社神戸製鋼所 銅合金
KR101715532B1 (ko) * 2012-07-26 2017-03-10 엔지케이 인슐레이터 엘티디 구리 합금 및 그의 제조 방법
JP6039999B2 (ja) * 2012-10-31 2016-12-07 Ｄｏｗａメタルテック株式会社 Ｃｕ−Ｎｉ−Ｃｏ−Ｓｉ系銅合金板材およびその製造法
JP5647703B2 (ja) * 2013-02-14 2015-01-07 Ｄｏｗａメタルテック株式会社 高強度Ｃｕ−Ｎｉ−Ｃｏ−Ｓｉ系銅合金板材およびその製造法並びに通電部品
CN103290254A (zh) * 2013-05-07 2013-09-11 锡山区羊尖泓之盛五金厂 一种耐高温超导铜线及其制备方法
CN105441770A (zh) * 2015-11-13 2016-03-30 太仓旺美模具有限公司 一种电子材料用铜合金
CN106244849A (zh) * 2016-10-13 2016-12-21 龙岩学院 一种超声波强化高性能铜合金的制备方法
CN106435248B (zh) * 2016-10-13 2018-05-04 龙岩学院 一种硅片切割砂浆制备高性能铜合金的方法
CN107326215A (zh) * 2017-08-15 2017-11-07 徐高杰 一种槽楔用铜合金的加工方法
JP6670277B2 (ja) * 2017-09-14 2020-03-18 Ｊｘ金属株式会社 金型摩耗性に優れたＣｕ−Ｎｉ−Ｓｉ系銅合金
CN107988512A (zh) * 2017-11-30 2018-05-04 中铝洛阳铜加工有限公司 一种高强高弹铜镍硅钴系引线框架加工工艺
CN111590084B (zh) * 2019-02-21 2022-02-22 刘丽 一种金属粉体材料的制备方法
CN110923505B (zh) * 2019-12-31 2021-11-02 内蒙古工业大学 Cu-Ni-Mn合金及其制备方法和应用
CN116021237B (zh) * 2023-01-06 2025-08-12 陕西斯瑞新材料股份有限公司 一种高铁车厢焊接电极用铬锆铜板的制造方法

Citations (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58123846A (ja) * 1982-01-20 1983-07-23 Nippon Mining Co Ltd 半導体機器用リ−ド材
JPS63143230A (ja) * 1986-12-08 1988-06-15 Nippon Mining Co Ltd 析出強化型高力高導電性銅合金
JPH10219374A (ja) 1997-02-10 1998-08-18 Kobe Steel Ltd 剪断加工性に優れる高強度銅合金
JPH11222641A (ja) 1998-01-30 1999-08-17 Furukawa Electric Co Ltd:The 導電性ばね用銅合金及及びその製造方法
JP2001049369A (ja) 1999-08-05 2001-02-20 Nippon Mining & Metals Co Ltd 電子材料用銅合金及びその製造方法
JP2005532477A (ja) 2002-07-05 2005-10-27 オリン コーポレイション コバルト、ニッケル、珪素を含む銅合金
JP3735005B2 (ja) 1999-10-15 2006-01-11 古河電気工業株式会社 打抜加工性に優れた銅合金およびその製造方法
JP3800279B2 (ja) 1998-08-31 2006-07-26 株式会社神戸製鋼所 プレス打抜き性が優れた銅合金板
JP2006233314A (ja) * 2005-02-28 2006-09-07 Dowa Mining Co Ltd 高強度銅合金
WO2006101172A1 (ja) 2005-03-24 2006-09-28 Nippon Mining & Metals Co., Ltd. 電子材料用銅合金
JP2006283120A (ja) * 2005-03-31 2006-10-19 Nikko Metal Manufacturing Co Ltd 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ−Ｃｒ系銅合金及びその製造方法
JP2007092269A (ja) 1998-08-12 2007-04-12 Ebara Corp 放射線グラフト重合用基材及びフィルター素材
JP2007100145A (ja) * 2005-09-30 2007-04-19 Dowa Holdings Co Ltd 曲げ加工性と疲労特性を改善した銅合金板材
JP2007107062A (ja) * 2005-10-14 2007-04-26 Nikko Kinzoku Kk 電子材料用Ｃｕ−Ｎｉ−Ｓｉ系銅合金
JP2007136467A (ja) * 2005-11-15 2007-06-07 Hitachi Cable Ltd 銅合金鋳塊と該銅合金鋳塊の製造方法、および銅合金条の製造方法、並びに銅合金鋳塊の製造装置
JP2008038231A (ja) * 2006-08-09 2008-02-21 Dowa Holdings Co Ltd 曲げ加工性に優れた高強度銅合金板材およびその製造法
JP2008248333A (ja) * 2007-03-30 2008-10-16 Nikko Kinzoku Kk 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6286151A (ja) * 1985-09-24 1987-04-20 Kobe Steel Ltd ピン・グリツト・アレイｉｃリ−ド用線材の製造方法
JPS63143320A (ja) * 1986-12-05 1988-06-15 Honda Motor Co Ltd タ−ボチヤ−ジヤの可動ベ−ン駆動機構
JP2737206B2 (ja) * 1989-02-15 1998-04-08 住友電気工業株式会社 電気・電子機器用銅合金細線
JP3408021B2 (ja) * 1995-06-30 2003-05-19 古河電気工業株式会社 電子電気部品用銅合金およびその製造方法
JP3520034B2 (ja) * 2000-07-25 2004-04-19 古河電気工業株式会社 電子電気機器部品用銅合金材
US20030155050A1 (en) * 2001-09-21 2003-08-21 Industrial Technology Research Institute High-strength and high-conductivity Cu-(Ni, Co, Fe)-Si copper alloy for use in leadframes
DE10206597A1 (de) * 2002-02-15 2003-08-28 Km Europa Metal Ag Aushärtbare Kupferlegierung
KR100787269B1 (ko) 2002-03-12 2007-12-21 후루카와 덴키 고교 가부시키가이샤 내응력완화특성에 뛰어난 고강도 고도전성 동합금선재의 제조방법
JP4255330B2 (ja) * 2003-07-31 2009-04-15 日鉱金属株式会社 疲労特性に優れたＣｕ−Ｎｉ−Ｓｉ系合金部材
JP4809602B2 (ja) * 2004-05-27 2011-11-09 古河電気工業株式会社 銅合金
JP4686658B2 (ja) * 2005-03-30 2011-05-25 Ｊｘ日鉱日石金属株式会社 プレス打抜き性に優れた電子部品用素材

Patent Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58123846A (ja) * 1982-01-20 1983-07-23 Nippon Mining Co Ltd 半導体機器用リ−ド材
JPS63143230A (ja) * 1986-12-08 1988-06-15 Nippon Mining Co Ltd 析出強化型高力高導電性銅合金
JP3797736B2 (ja) 1997-02-10 2006-07-19 株式会社神戸製鋼所 剪断加工性に優れる高強度銅合金
JPH10219374A (ja) 1997-02-10 1998-08-18 Kobe Steel Ltd 剪断加工性に優れる高強度銅合金
JPH11222641A (ja) 1998-01-30 1999-08-17 Furukawa Electric Co Ltd:The 導電性ばね用銅合金及及びその製造方法
JP2007092269A (ja) 1998-08-12 2007-04-12 Ebara Corp 放射線グラフト重合用基材及びフィルター素材
JP3800279B2 (ja) 1998-08-31 2006-07-26 株式会社神戸製鋼所 プレス打抜き性が優れた銅合金板
JP2001049369A (ja) 1999-08-05 2001-02-20 Nippon Mining & Metals Co Ltd 電子材料用銅合金及びその製造方法
JP3735005B2 (ja) 1999-10-15 2006-01-11 古河電気工業株式会社 打抜加工性に優れた銅合金およびその製造方法
JP2005532477A (ja) 2002-07-05 2005-10-27 オリン コーポレイション コバルト、ニッケル、珪素を含む銅合金
JP2006233314A (ja) * 2005-02-28 2006-09-07 Dowa Mining Co Ltd 高強度銅合金
WO2006101172A1 (ja) 2005-03-24 2006-09-28 Nippon Mining & Metals Co., Ltd. 電子材料用銅合金
JP2006283120A (ja) * 2005-03-31 2006-10-19 Nikko Metal Manufacturing Co Ltd 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ−Ｃｒ系銅合金及びその製造方法
JP2007100145A (ja) * 2005-09-30 2007-04-19 Dowa Holdings Co Ltd 曲げ加工性と疲労特性を改善した銅合金板材
JP2007107062A (ja) * 2005-10-14 2007-04-26 Nikko Kinzoku Kk 電子材料用Ｃｕ−Ｎｉ−Ｓｉ系銅合金
JP2007136467A (ja) * 2005-11-15 2007-06-07 Hitachi Cable Ltd 銅合金鋳塊と該銅合金鋳塊の製造方法、および銅合金条の製造方法、並びに銅合金鋳塊の製造装置
JP2008038231A (ja) * 2006-08-09 2008-02-21 Dowa Holdings Co Ltd 曲げ加工性に優れた高強度銅合金板材およびその製造法
JP2008248333A (ja) * 2007-03-30 2008-10-16 Nikko Kinzoku Kk 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103526072A (zh) * 2013-04-26 2014-01-22 洛阳新火种节能技术推广有限公司 一种铜基合金制作工艺
JP2016176105A (ja) * 2015-03-19 2016-10-06 Ｊｘ金属株式会社 電子部品用Ｃｕ−Ｎｉ−Ｃｏ−Ｓｉ合金
JP2017071811A (ja) * 2015-10-05 2017-04-13 Ｊｘ金属株式会社 電子部品用Ｃｕ−Ｃｏ−Ｎｉ−Ｓｉ合金
JP2019194361A (ja) * 2019-06-27 2019-11-07 Ｊｘ金属株式会社 電子部品用Ｃｕ−Ｎｉ−Ｃｏ−Ｓｉ合金

Also Published As

Publication number Publication date
KR20090094458A (ko) 2009-09-07
CN101541987A (zh) 2009-09-23
CA2669122A1 (en) 2009-04-02
US8444779B2 (en) 2013-05-21
KR101161597B1 (ko) 2012-07-03
EP2194151A4 (en) 2011-01-26
TW200918678A (en) 2009-05-01
TWI387657B (zh) 2013-03-01
RU2413021C1 (ru) 2011-02-27
CA2669122C (en) 2012-03-20
EP2194151B1 (en) 2014-08-13
AU2008305239A1 (en) 2009-04-02
US20090301614A1 (en) 2009-12-10
CN101541987B (zh) 2011-01-26
JPWO2009041197A1 (ja) 2011-01-20
AU2008305239B2 (en) 2010-04-22
EP2194151A1 (en) 2010-06-09
JP4303313B2 (ja) 2009-07-29

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