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WO2009051254A1 - Copper alloy powder and method for producing the same - Google Patents

Copper alloy powder and method for producing the same Download PDF

Info

Publication number
WO2009051254A1
WO2009051254A1 PCT/JP2008/068955 JP2008068955W WO2009051254A1 WO 2009051254 A1 WO2009051254 A1 WO 2009051254A1 JP 2008068955 W JP2008068955 W JP 2008068955W WO 2009051254 A1 WO2009051254 A1 WO 2009051254A1
Authority
WO
WIPO (PCT)
Prior art keywords
alloy powder
copper alloy
producing
same
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/068955
Other languages
French (fr)
Japanese (ja)
Inventor
Yasushi Kino
Koji Kajita
Kenji Tamaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sintobrator Ltd
Original Assignee
Sintobrator Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sintobrator Ltd filed Critical Sintobrator Ltd
Priority to CN200880102503A priority Critical patent/CN101815799A/en
Priority to JP2009514286A priority patent/JP4400696B2/en
Publication of WO2009051254A1 publication Critical patent/WO2009051254A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/02—Making metallic powder or suspensions thereof using physical processes
    • B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
    • B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
    • B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/01—Alloys based on copper with aluminium as the next major constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/02—Making metallic powder or suspensions thereof using physical processes
    • B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
    • B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
    • B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
    • B22F2009/0824—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid with a specific atomising fluid
    • B22F2009/0828—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid with a specific atomising fluid with water

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

Disclosed is a copper alloy powder having excellent oxidizability and electrical conductivity, whose sintering starting temperature can be set discretionally. This copper alloy powder enables low production cost, that is composed of the costs for raw materials and production facilities. Specifically disclosed is a copper alloy powder composed of 0.05-3.00% by mass of aluminum, and the balance of copper and unavoidable impurities, while additionally containing 0.01-0.10% by mass of boron, if necessary. This copper alloy powder is granulated by a water atomization process.
PCT/JP2008/068955 2007-10-18 2008-10-20 Copper alloy powder and method for producing the same Ceased WO2009051254A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200880102503A CN101815799A (en) 2007-10-18 2008-10-20 Copper alloy powder and method for producing the same
JP2009514286A JP4400696B2 (en) 2007-10-18 2008-10-20 Copper alloy powder and method for producing the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-271770 2007-10-18
JP2007271770 2007-10-18

Publications (1)

Publication Number Publication Date
WO2009051254A1 true WO2009051254A1 (en) 2009-04-23

Family

ID=40567514

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/068955 Ceased WO2009051254A1 (en) 2007-10-18 2008-10-20 Copper alloy powder and method for producing the same

Country Status (5)

Country Link
JP (1) JP4400696B2 (en)
KR (1) KR100991626B1 (en)
CN (1) CN101815799A (en)
TW (1) TWI421355B (en)
WO (1) WO2009051254A1 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009235556A (en) * 2008-03-04 2009-10-15 Mitsui Mining & Smelting Co Ltd Copper powder for conductive pastes, and conductive paste
US7776163B2 (en) 2008-12-23 2010-08-17 Xiamen Lota International Co., Ltd. Lead-free free-cutting aluminum brass alloy and its manufacturing method
WO2011016217A1 (en) * 2009-08-05 2011-02-10 日立化成工業株式会社 Cu-Al ALLOY POWDER, ALLOY PASTE UTILIZING SAME, AND ELECTRONIC COMPONENT
JP2012067327A (en) * 2010-09-21 2012-04-05 Mitsui Mining & Smelting Co Ltd Copper powder for conductive paste, and conductive paste
JP2013026196A (en) * 2011-07-26 2013-02-04 Murata Mfg Co Ltd Conductive paste and ceramic electronic component
JP2016204700A (en) * 2015-04-21 2016-12-08 住友金属鉱山株式会社 Copper powder
JP2017115220A (en) * 2015-12-25 2017-06-29 株式会社ダイヘン Metal powder, method for producing laminated molding and laminated molding
EP4509246A4 (en) * 2022-05-09 2025-09-10 Fukuda Metal Foil & Powder Co Ltd Copper alloy powder for additive manufacturing and method for producing said copper alloy powder, as well as additively manufactured articles made of copper alloy and method for producing the same

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9023254B2 (en) * 2011-10-20 2015-05-05 E I Du Pont De Nemours And Company Thick film silver paste and its use in the manufacture of semiconductor devices
JP6425943B2 (en) * 2013-08-27 2018-11-21 Ntn株式会社 Sintered bearing for fuel pump and method of manufacturing the same
JP6030186B1 (en) 2015-05-13 2016-11-24 株式会社ダイヘン Copper alloy powder, manufacturing method of layered object, and layered object
WO2018079304A1 (en) 2016-10-25 2018-05-03 株式会社ダイヘン Copper alloy powder, laminate molding production method, and laminate molding
CA3057056C (en) * 2017-08-21 2022-12-06 Jx Nippon Mining & Metals Corporation Copper alloy powder for lamination shaping, lamination shaped product production method, and lamination shaped product
JP6467535B1 (en) * 2018-02-13 2019-02-13 福田金属箔粉工業株式会社 Cu-based powder for infiltration
TWI823518B (en) * 2022-06-14 2023-11-21 國立成功大學 Method for sintering base metal electrodes or alloys at high temperature in air
KR102732700B1 (en) * 2022-11-28 2024-11-25 주식회사 비앤씨 Copper alloy manufacturing method, copper alloy manufactured from it

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5931838A (en) * 1982-08-18 1984-02-21 Teikoku Piston Ring Co Ltd Production of dispersion reinforced copper alloy material having heat resistance and electrical conductivity
JPS6141737A (en) * 1984-07-31 1986-02-28 Tamagawa Kikai Kinzoku Kk Cu alloy for electric fuse
JPS61207554A (en) * 1985-03-11 1986-09-13 Sumitomo Light Metal Ind Ltd Manufacture of heat resistant and high conductivity dispersion strengthened copper alloy material
JPH0375321A (en) * 1989-08-18 1991-03-29 Kobe Steel Ltd Manufacture of oxide dispersion strengthened copper alloy
JPH09296234A (en) * 1996-04-30 1997-11-18 Sumitomo Light Metal Ind Ltd Method for producing alumina dispersion strengthened copper
JPH11286702A (en) * 1998-04-01 1999-10-19 Mitsui Mining & Smelting Co Ltd Method for producing alumina dispersion strengthened copper powder
JP2000042836A (en) * 1998-05-19 2000-02-15 Yazaki Corp Electrode material for electric discharge machining and method for producing the same
JP2005314806A (en) * 2004-03-29 2005-11-10 Nano Gijutsu Kenkyusho:Kk Powder of nano crystalline copper metal and nano crystalline copper alloy having high hardness and high electric conductivity, bulk material of nano crystalline copper or copper alloy having high hardness, high strength, high electric conductivity and high toughness, and production method thereof

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4494048B2 (en) * 2004-03-15 2010-06-30 トヨタ自動車株式会社 Overlay wear resistant copper alloy and valve seat

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5931838A (en) * 1982-08-18 1984-02-21 Teikoku Piston Ring Co Ltd Production of dispersion reinforced copper alloy material having heat resistance and electrical conductivity
JPS6141737A (en) * 1984-07-31 1986-02-28 Tamagawa Kikai Kinzoku Kk Cu alloy for electric fuse
JPS61207554A (en) * 1985-03-11 1986-09-13 Sumitomo Light Metal Ind Ltd Manufacture of heat resistant and high conductivity dispersion strengthened copper alloy material
JPH0375321A (en) * 1989-08-18 1991-03-29 Kobe Steel Ltd Manufacture of oxide dispersion strengthened copper alloy
JPH09296234A (en) * 1996-04-30 1997-11-18 Sumitomo Light Metal Ind Ltd Method for producing alumina dispersion strengthened copper
JPH11286702A (en) * 1998-04-01 1999-10-19 Mitsui Mining & Smelting Co Ltd Method for producing alumina dispersion strengthened copper powder
JP2000042836A (en) * 1998-05-19 2000-02-15 Yazaki Corp Electrode material for electric discharge machining and method for producing the same
JP2005314806A (en) * 2004-03-29 2005-11-10 Nano Gijutsu Kenkyusho:Kk Powder of nano crystalline copper metal and nano crystalline copper alloy having high hardness and high electric conductivity, bulk material of nano crystalline copper or copper alloy having high hardness, high strength, high electric conductivity and high toughness, and production method thereof

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009235556A (en) * 2008-03-04 2009-10-15 Mitsui Mining & Smelting Co Ltd Copper powder for conductive pastes, and conductive paste
US7776163B2 (en) 2008-12-23 2010-08-17 Xiamen Lota International Co., Ltd. Lead-free free-cutting aluminum brass alloy and its manufacturing method
WO2011016217A1 (en) * 2009-08-05 2011-02-10 日立化成工業株式会社 Cu-Al ALLOY POWDER, ALLOY PASTE UTILIZING SAME, AND ELECTRONIC COMPONENT
JP2011034894A (en) * 2009-08-05 2011-02-17 Hitachi Chem Co Ltd Cu-Al ALLOY POWDER, ALLOY PASTE USING IT, AND ELECTRONIC PARTS
CN102470438A (en) * 2009-08-05 2012-05-23 日立化成工业株式会社 Cu-Al alloy powder, alloy paste utilizing same, and electronic component
JP2012067327A (en) * 2010-09-21 2012-04-05 Mitsui Mining & Smelting Co Ltd Copper powder for conductive paste, and conductive paste
JP2013026196A (en) * 2011-07-26 2013-02-04 Murata Mfg Co Ltd Conductive paste and ceramic electronic component
JP2016204700A (en) * 2015-04-21 2016-12-08 住友金属鉱山株式会社 Copper powder
JP2017115220A (en) * 2015-12-25 2017-06-29 株式会社ダイヘン Metal powder, method for producing laminated molding and laminated molding
US20170182557A1 (en) * 2015-12-25 2017-06-29 Daihen Corporation Metal powder, method of producing additively-manufactured article, and additively-manufactured article
WO2017110445A1 (en) * 2015-12-25 2017-06-29 株式会社ダイヘン Metal powder, method for producing multilayer shaped article, and multilayer shaped article
KR20180091083A (en) * 2015-12-25 2018-08-14 가부시키가이샤 다이헨 METHOD FOR MANUFACTURING METAL POWDER, LAMINATED ART, AND LAMINATED ART
US10967431B2 (en) 2015-12-25 2021-04-06 Daihen Corporation Metal powder, method of producing additively-manufactured article, and additively-manufactured article
KR102238218B1 (en) * 2015-12-25 2021-04-08 가부시키가이샤 다이헨 Metal powder, manufacturing method of laminated sculpture and laminated sculpture
US11185924B2 (en) 2015-12-25 2021-11-30 Daihen Corporation Metal powder, method of producing additively-manufactured article, and additively-manufactured article
EP4509246A4 (en) * 2022-05-09 2025-09-10 Fukuda Metal Foil & Powder Co Ltd Copper alloy powder for additive manufacturing and method for producing said copper alloy powder, as well as additively manufactured articles made of copper alloy and method for producing the same

Also Published As

Publication number Publication date
JPWO2009051254A1 (en) 2011-03-03
JP4400696B2 (en) 2010-01-20
KR100991626B1 (en) 2010-11-04
KR20100068262A (en) 2010-06-22
CN101815799A (en) 2010-08-25
TWI421355B (en) 2014-01-01
TW200927959A (en) 2009-07-01

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