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WO2009051254A1 - Poudre d'alliage de cuivre et son procédé de production - Google Patents

Poudre d'alliage de cuivre et son procédé de production Download PDF

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Publication number
WO2009051254A1
WO2009051254A1 PCT/JP2008/068955 JP2008068955W WO2009051254A1 WO 2009051254 A1 WO2009051254 A1 WO 2009051254A1 JP 2008068955 W JP2008068955 W JP 2008068955W WO 2009051254 A1 WO2009051254 A1 WO 2009051254A1
Authority
WO
WIPO (PCT)
Prior art keywords
alloy powder
copper alloy
producing
same
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/068955
Other languages
English (en)
Japanese (ja)
Inventor
Yasushi Kino
Koji Kajita
Kenji Tamaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sintobrator Ltd
Original Assignee
Sintobrator Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sintobrator Ltd filed Critical Sintobrator Ltd
Priority to CN200880102503A priority Critical patent/CN101815799A/zh
Priority to JP2009514286A priority patent/JP4400696B2/ja
Publication of WO2009051254A1 publication Critical patent/WO2009051254A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/02—Making metallic powder or suspensions thereof using physical processes
    • B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
    • B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
    • B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/01—Alloys based on copper with aluminium as the next major constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/02—Making metallic powder or suspensions thereof using physical processes
    • B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
    • B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
    • B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
    • B22F2009/0824—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid with a specific atomising fluid
    • B22F2009/0828—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid with a specific atomising fluid with water

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

La présente invention concerne une poudre d'alliage de cuivre présentant une excellente aptitude à l'oxydation et une excellente conductivité thermique, dont la température de début de frittage peut être définie à discrétion. Cette poudre d'alliage de cuivre permet d'obtenir de faibles coûts de production, à savoir des coûts composés des coûts de la matière première et des installations de production. L'invention concerne en particulier une poudre d'alliage de cuivre composée de 0,05 à 3,00 % en masse d'aluminium et le reste de cuivre et d'impuretés inévitables, contenant également en outre 0,01 à 0,10 % en masse de bore, si nécessaire. Cette poudre d'alliage de cuivre est granulée par un procédé par pulvérisation d'eau.
PCT/JP2008/068955 2007-10-18 2008-10-20 Poudre d'alliage de cuivre et son procédé de production Ceased WO2009051254A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200880102503A CN101815799A (zh) 2007-10-18 2008-10-20 铜合金粉末及其制造方法
JP2009514286A JP4400696B2 (ja) 2007-10-18 2008-10-20 銅合金粉末およびその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-271770 2007-10-18
JP2007271770 2007-10-18

Publications (1)

Publication Number Publication Date
WO2009051254A1 true WO2009051254A1 (fr) 2009-04-23

Family

ID=40567514

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/068955 Ceased WO2009051254A1 (fr) 2007-10-18 2008-10-20 Poudre d'alliage de cuivre et son procédé de production

Country Status (5)

Country Link
JP (1) JP4400696B2 (fr)
KR (1) KR100991626B1 (fr)
CN (1) CN101815799A (fr)
TW (1) TWI421355B (fr)
WO (1) WO2009051254A1 (fr)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009235556A (ja) * 2008-03-04 2009-10-15 Mitsui Mining & Smelting Co Ltd 導電性ペースト用銅粉及び導電性ペースト
US7776163B2 (en) 2008-12-23 2010-08-17 Xiamen Lota International Co., Ltd. Lead-free free-cutting aluminum brass alloy and its manufacturing method
WO2011016217A1 (fr) * 2009-08-05 2011-02-10 日立化成工業株式会社 POUDRE D'ALLIAGE Cu-Al, PÂTE D'ALLIAGE UTILISANT CELLE-CI, ET COMPOSANT ÉLECTRONIQUE
JP2012067327A (ja) * 2010-09-21 2012-04-05 Mitsui Mining & Smelting Co Ltd 導電性ペースト用銅粉及び導電性ペースト
JP2013026196A (ja) * 2011-07-26 2013-02-04 Murata Mfg Co Ltd 導電性ペーストおよびセラミック電子部品
JP2016204700A (ja) * 2015-04-21 2016-12-08 住友金属鉱山株式会社 銅粉末
JP2017115220A (ja) * 2015-12-25 2017-06-29 株式会社ダイヘン 金属粉末、積層造形物の製造方法および積層造形物
EP4509246A4 (fr) * 2022-05-09 2025-09-10 Fukuda Metal Foil & Powder Co Ltd Poudre d'alliage de cuivre pour fabrication additive et procédé de production de ladite poudre d'alliage de cuivre, et article fabriqué de manière additive d'alliage de cuivre et son procédé de production

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9023254B2 (en) * 2011-10-20 2015-05-05 E I Du Pont De Nemours And Company Thick film silver paste and its use in the manufacture of semiconductor devices
JP6425943B2 (ja) * 2013-08-27 2018-11-21 Ntn株式会社 燃料ポンプ用焼結軸受およびその製造方法
JP6030186B1 (ja) 2015-05-13 2016-11-24 株式会社ダイヘン 銅合金粉末、積層造形物の製造方法および積層造形物
WO2018079304A1 (fr) 2016-10-25 2018-05-03 株式会社ダイヘン Poudre d'alliage de cuivre, procédé de production de moulage de stratifié et moulage de stratifié
CA3057056C (fr) * 2017-08-21 2022-12-06 Jx Nippon Mining & Metals Corporation Poudre d'alliage de cuivre destinee au formage par stratification, procede de production de produit forme par stratification, et produit forme par stratification
JP6467535B1 (ja) * 2018-02-13 2019-02-13 福田金属箔粉工業株式会社 溶浸用Ｃｕ系粉末
TWI823518B (zh) * 2022-06-14 2023-11-21 國立成功大學 卑金屬電極或合金在空氣下高溫燒結之方法
KR102732700B1 (ko) * 2022-11-28 2024-11-25 주식회사 비앤씨 구리-이종금속 합금의 제조방법, 이로부터 제조되는 구리-이종금속 합금

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5931838A (ja) * 1982-08-18 1984-02-21 Teikoku Piston Ring Co Ltd 耐熱，導電性分散強化銅合金材料の製造方法
JPS6141737A (ja) * 1984-07-31 1986-02-28 Tamagawa Kikai Kinzoku Kk 電気ヒユ−ズ用Ｃｕ合金
JPS61207554A (ja) * 1985-03-11 1986-09-13 Sumitomo Light Metal Ind Ltd 耐熱、高導電性分散強化銅合金材料の製造方法
JPH0375321A (ja) * 1989-08-18 1991-03-29 Kobe Steel Ltd 酸化物分散強化銅合金の製造方法
JPH09296234A (ja) * 1996-04-30 1997-11-18 Sumitomo Light Metal Ind Ltd アルミナ分散強化銅の製造方法
JPH11286702A (ja) * 1998-04-01 1999-10-19 Mitsui Mining & Smelting Co Ltd アルミナ分散強化銅粉の製造方法
JP2000042836A (ja) * 1998-05-19 2000-02-15 Yazaki Corp 放電加工用電極材料及びその製造方法
JP2005314806A (ja) * 2004-03-29 2005-11-10 Nano Gijutsu Kenkyusho:Kk 高硬度で高導電性を有するナノ結晶銅金属及びナノ結晶銅合金の粉末、高硬度・高強度で高導電性を有する強靱なナノ結晶銅又は銅合金のバルク材並びにそれらの製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4494048B2 (ja) * 2004-03-15 2010-06-30 トヨタ自動車株式会社 肉盛耐摩耗性銅合金及びバルブシート

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5931838A (ja) * 1982-08-18 1984-02-21 Teikoku Piston Ring Co Ltd 耐熱，導電性分散強化銅合金材料の製造方法
JPS6141737A (ja) * 1984-07-31 1986-02-28 Tamagawa Kikai Kinzoku Kk 電気ヒユ−ズ用Ｃｕ合金
JPS61207554A (ja) * 1985-03-11 1986-09-13 Sumitomo Light Metal Ind Ltd 耐熱、高導電性分散強化銅合金材料の製造方法
JPH0375321A (ja) * 1989-08-18 1991-03-29 Kobe Steel Ltd 酸化物分散強化銅合金の製造方法
JPH09296234A (ja) * 1996-04-30 1997-11-18 Sumitomo Light Metal Ind Ltd アルミナ分散強化銅の製造方法
JPH11286702A (ja) * 1998-04-01 1999-10-19 Mitsui Mining & Smelting Co Ltd アルミナ分散強化銅粉の製造方法
JP2000042836A (ja) * 1998-05-19 2000-02-15 Yazaki Corp 放電加工用電極材料及びその製造方法
JP2005314806A (ja) * 2004-03-29 2005-11-10 Nano Gijutsu Kenkyusho:Kk 高硬度で高導電性を有するナノ結晶銅金属及びナノ結晶銅合金の粉末、高硬度・高強度で高導電性を有する強靱なナノ結晶銅又は銅合金のバルク材並びにそれらの製造方法

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009235556A (ja) * 2008-03-04 2009-10-15 Mitsui Mining & Smelting Co Ltd 導電性ペースト用銅粉及び導電性ペースト
US7776163B2 (en) 2008-12-23 2010-08-17 Xiamen Lota International Co., Ltd. Lead-free free-cutting aluminum brass alloy and its manufacturing method
WO2011016217A1 (fr) * 2009-08-05 2011-02-10 日立化成工業株式会社 POUDRE D'ALLIAGE Cu-Al, PÂTE D'ALLIAGE UTILISANT CELLE-CI, ET COMPOSANT ÉLECTRONIQUE
JP2011034894A (ja) * 2009-08-05 2011-02-17 Hitachi Chem Co Ltd Ｃｕ−Ａｌ合金粉末、それを用いた合金ペーストおよび電子部品
CN102470438A (zh) * 2009-08-05 2012-05-23 日立化成工业株式会社 Cu-Al 合金粉末、采用该合金粉末的合金糊膏以及电子部件
JP2012067327A (ja) * 2010-09-21 2012-04-05 Mitsui Mining & Smelting Co Ltd 導電性ペースト用銅粉及び導電性ペースト
JP2013026196A (ja) * 2011-07-26 2013-02-04 Murata Mfg Co Ltd 導電性ペーストおよびセラミック電子部品
JP2016204700A (ja) * 2015-04-21 2016-12-08 住友金属鉱山株式会社 銅粉末
JP2017115220A (ja) * 2015-12-25 2017-06-29 株式会社ダイヘン 金属粉末、積層造形物の製造方法および積層造形物
US20170182557A1 (en) * 2015-12-25 2017-06-29 Daihen Corporation Metal powder, method of producing additively-manufactured article, and additively-manufactured article
WO2017110445A1 (fr) * 2015-12-25 2017-06-29 株式会社ダイヘン Poudre métallique, procédé de production d'un article façonné multicouche, et article multicouche
KR20180091083A (ko) * 2015-12-25 2018-08-14 가부시키가이샤 다이헨 금속 분말, 적층 조형물의 제조방법 및 적층 조형물
US10967431B2 (en) 2015-12-25 2021-04-06 Daihen Corporation Metal powder, method of producing additively-manufactured article, and additively-manufactured article
KR102238218B1 (ko) * 2015-12-25 2021-04-08 가부시키가이샤 다이헨 금속 분말, 적층 조형물의 제조방법 및 적층 조형물
US11185924B2 (en) 2015-12-25 2021-11-30 Daihen Corporation Metal powder, method of producing additively-manufactured article, and additively-manufactured article
EP4509246A4 (fr) * 2022-05-09 2025-09-10 Fukuda Metal Foil & Powder Co Ltd Poudre d'alliage de cuivre pour fabrication additive et procédé de production de ladite poudre d'alliage de cuivre, et article fabriqué de manière additive d'alliage de cuivre et son procédé de production

Also Published As

Publication number Publication date
JPWO2009051254A1 (ja) 2011-03-03
JP4400696B2 (ja) 2010-01-20
KR100991626B1 (ko) 2010-11-04
KR20100068262A (ko) 2010-06-22
CN101815799A (zh) 2010-08-25
TWI421355B (zh) 2014-01-01
TW200927959A (en) 2009-07-01

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