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WO2008108335A1 - 半導体装置 - Google Patents

半導体装置 Download PDF

Info

Publication number
WO2008108335A1
WO2008108335A1 PCT/JP2008/053769 JP2008053769W WO2008108335A1 WO 2008108335 A1 WO2008108335 A1 WO 2008108335A1 JP 2008053769 W JP2008053769 W JP 2008053769W WO 2008108335 A1 WO2008108335 A1 WO 2008108335A1
Authority
WO
WIPO (PCT)
Prior art keywords
dram
semiconductor device
logic lsi
gpu
bypassing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/053769
Other languages
English (en)
French (fr)
Inventor
Isao Sugaya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Priority to JP2009502573A priority Critical patent/JP5521546B2/ja
Priority to US12/530,093 priority patent/US8183686B2/en
Publication of WO2008108335A1 publication Critical patent/WO2008108335A1/ja
Anticipated expiration legal-status Critical
Priority to US13/457,051 priority patent/US8878358B2/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/18—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of the types provided for in two or more different main groups of the same subclass of H10B, H10D, H10F, H10H, H10K or H10N
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes
    • H01L2225/04—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same main group of the same subclass of class H10
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06589—Thermal management, e.g. cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H01L2924/15321—Connection portion the connection portion being formed on the die mounting surface of the substrate being a ball array, e.g. BGA

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

　ＤＲＡＭ１の一側に配置され、該ＤＲＡＭに接合されるロジックＬＳＩ４と、ＤＲＡＭ１の他側に配置され、ＤＲＡＭ１及びロジックＬＳＩ４の熱を放出するための放熱部材６との間に、それらの間でＤＲＡＭ１を迂回して伸びる熱バイパス経路５を設ける。これにより、ＣＰＵ、ＧＰＵ等のロジックＬＳＩから発生する熱を効率的に放熱でき、温度上昇や温度分布を小さくすることが可能な半導体装置を提供することができる。
PCT/JP2008/053769 2007-03-06 2008-03-03 半導体装置 Ceased WO2008108335A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009502573A JP5521546B2 (ja) 2007-03-06 2008-03-03 半導体装置
US12/530,093 US8183686B2 (en) 2007-03-06 2008-03-03 Semiconductor device
US13/457,051 US8878358B2 (en) 2007-03-06 2012-04-26 Semiconductor device

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007055354 2007-03-06
JP2007-055354 2007-03-06
JP2007091082 2007-03-30
JP2007-091082 2007-03-30

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US12/530,093 A-371-Of-International US8183686B2 (en) 2007-03-06 2008-03-03 Semiconductor device
US13/457,051 Continuation US8878358B2 (en) 2007-03-06 2012-04-26 Semiconductor device

Publications (1)

Publication Number Publication Date
WO2008108335A1 true WO2008108335A1 (ja) 2008-09-12

Family

ID=39738212

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/053769 Ceased WO2008108335A1 (ja) 2007-03-06 2008-03-03 半導体装置

Country Status (5)

Country Link
US (2) US8183686B2 (ja)
JP (1) JP5521546B2 (ja)
KR (1) KR101477309B1 (ja)
TW (1) TWI456712B (ja)
WO (1) WO2008108335A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010109333A (ja) * 2008-11-03 2010-05-13 Headway Technologies Inc ヒートシンクを備えた積層チップパッケージ
CN103988296A (zh) * 2011-11-14 2014-08-13 美光科技公司 具有多个热路径的堆叠半导体裸片组合件及相关联系统和方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9136202B2 (en) * 2012-04-17 2015-09-15 Qualcomm Incorporated Enhanced package thermal management using external and internal capacitive thermal material
CN104053337A (zh) * 2013-03-15 2014-09-17 君瞻科技股份有限公司 具散热功能的电子装置及其散热模块
US10541229B2 (en) 2015-02-19 2020-01-21 Micron Technology, Inc. Apparatuses and methods for semiconductor die heat dissipation
US10008395B2 (en) * 2016-10-19 2018-06-26 Micron Technology, Inc. Stacked semiconductor die assemblies with high efficiency thermal paths and molded underfill
US12317407B2 (en) 2021-11-12 2025-05-27 Samsung Electronics Co., Ltd. Electronic device including printed circuit board structure including thermal interface material
WO2023085672A1 (ko) * 2021-11-12 2023-05-19 삼성전자주식회사 열 전도성 계면 물질을 수용하는 인쇄 회로 기판 구조체를 포함하는 전자 장치

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6336052U (ja) * 1986-08-27 1988-03-08
JPH0878616A (ja) * 1994-09-02 1996-03-22 Fujitsu Ltd マルチチップ・モジュール
JPH0878618A (ja) * 1994-09-08 1996-03-22 Fujitsu Ltd マルチチップモジュール及びその製造方法
JP2002110869A (ja) * 2000-09-26 2002-04-12 Toshiba Corp 半導体装置
JP2005005529A (ja) * 2003-06-12 2005-01-06 Toshiba Corp 三次元実装半導体モジュール及び三次元実装半導体システム
JP2005166752A (ja) * 2003-11-28 2005-06-23 Ngk Spark Plug Co Ltd 半導体部品の冷却装置及び冷却装置付き半導体部品
JP2006210892A (ja) * 2004-12-27 2006-08-10 Nec Corp 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6336052A (ja) 1986-07-30 1988-02-16 Aisin Seiki Co Ltd スタ−リング機関の高温熱交換器
JPH07235633A (ja) * 1994-02-25 1995-09-05 Fujitsu Ltd マルチチップモジュール
TW367436B (en) * 1997-11-19 1999-08-21 Sun Tai Lin Heat pipes radiator
US7271479B2 (en) * 2004-11-03 2007-09-18 Broadcom Corporation Flip chip package including a non-planar heat spreader and method of making the same

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6336052U (ja) * 1986-08-27 1988-03-08
JPH0878616A (ja) * 1994-09-02 1996-03-22 Fujitsu Ltd マルチチップ・モジュール
JPH0878618A (ja) * 1994-09-08 1996-03-22 Fujitsu Ltd マルチチップモジュール及びその製造方法
JP2002110869A (ja) * 2000-09-26 2002-04-12 Toshiba Corp 半導体装置
JP2005005529A (ja) * 2003-06-12 2005-01-06 Toshiba Corp 三次元実装半導体モジュール及び三次元実装半導体システム
JP2005166752A (ja) * 2003-11-28 2005-06-23 Ngk Spark Plug Co Ltd 半導体部品の冷却装置及び冷却装置付き半導体部品
JP2006210892A (ja) * 2004-12-27 2006-08-10 Nec Corp 半導体装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010109333A (ja) * 2008-11-03 2010-05-13 Headway Technologies Inc ヒートシンクを備えた積層チップパッケージ
CN103988296A (zh) * 2011-11-14 2014-08-13 美光科技公司 具有多个热路径的堆叠半导体裸片组合件及相关联系统和方法
JP2014533440A (ja) * 2011-11-14 2014-12-11 マイクロン テクノロジー， インク． 温度管理強化型半導体ダイアセンブリ、それを含む半導体デバイスおよび関連方法
JP2014533439A (ja) * 2011-11-14 2014-12-11 マイクロン テクノロジー， インク． 複数の熱経路を備える積み重ねられた半導体ダイアセンブリ、ならびに関連するシステムおよび方法
US9269646B2 (en) 2011-11-14 2016-02-23 Micron Technology, Inc. Semiconductor die assemblies with enhanced thermal management and semiconductor devices including same
US10170389B2 (en) 2011-11-14 2019-01-01 Micron Technology, Inc. Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods
US10741468B2 (en) 2011-11-14 2020-08-11 Micron Technology, Inc. Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods
US11594462B2 (en) 2011-11-14 2023-02-28 Micron Technology, Inc. Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods

Also Published As

Publication number Publication date
JP5521546B2 (ja) 2014-06-18
US20100102441A1 (en) 2010-04-29
KR101477309B1 (ko) 2014-12-29
TWI456712B (zh) 2014-10-11
US8878358B2 (en) 2014-11-04
JPWO2008108335A1 (ja) 2010-06-17
US20120205792A1 (en) 2012-08-16
US8183686B2 (en) 2012-05-22
KR20090119772A (ko) 2009-11-19
TW200839978A (en) 2008-10-01

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