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WO2008078737A1 - 電子機器の冷却装置及び冷却方法 - Google Patents

電子機器の冷却装置及び冷却方法 Download PDF

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Publication number
WO2008078737A1
WO2008078737A1 PCT/JP2007/074820 JP2007074820W WO2008078737A1 WO 2008078737 A1 WO2008078737 A1 WO 2008078737A1 JP 2007074820 W JP2007074820 W JP 2007074820W WO 2008078737 A1 WO2008078737 A1 WO 2008078737A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic apparatus
cooling
lsi
signal transmission
transmission speed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/074820
Other languages
English (en)
French (fr)
Inventor
Tomotaka Ishida
Minoru Yoshikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of WO2008078737A1 publication Critical patent/WO2008078737A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

　ＬＳＩのより近くに部品を実装することができるようにして配線長距離を短くすることでき、信号伝達速度を向上させることができる電子機器の冷却装置及び冷却方法を提供する。 　単一の液冷ユニットを単一の発熱体に熱的に接合し、複数のフィンの存在領域として規定される面と前記単一の発熱体の前記単一の液冷ユニットに対する熱的接合面を実質的に同一形状でかつ同一面積とするので、冷却装置を可及的に縮小することができ、例えば電子機器としてのＬＳＩのすぐ近くにＬＳＩの周辺部品を実装することができ、結果として配線長を短くし、信号伝達速度を向上させることができる。
PCT/JP2007/074820 2006-12-22 2007-12-25 電子機器の冷却装置及び冷却方法 Ceased WO2008078737A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006-346619 2006-12-22
JP2006346619A JP2010080455A (ja) 2006-12-22 2006-12-22 電子機器の冷却装置及び冷却方法

Publications (1)

Publication Number Publication Date
WO2008078737A1 true WO2008078737A1 (ja) 2008-07-03

Family

ID=39562526

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/074820 Ceased WO2008078737A1 (ja) 2006-12-22 2007-12-25 電子機器の冷却装置及び冷却方法

Country Status (2)

Country Link
JP (1) JP2010080455A (ja)
WO (1) WO2008078737A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010010826A1 (ja) * 2008-07-24 2010-01-28 トヨタ自動車株式会社 熱交換器及びその製造方法
JP2011071386A (ja) * 2009-09-28 2011-04-07 Furukawa Electric Co Ltd:The 冷却装置
US20170223869A1 (en) * 2014-02-25 2017-08-03 Sanoh Industrial Co., Ltd. Cooling device and cooling device manufacturing method

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6083516B2 (ja) * 2013-03-28 2017-02-22 富士通株式会社 マイクロチャネル熱交換装置及び電子機器
JP7407577B2 (ja) * 2019-12-04 2024-01-04 三菱電機株式会社 ヒートシンク
EP3842726A1 (en) * 2019-12-25 2021-06-30 Showa Denko Packaging Co., Ltd. Heat exchanger and inner fin thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003324173A (ja) * 2002-05-02 2003-11-14 Nissan Motor Co Ltd 半導体素子の冷却装置
JP2004022914A (ja) * 2002-06-19 2004-01-22 Hitachi Ltd 絶縁回路基板とその冷却構造及ぴパワー半導体装置とその冷却構造
JP2004296748A (ja) * 2003-03-26 2004-10-21 Nissan Motor Co Ltd 半導体モジュールの冷却装置
JP2004349324A (ja) * 2003-05-20 2004-12-09 Hitachi Ltd 直接水冷型パワー半導体モジュール構造
JP2005324647A (ja) * 2004-05-13 2005-11-24 Ishikawajima Harima Heavy Ind Co Ltd バトックフロー型船

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003324173A (ja) * 2002-05-02 2003-11-14 Nissan Motor Co Ltd 半導体素子の冷却装置
JP2004022914A (ja) * 2002-06-19 2004-01-22 Hitachi Ltd 絶縁回路基板とその冷却構造及ぴパワー半導体装置とその冷却構造
JP2004296748A (ja) * 2003-03-26 2004-10-21 Nissan Motor Co Ltd 半導体モジュールの冷却装置
JP2004349324A (ja) * 2003-05-20 2004-12-09 Hitachi Ltd 直接水冷型パワー半導体モジュール構造
JP2005324647A (ja) * 2004-05-13 2005-11-24 Ishikawajima Harima Heavy Ind Co Ltd バトックフロー型船

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010010826A1 (ja) * 2008-07-24 2010-01-28 トヨタ自動車株式会社 熱交換器及びその製造方法
JP2010025521A (ja) * 2008-07-24 2010-02-04 Toyota Motor Corp 熱交換器及びその製造方法
KR101232403B1 (ko) * 2008-07-24 2013-02-12 도요타지도샤가부시키가이샤 열교환기 및 그 제조 방법
JP2011071386A (ja) * 2009-09-28 2011-04-07 Furukawa Electric Co Ltd:The 冷却装置
US20170223869A1 (en) * 2014-02-25 2017-08-03 Sanoh Industrial Co., Ltd. Cooling device and cooling device manufacturing method

Also Published As

Publication number Publication date
JP2010080455A (ja) 2010-04-08

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