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WO2016122039A1 - Bloc de broches et dispositif d'essai le comprenant - Google Patents

Bloc de broches et dispositif d'essai le comprenant Download PDF

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Publication number
WO2016122039A1
WO2016122039A1 PCT/KR2015/001158 KR2015001158W WO2016122039A1 WO 2016122039 A1 WO2016122039 A1 WO 2016122039A1 KR 2015001158 W KR2015001158 W KR 2015001158W WO 2016122039 A1 WO2016122039 A1 WO 2016122039A1
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WO
WIPO (PCT)
Prior art keywords
pin
pogo
connection
block
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2015/001158
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English (en)
Korean (ko)
Inventor
김유곤
김천기
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Uniquest Co Ltd
Original Assignee
Uniquest Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uniquest Co Ltd filed Critical Uniquest Co Ltd
Publication of WO2016122039A1 publication Critical patent/WO2016122039A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07321—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support the probes being of different lengths
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2803—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP] by means of functional tests, e.g. logic-circuit-simulation or algorithms therefor

Definitions

  • the present invention relates to a pin block and an inspection apparatus having the same, and more particularly, a pin block for connecting a function of a module substrate having a connection pin terminal connected to a main board of an electronic terminal such as a smart phone, and the same. It relates to an inspection device.
  • Smartphone manufacturing technology has become popular as an electronic product that can be easily developed by electronic companies around the world.
  • One of the reasons for this universalization is the modularization of components.
  • manufacturing techniques such as the technology of designing circuits and mounting components are necessary for each manufacturer, but now, since most necessary components are modularized and can be supplied from an external specialized company, a board mounted with modular components on the main board Is connected via the inout pin to complete the manufacture. For example, if a camera is needed, a module board equipped with a camera module supplied by an external specialist may be connected to the main board through an inout pin.
  • the module substrate 100 includes a semiconductor chip 150, a smartphone function button module (not shown), an antenna module (not shown), and the like on a flexible printed circuit board (FPCB) 130 on which the lead wire 140 is printed. At least one of the same module is electrically connected through the lead wire 140 and forms a single substrate.
  • the module substrate 100 is connected to a main circuit board mounted on an electric and electronic device (for example, a smartphone) to complete one device.
  • the module substrate is connected to the main circuit board through a connecting pin terminal connected to the end of the lead wire, and the inspection apparatus of the present invention to determine whether the module board is good before connecting the module board to the main circuit board. Functional test is performed through
  • FIG. 1 is a plan view schematically showing an example of a module substrate to be inspected
  • FIG. 2 is a cross-sectional view taken along line A-A 'of the connection pin terminal shown in FIG. 1 and 2 will be described a problem of the conventional pin block for inspecting the module substrate and the inspection device having the same.
  • the inspection apparatus includes a pin block, and a functional test is performed with the connection pin terminal 125 of the module substrate 100 inserted into the pin block.
  • the functional test is a test method that checks the quality of the module board before inserting the module board into the main circuit board. After the specific data is applied to the input pin, the desired data is output to the designated output pin. This is how the test is performed.
  • the connection pin terminals 125 are provided with a plurality of connection pins 110 serving as in / out pins for inputting and outputting electrical signals to and from the module substrate 100.
  • the connecting pin terminals 125 of the module substrate illustrated in FIG. 1 are provided with connecting pins 110a and 110b one by one from side to side. As shown in FIG. 2, the connection pin terminal 125 forms a plurality of protrusions 131a, 131b, and 131c on the FPCB 130, and top, left, and right sides of the protrusions 131a, 131b, and 131c.
  • the plurality of connection pins 110a and 110b formed of a conductor over a portion of the upper surface may be provided while maintaining an insulated state. It can be seen that due to this shape, two trenches 115a and 115b are formed.
  • a portion electrically connected to the connecting pin provided on the main circuit board is an area indicated by 'A' in FIG. 2 and the other area indicated by 'B'. Is a portion extending from the 'A' region to serve as an extension lead for forming an electrical connection with the lead wires 140a and 140b provided in the FPCB.
  • the area 'A' is referred to as a 'normal connection area' and the area 'B' is referred to as an 'FPCB connection area'.
  • FIG. 3 is a cross-sectional view illustrating a PCB connection terminal form of a main circuit board corresponding to the connection pin terminal of the module substrate shown in FIG. 2.
  • Protrusions 1131a and 1131b are formed on the PCB substrate 1130 of the main circuit board, and the conductors 1110a and 1110b are disposed on the top and side surfaces of the protrusions 1131a and 1131b and some surfaces of the PCT substrate 1130. Is formed.
  • two regions designated as 'C' are inserted into the trenches 115a and 115b of FIG. 2, respectively, so that the module substrate and the main circuit board are electrically connected.
  • connection pin terminal of the module substrate shown in FIG. 2 is called a container
  • the PCB connection terminal of the main circuit board shown in FIG. 3 is called a plug
  • the plug shown in FIG. 3 may be formed by the connecting pin terminal of the module substrate
  • the container shown in FIG. 2 may be formed by the PCB connection terminal of the mail circuit board.
  • the 'C' region shown in FIG. 3 corresponds to the 'normal connection region'
  • the 'D' region corresponds to the 'FPCB connection region'.
  • connection port of FIG. 3 is described as being provided in the main circuit board. However, when the functional test is performed, it is to be understood that the connection port of FIG.
  • the inspection device having a pin block is provided with a pin block for inserting the connecting pin terminal, and after the plurality of pogo pins are installed in the pin block, the pogo pin is connected to the connecting pin terminal while pressing the connecting pin terminal 125 from the top.
  • the function test is performed in the state of being electrically connected with.
  • Figure 4 is a shape diagram showing the shape of the pogo pin used in the conventional inspection device.
  • the conventional pogo pin 49 is composed of a housing 43, a lower pin 45 and an upper pin 41, the housing 43 has a structure in which an elastic spring is inserted.
  • the end of the lower pin 45 is connected to the connecting terminal formed on the main circuit board (or the pin block), and the upper pin 41 is connected to the module. It is connected with the connecting pin of a circuit board.
  • FIG. 5 is an explanatory diagram illustrating a process of performing inspection while the connection pin of the module substrate shown in FIG. 2 and the pogo pin shown in FIG. 4 are connected by using an inspection apparatus having a conventional pin block.
  • Figure 5 (a) shows a state before the connecting pin terminal of the module substrate is connected to the pogo pin provided in the pin block
  • Figure 5 (b) is a lower portion while the pressure is applied from the upper portion of the connecting pin terminal of the module substrate It shows the state connected with the pogo pin as going down.
  • the conventional inspection apparatus when the connecting pin terminal of the module substrate moves downward by ⁇ t, the upper pin 41 of the pogo pin is inserted into the trenches 115a and 115b of the connecting pin terminal of the module substrate, thereby making a connection. .
  • the pin block is configured to be elastically movable in the vertical direction with respect to the body.
  • a vertical impact may be applied to the pin block
  • the connecting pin terminal is the pin position (that is, In the process of finely adjusting the left and right position of the connecting pin terminal to be located in the correct connection with the pogo pin)
  • a horizontal impact may be applied to the pin block.
  • the vertical impact can be mitigated by the above-described elastic operation of the pin block, but the horizontal impact cannot be solved by the elastic operation of the pin block, and when such horizontal impact is accumulated or a threshold value is applied, the pogo is transmitted. This can be a major cause of broken pins.
  • the pogo pin is not broken, if it is slightly bent, the length thereof is shorter than that of other pogo pins, so that the corresponding pogo pin cannot be connected to the connection pin of the connection pin terminal.
  • the present invention has been made to solve the above problems, the object of the present invention is that the physical impact (especially horizontal impact) is applied when inserting the connecting pin terminal into the pin block, the pogo pin is the top of the connection pin It is to provide a pin block that can be inspected by providing a separate electrical connection even if not connected to the connection area and an inspection apparatus having the same.
  • an object of the present invention is to provide a pin block and an inspection apparatus having the same by providing a separate additional connection pin even if the pogo pin connected to the normal connection area by physical impact is broken. do.
  • Still another object of the present invention is to provide a pin block having a structure capable of minimizing damage when inserting a connection pin terminal of a module substrate into a pin block and an inspection apparatus having the same.
  • the object of the present invention is to provide a specific function coupled to the main circuit board including a printed circuit board having a plurality of connection terminals (hereinafter referred to as "PCB"), and a flexible printed circuit board coupled to the plurality of connection terminals
  • PCB printed circuit board having a plurality of connection terminals
  • 'FPCB' connecting pin terminal consisting of a plurality of connecting pins
  • the second through hole in the center A base cover having a housing portion, a base cover coupled to a lower portion of the housing portion, and having a first through hole at the center thereof, and a plurality of first pogo pins installed in the space between the housing portion and the base cover.
  • the first pogo pin and the second pogo pin can be achieved by a pin block and an inspection apparatus including the pin block, characterized in that arranged in pairs to be connected to the same connecting pin of the module substrate.
  • the pin block In the conventional pin block and the inspection apparatus having the same, if any one of a plurality of pogo pins electrically connected to the connecting pin connection area should be replaced, the pin block has to be replaced, but the pin block according to the present invention and the inspection apparatus having the same
  • the pogo pin connected to the connection pin connecting area further comprises a secondary pogo pin connected to the FPCB connection area to function stably by the auxiliary pogo pin even if some of the plurality of pogo pin problems such as broken or bent The test can now be performed.
  • the conventional pin block is broken when pogo pin breaks while colliding with the floating part of the pin block when it does not come down from the vertical vertical direction when the connection pin terminal of the module board is inserted,
  • the guide block is formed in the floating part and the guide surface is lowered in steps in the guide block, thereby inducing the connection pin terminal to be inserted into the pin block in place when the pin block is seated, thereby reducing breakage of the pogo pin. I can do it.
  • 1 is a plan view schematically showing an example of a module substrate to be inspected.
  • FIG. 2 is a cross-sectional view along the line A-A 'of the connecting pin terminal shown in FIG. 1;
  • FIG. 3 is a cross-sectional view illustrating a PCB connection terminal form of a main circuit board corresponding to a connection pin terminal of the module substrate shown in FIG. 2.
  • Figure 4 is a diagram showing the shape of the pogo pin used in the conventional inspection device.
  • FIG. 5 is an explanatory diagram illustrating a process of performing an inspection while the connection pins of the module substrate shown in FIG. 2 and the pogo pins shown in FIG. 4 are connected by using an inspection apparatus having a conventional pin block.
  • Figure 6 is a perspective view of the pin block coupling of an embodiment according to the present invention.
  • Figure 7 is an exploded perspective view of the pin block of one embodiment according to the present invention.
  • FIG 8 is a front view of a pogo pin of an embodiment according to the present invention.
  • FIG. 9 is a cross-sectional view of a pin block illustrating a process of inspecting a module substrate using an embodiment according to the present invention.
  • FIG. 10 is an enlarged view illustrating a portion where an upper pin of a pogo pin is connected to a module substrate in FIG. 9;
  • FIG. 11 is a view showing various embodiments of the tapered portion of the first pogo pin upper pin according to the present invention.
  • on or above means to be located above or below the target portion, and does not necessarily mean to be located above the gravity direction. Also, when a portion such as an area, a plate, etc. is said “on or on top” of another part, it is not only when the other part is connected or spaced "on or on top of” another part but also another part in between. It also includes cases where there is.
  • one component when one component is referred to as “connected” or “connected” with another component, the one component may be directly connected or directly connected to the other component, but in particular It is to be understood that, unless there is an opposite substrate, it may be connected or connected via another component in the middle.
  • Figure 6 is a perspective view of the pin block coupling of an embodiment according to the present invention
  • Figure 7 is an exploded perspective view of the pin block of one embodiment according to the present invention shown in Figure 6 (b).
  • FIG. 6 (a) is a perspective view illustrating a pin block coupling of an embodiment without a guide block 247
  • FIG. 6 (b) shows a perspective view of a pin block coupling of an embodiment having a guide block 247.
  • Guide block 247 is formed as extending the outer edge of the floating portion 240 as shown in the figure, the guide surface 247a is formed stepped (or inclined) to the center inside the guide block 247 Formed.
  • Pin block is composed of a base cover 210, the housing portion 230 and the floating portion 240.
  • the base cover 210 is a member that is placed on the upper connection terminal of the PCB provided in the inspection device not shown in the drawings, and is fastened by using the bolt 211 to the lower portion of the housing portion 230 disposed above,
  • the portion is provided with a plurality of first through holes 217.
  • the lower pins of the pogo pins 149 and 159 are exposed downward through the first through hole 217 to be connected to the connection terminals of the PCB provided in the inspection apparatus.
  • a plurality of pogo pins 149 and 159 are accommodated in the accommodation space formed between the base cover 210 and the housing 230.
  • the base cover 210 is provided with a coupling pin 213, it is configured to be coupled to the correct position when the housing portion 230 is coupled using the alignment pin 215.
  • a plurality of second through-holes 233 through which the upper pins of the pogo pins 149 and 159 are exposed is provided at the center of the housing portion 230.
  • the second through-hole 233 provided in the housing portion 230 it can be seen that it consists of a total of four rows, the second pogo pin 159 is located in the first row (253a), the second The first pogo pin 149 is located in row 253b, the first pogo pin 149 is located in third row 253c, and the second pogo pin 159 is located in fourth row 253d. do.
  • the second pogo pins 159 of the first row 253a and the first pogo pins 149 of the second row 253b are connected to the same connector 110a of the module substrate in pairs.
  • the first pogo pin 149 of the third row 253c and the second pogo pin 159 of the fourth row 253d positioned in the same column may be connected to the same connector 110b of the module substrate in pairs.
  • the spring 231 and the floating part 240 are placed in the upper part of the housing part 230, and the floating part 240 is coupled to the upper part of the housing part 230 by using the washer 241 and the bolt 243. .
  • a plurality of third through holes 245 are provided in the center of the floating part 240 to expose the upper pins of the pogo pins 149 and 159.
  • the first through hole 217, the second through hole 233, and the third through hole 245 provided in the base cover 210, the housing part 230, and the floating part 240 are all located at the same vertical position.
  • the hole is formed so that the upper pin and the lower pin of the pogo pins 149 and 159 can be connected to the connection pin and the PCB connection terminal of the module substrate, respectively.
  • pogo pins 149 and 159 arranged in a total of four rows are shown in the pin block of one embodiment according to the present invention, and the pogo pins 159 shown in rows 1 and 4, and 2
  • the pogo pins 149 shown in rows and 3 use different kinds of pogo pins 149 and 159 with different lengths. This will be described in detail with reference to FIG. 8.
  • the pogo pin shown in FIG. 8A (149, hereinafter referred to as 'first pogo pin') is used to connect to the 'normal connection area' of the connection pin of the module substrate, and the conventional pogo pin shown in FIG.
  • the upper pin 141 of the first pogo pin 149 is composed of a body portion 141a and a tapered portion 141b.
  • the pogo pin 159 (hereinafter, referred to as 'second pogo pin') shown in FIG. 8B is used to connect to the 'FPCB connection area' of the connection pin of the module substrate.
  • FIG. 9 is a cross-sectional view of a pin block for explaining a process of inspecting a module substrate using an embodiment according to the present invention.
  • FIG. 9A illustrates a state in which pressure is not applied to the upper portion of the module substrate.
  • the first pogo pin 149 and the second pogo pin 159 are not yet connected to the connection pin terminals of the module substrate. Indicates the state.
  • FIG. 9B when pressure is applied to the upper portion of the module substrate, as shown in FIG. 9B, the spring 231 interposed between the housing part 230 and the floating part 240 is compressed and the floating part 240 is pressed. Downwards, a portion of the upper pins of the first pogo pin 149 and the second pogo pin 159 through the through hole formed in the center of the floating portion 240 is projected through the connection pin 110a of the module substrate Electrical connection with the
  • FIG. 10 is an enlarged view illustrating a portion where the upper pin of the pogo pin is connected to the module substrate in FIG. 9.
  • FIG. 10A illustrates a state in which pressure is not applied to the upper portion of the module substrate.
  • the first pogo pin 149 and the second pogo pin 159 are not yet connected to the connection pin terminals of the module substrate.
  • the arrow shows the direction in which the module substrate is lowered by the pressure applied on the module substrate.
  • 10 (b) shows a portion of the upper pins of the first pogo pin 149 and the second pogo pin 159 through the through hole formed in the center of the floating part 240 as the floating part descends downward.
  • substrate is shown.
  • the upper pin 151 of the second pogo pin is connected to the FPCB connection region of the connecting pin 110a, and the tapered portion 141b of the upper pin 141 of the first pogo pin 149 is the connecting pin.
  • the first pogo pin according to the present invention is connected to the bottom surface while the pogo pin is fully inserted into the trench 115b of the connection pin 110b while the first pogo pin according to the present invention is connected to the normal connection area of the 110b. It can be seen that a predetermined region of the tapered portion 141b is connected to the connection pin 110b formed at the inlet side of the trench 115b by inserting a portion of the predetermined region into the trench 115b of the connection pin 110b.
  • the conventional pogo pin is connected to the bottom surface of the trench 115b should be connected to the connection of the pogo pin, but the first pogo pin according to the present invention Even if the attachment of the pin 141 (that is, the tapered portion 141b of the present invention) is not inserted to the bottom surface of the trench 115b, the pin 141 can be connected to the connection pin 110b.
  • the tapered portion corresponding to the first diameter D1 is not inserted into the trench 115b and positioned at an upper portion thereof, and the tapered portion corresponding to the third diameter D3 is spaced apart from the bottom surface of the trench 115b. You can see that it is located at.
  • the outer circumferential portion corresponding to the second diameter D2 of the tapered portion 141b is connected to the conductive portion formed on the inner wall of the trench 115b.
  • the electrical connection can be realized even if the upper pin 141 is not inserted to the bottom of the connection pin 110b, thereby accurately connecting the first pogo pin. It can be carried out stably while also minimizing the problem of probe damage due to the conventional wrong connection operation.
  • connection pin 110b formed on the module substrate
  • the corresponding connection pin is caused by the second pogo pin. It can be seen that the inspection can be performed by stably maintaining the connection with 110b.
  • Figure 11 (a) to (c) is a view showing various embodiments of the tapered portion of the upper pin of the first pogo pin according to the present invention.
  • the tapered portion of the first pogo pin in the present invention is composed of a semi-elliptic spherical shape (141a) as shown in Figure 11 (a), or conical shape (141c) as shown in Figure 11 (b), or It can be configured as a semi-spherical shape (141d) as shown in Fig. 11 (c), preferably a semi-elliptic shape as shown in Fig. 11 (a).
  • the same purpose can be achieved even if the tapered portion of the first pogo pin is composed of a semi-elliptic spherical shape, a truncated cone shape, or a pyramidal shape made of a polyhedron.
  • the pin block according to the present invention is further provided with a second pogo pin additionally, unlike shown in Figure 8, the shape of the upper pin 141 of the first pogo pin 149 conventional pogo pin (49) It can be implemented to be implemented in the same shape as the upper pin of, and to be connected to the bottom surface of the trench of the connecting pin formed on the module substrate.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)

Abstract

La présente invention concerne un bloc de broches et un dispositif d'essai qui le comprend. Un bloc de broches, selon la présente invention, présente deux broches pogo et permet à des broches de connexion identiques sur un substrat de module d'être connectées aux deux broches pogo. Le bloc de broches, selon la présente invention, possède en outre des broches pogo auxiliaires qui sont connectées à une surface de connexion FPCB, autres que les broches pogo qui sont connectées à une surface de connexion des broches de connexion, permettant ainsi une exécution stable de l'essai de fonctionnement à l'aide des broches pogo auxiliaires même si une partie de la pluralité des broches pogo se brise ou se courbe. De plus, le bloc de broches possède un bloc de guidage formé dessus ayant une surface de guidage (247a), permettant ainsi à une borne de broches de connexion du substrat de module d'être guidée afin d'être insérée avec précision dans la position correcte.
PCT/KR2015/001158 2015-01-27 2015-02-04 Bloc de broches et dispositif d'essai le comprenant Ceased WO2016122039A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020150012911A KR20160092366A (ko) 2015-01-27 2015-01-27 핀블록 및 이를 구비하는 검사 장치
KR10-2015-0012911 2015-01-27

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US11674999B2 (en) 2020-11-19 2023-06-13 Advantest Test Solutions, Inc. Wafer scale active thermal interposer for device testing
US11808812B2 (en) 2020-11-02 2023-11-07 Advantest Test Solutions, Inc. Passive carrier-based device delivery for slot-based high-volume semiconductor test system
US11821913B2 (en) 2020-11-02 2023-11-21 Advantest Test Solutions, Inc. Shielded socket and carrier for high-volume test of semiconductor devices
US11835549B2 (en) 2022-01-26 2023-12-05 Advantest Test Solutions, Inc. Thermal array with gimbal features and enhanced thermal performance
US12235314B2 (en) 2021-09-14 2025-02-25 Advantest Test Solutions, Inc Parallel test cell with self actuated sockets
US12411167B2 (en) 2022-01-26 2025-09-09 Advantest Test Solutions, Inc. Tension-based socket gimbal for engaging device under test with thermal array

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