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WO2015099431A1 - Unité à fiche d'alignement d'un dispositif à semi-conducteur et appareil de vérification de dispositif à semi-conducteur la comprenant - Google Patents

Unité à fiche d'alignement d'un dispositif à semi-conducteur et appareil de vérification de dispositif à semi-conducteur la comprenant Download PDF

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Publication number
WO2015099431A1
WO2015099431A1 PCT/KR2014/012768 KR2014012768W WO2015099431A1 WO 2015099431 A1 WO2015099431 A1 WO 2015099431A1 KR 2014012768 W KR2014012768 W KR 2014012768W WO 2015099431 A1 WO2015099431 A1 WO 2015099431A1
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor device
guide
socket unit
alignment socket
insertion body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2014/012768
Other languages
English (en)
Korean (ko)
Inventor
김기민
윤용희
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ISC Co Ltd
Original Assignee
ISC Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ISC Co Ltd filed Critical ISC Co Ltd
Publication of WO2015099431A1 publication Critical patent/WO2015099431A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures

Definitions

  • the present invention is for conducting a conductive test for a memory or non-memory semiconductor device, and more particularly, a stable alignment of the probe pin when conducting a conductive test for a semiconductor device having a relatively large number of ball terminals.
  • the present invention relates to a semiconductor device alignment socket unit and a semiconductor device inspection apparatus including the same.
  • semiconductor devices such as ICs are inspected for defects by inspecting electrical characteristics during the manufacturing process, and the electrical characteristics inspection of the semiconductor devices includes a contact point (bump) and a printed circuit board (PCB) of the semiconductor device. Is performed through a probe pin interposed between the contacts (pads) of the test board.
  • a contact point bump
  • PCB printed circuit board
  • the electrical characteristic inspection of the semiconductor device is performed in the state where the semiconductor device is inserted into the inspected carrier.
  • the inspection of the conventional semiconductor device is performed by the electrical contact between the ball terminal of the semiconductor device mounted on the object carrier and the probe pin supported on the socket assembly.
  • very small ball terminals and probe pins are arranged at a narrow pitch, so highly accurate alignment is required during the test.
  • the alignment of the ball terminals and the probe pins is necessary to align the alignment holes of the specimen carrier and the socket guide. This is achieved through the alignment of the pins.
  • the alignment pins and the alignment holes are increased in margin through repeated coupling and disconnection. As a result, this increase in margin causes a problem of mismatching or offset of the ball terminal and the probe pin.
  • This problem can cause damage to expensive semiconductor devices due to collisions between semiconductor devices and probe pins when conducting conductivity tests on thousands of semiconductor devices, or the ball terminals of broken semiconductor devices may remain in the equipment. In this case, a problem arises in that replacement or repair should be performed while the conductivity test is stopped.
  • the present invention has been made to solve the above-mentioned problems, and more specifically, a semiconductor device alignment socket unit having improved accuracy according to contact by precisely matching the mutual alignment of the ball terminal and the probe pin of the semiconductor device. And a semiconductor device inspection apparatus.
  • the semiconductor device alignment socket unit of the present invention for achieving the above object, the insertion body having an opening for receiving the semiconductor device for testing the packaged semiconductor device; A guide sheet for aligning the insertion position of the ball terminal provided on the bottom surface of the insertion body and provided in the semiconductor device; A base part including a plurality of probe pins disposed on a lower surface of the insertion body and facing each other with the ball terminal; And a guide pad in close contact with a lower surface of the guide sheet and having a guide hole partially inserted at an upper end of the probe pin to guide the position of the probe pin to a constant position at all times.
  • the semiconductor device may have the ball terminal disposed between at least 500 balls and 2000 balls.
  • the guide sheet may include a conductive pad including conductive particles in a silicon rubber; A first guide sheet positioned in close contact with an upper surface of the conductive pad and having a first guide hole formed at a position corresponding to the ball terminal; It may include a second guide sheet which is positioned in close contact with the lower surface of the conductive pad and has a second guide hole in which an end portion of the probe pin is partially inserted.
  • the conductive pad may be a polyamide film or any one of FR4 or FR5 or XPC.
  • the guide pad may have a thickness relatively thicker than the thickness of the guide sheet.
  • the guide pad may be an insulating material having electrical insulation.
  • the guide pad may be a flexible printed circuit board (FPCB).
  • FPCB flexible printed circuit board
  • the insertion body includes a coupling protrusion projecting downward toward an upper surface of the base portion, and the base portion is formed with an insertion hole opened at a position corresponding to the coupling protrusion so that the coupling protrusion is formed. The state coupled to the insertion hole may be maintained.
  • the base part may include a guide member positioned on an inner side of the semiconductor device to face each other and in contact with an outer side of the insertion body to maintain a fixed position.
  • the guide member may be any one of rubber, silicon, and plastic.
  • the insertion body may include an insertion groove formed at a position corresponding to the guide member and into which the guide member is inserted.
  • the semiconductor device inspection apparatus of the present invention for achieving the above object is aligned with the insertion position of the insertion main body having an opening for accommodating the semiconductor device, and the insertion position of the ball terminal provided inside the insertion body and provided in the semiconductor device.
  • a base portion including a guide sheet for mounting, a lower surface of the insertion body and a plurality of probe pins disposed at positions facing the ball terminal, and a top portion of the probe pin in close contact with the lower surface of the guide sheet.
  • An alignment socket unit having a guide pad inserted therein to guide the position of the probe pin to the home position at all times;
  • a loading unit in which a plurality of alignment socket units are installed;
  • a pusher installed at a position facing the upper portion of the alignment socket unit and pressing the plurality of semiconductor devices moved to the upper portion of the alignment socket unit to the inside of the insertion body;
  • a controller for controlling the presence or absence of abnormalities of the plurality of semiconductor devices during the conduction test on the semiconductor device pressurized by the pusher at a predetermined pressure.
  • the semiconductor device alignment socket unit according to the present invention can improve workability and work efficiency through a stable conductivity test of a plurality of semiconductor devices, and conduct a conductivity test of a semiconductor device having a relatively large number of ball terminals. There is an advantage that can be easily carried out.
  • the alignment socket unit In the semiconductor device alignment socket unit according to the present invention, only a plurality of semiconductor devices are transferred, and the alignment socket unit can perform work in a state where it is located in the loading apparatus, and thus, workability is remarkably improved.
  • the semiconductor device alignment socket unit according to the present invention has an advantage of conducting a conductive test on a semiconductor device while stably aligning an upper end of a probe pin so as to exactly match the alignment of the plurality of ball terminals.
  • FIG. 1 is an exploded perspective view of a semiconductor device alignment socket unit according to an exemplary embodiment of the present inventive concept.
  • FIG. 2 is a plan view of a semiconductor device alignment socket unit according to an exemplary embodiment of the present inventive concept.
  • FIG 3 is an exploded cross-sectional perspective view of a semiconductor device alignment socket unit according to an exemplary embodiment of the present inventive concept.
  • FIG. 4 is a front view briefly showing a semiconductor device inspection apparatus according to an embodiment of the present invention.
  • 5 to 6 are diagrams illustrating a use state of a semiconductor device alignment socket unit according to an embodiment of the present invention.
  • the alignment socket unit 1 includes an insertion body 100 having an opening 110 in which the semiconductor device 10 is accommodated for testing the packaged semiconductor device 10, and It is installed on the lower surface of the insertion body 100 and the guide sheet 200 for alignment with the insertion position of the ball terminal 12 of the semiconductor device 10, and the lower surface of the insertion body 100 is seated and the ball
  • a base portion 300 including a plurality of probe pins 302 disposed at positions facing the terminal 12;
  • a guide pad 400 that is in close contact with the bottom surface of the guide sheet 200 and partially inserts an upper end of the probe pin 302 to guide the position of the probe pin 302 at a constant position at all times.
  • the alignment socket unit 1 is for conducting a conductive test on the semiconductor device 10 used in a CPU in which the ball terminals 12 are relatively numbered from 500 balls to 2000 balls. For example, it is used to conduct a conductive test on a relatively large semiconductor device 10 such as a CPU installed in a PC.
  • the insert body 100 includes an inclined surface 120 in which the opening 110 is opened upward to allow the semiconductor device 10 to be stably inserted, and the inside of the opening 110 is inclined downward. do.
  • the inclined surface 120 is formed to stably insert the semiconductor device 10 toward the opening 110.
  • the insertion body 100 includes an insertion groove 104 formed at a position corresponding to the guide member 310 to be described later and into which the guide member 310 is inserted, and the guide member 310 and the insertion groove 104. A detailed description thereof will be given below with reference to the base unit 300.
  • the guide sheet 200 includes a conductive pad 210 positioned below the insertion body 100 and first and second guide sheets 220 and 230.
  • the conductive pad 210 includes a conductive portion 211 and an insulating portion 212.
  • the conductive portion 211 is formed in a shape in which a plurality of conductive particles are arranged in the thickness direction in the insulating elastic material, the conductive portion 211 is in contact with the ball terminal 12 to energize the probe pin 302 while the semiconductor The conduction state of the plurality of ball terminals 12 installed in the device 10 can be checked.
  • the conductive portion 211 is the conductive particles are positioned at a position corresponding to the first, second guide holes (222, 232) to be described later. Specifically, when the conductive portion 211 is disposed at positions corresponding to the first and second guide holes 222 and 232, and the ball terminal 12 of the semiconductor device 10 presses the conductive portion to a predetermined pressure, The ball terminal 12 is energized to the probe pin 302 through the conductive portion.
  • the insulating elastic material constituting the conductive part 211 is preferably made of silicone rubber, but is not limited thereto. Any rubber material having good elasticity may be used.
  • the insulating part 212 is integrally coupled with the conductive part 211 around the plurality of conductive parts 211 to insulate while supporting the conductive part 211. Electrical insulation is enabled only in the thickness direction by the insulation part 212.
  • the insulating part 212 may be made of the same material as the insulating elastic material constituting the conductive part 211, but is not limited thereto. Any one of a polyamide film, FR4, FR5, and XPC may be used.
  • the first guide sheet 220 is positioned in close contact with the upper surface of the conductive pad 210 and the first guide hole 222 is formed at a position corresponding to the ball terminal 12.
  • the first guide hole 222 is opened in the entire region of the first guide sheet 220, and in the drawing according to the present embodiment, the first guide hole 222 is not shown as a whole, but is partially shown only at the central position.
  • the first guide hole 222 is not shown as a whole, but is partially shown only at the central position.
  • the first guide hole 222 is disposed at a distance of 0.4 mm from the center of the neighboring first guide hole, and at least 1000 ball terminals 12 are simultaneously disposed in the first guide hole 222 and the second guide hole.
  • Probe pins 302 positioned at positions corresponding to the ball terminals 12 via 232 are aligned to conduct conductivity tests on the semiconductor device 10.
  • the second guide sheet 230 is positioned in close contact with the bottom surface of the conductive pad 210, and a second guide hole 232 is formed to partially insert the end of the probe pin 302.
  • the second guide hole 232 is formed to align the plurality of probe pins 302 differently from the first guide hole 222 described above, and the top of the probe pins 302 is partially inserted. maintain.
  • the first and second guide holes 222 and 232 are opened at the same position, and in this embodiment, a plurality of probe pins 302 are provided by installing a guide pad 400 for more accurate alignment of the probe pins 302. Conduct an alignment on
  • the guide pad 400 is made of a thickness relatively thicker than the thickness of the guide sheet 200 described above, the top of the probe pin 302 is more stably coupled.
  • FPCB is used for the guide pad 400. Since the FPCB is excellent in electrical insulation and strong in heat resistance, bending resistance, and chemical resistance, a predetermined external force is applied by the semiconductor device 10 in the guide sheet 200. Edo stably supported and is maintained in a stable state without being separated even when a plurality of probe pins 302 are coupled.
  • the guide pad 400 has a portion of the upper end of the probe pin 302 inserted into the guide hole 410.
  • the number of the ball terminals 12 is 1000 balls or more
  • an upper end of the probe pins 302 may be formed in the guide hole 410.
  • the conductive pins are electrically aligned with the probe pins 302 through the conductive particles aligned without dislocations and distributed on the conductive pads 210.
  • the probe pin 302 is a well-known configuration, detailed description thereof will be omitted.
  • the base part 300 has an insertion hole 301 formed at a position corresponding to the coupling protrusion 130 protruding from the lower side of the insertion body 100 to insert the body 100. Primary coupling is performed, and the guide member 310 is brought into contact with the outside of the insertion body 100 to maintain a fixed position.
  • the guide member 310 may be any one of rubber, silicon, or plastic is selectively used.
  • the guide member 310 is disposed to face each other on the left and right sides of the base part 300 on the basis of the drawing, and is inserted into the insertion groove 104. Is inserted.
  • the insertion groove 104 is formed in a shape corresponding to the shape of the guide member 310 when the insertion body 100 is coupled to the inside of the base portion 300, the guide member 310 is easily inserted groove 104 To be inserted).
  • the guide member 310 is protruded in the form of a spherical shape toward the outside of the base portion 300, it is noted that it is possible to change to another shape that is coupled to the insertion groove 104 and the male and female form.
  • the base portion 300 includes a first base portion 320 to which the lower end of the probe pin 302 is coupled, and a second base portion 330 in close contact with the upper portion of the first base portion 320.
  • the first and second base parts 320 and 330 stably support the lower portion of the probe pin 302.
  • socket unit 1 is the same as in FIG.
  • the semiconductor device inspecting apparatus 1a relates to an inspecting apparatus for testing a semiconductor device using the above-described alignment socket unit 1, and the semiconductor device 10 is accommodated.
  • a guide sheet for alignment with an insertion position of the insertion body 100 having an opening 110 formed therein, and an insertion position of the ball terminal 12 provided inside the insertion body 100 and provided in the semiconductor device 10 200 and a base portion 300 including a plurality of probe pins 302 disposed at positions where the lower surface of the insertion body 100 faces the ball terminal 12 and faces each other, and the guide sheet (
  • the guide hole 410 is closely attached to the lower surface of the 200, and the upper end of the probe pin 302 is partially inserted to guide the position of the probe pin 302 to a constant position when a test is performed on the semiconductor device 10.
  • Formed Alignment socket unit 1 having an id pad 400, a loading unit 2 having a plurality of alignment socket units 1 installed thereon, and a position facing the upper portion of the alignment socket unit 1
  • a pusher (3) installed and pressing the plurality of semiconductor devices (10) moved to the upper portion of the alignment socket unit (1) to the inside of the insertion body (100);
  • a controller 4 for controlling the presence or absence of abnormalities of the plurality of semiconductor devices 10 during the conducting inspection of the semiconductor device 10 pressed by the pusher 3 at a predetermined pressure.
  • the loading unit 2 has 30 to 50 alignment socket units 1 installed therein to conduct conductivity tests of the plurality of semiconductor devices 10. It can be carried out at one time, and in this case, the operator can conduct the conductivity test on the plurality of semiconductor devices 10 more conveniently and quickly, thereby improving workability and having an abnormality for the plurality of semiconductor devices at a faster time. You can check.
  • the pusher 3 is composed of a hydraulic cylinder and a piston and is installed to simultaneously press all of the semiconductor device 10 at a predetermined pressure toward the inside of the insertion body 100, and the pressing force of the pusher 3 is pneumatically. It is operated so that the operator can easily set it to any pressure.
  • the controller 4 determines whether a conductive state input through the plurality of semiconductor devices 10 inserted into the plurality of alignment socket units 1 is stable, and outputs a current signal input from the specific alignment socket unit 1. Sensing and classifying the malfunctioning semiconductor device, and controls only the semiconductor device that is operating normally.
  • the semiconductor device 10 is moved by the pusher 3 to the opening 110 of the insertion body 100, and the 1000 or more ball terminals 12 are removed. 1 is accurately inserted into the first guide hole 222 formed in the guide sheet 220.
  • an electrical signal is simultaneously applied to the plurality of ball terminals 12 and pressed by the pusher toward the lower side of the insertion body 100, thereby conducting the conductive portion of the conductive pad 210.
  • the ball terminal 12 is pressed by the ball terminal 12 so that an electrical signal is conducted to the probe pin 302 located at a position corresponding to each ball terminal 12 to conduct a conductivity test of the semiconductor device 10.
  • the ball terminal 12 of the present invention is stably aligned by the first guide hole 222, and the plurality of probe pins 302 have an upper end accurately by the second guide hole 232 and the guide hole 410. It is located under the ball terminal 12.
  • the upper end of the probe pin 302 is stably aligned with respect to the ball terminal 12, so that the top of the probe pin 302 may be always aligned in the right position regardless of the movement caused by the falling of the ball terminal 12. Therefore, precise conductivity test can be performed.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

La présente invention concerne une unité à fiche d'alignement d'un dispositif à semi-conducteur. L'unité à fiche d'alignement du dispositif à semi-conducteur, conformément à un mode de réalisation de la présente invention, comprend : un corps d'insertion présentant une ouverture qui reçoit le dispositif à semi-conducteur afin de pouvoir tester un dispositif à semi-conducteur mis en boîtier ; une feuille de guidage qui est installée sur la surface inférieure du corps d'insertion et qui est prévue pour l'alignement d'une position d'insertion d'une borne à bille prévue dans le dispositif à semi-conducteur ; une partie de base sur laquelle repose la surface inférieure du corps d'insertion et qui comprend une pluralité de broches de sondage disposées en face de la borne à bille ; et une pastille de guidage en contact étroit avec la surface inférieure de la feuille de guidage et comportant des orifices de guidage dans lesquels sont partiellement insérées les extrémités supérieures des broches de sondage de manière à toujours guider la position des broches de sondage vers la position voulue.
PCT/KR2014/012768 2013-12-24 2014-12-23 Unité à fiche d'alignement d'un dispositif à semi-conducteur et appareil de vérification de dispositif à semi-conducteur la comprenant Ceased WO2015099431A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20130162898A KR101464990B1 (ko) 2013-12-24 2013-12-24 반도체 디바이스 얼라인 소켓유닛 및 이를 포함하는 반도체 디바이스 검사장치
KR10-2013-0162898 2013-12-24

Publications (1)

Publication Number Publication Date
WO2015099431A1 true WO2015099431A1 (fr) 2015-07-02

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PCT/KR2014/012768 Ceased WO2015099431A1 (fr) 2013-12-24 2014-12-23 Unité à fiche d'alignement d'un dispositif à semi-conducteur et appareil de vérification de dispositif à semi-conducteur la comprenant

Country Status (3)

Country Link
KR (1) KR101464990B1 (fr)
TW (1) TWI578001B (fr)
WO (1) WO2015099431A1 (fr)

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JP6744173B2 (ja) * 2016-08-09 2020-08-19 株式会社エンプラス 電気部品用ソケット
JP6823534B2 (ja) * 2017-04-28 2021-02-03 株式会社アドバンテスト 電子部品試験装置用のキャリア
KR101952722B1 (ko) * 2017-09-12 2019-02-27 리노공업주식회사 검사장치
KR101943750B1 (ko) 2017-09-14 2019-01-30 매그나칩 반도체 유한회사 플렉서블 반도체 칩 패키지의 벤딩 테스트 소켓 및 이를 이용한 벤딩 테스트 방법
US10634717B2 (en) * 2017-09-29 2020-04-28 Taiwan Semiconductor Manufacturing Co., Ltd. Testing apparatus and testing method
KR101981521B1 (ko) 2018-03-05 2019-05-23 (주)티에스이 반도체 디바이스의 테스트 소켓과 소켓 가이드의 일체화 방법 및 소켓 가이드가 일체화된 반도체 디바이스의 테스트 소켓
KR102270760B1 (ko) 2019-11-29 2021-06-30 에이엠티 주식회사 미세 피치를 갖는 디바이스의 테스트장치
KR102291194B1 (ko) 2020-03-09 2021-08-20 에이엠티 주식회사 미세 피치를 갖는 디바이스의 얼라인장치 및 그 방법
KR102295435B1 (ko) 2020-03-12 2021-08-31 에이엠티 주식회사 미세 피치를 갖는 디바이스의 얼라인 및 테스트장치 그리고 디바이스의 얼라인방법
CN115870241A (zh) * 2021-08-09 2023-03-31 泰克元有限公司 用于电子部件测试的插座引导件
US11656273B1 (en) * 2021-11-05 2023-05-23 Advantest Test Solutions, Inc. High current device testing apparatus and systems
KR102709001B1 (ko) * 2022-11-04 2024-09-24 주식회사 티에스이 이미지센서 패키지의 테스트 장치
TWM650398U (zh) * 2023-06-09 2024-01-11 穎崴科技股份有限公司 測試座

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JP2002196035A (ja) * 2000-12-27 2002-07-10 Hitachi Ltd 半導体装置の製造方法およびキャリア
US20050202716A1 (en) * 2002-03-06 2005-09-15 Noboru Saito Insert and electronic component handling apparatus provided with the same
KR20100099065A (ko) * 2009-03-02 2010-09-10 리노공업주식회사 검사용 소켓
KR20130111066A (ko) * 2012-03-30 2013-10-10 삼성전자주식회사 반도체 칩 패키지 테스트 소켓

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KR102000948B1 (ko) * 2012-02-29 2019-07-17 (주)제이티 소자검사장치
KR101284212B1 (ko) * 2012-04-27 2013-07-09 주식회사 아이에스시 위치정렬이 용이한 테스트용 소켓

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Publication number Priority date Publication date Assignee Title
JP2002196035A (ja) * 2000-12-27 2002-07-10 Hitachi Ltd 半導体装置の製造方法およびキャリア
US20050202716A1 (en) * 2002-03-06 2005-09-15 Noboru Saito Insert and electronic component handling apparatus provided with the same
KR20100099065A (ko) * 2009-03-02 2010-09-10 리노공업주식회사 검사용 소켓
KR20130111066A (ko) * 2012-03-30 2013-10-10 삼성전자주식회사 반도체 칩 패키지 테스트 소켓

Also Published As

Publication number Publication date
KR101464990B1 (ko) 2014-11-26
TWI578001B (zh) 2017-04-11
TW201530166A (zh) 2015-08-01

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