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WO2011010889A3 - Carte de circuit imprimé souple et son procédé de fabrication - Google Patents

Carte de circuit imprimé souple et son procédé de fabrication Download PDF

Info

Publication number
WO2011010889A3
WO2011010889A3 PCT/KR2010/004837 KR2010004837W WO2011010889A3 WO 2011010889 A3 WO2011010889 A3 WO 2011010889A3 KR 2010004837 W KR2010004837 W KR 2010004837W WO 2011010889 A3 WO2011010889 A3 WO 2011010889A3
Authority
WO
WIPO (PCT)
Prior art keywords
metal layer
thin film
circuit board
printed circuit
resist thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2010/004837
Other languages
English (en)
Other versions
WO2011010889A2 (fr
Inventor
Sungwon Lee
Jaebeum Kim
Hwajin Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of WO2011010889A2 publication Critical patent/WO2011010889A2/fr
Publication of WO2011010889A3 publication Critical patent/WO2011010889A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0353—Making conductive layer thin, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

La présente invention concerne une carte de circuit imprimé souple et son procédé de fabrication. Ledit procédé est caractérisé par : (a) la réalisation d'une demi-gravure afin de réduire l'épaisseur d'une couche métallique formée sur au moins une surface d'un substrat isolant ; (b) la fixation d'un film mince de réserve sous forme de plaque à ladite couche métallique ; (c) l'exposition et le développement du film mince de réserve sous forme de plaque, ainsi que l'exposition d'une partie de la couche métallique ; (d) le placage de la partie de la couche métallique exposée ; (e) l'exfoliation du film mince de réserve sous forme de plaque ; et (f) la réalisation d'une gravure éclair afin de retirer la couche métallique de l'étape (a) exposée grâce à l'exfoliation du film mince de réserve sous forme de plaque. Il est ainsi possible de fabriquer une carte de circuit imprimé qui possède une excellente aptitude au pliage, et d'obtenir à moindre coût un substrat de câblage imprimé qui présente un motif fin et une excellente aptitude au pliage à l'aide des lignes de traitement existantes.
PCT/KR2010/004837 2009-07-23 2010-07-23 Carte de circuit imprimé souple et son procédé de fabrication Ceased WO2011010889A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020090067168A KR20110009790A (ko) 2009-07-23 2009-07-23 플렉서블 인쇄 회로 기판 및 그 제조 방법
KR10-2009-0067168 2009-07-23

Publications (2)

Publication Number Publication Date
WO2011010889A2 WO2011010889A2 (fr) 2011-01-27
WO2011010889A3 true WO2011010889A3 (fr) 2011-06-30

Family

ID=43499558

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/004837 Ceased WO2011010889A2 (fr) 2009-07-23 2010-07-23 Carte de circuit imprimé souple et son procédé de fabrication

Country Status (3)

Country Link
KR (1) KR20110009790A (fr)
TW (1) TW201125449A (fr)
WO (1) WO2011010889A2 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101301248B1 (ko) * 2012-04-20 2013-08-28 삼성에스엔에스 주식회사 데드볼트의 우선 이송이 가능한 모티스 구조
CN103906364B (zh) * 2012-12-25 2017-07-14 上海美维科技有限公司 一种印制电路板中隐埋电阻的加工方法
KR102107034B1 (ko) * 2013-11-13 2020-05-07 삼성전기주식회사 인쇄회로기판, 이를 포함하는 반도체 패키지 및 인쇄회로기판 제조 방법
CN107452633B (zh) * 2017-08-17 2020-01-31 林英洪 引线框制造工艺
CN113613395B (zh) * 2021-08-11 2022-12-27 东南大学 一种简便高效的定制化液态金属电路图案印刷方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002316386A (ja) * 2001-04-20 2002-10-29 Kanegafuchi Chem Ind Co Ltd 銅張積層体およびその製造方法
JP2005254632A (ja) * 2004-03-11 2005-09-22 Kaneka Corp セミアディティブ用金属張積層板の製造方法ならびにこれにより得られるセミアディティブ用金属張積層板
KR20060009885A (ko) * 2003-05-19 2006-02-01 다이니폰 인사츠 가부시키가이샤 양면 배선기판과, 양면 배선기판 제조방법 및 다층배선기판
KR20080057343A (ko) * 2005-10-14 2008-06-24 우베 고산 가부시키가이샤 구리 배선 폴리이미드 필름의 제조 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002316386A (ja) * 2001-04-20 2002-10-29 Kanegafuchi Chem Ind Co Ltd 銅張積層体およびその製造方法
KR20060009885A (ko) * 2003-05-19 2006-02-01 다이니폰 인사츠 가부시키가이샤 양면 배선기판과, 양면 배선기판 제조방법 및 다층배선기판
JP2005254632A (ja) * 2004-03-11 2005-09-22 Kaneka Corp セミアディティブ用金属張積層板の製造方法ならびにこれにより得られるセミアディティブ用金属張積層板
KR20080057343A (ko) * 2005-10-14 2008-06-24 우베 고산 가부시키가이샤 구리 배선 폴리이미드 필름의 제조 방법

Also Published As

Publication number Publication date
KR20110009790A (ko) 2011-01-31
TW201125449A (en) 2011-07-16
WO2011010889A2 (fr) 2011-01-27

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