TW201125449A - Flexible printed circuit board and method for manufacturing the same - Google Patents
Flexible printed circuit board and method for manufacturing the same Download PDFInfo
- Publication number
- TW201125449A TW201125449A TW099124358A TW99124358A TW201125449A TW 201125449 A TW201125449 A TW 201125449A TW 099124358 A TW099124358 A TW 099124358A TW 99124358 A TW99124358 A TW 99124358A TW 201125449 A TW201125449 A TW 201125449A
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- metal layer
- printed circuit
- flexible printed
- layer
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 238000000034 method Methods 0.000 title claims abstract description 20
- 229910052751 metal Inorganic materials 0.000 claims abstract description 33
- 239000002184 metal Substances 0.000 claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 238000007747 plating Methods 0.000 claims abstract description 17
- 238000005530 etching Methods 0.000 claims abstract description 9
- 238000009413 insulation Methods 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 22
- 229910052802 copper Inorganic materials 0.000 claims description 22
- 239000010949 copper Substances 0.000 claims description 22
- 229920001721 polyimide Polymers 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 150000001408 amides Chemical class 0.000 claims 1
- 239000010409 thin film Substances 0.000 abstract description 8
- 239000000463 material Substances 0.000 description 13
- 239000010408 film Substances 0.000 description 12
- 230000008569 process Effects 0.000 description 11
- 238000010586 diagram Methods 0.000 description 7
- 229910000831 Steel Inorganic materials 0.000 description 5
- 238000005452 bending Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- 239000011651 chromium Substances 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229920001646 UPILEX Polymers 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000005007 epoxy-phenolic resin Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- -1 poly(imide) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0353—Making conductive layer thin, e.g. by etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020090067168A KR20110009790A (ko) | 2009-07-23 | 2009-07-23 | 플렉서블 인쇄 회로 기판 및 그 제조 방법 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201125449A true TW201125449A (en) | 2011-07-16 |
Family
ID=43499558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099124358A TW201125449A (en) | 2009-07-23 | 2010-07-23 | Flexible printed circuit board and method for manufacturing the same |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR20110009790A (fr) |
| TW (1) | TW201125449A (fr) |
| WO (1) | WO2011010889A2 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107452633A (zh) * | 2017-08-17 | 2017-12-08 | 林英洪 | 引线框制造工艺 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101301248B1 (ko) * | 2012-04-20 | 2013-08-28 | 삼성에스엔에스 주식회사 | 데드볼트의 우선 이송이 가능한 모티스 구조 |
| CN103906364B (zh) * | 2012-12-25 | 2017-07-14 | 上海美维科技有限公司 | 一种印制电路板中隐埋电阻的加工方法 |
| KR102107034B1 (ko) * | 2013-11-13 | 2020-05-07 | 삼성전기주식회사 | 인쇄회로기판, 이를 포함하는 반도체 패키지 및 인쇄회로기판 제조 방법 |
| CN113613395B (zh) * | 2021-08-11 | 2022-12-27 | 东南大学 | 一种简便高效的定制化液态金属电路图案印刷方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002316386A (ja) * | 2001-04-20 | 2002-10-29 | Kanegafuchi Chem Ind Co Ltd | 銅張積層体およびその製造方法 |
| JPWO2004103039A1 (ja) * | 2003-05-19 | 2006-07-20 | 大日本印刷株式会社 | 両面配線基板および両面配線基板の製造方法 |
| JP4516769B2 (ja) * | 2004-03-11 | 2010-08-04 | 株式会社カネカ | セミアディティブ用金属張積層板の製造方法ならびにこれにより得られるセミアディティブ用金属張積層板 |
| JP4736703B2 (ja) * | 2005-10-14 | 2011-07-27 | 宇部興産株式会社 | 銅配線ポリイミドフィルムの製造方法 |
-
2009
- 2009-07-23 KR KR1020090067168A patent/KR20110009790A/ko not_active Withdrawn
-
2010
- 2010-07-23 TW TW099124358A patent/TW201125449A/zh unknown
- 2010-07-23 WO PCT/KR2010/004837 patent/WO2011010889A2/fr not_active Ceased
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107452633A (zh) * | 2017-08-17 | 2017-12-08 | 林英洪 | 引线框制造工艺 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2011010889A3 (fr) | 2011-06-30 |
| WO2011010889A2 (fr) | 2011-01-27 |
| KR20110009790A (ko) | 2011-01-31 |
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