201125449 六、發明說明： 【發明所屬之技術領域】 本發明主張關於2009年07月23日所申請的韓國專利 案號10-2009-0067168的優先權’並在此以引用的方式併 入本文中，以作為參考。 本發明係關於一種印刷電路板及其製造方法，特別是 關於一種可撓式印刷電路板’能夠在低成本下，製造出一 種具有細微圖案和優良彎曲性的印刷線路基板，以及—種 該可撓式印刷電路板的製造方法。 【先前技術】 印刷電路板（PCB)，其為一種基板，在安置電子跫件前 疋一薄的平板（thin plate)，而電子零件例如積體電路、 電阻、或開關被焊接到該平板。使用在例如電腦的大多數 的電子產品的線路（Circuit)被設置在印刷電路板上。 通常，印刷電路板的製造是藉由壓合—鋼箔在由絕緣 材料環氧樹脂或酚醛樹脂（b a k e丨i t e )所製成的—薄基板、 ，擇性地印刷-餘刻光阻於將形成電路之鋼部分、藉由 =包印刷基板於料㈣選擇性祕彡彳未被㈣光阻覆蓋 王、I刀、然後移除蝕刻光阻以形成線路圖案。作為一後處 里1程，在預黏$電子零件的部分形成孔部及防焊（solder 201125449 散佈在不覆蓋鲜錫之部分’如此得以完成印刷電路 板的製造。 依照目前印刷電路板的整合的趨勢，間距（pitch)·•其 為介於晶片與印刷電路板的電氣線（electrical line)-之 尺寸逐渐縮小。為達此目的，將形成線路圖案的傳導金屬 層的厚度也必需減少。而為減少傳導金屬層的厚度，藉由 鍍銅具有形成在一絕緣層的一濺鍍層和具有形成在一濺 渡層的一金屬層的一材料已被使用。然而，該材料具有缺 點在於相較於雙層基板（double layered substrate)具 有較高的成本。而雙層基板為具有形成在傳統絕緣基板表 面的金屬層。另一缺點為該材料因為彎曲性不佳，故並不 適合於可撓式印刷電路板的使用。 圖1為使用傳統藏鍍層之印刷電路板製造方法的方塊 圖，及圖2為印刷電路板製造方法的流程圖，每一流程對應 圖1的製造方法。 … 參閱圖1和圖2’準備一聚亞醯胺（polyimide)絕緣基板 110其依序堆疊錄（Ni)或鉻(Cr)層和一銅層13〇作為原弘材料 (mwiMterial) S1。接續，一電鍍層14〇形成在鋼層丨°別= 以形成一圖案S2。之後，暴露的銅層13〇經蝕刻而移除幻 再者’因銅層130的移除而暴露的鎳/鉻層ι2〇姑 S4。 、'ι域剡而移除 此時’鎳/鉻層120的傳導金屬層經由濺鍍而形 — 及猎 201125449 由化予而私除以用來改善線路的絕緣可靠度。如此的習知技術 ’、有缺點在於原始材料非常昂責且彎曲性不佳及不適用於需 具備彎曲_可撓式_魏板⑽B)。從塌雛，習知技 2在用以形成圖案的電鍍製程之後，需要兩次⑽製程來形成 電路’進而造成製造成本的增加。 、、特別是談論到彎曲性，適合於習知的薄科刷電路板材 料僅包含如錄或鉻的濺渡材料。然而，濺渡材料的彎曲性比傳 統的可撓性印刷電路板的材料更為不佳。例如，傳統的可撓式 印刷電路板材料可超過3⑽次或更多的彎曲測試，然而，賤渡 材料例如UPILEX和KAPT⑽其個別僅約通過％次和157次的 測試’顯示出非常不佳的彎曲性。因此，印刷電路板需要形成 細微®案能力及具有優良的料性和低成切是非常重要的 課題。 【發明内容】 本發明的揭露可用以解決上述的缺點，且本發明的一 目的在於提供-種可撓式印刷f路板，其應㈣統的生產 、-於低成本下裝造出具有細微線路和優良的彎曲性的可挽 式印刷電路板，以及提供該種可撓式印刷電路板的製造方 法。 本發明所解決的技術問題並不限定於上述所提及之問 題，至此未提到的任何技術問題，熟知此技藝者將可於下 列描述中清楚領會。 本發明的一目的在於解決至少一或更多上述的問題和 201125449 為達成全部输二目Μ至少於下面所描述的優點。 述的本發明目二Γ 依據如同具體和廣泛所描 印刷雷m 明的考量面，提供了—種可繞式 反的製造方法，其特徵在於：⑸執行半_以減 料膜在的至少-表面的金屬層的厚度；（b)貼附抗 二;_;(e)曝光和顯影抗_膜及暴露金屬層的 、 ⑷鍍覆金屬層的暴露部份；（e)剝落抗鑛薄膜； 二f執行—閃蝕刻以移除藉由剝落該抗鍍薄膜而暴露 ϋ的=(a)的金屬層。因此具有優"錄的印刷電路板 传以被製造出。 在本發明—些實施例，步驟⑷可為半姓刻金屬層至大 於〇微米但小於5微米的厚度之步驟。因此，於_刻期 間，線路寬度的縮減可減到最小。 在本發明-些實施例，步驟⑷的絕緣基板為一種聚亞 «膜片。因此’ $見有的原始材料可被繼續使用而減少成 本。 在本發明的另―考量面’提供—射撓式印刷電路 板’其包含絕緣基板；—第—金屬層形成在該絕緣基 板的至少一表面且具有一薄膜圖案形狀；以及一第二金屬 層鐘覆在第一金屬層。 〃 一銅層。 種聚亞酸胺膜 在本發明一些實施例’第一金屬層可為 在本發明一些實施例’絕緣基板可為一 片（polyimide film)。 201125449 在本發明一些實施例’第一金屬層的厚度可大於〇微 米但小於5微米。 根據本發明之可撓式印刷電路板及其製造方法具有優 良效益，因為具有微細圖案和優良彎曲性的印刷線路基板 可藉由現有的製程線以低成本製造。 【實施方式】 以下所述之内容將詳細描述本發明所揭露的可撓式印 刷電路板及其製造方法，並配合圖式來進行舉例說明。而 揭露的實施例與其優點可配合圖i至圖6得到最佳了解。 在描述本發明結構，對於習知的結構描述、配置盥製 程將予以省略以避免因不需要的内容與已知的結構㈣能 模糊熟知此技藝者對本發明的鑑賞。 在圖不中，各個元件的尺寸和相對尺寸可能會以誇大 的方式來呈現，以清晰顯示本發明，但並不適用於實際應 用。圖中相同的元件標號代表相同的元件。可以了解，當 提及：—層、一膜、一區域、或基板被提到是位在其它元 件的上（〇n) /下方（under·)，，時，表示基板是直接位 於或連接到其它元件，或可出現中介元件。而在其它元件 的上或下方需依照圖示。同時，”實施例，，僅代表範例而 非最佳。 本發明的整體流程為執行一半蝕刻以促進一半加成處 理（semi-additiveprocess)形成一細微圖案，其中半加成 處理為一種形成細微圖案的方法，其中一種子層藉由無電 8 201125449 解電鏡（electroless plating)形成於一絕緣層、一抗鍍薄 膜（plate resist thin film)形成在種子層、一圖案錢覆 層藉由電鍍（electroplating)形成在種子層、一未形成圖 案鍍覆層的暴露種子層和圖案鍍覆層經閃餘$ (flash-etching)處理。本發明由於半加成處理的應用，所 以可增加圖案的細微度及蝕刻因子。 圖3為根據本發明一實施例的可撓式印刷電路板製造 方法的方塊圖。圖4為可撓式印刷電路板製造方法的流程 圖’每一流程對應圖3的製造方法。 參閱圖3和4，準備一聚亞醯胺（polyimide)絕緣基板 210，聚亞醯胺（p〇iyimide)絕緣基板21〇之一表面或雙面 (both sides)形成有銅層220 S1。聚亞醯胺絕緣基板21〇 為種材料被應用在現有之製程，且具經濟性。雖然一銅 層被緣示在圖示中’作為形成在Μ«絕緣基板210上 的一金屬層，但金屬層並不限定於銅層。例如，可使用用 於可換性印刷電路板’具有優良延展性（ductility)的傳導 材料。 …接著，銅層220經半㈣以減少鋼層的厚度到少於5 微米S2。此時，制半_的觀點在於其可藉由薄化銅層 厚度使圖錢加精細而利於㈣複再現（reprQdUGti〇n)。 例如’半钕刻處理均勻敍刻1/4 〇ζ@1/2 〇z義層至— 要求的厚度。如果閃飯刻未形成電錢圖案的暴露銅詹挪 的表面作為—最終程序，薄化鋼I 220的厚度允許線寬 201125449 (circuit width)的縮減減到最小。 接續’一抗鍍薄膜（plate resist thin film) 230 附 加到銅層220 S3。抗鍍薄膜230最好為一乾膜抗餘（dry film resist)。抗鍍薄膜230經歷曝光與顯影以暴露出部 份的銅層220 S4。特別是對抗鍍薄膜23〇執行曝光與顯影 是用來形成製造者所想要的預定印刷線路圖案。 然後，進行錢覆鋼層220暴露出的部份S5。剝落抗鍍 薄膜230以形成〜線路圖案％。最後，未形成圖案錢覆層 240的銅層220暴露部份經閃侧而被移除幻。閃钱刻能 夠移暴露的銅層220部份，即不使用遮罩（mask)於將預移 除七伤在此晴況下，最好使用含硫餘刻酸（sulfuric etching acid)用於閃餘刻，但不用以限定本發明。 因此本&明可僅藉由…欠_銅種子層來形成印刷 線路圖案’然而習知技術在電鍍製程之後需要兩次餘刻。 ® 5 ^據本發明—實補之可撓式印路板於執 灯半仙的⑴麵大圖示^本圖示將實際尺寸放大約⑽ 倍。 參閱圖5,銅層220的厚度在半触刻前為大約12微米 在姓刻後其厚度則減少至5微米。因此，可於銅層220 , 閃触刻顧將線路寬度的縮減減到最小。 圖6為根據本私日日 ^明一實施例之可撓式印刷電路板於執 行閃蝕刻的前、後放士回_ , — 欲大圖示。本圖示將貫際尺寸放大約2〇 倍。 201125449 ，閱圖6，可以注意 有圖案鍍覆層24〇 的銅層220勃 _ 巩仃〜閃蝕刻以移除銅種子層而僅留下線路。 5迷所長1及，印刷電路板可經由触刻種子層而快速製 k再者，由於本發明並未使用濺鍍材料，將可製造出具 有彎曲性優於習4 炎、‘知的印刷電路板。 【工業適用性】 一根據本發明之可撓式印刷電路板及其製造方法具有工 業適用险，因為具有微細圖案和優良彎曲性的印刷線路基 板可藉由現有的製程線以低成本製造。 雖然本發明以較佳實施例揭露如上，然其並非用以限 定本發明，任何熟習相像技藝者，在不脫離本發明之精神 和範圍内，所作更動與潤飾之等效替換，仍為本發明之專 利保護範圍内。 【圖式簡單說明】 圖1為使用傳統濺鍍層的印刷電路板製造方法的方塊 圖； 圖2為印刷電路板製造方法的流程圖，每一流程對應 圖1的製造方法； 圖3為根據本發明一實施例的可撓式印刷電路板製造 方法的方塊圖； 圖4為可繞式印刷電路板製造方法的流程圖’母一 W 程對應圖3的製造方法； 11 201125449 圖5為根據本發明一實施例之可撓式印刷電路板於執 行半姓刻的前、後放大圖示；以及 圖6為根據本發明一實施例之可撓式印刷電路板於執 行閃钱刻的前、後放大圖示。 【主要元件符號說明】 110 絕緣基板 120 鎳/鉻層 130 銅層 140 電鍍層 220 銅層 230 抗鍍薄膜 240 電鍍層 12。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 For reference. The present invention relates to a printed circuit board and a method of manufacturing the same, and more particularly to a flexible printed circuit board capable of producing a printed circuit board having a fine pattern and excellent flexibility at a low cost, and A method of manufacturing a flexographic printed circuit board. [Prior Art] A printed circuit board (PCB), which is a substrate on which a thin plate is placed before an electronic component is placed, and electronic components such as integrated circuits, resistors, or switches are soldered to the plate. A circuit using most of an electronic product such as a computer is placed on a printed circuit board. Usually, the printed circuit board is manufactured by pressing-steel foil on a thin substrate made of insulating material epoxy resin or phenolic resin (bake 丨ite), selective printing - residual photoresist Forming the steel portion of the circuit, by printing the substrate to the material (4), the selective secret is not covered by the (four) photoresist, the I knife, and then the etching photoresist is removed to form a line pattern. As a one-pass process, holes are formed in the pre-adhesive part of the electronic parts and solder-proof (solder 201125449 is spread over the part that does not cover the fresh tin). This completes the manufacture of printed circuit boards. According to the current integration of printed circuit boards The trend, the pitch, which is the electrical line between the wafer and the printed circuit board, is gradually reduced in size. To this end, the thickness of the conductive metal layer forming the wiring pattern must also be reduced. In order to reduce the thickness of the conductive metal layer, a material having a sputter layer formed on an insulating layer and a metal layer formed on a splash layer has been used by copper plating. However, the material has a disadvantage in that Compared with a double layered substrate, the double layer substrate has a metal layer formed on the surface of the conventional insulating substrate. Another disadvantage is that the material is not suitable for being flexible because of poor bending property. The use of a printed circuit board. Figure 1 is a block diagram of a printed circuit board manufacturing method using a conventional Tibetan plating layer, and Figure 2 is a flow of a printed circuit board manufacturing method. Process diagram, each process corresponds to the manufacturing method of FIG. 1. Referring to FIG. 1 and FIG. 2', a polyimide insulating substrate 110 is prepared, which sequentially stacks (Ni) or chromium (Cr) layers and a copper layer. Layer 13 is used as the original material (mwiMterial) S1. Next, a plating layer 14 is formed in the steel layer 以° = to form a pattern S2. Thereafter, the exposed copper layer 13 is etched to remove the illusion. The exposed nickel/chromium layer ι2 〇 S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S S It is used to improve the insulation reliability of the line. Such a conventional technique has the disadvantage that the original material is very high and the bending property is not good and it is not suitable for bending _ flexible type _Wei board (10) B) . From the collapse, the conventional technique 2 requires two (10) processes to form the circuit after the electroplating process for patterning, thereby causing an increase in manufacturing cost. In particular, when it comes to bending, the thin-film circuit board suitable for conventional use only contains splash materials such as recording or chrome. However, the flexibility of the spoiler material is less than that of conventional flexible printed circuit boards. For example, conventional flexible printed circuit board materials can exceed 3 (10) or more bend tests, however, transition materials such as UPILEX and KAPT (10) individually show only about 5% and 157 tests 'showing very poor Flexibility. Therefore, the need for a printed circuit board to form a fine-grained case and excellent material properties and low-cutting is an important issue. SUMMARY OF THE INVENTION The disclosure of the present invention can be used to solve the above-mentioned disadvantages, and an object of the present invention is to provide a flexible printed f-way board which is produced in a (four) system and is manufactured at a low cost. A circuit and an excellent bendable printed circuit board, and a method of manufacturing such a flexible printed circuit board. The technical problems solved by the present invention are not limited to the above-mentioned problems, and any technical problems that have not been mentioned so far will be clearly understood by those skilled in the art. It is an object of the present invention to address at least one or more of the above problems and the advantages of 201125449 to achieve all of the above-described objectives, at least as described below. OBJECTS OF THE INVENTION The present invention provides a method for manufacturing a reversible method based on the specific and extensively described aspects of printing, characterized in that: (5) performing at least half of the film is at least The thickness of the metal layer on the surface; (b) the adhesion of the anti-two; _; (e) the exposure and development of the anti-film and the exposed metal layer, (4) the exposed portion of the plated metal layer; (e) the peeling off the anti-mineral film; The second f-flash etch is performed to remove the metal layer of (a) exposed by flaking the anti-plating film. Therefore, the printed circuit board with excellent " recorded is manufactured. In some embodiments of the invention, step (4) may be a step of etching a metal layer to a thickness greater than 〇 micron but less than 5 microns. Therefore, the line width reduction can be minimized during the _ inscription. In some embodiments of the invention, the insulating substrate of step (4) is a poly-[membrane. Therefore, the original material that is seen can be used continuously to reduce costs. In another aspect of the present invention, a radiation printed circuit board is provided that includes an insulating substrate; a first metal layer is formed on at least one surface of the insulating substrate and has a thin film pattern shape; and a second metal layer The clock covers the first metal layer. 〃 A copper layer. Polyimide Films In some embodiments of the invention, the first metal layer may be in some embodiments of the invention. The insulating substrate may be a polyimide film. 201125449 In some embodiments of the invention, the thickness of the first metal layer can be greater than 〇 micrometers but less than 5 microns. The flexible printed circuit board and the method of manufacturing the same according to the present invention are excellent in that a printed wiring board having a fine pattern and excellent bendability can be manufactured at a low cost by an existing process line. [Embodiment] Hereinafter, a flexible printed circuit board and a method of manufacturing the same disclosed in the present invention will be described in detail, and will be exemplified in conjunction with the drawings. The disclosed embodiments and their advantages are best understood in conjunction with Figures i through 6. In describing the structure of the present invention, the description of the conventional structure, configuration, and configuration will be omitted to avoid obscuring the present invention by those skilled in the art from the unneeded content and the known structure. In the drawings, the dimensions and relative sizes of the various elements may be presented in an exaggerated manner to clearly illustrate the invention, but not to the actual application. The same reference numerals in the figures denote the same elements. It can be understood that when it is mentioned that a layer, a film, a region, or a substrate is referred to as being on (〇n) / under (under), it means that the substrate is directly located or connected to Other components, or intervening components may appear. On or below the other components, follow the diagram. Meanwhile, the "embodiment" is merely an example and not the best. The overall flow of the present invention is to perform a half etching to promote a semi-additive process to form a fine pattern, wherein the semi-additive process is a fine pattern. The method, wherein one of the sublayers is formed on the insulating layer by an electroless plating, a plate resist thin film is formed on the seed layer, and a pattern is coated by electroplating. The exposed seed layer and the pattern plating layer formed on the seed layer and the unpatterned plating layer are processed by flash-etching. The invention can increase the fineness of the pattern due to the application of the semi-additive treatment. Figure 3 is a block diagram of a method of fabricating a flexible printed circuit board in accordance with an embodiment of the present invention. Figure 4 is a flow diagram of a method of fabricating a flexible printed circuit board. [Each flow corresponds to the method of fabrication of Figure 3. Referring to Figures 3 and 4, a polyimide insulating substrate 210, a surface or a double side of a poly(imide) insulating substrate 21 is prepared (both si Des) is formed with a copper layer 220 S1. The polyamidene insulating substrate 21 is applied to the existing process and is economical, although a copper layer is shown in the figure as "insulated" A metal layer on the substrate 210, but the metal layer is not limited to the copper layer. For example, a conductive material having excellent ductility for a replaceable printed circuit board can be used. Next, the copper layer 220 is half-turned. (d) to reduce the thickness of the steel layer to less than 5 microns S2. At this time, the view of the system is that it can be refined by thinning the thickness of the copper layer to facilitate (4) complex reproduction (reprQdUGti〇n). For example Semi-etching treatment evenly engraves 1/4 〇ζ@1/2 〇z layer to the required thickness. If the flashing rice is not formed, the exposed copper surface of the electric money pattern is used as the final procedure, thinned steel The thickness of I 220 allows the reduction of the line width 201125449 (circuit width) to be minimized. The subsequent 'plate resist thin film 230 is attached to the copper layer 220 S3. The anti-plating film 230 is preferably a dry film resistant ( Dry film resist. The anti-plating film 230 undergoes exposure and development to expose A portion of the copper layer 220 S4 is formed. In particular, the exposure and development of the anti-plating film 23 is used to form a predetermined printed wiring pattern desired by the manufacturer. Then, the exposed portion S5 of the carbon steel layer 220 is formed. The anti-plating film 230 is peeled off to form a ~-line pattern %. Finally, the exposed portion of the copper layer 220 not forming the pattern of the carbon coating 240 is removed by the flash side. The flash money engraving can expose the exposed portion of the copper layer 220, that is, without using a mask, the pre-removed seven-injury is used in this case, and it is preferable to use a sulfuric etching acid for flashing. It is not necessary to limit the invention. Therefore, the present & amps can only form a printed wiring pattern by owing a copper seed layer. However, the prior art requires two remnants after the electroplating process. ® 5 ^ According to the present invention - the solid printed circuit board is fixed on the (1) side of the lamp. The figure shows that the actual size is about (10) times. Referring to Figure 5, the thickness of the copper layer 220 is about 12 microns before the half-touch, and its thickness is reduced to 5 microns after the last name. Therefore, the reduction of the line width can be minimized in the copper layer 220 by flashing. Fig. 6 is a view showing the front and rear of the flexible printed circuit board according to the embodiment of the present invention. This illustration puts the continuous size approximately 2 times. 201125449, see Figure 6, it can be noted that there is a pattern of 24 〇 copper layer 220 仃 _ _ 闪 闪 闪 闪 闪 闪 闪 闪 闪 闪 闪 闪 闪 移除 移除 移除 移除 移除 移除 移除 移除 移除 移除 移除 移除5, the director of the 1 and the printed circuit board can be quickly made by touching the seed layer, because the invention does not use the sputtering material, it will be able to produce a printed circuit with better bending than the 4 board. [Industrial Applicability] A flexible printed circuit board and a method of manufacturing the same according to the present invention are industrially applicable because a printed wiring board having a fine pattern and excellent flexibility can be manufactured at a low cost by an existing process line. While the present invention has been described above by way of a preferred embodiment, it is not intended to limit the invention, and the equivalents of the modification and retouching are still in the present invention without departing from the spirit and scope of the invention. Within the scope of patent protection. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram showing a method of manufacturing a printed circuit board using a conventional sputtering layer; FIG. 2 is a flow chart showing a method of manufacturing a printed circuit board, each of which corresponds to the manufacturing method of FIG. 1; FIG. 4 is a block diagram showing a method of manufacturing a flexible printed circuit board according to an embodiment of the present invention; FIG. 4 is a flow chart of a method for manufacturing a wrapable printed circuit board. FIG. 5 is a manufacturing method corresponding to FIG. 3; The flexible printed circuit board according to an embodiment of the present invention is enlarged before and after performing a half-length engraving; and FIG. 6 is a front and rear view of the flexible printed circuit board according to an embodiment of the present invention. Zoom in on the icon. [Main component symbol description] 110 Insulation substrate 120 Nickel/chromium layer 130 Copper layer 140 Electroplating layer 220 Copper layer 230 Anti-plating film 240 Plating layer 12