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WO2010013790A1 - Copper alloy material for electrical and electronic components, and manufacturing method therefor - Google Patents

Copper alloy material for electrical and electronic components, and manufacturing method therefor Download PDF

Info

Publication number
WO2010013790A1
WO2010013790A1 PCT/JP2009/063616 JP2009063616W WO2010013790A1 WO 2010013790 A1 WO2010013790 A1 WO 2010013790A1 JP 2009063616 W JP2009063616 W JP 2009063616W WO 2010013790 A1 WO2010013790 A1 WO 2010013790A1
Authority
WO
WIPO (PCT)
Prior art keywords
copper alloy
alloy material
electrical
electronic components
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2009/063616
Other languages
French (fr)
Japanese (ja)
Inventor
邦照 三原
亮佑 松尾
立彦 江口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP2010507743A priority Critical patent/JP5224415B2/en
Priority to CN2009801303117A priority patent/CN102112639A/en
Priority to EP09803032A priority patent/EP2319947A4/en
Publication of WO2010013790A1 publication Critical patent/WO2010013790A1/en
Priority to US13/016,260 priority patent/US20110186192A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/023—Alloys based on aluminium
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/10—Alloys based on copper with silicon as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)

Abstract

Disclosed is a copper alloy material for electrical and electronic components that has a composition comprising 0.5-2.0 mass% Co, 0.1-0.5 mass% Si, and the remainder Cu and unavoidable impurities. The crystal grain diameter of the base material copper alloy is 3-35 mm, the particle diameter of a precipitate composed of Co and Si is 5-50 nm, and the density of the precipitate is 1×108 to 1×1010 particles/mm2. The tensile strength of the copper alloy material is at least 550 MPa, and the conductivity is at least 50% IACS.
PCT/JP2009/063616 2008-07-31 2009-07-30 Copper alloy material for electrical and electronic components, and manufacturing method therefor Ceased WO2010013790A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010507743A JP5224415B2 (en) 2008-07-31 2009-07-30 Copper alloy material for electric and electronic parts and manufacturing method thereof
CN2009801303117A CN102112639A (en) 2008-07-31 2009-07-30 Copper alloy material for electrical and electronic components, and manufacturing method therefof
EP09803032A EP2319947A4 (en) 2008-07-31 2009-07-30 Copper alloy material for electrical and electronic components, and manufacturing method therefor
US13/016,260 US20110186192A1 (en) 2008-07-31 2011-01-28 Copper alloy material for electric/electronic parts and method of producing the same

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2008-197672 2008-07-31
JP2008-197677 2008-07-31
JP2008197672 2008-07-31
JP2008197677 2008-07-31
JP2008202468 2008-08-05
JP2008-202468 2008-08-05

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/016,260 Continuation US20110186192A1 (en) 2008-07-31 2011-01-28 Copper alloy material for electric/electronic parts and method of producing the same

Publications (1)

Publication Number Publication Date
WO2010013790A1 true WO2010013790A1 (en) 2010-02-04

Family

ID=41610488

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2009/063616 Ceased WO2010013790A1 (en) 2008-07-31 2009-07-30 Copper alloy material for electrical and electronic components, and manufacturing method therefor

Country Status (6)

Country Link
US (1) US20110186192A1 (en)
EP (1) EP2319947A4 (en)
JP (1) JP5224415B2 (en)
KR (1) KR101570555B1 (en)
CN (1) CN102112639A (en)
WO (1) WO2010013790A1 (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011152124A1 (en) * 2010-05-31 2011-12-08 Jx日鉱日石金属株式会社 Cu-co-si-based copper alloy for electronic material, and process for production thereof
WO2012026488A1 (en) * 2010-08-24 2012-03-01 Jx日鉱日石金属株式会社 Copper-cobalt-silicon alloy for electrode material
JP2012167319A (en) * 2011-02-14 2012-09-06 Jx Nippon Mining & Metals Corp Cu-Co-Si-BASED ALLOY, ROLLED COPPER ARTICLE, ELECTRONIC COMPONENT, CONNECTOR, AND METHOD FOR PRODUCING Cu-Co-Si-BASED ALLOY
WO2012132805A1 (en) 2011-03-28 2012-10-04 Jx日鉱日石金属株式会社 Co-Si-BASED COPPER ALLOY SHEET
JP2012201905A (en) * 2011-03-24 2012-10-22 Jx Nippon Mining & Metals Corp Co-Si BASED COPPER ALLOY SHEET
JP2012207264A (en) * 2011-03-29 2012-10-25 Jx Nippon Mining & Metals Corp Cu-Co-Si-BASED ALLOY HAVING EXCELLENT BENDING WORKABILITY
CN102812139A (en) * 2010-03-30 2012-12-05 Jx日矿日石金属株式会社 Cu-Co-Si alloy material
CN102844452A (en) * 2010-04-14 2012-12-26 Jx日矿日石金属株式会社 Cu-Si-Co alloy for electronic material and preparation method thereof
CN103140591A (en) * 2010-09-29 2013-06-05 Jx日矿日石金属株式会社 Cu-co-si-based alloy for electronic material and method of manufacturing the same
CN103443310A (en) * 2011-03-29 2013-12-11 Jx日矿日石金属株式会社 Cu-co-si-based copper alloy strip for electron material, and method for manufacturing same
EP2664685A4 (en) * 2011-01-13 2014-04-09 Jx Nippon Mining & Metals Corp CU-CO-SI-ZR ALLOY MATERIAL AND MANUFACTURING METHOD THEREOF
EP2578708A4 (en) * 2010-06-03 2014-04-09 Jx Nippon Mining & Metals Corp ALLOY SHEET BASED ON CU-CO-SI AND METHOD FOR PRODUCING SAME
EP2692878A4 (en) * 2011-03-28 2014-09-10 Jx Nippon Mining & Metals Corp CU-SI-CO BASED COPPER ALLOY FOR ELECTRONIC MATERIALS AND METHOD FOR MANUFACTURING THE SAME
US9476109B2 (en) 2010-03-31 2016-10-25 Jx Nippon Mining & Metals Corporation Cu—Ni—Si—Co copper alloy for electronic material and process for producing same

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MY189251A (en) 2010-05-14 2022-01-31 Mitsubishi Materials Corp Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device
JP5903832B2 (en) 2011-10-28 2016-04-13 三菱マテリアル株式会社 Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, rolled copper alloy material for electronic equipment, and electronic equipment parts
JP5903838B2 (en) 2011-11-07 2016-04-13 三菱マテリアル株式会社 Copper alloy for electronic equipment, copper material for electronic equipment, copper alloy manufacturing method for electronic equipment, copper alloy plastic working material for electronic equipment, and electronic equipment parts
JP5903842B2 (en) * 2011-11-14 2016-04-13 三菱マテリアル株式会社 Copper alloy, copper alloy plastic working material, and method for producing copper alloy plastic working material
JP6039999B2 (en) * 2012-10-31 2016-12-07 Ｄｏｗａメタルテック株式会社 Cu-Ni-Co-Si based copper alloy sheet and method for producing the same
KR101954051B1 (en) * 2012-11-20 2019-03-05 제이엑스금속주식회사 Copper foil with carrier
US9394619B2 (en) * 2013-03-12 2016-07-19 Intel Corporation Methods of adding dopants to conductive interconnect structures in substrate technologies and structures formed thereby
CN105018782B (en) * 2015-07-23 2017-09-26 宁波博威合金板带有限公司 A kind of copper alloy of the silicon containing cobalt
JP6246173B2 (en) * 2015-10-05 2017-12-13 Ｊｘ金属株式会社 Cu-Co-Ni-Si alloy for electronic parts
KR101810925B1 (en) * 2017-10-18 2017-12-20 주식회사 풍산 Copper alloy strips having high heat resistance and thermal dissipation properties
CN112725657B (en) * 2020-12-24 2021-09-17 国工恒昌新材料沧州有限公司 Preparation method of C70350 nickel-silicon bronze strip
KR102804249B1 (en) 2022-11-24 2025-05-13 신영금속 (주) Ag-Pd-Cu alloy material having improved electrical resistance and abrasion resistance and electrical and electronic components manufactured using the same

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JPS6187838A (en) 1984-10-03 1986-05-06 Kobe Steel Ltd Copper alloy having superior hot workability
JPS63307232A (en) 1987-06-04 1988-12-14 Sumitomo Metal Mining Co Ltd Copper alloy
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JPH0920943A (en) * 1995-06-30 1997-01-21 Furukawa Electric Co Ltd:The Copper alloy for electronic and electrical parts and method for producing the same
JPH1112714A (en) * 1997-06-25 1999-01-19 Dowa Mining Co Ltd Copper and copper-based alloy excellent in direct bonding property and solderability and method for producing the same
JP2005243821A (en) * 2004-02-25 2005-09-08 Dowa Mining Co Ltd Heat sink for semiconductor device and manufacturing method thereof
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JP2008007839A (en) * 2006-06-30 2008-01-17 Nikko Kinzoku Kk Cu-Zn alloy with high strength and excellent bending workability
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JP2008197677A (en) 1997-02-17 2008-08-28 Seiko Epson Corp Display device
JP2008197672A (en) 2005-08-05 2008-08-28 Seiko Epson Corp Liquid crystal device
JP2008202468A (en) 2007-02-19 2008-09-04 Toyota Motor Corp Output convergence value calculation device for engine system

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WO2006093233A1 (en) * 2005-03-02 2006-09-08 The Furukawa Electric Co., Ltd. Copper alloy and method for production thereof
JP2008266787A (en) * 2007-03-28 2008-11-06 Furukawa Electric Co Ltd:The Copper alloy material and method for producing the same
EP2248921A4 (en) * 2008-01-31 2011-03-16 Furukawa Electric Co Ltd COPPER ALLOY MATERIAL FOR ELECTRICAL / ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING COPPER ALLOY MATERIAL

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JPS6187838A (en) 1984-10-03 1986-05-06 Kobe Steel Ltd Copper alloy having superior hot workability
JPS63307232A (en) 1987-06-04 1988-12-14 Sumitomo Metal Mining Co Ltd Copper alloy
JPH02129326A (en) 1988-11-08 1990-05-17 Sumitomo Metal Mining Co Ltd high strength copper alloy
JPH02277735A (en) 1989-04-20 1990-11-14 Sumitomo Metal Mining Co Ltd Copper alloy for lead frame
JPH0920943A (en) * 1995-06-30 1997-01-21 Furukawa Electric Co Ltd:The Copper alloy for electronic and electrical parts and method for producing the same
JP2008197677A (en) 1997-02-17 2008-08-28 Seiko Epson Corp Display device
JPH1112714A (en) * 1997-06-25 1999-01-19 Dowa Mining Co Ltd Copper and copper-based alloy excellent in direct bonding property and solderability and method for producing the same
JP2005243821A (en) * 2004-02-25 2005-09-08 Dowa Mining Co Ltd Heat sink for semiconductor device and manufacturing method thereof
JP2008197672A (en) 2005-08-05 2008-08-28 Seiko Epson Corp Liquid crystal device
JP2007169765A (en) * 2005-12-26 2007-07-05 Furukawa Electric Co Ltd:The Copper alloy and its manufacturing method
JP2007177274A (en) * 2005-12-27 2007-07-12 Kobe Steel Ltd Copper alloy with high strength and excellent processability in bending, and its production process
JP2008007839A (en) * 2006-06-30 2008-01-17 Nikko Kinzoku Kk Cu-Zn alloy with high strength and excellent bending workability
JP2008056977A (en) 2006-08-30 2008-03-13 Mitsubishi Electric Corp Copper alloy and manufacturing method thereof
JP2008088512A (en) 2006-10-03 2008-04-17 Nikko Kinzoku Kk Method for producing copper alloy for electronic materials
JP2008202468A (en) 2007-02-19 2008-09-04 Toyota Motor Corp Output convergence value calculation device for engine system

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See also references of EP2319947A4

Cited By (35)

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CN102812139A (en) * 2010-03-30 2012-12-05 Jx日矿日石金属株式会社 Cu-Co-Si alloy material
EP2554692A4 (en) * 2010-03-30 2014-04-09 Jx Nippon Mining & Metals Corp CU-CO-SI ALLOY MATERIAL
US9476109B2 (en) 2010-03-31 2016-10-25 Jx Nippon Mining & Metals Corporation Cu—Ni—Si—Co copper alloy for electronic material and process for producing same
CN102844452B (en) * 2010-04-14 2015-02-11 Jx日矿日石金属株式会社 Cu-Si-Co alloy for electronic material and preparation method thereof
US9499885B2 (en) 2010-04-14 2016-11-22 Jx Nippon Mining & Metals Corporation Cu—Si—Co alloy for electronic materials, and method for producing same
EP2559777A4 (en) * 2010-04-14 2014-04-09 Jx Nippon Mining & Metals Corp CU-SI-CO ALLOY FOR ELECTRONIC MATERIALS AND METHOD FOR MANUFACTURING THE SAME
CN102844452A (en) * 2010-04-14 2012-12-26 Jx日矿日石金属株式会社 Cu-Si-Co alloy for electronic material and preparation method thereof
EP2578709A4 (en) * 2010-05-31 2014-04-09 Jx Nippon Mining & Metals Corp CU-CO-SI COPPER ALLOY FOR ELECTRONIC MATERIAL AND METHOD FOR PRODUCING THE SAME
KR101377316B1 (en) 2010-05-31 2014-03-25 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 Cu-co-si-based copper alloy for electronic material, and process for production thereof
JP2011252188A (en) * 2010-05-31 2011-12-15 Jx Nippon Mining & Metals Corp Cu-Co-Si-BASED COPPER ALLOY FOR ELECTRONIC MATERIAL AND METHOD FOR PRODUCING THE SAME
US9460825B2 (en) 2010-05-31 2016-10-04 Jx Nippon Mining & Metals Corporation Cu-Co-Si-based copper alloy for electronic materials, and method of manufacturing same
CN102575320A (en) * 2010-05-31 2012-07-11 Jx日矿日石金属株式会社 Cu-co-si-based copper alloy for electronic material, and process for production thereof
WO2011152124A1 (en) * 2010-05-31 2011-12-08 Jx日鉱日石金属株式会社 Cu-co-si-based copper alloy for electronic material, and process for production thereof
CN102575320B (en) * 2010-05-31 2014-01-08 Jx日矿日石金属株式会社 Cu-Co-Si system copper alloy for electronic material and manufacturing method thereof
EP2578708A4 (en) * 2010-06-03 2014-04-09 Jx Nippon Mining & Metals Corp ALLOY SHEET BASED ON CU-CO-SI AND METHOD FOR PRODUCING SAME
KR101917416B1 (en) 2010-08-24 2018-11-09 제이엑스금속주식회사 Copper-cobalt-silicon alloy for electrode material
US10056166B2 (en) 2010-08-24 2018-08-21 Jx Nippon Mining & Metals Corporation Copper-cobalt-silicon alloy for electrode material
EP2607508A4 (en) * 2010-08-24 2014-04-09 Jx Nippon Mining & Metals Corp COPPER-COBALT-SILICON ALLOY FOR ELECTRODE MATERIAL
CN103052728B (en) * 2010-08-24 2015-07-08 Jx日矿日石金属株式会社 Copper-cobalt-silicon alloy for electrode material
JP2012046774A (en) * 2010-08-24 2012-03-08 Jx Nippon Mining & Metals Corp Cu-Co-Si-BASED ALLOY FOR ELECTRONIC MATERIAL
CN103052728A (en) * 2010-08-24 2013-04-17 Jx日矿日石金属株式会社 Copper-cobalt-silicon alloy for electrode material
WO2012026488A1 (en) * 2010-08-24 2012-03-01 Jx日鉱日石金属株式会社 Copper-cobalt-silicon alloy for electrode material
CN103140591A (en) * 2010-09-29 2013-06-05 Jx日矿日石金属株式会社 Cu-co-si-based alloy for electronic material and method of manufacturing the same
EP2623619A4 (en) * 2010-09-29 2014-04-09 Jx Nippon Mining & Metals Corp COPPER-COBALT-SILICON COPPER ALLOY FOR ELECTRONIC MATERIAL AND PROCESS FOR PRODUCING THE SAME
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JP2012167319A (en) * 2011-02-14 2012-09-06 Jx Nippon Mining & Metals Corp Cu-Co-Si-BASED ALLOY, ROLLED COPPER ARTICLE, ELECTRONIC COMPONENT, CONNECTOR, AND METHOD FOR PRODUCING Cu-Co-Si-BASED ALLOY
JP2012201905A (en) * 2011-03-24 2012-10-22 Jx Nippon Mining & Metals Corp Co-Si BASED COPPER ALLOY SHEET
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Also Published As

Publication number Publication date
JPWO2010013790A1 (en) 2012-01-12
KR101570555B1 (en) 2015-11-19
EP2319947A4 (en) 2011-11-23
KR20110038143A (en) 2011-04-13
CN102112639A (en) 2011-06-29
JP5224415B2 (en) 2013-07-03
EP2319947A1 (en) 2011-05-11
US20110186192A1 (en) 2011-08-04

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