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TW200632115A - Alloy target for conductive film or its protection layer and manufacturing method thereof - Google Patents

Alloy target for conductive film or its protection layer and manufacturing method thereof

Info

Publication number
TW200632115A
TW200632115A TW094106124A TW94106124A TW200632115A TW 200632115 A TW200632115 A TW 200632115A TW 094106124 A TW094106124 A TW 094106124A TW 94106124 A TW94106124 A TW 94106124A TW 200632115 A TW200632115 A TW 200632115A
Authority
TW
Taiwan
Prior art keywords
alloy target
conductive film
protection layer
manufacturing
weight percentages
Prior art date
Application number
TW094106124A
Other languages
Chinese (zh)
Other versions
TWI254747B (en
Inventor
Yih Chang
Chih-Hsiao Chao
Tien-Wang Huang
Hung-Hua Chen
Jiin-Chyuan Chang
Original Assignee
Ritdisplay Corp
Solar Applied Mat Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ritdisplay Corp, Solar Applied Mat Tech Corp filed Critical Ritdisplay Corp
Priority to TW094106124A priority Critical patent/TWI254747B/en
Priority to JP2005331888A priority patent/JP4815194B2/en
Priority to KR1020060014271A priority patent/KR100726872B1/en
Application granted granted Critical
Publication of TWI254747B publication Critical patent/TWI254747B/en
Publication of TW200632115A publication Critical patent/TW200632115A/en

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Abstract

An alloy target for conductive film or its protection layer comprises copper (Cu), nickel (Ni) and zinc (Zn), wherein copper is about 50 to 80 weight percentages, nickel is about 5 to 20 weight percentages and zinc is about 15 to 30 weight percentages and the total weight percentages of the alloy target is 100%.
TW094106124A 2005-03-01 2005-03-01 Alloy target for conductive film or its protection layer and manufacturing method thereof TWI254747B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW094106124A TWI254747B (en) 2005-03-01 2005-03-01 Alloy target for conductive film or its protection layer and manufacturing method thereof
JP2005331888A JP4815194B2 (en) 2005-03-01 2005-11-16 Conductive thin film, alloy target material for protective layer thereof, and manufacturing method thereof
KR1020060014271A KR100726872B1 (en) 2005-03-01 2006-02-14 Alloy target for conductive film or its protective layer, and its manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094106124A TWI254747B (en) 2005-03-01 2005-03-01 Alloy target for conductive film or its protection layer and manufacturing method thereof

Publications (2)

Publication Number Publication Date
TWI254747B TWI254747B (en) 2006-05-11
TW200632115A true TW200632115A (en) 2006-09-16

Family

ID=37048276

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094106124A TWI254747B (en) 2005-03-01 2005-03-01 Alloy target for conductive film or its protection layer and manufacturing method thereof

Country Status (3)

Country Link
JP (1) JP4815194B2 (en)
KR (1) KR100726872B1 (en)
TW (1) TWI254747B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007039781A (en) * 2005-07-06 2007-02-15 Idemitsu Kosan Co Ltd Sputtering target, its manufacturing method, reflective film, and organic electroluminescence element
JP5532767B2 (en) * 2009-09-04 2014-06-25 大同特殊鋼株式会社 NiCu alloy target material for Cu electrode protection film
JP5724998B2 (en) * 2012-12-10 2015-05-27 三菱マテリアル株式会社 Protective film forming sputtering target and laminated wiring film
JP5979034B2 (en) 2013-02-14 2016-08-24 三菱マテリアル株式会社 Sputtering target for protective film formation
JP6135275B2 (en) 2013-04-22 2017-05-31 三菱マテリアル株式会社 Sputtering target for protective film formation
JP5757318B2 (en) 2013-11-06 2015-07-29 三菱マテリアル株式会社 Protective film forming sputtering target and laminated wiring film
JP6207406B2 (en) * 2014-01-14 2017-10-04 株式会社Ｓｈカッパープロダクツ Sputtering target material and wiring laminate
JP6398594B2 (en) * 2014-10-20 2018-10-03 三菱マテリアル株式会社 Sputtering target

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002265942A (en) * 2001-03-15 2002-09-18 Sony Corp Phosphor powder, manufacturing method thereof, display panel, and flat display device

Also Published As

Publication number Publication date
JP2006241587A (en) 2006-09-14
JP4815194B2 (en) 2011-11-16
TWI254747B (en) 2006-05-11
KR20060096890A (en) 2006-09-13
KR100726872B1 (en) 2007-06-14

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees