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WO2008123433A1 - Cu-ni-si-based alloy for electronic material - Google Patents

Cu-ni-si-based alloy for electronic material Download PDF

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Publication number
WO2008123433A1
WO2008123433A1 PCT/JP2008/056138 JP2008056138W WO2008123433A1 WO 2008123433 A1 WO2008123433 A1 WO 2008123433A1 JP 2008056138 W JP2008056138 W JP 2008056138W WO 2008123433 A1 WO2008123433 A1 WO 2008123433A1
Authority
WO
WIPO (PCT)
Prior art keywords
mass
alloy
ratio
electronic material
based alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/056138
Other languages
French (fr)
Japanese (ja)
Inventor
Naohiko Era
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mining Holdings Inc
Original Assignee
Nippon Mining and Metals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining and Metals Co Ltd filed Critical Nippon Mining and Metals Co Ltd
Priority to CN2008800101895A priority Critical patent/CN101646792B/en
Priority to US12/532,929 priority patent/US20100086435A1/en
Priority to JP2009509224A priority patent/JP4418028B2/en
Priority to EP08739256.9A priority patent/EP2154257B1/en
Publication of WO2008123433A1 publication Critical patent/WO2008123433A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/02—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/02—Single bars, rods, wires, or strips

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

Disclosed is a Corson alloy having dramatically improved properties (e.g., high strength and high conductivity) which are achieved by allowing the effect of the addition of Cr to a Cu-Ni-Si-based alloy to exhibit more effectively. Specifically disclosed is a copper alloy for an electronic material, which comprises 1.0 to 4.5 mass% of Ni, 0.50 to 1.2 mass% of Si, 0.0030 to 0.3 mass% of Cr (provided that the weight-based ratio of Ni to Si (i.e., a Ni/Si ratio) by weight is as follows: 3 ≤ Ni/Si ≤ 5.5), with the remainder being Cu and unavoidable impurities. In the copper alloy, a Cr-Si compound having a size of 0.1 to 5 μm (inclusive) is dispersed in the material at a dispersion density of 1 × 106 particles/mm2 or less, wherein the atom-based ratio of the concentration of Cr to that of Si in the dispersed particle is 1 to 5.
PCT/JP2008/056138 2007-03-30 2008-03-28 Cu-ni-si-based alloy for electronic material Ceased WO2008123433A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2008800101895A CN101646792B (en) 2007-03-30 2008-03-28 Cu-Ni-Si alloys for electronic materials
US12/532,929 US20100086435A1 (en) 2007-03-30 2008-03-28 Cu-Ni-Si SYSTEM ALLOY FOR ELECTRONIC MATERIALS
JP2009509224A JP4418028B2 (en) 2007-03-30 2008-03-28 Cu-Ni-Si alloy for electronic materials
EP08739256.9A EP2154257B1 (en) 2007-03-30 2008-03-28 Cu-ni-si-based alloy for electronic material

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007094441 2007-03-30
JP2007-094441 2007-03-30

Publications (1)

Publication Number Publication Date
WO2008123433A1 true WO2008123433A1 (en) 2008-10-16

Family

ID=39830918

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/056138 Ceased WO2008123433A1 (en) 2007-03-30 2008-03-28 Cu-ni-si-based alloy for electronic material

Country Status (7)

Country Link
US (1) US20100086435A1 (en)
EP (1) EP2154257B1 (en)
JP (1) JP4418028B2 (en)
KR (1) KR101211984B1 (en)
CN (1) CN101646792B (en)
TW (1) TWI395824B (en)
WO (1) WO2008123433A1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110017357A1 (en) * 2008-03-31 2011-01-27 Koji Sato Copper alloy material for electrical/electronic equipments, and electrical/electronic part
US20110017358A1 (en) * 2008-03-31 2011-01-27 Koji Sato Copper alloy material for electrical/electronic equipments, and electrical/electronic part
JP2012201958A (en) * 2011-03-28 2012-10-22 Mitsubishi Shindoh Co Ltd Cu-Ni-Si BASED COPPER ALLOY SHEET HAVING EXCELLENT STRESS RELAXATION RESISTANCE, AND FATIGUE RESISTANCE AND SPRING PROPERTY AFTER BENDING, AND METHOD FOR PRODUCING THE SAME
JP2015158009A (en) * 2014-01-27 2015-09-03 古河電気工業株式会社 Copper alloy material and production method thereof
JPWO2024090449A1 (en) * 2022-10-24 2024-05-02
JPWO2024090450A1 (en) * 2022-10-24 2024-05-02

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2508634B1 (en) * 2009-12-02 2017-08-23 Furukawa Electric Co., Ltd. Method for producing a copper alloy sheet material having low young's modulus
EP2554691A4 (en) * 2010-04-02 2014-03-12 Jx Nippon Mining & Metals Corp CU-NI-SI ALLOY FOR ELECTRONIC MATERIAL
JP5045784B2 (en) * 2010-05-14 2012-10-10 三菱マテリアル株式会社 Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, and rolled copper alloy material for electronic equipment
JP5714863B2 (en) 2010-10-14 2015-05-07 矢崎総業株式会社 Female terminal and method for manufacturing female terminal
JP5712585B2 (en) * 2010-12-03 2015-05-07 三菱マテリアル株式会社 Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, and rolled copper alloy material for electronic equipment
US9159985B2 (en) * 2011-05-27 2015-10-13 Ostuka Techno Corporation Circuit breaker and battery pack including the same
JP5903842B2 (en) 2011-11-14 2016-04-13 三菱マテリアル株式会社 Copper alloy, copper alloy plastic working material, and method for producing copper alloy plastic working material
KR101274063B1 (en) * 2013-01-22 2013-06-12 한국기계연구원 A metal matrix composite with two-way shape precipitation and method for manufacturing thereof
KR101709560B1 (en) 2013-09-27 2017-02-23 주식회사 엘지화학 Secondary Battery with Electrode Tab Having Low Resistance
CN105385890A (en) * 2015-11-27 2016-03-09 宁波博威合金材料股份有限公司 Nickel and silicon contained bronze alloy and application thereof
CN105821238B (en) * 2016-05-31 2018-01-02 黄河科技学院 A kind of Cu alloy material and preparation method thereof
CN106191725B (en) * 2016-06-24 2018-01-26 河南江河机械有限责任公司 High-intensity high-conductivity copper alloy nanometer phase precipitation technique method
CN108193080B (en) * 2016-12-08 2019-12-17 北京有色金属研究总院 High-strength high-conductivity stress relaxation-resistant copper-nickel-silicon alloy material and preparation method thereof
CN109609801A (en) * 2018-12-06 2019-04-12 宁波博威合金材料股份有限公司 High property copper alloy and preparation method thereof
CN115386766A (en) * 2022-08-11 2022-11-25 中国科学院金属研究所 A kind of Cu-Ni-Si-Cr-Mg five-element copper alloy and preparation method thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0349137B2 (en) 1984-11-09 1991-07-26 Sanyo Electric Co
JPH0718356A (en) * 1993-07-01 1995-01-20 Mitsubishi Electric Corp Copper alloy for electronic equipment, its manufacturing method and IC lead frame
JP2862942B2 (en) 1990-03-20 1999-03-03 古河電気工業株式会社 Heat treatment method of Corson alloy
JP2001207229A (en) 2000-01-27 2001-07-31 Nippon Mining & Metals Co Ltd Copper alloy for electronic materials
JP2005113180A (en) 2003-10-06 2005-04-28 Furukawa Electric Co Ltd:The Copper alloy for electronic equipment and its manufacturing method
JP2005350696A (en) * 2004-06-08 2005-12-22 Hitachi Cable Ltd Manufacturing method of copper alloy for terminals and connectors

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3049137B2 (en) * 1991-12-27 2000-06-05 株式会社神戸製鋼所 High strength copper alloy excellent in bending workability and method for producing the same
CN101166840B (en) * 2005-02-28 2012-07-18 古河电气工业株式会社 Copper alloy
CN1776997B (en) * 2005-12-13 2010-05-05 江苏科技大学 Large-capacity steam turbine generator rotor copper alloy slot wedge and its preparing method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0349137B2 (en) 1984-11-09 1991-07-26 Sanyo Electric Co
JP2862942B2 (en) 1990-03-20 1999-03-03 古河電気工業株式会社 Heat treatment method of Corson alloy
JPH0718356A (en) * 1993-07-01 1995-01-20 Mitsubishi Electric Corp Copper alloy for electronic equipment, its manufacturing method and IC lead frame
JP2001207229A (en) 2000-01-27 2001-07-31 Nippon Mining & Metals Co Ltd Copper alloy for electronic materials
JP2005113180A (en) 2003-10-06 2005-04-28 Furukawa Electric Co Ltd:The Copper alloy for electronic equipment and its manufacturing method
JP2005350696A (en) * 2004-06-08 2005-12-22 Hitachi Cable Ltd Manufacturing method of copper alloy for terminals and connectors

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2154257A4 *

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110017357A1 (en) * 2008-03-31 2011-01-27 Koji Sato Copper alloy material for electrical/electronic equipments, and electrical/electronic part
US20110017358A1 (en) * 2008-03-31 2011-01-27 Koji Sato Copper alloy material for electrical/electronic equipments, and electrical/electronic part
JP2012201958A (en) * 2011-03-28 2012-10-22 Mitsubishi Shindoh Co Ltd Cu-Ni-Si BASED COPPER ALLOY SHEET HAVING EXCELLENT STRESS RELAXATION RESISTANCE, AND FATIGUE RESISTANCE AND SPRING PROPERTY AFTER BENDING, AND METHOD FOR PRODUCING THE SAME
JP2015158009A (en) * 2014-01-27 2015-09-03 古河電気工業株式会社 Copper alloy material and production method thereof
JPWO2024090449A1 (en) * 2022-10-24 2024-05-02
JPWO2024090450A1 (en) * 2022-10-24 2024-05-02
JP7563652B2 (en) 2022-10-24 2024-10-08 三菱マテリアル株式会社 Copper alloy powder for metal AM and method for manufacturing laminated objects
JP7586376B2 (en) 2022-10-24 2024-11-19 三菱マテリアル株式会社 Metal AM copper alloy powder and method for manufacturing laminated objects

Also Published As

Publication number Publication date
KR20090123017A (en) 2009-12-01
KR101211984B1 (en) 2012-12-13
EP2154257A1 (en) 2010-02-17
EP2154257B1 (en) 2016-10-05
CN101646792A (en) 2010-02-10
CN101646792B (en) 2012-02-22
JP4418028B2 (en) 2010-02-17
JPWO2008123433A1 (en) 2010-07-15
EP2154257A4 (en) 2012-01-11
TWI395824B (en) 2013-05-11
US20100086435A1 (en) 2010-04-08
TW200902732A (en) 2009-01-16

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